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All rights reserved. Intel® Atom™ Processor C2000 Product Family for Microserver Datasheet January 2016 2 Order Number: 330061-003US Revision History—C2000 Product Family Revision History Date Revision Description The following technical changes were made in Datasheet 003US: • Table 1-2 - Added “Lowest Frequency Mode” row to table and removed “Reliability/ Availability” row from table. • Table 1-4 - Added CPPM to terminology. • Section 3.3.1 and Section 3.3.2 - Corrected minimum memory capacity. and device density. • Table 3-1 and Table 3-2 - Added row for 1 GB. • Section 3.4.2 - Added Paragraph. • Section 4.4 - Updated section. • Table 5-2 - Updated signals. • Section 7 - Added note to SoC Reset and Power Supply Sequences. • Section 7.1.3 - Changed sequence shown in V1P0A voltage is provided to all V1P0A voltage- group pins the of SoC. • Section 7.2.1 - Updated Cold Reset Sequence. • Section 12.3.6 - Added note. January 2016 003US • Section 15.4.7.1 and Section 15.4.8.1- Updated. • Table 22-3 - Updated entries in Content column. • Section 22.7 - Added note. • Table 23-2 - Updated descriptions. • Table 25-1 - Updated and clarified reserved bits in Section 25.3.1. • Figure 31-1 and Table 31-14 - Updated signal names. • Table 31-15 - Updated RTC Well Signals. • Table 31-17 - Updated Description of PMU_RESETBUTTON_B/GPIOS_30. • Table 31-24 - Updated entries in “Internal Pull-up or Pull-down” column. • Table 31-25 - Updated entries in “Internal Pull-up or Pull-down” column. • Table 31-25 - Added footnote to SPI_CS0_B. • Table 33-2 and Table 33-3 - Updated signal name of TDQS_CK. • Table 33-42 - Updated RTC Crystal Requirements. • Figure 33-10 - Figure updated. The following technical changes were made in Datasheet 002US: • Updated Revision numbering scheme for public release from 1.1 to 002US. • Global Change - IRERR changed to IERR throughout the manual. • Global Change - SMBALERT# changed to SMBALRT_N throughout the manual. • Table 1-2 - Added CUNIT_REG_DEVICEID[31:0] row. • Section 3.3.3 - Added System Memory Technology which is Not Supported. • Table 3-2 - Added Table note. • Section 7.2.1 - Updated V1P35S note. • Section 9.3 - Updated PCI Express. • Section 11.5.2.1 - Added paragraph. • Table 12-2 - Updated Description for FLEX_CLK_SE1. September 2014 002US • Section 12.2 - Updated supported features. • Section 12.3.3.2 - Updated ASPM and ASPM Optionality. • Section 12.6 - Updated Power Management. • Table 12-9 - Added x4 Lanes with 4 Controllers SKUs. • Previous Section 16.5.2 - Deleted section. • Table 16-1 - Changed Strap Usage for FLEX_CLK_SE1. • Table 16-5 - Updated Description for Bits 1 and 0. • Table 17-4 - Added Table Note 1 to Slave Address (Data Phase). • Table 31-6 - Updated Description for THERMTRIP_N. • Table 31-24 - Changed FLEX_CLK_SE1 pin 0 to Reserved. • Section 33.16.4 - Changed PPM Tolerance to 35 ppm. • Table 33-45 - Changed TRISE/FALL Min and Max Rise/Fall Time Max from 5ns to 3ns. January 2014 1.0 Initial Release. Intel® Atom™ Processor C2000 Product Family for Microserver January 2016 Datasheet Order Number: 330061-003US 3 C2000 Product Family—Contents Contents Volume 1: C2000 Product Family Program Overview .....................30 1 Introduction and Product Offerings ......................................................................... 31 1.1 Overview ......................................................................................................... 31 1.2 Key Features.................................................................................................... 32 1.3 Intel® Atom™ Processor C2000 Product Family for Microserver Block Diagram .......................................................................................................... 34 1.4 Product SKUs ................................................................................................... 35 1.5 Datasheet Volume Structure and Scope ............................................................... 36 1.6 Terminology..................................................................................................... 38 1.7 Related Documents ........................................................................................... 43 2 Multi-Core Intel® Atom™ Processors ....................................................................... 46 2.1 Signal Descriptions ........................................................................................... 46 2.2 Features .......................................................................................................... 46 2.3 SoC Components .............................................................................................. 47 2.3.1 SoC Core............................................................................................. 47 2.4 Features .......................................................................................................... 48 2.4.1 Intel® Virtualization Technology ............................................................. 48 2.4.2 Intel® VT-x Objectives .......................................................................... 48 2.4.2.1 Intel® VT-x Features ............................................................ 49 2.4.3 Security and Cryptography Technologies ................................................. 50 2.4.3.1 Advanced Encryption Standard New Instructions (AES-NI)......... 50 2.4.3.2 PCLMULQDQ Instruction ....................................................... 50 2.4.3.3 Digital Random Number Generator ......................................... 50 2.4.4 Intel® Turbo Boost Technology............................................................... 51 2.4.4.1 Intel® Turbo Boost Technology Frequency............................... 51 2.5 CPUID Instruction and SoC Identification ............................................................. 52 Volume 2: Functional ...................................................................56 3 Memory Controller................................................................................................... 57 3.1 Introduction ..................................................................................................... 57 3.2 Signal Descriptions ........................................................................................... 57