W&M ScholarWorks Dissertations, Theses, and Masters Projects Theses, Dissertations, & Master Projects 2000 Surface processing by RFI PECVD and RFI PSII Lingling Wu College of William & Mary - Arts & Sciences Follow this and additional works at: https://scholarworks.wm.edu/etd Part of the Condensed Matter Physics Commons, Materials Science and Engineering Commons, and the Plasma and Beam Physics Commons Recommended Citation Wu, Lingling, "Surface processing by RFI PECVD and RFI PSII" (2000). Dissertations, Theses, and Masters Projects. Paper 1539623997. https://dx.doi.org/doi:10.21220/s2-sazs-yg02 This Dissertation is brought to you for free and open access by the Theses, Dissertations, & Master Projects at W&M ScholarWorks. It has been accepted for inclusion in Dissertations, Theses, and Masters Projects by an authorized administrator of W&M ScholarWorks. For more information, please contact [email protected]. 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SURFACE PROCESSING BY RFIPECVD AND RFI PSD A Dissertation Presented to The Faculty of the Department of Applied Science The College of William and Mary in Virginia In Partial Fulfillment Of the Requirements for the Degree of Doctor of Philosophy by Lingling Wu October, 2000 Reproduced with permission of the copyright owner. Further reproduction prohibited without permission. UMI Number. 9999060 Copyright 2001 by Wu, Lingling All rights reserved. UMI* UMI Microform9999060 Copyright 2001 by Bell & Howell Information and Learning Company. All rights reserved. This microform edition is protected against unauthorized copying under Title 17, United States Code. Bell & Howell Information and Learning Company 300 North Zeeb Road P.O. Box 1346 Ann Arbor, Ml 48106-1346 Reproduced with permission of the copyright owner. Further reproduction prohibited without permission. APPROVAL SHEET This dissertation is submitted in partital fulfillment of the requirements for the degree of Doctor of Philosophy ^Cingling^Wu Approved, October 2000 Dennis M. Manos, Ph.D., Chair Department of Applied Science Ri £ W — Roy L. Champion, Ph.T). Department of Physics H. Frederick Dylla, Ph.D. Thomas Jefferson National Accelerator Facility Mark K. Flinders, Ph.D. Department of Applied Science Reproduced with permission of the copyright owner. Further reproduction prohibited without permission. Table of Contents Acknowledgments ......................................................................................vii List of Tables ............................................................................................... x List of Figures .............................................................................................xi A bstract.....................................................................................................xxi 1 Introduction ............................................................................................ 2 1.1 Introduction to Surface Processing by RFI PECVD and RFI P S II ........................2 1.2 Organization of the Dissertation .............................................................................8 2 DLC and Ti/MoS 2 Films Deposition on Ti Alloy for Tribological Applications ............................................................................................14 2.1 Introduction .......................................................................................................... 14 2.2 PECVD DLC on Ti-6A1-4V ................................................................................16 2.2.1 Introduction to DLC Films ....................................................................... 16 2.2.2 DLC Films Deposition by Thin Film Processing Techniques .................. 18 2.2.3 DLC Films Deposition by RFI PECVD ....................................................19 2.3 PVD Ti/MoSo Films on Ti-6A1-4V ..................................................................... 21 Reproduced with permission of the copyright owner. Further reproduction prohibited without permission. 2.3.1 MoS2 Films Deposition for Triboiogical Applications ...........................21 2.3.2 Ti/MoSo Fibns Deposition by Magnetron Sputtering PVD ..................... 22 2.4 Plasma Sprayed Cu-Ni-In Coating Preparation .................................................. 22 2.5 DLC and Ti/MoSoFilms Characterization ...........................................................24 2.5.1 Ellipsometry Study of DLC Films ........................................................... 24 2.5.2 Hardness T est ...........................................................................................24 2.5.3 Pull Test................................................................................................... 25 2.5.4 SEM Study ................................................................................................25 2.5.5 Triboiogical Tests .................................................................................... 26 2.6 Characterization Results and Discussion ............................................................ 27 2.7 Summary and Conclusion ....................................................................................47 3 Design and Characterization of Large-Scale RFICP Source 50 ro ro . 1 rn Introduction ......................................................................................................... 50 .2 RF ICP Source .................................................................................................... 51 3.3 Large-scale RF ICP Design and Building ........................................................... 54 3.3.1 Dielectric Window .................................................................................... 54 3.3.2 RF Antenna .............................................................................................. 58 3.3.3 RF Inductive Mode Versus CapacitiveMode ............................................60 3.3.4 Magnetic Confinement ..............................................................................61 3.4 Characterization of RF IC P .................................................................................63 3.4.1 Langmuir Probe Measurement ................................................................ 63 3.4.2 Optical Emission Spectroscopy ................................................................ 72 iv Reproduced with permission of the copyright owner. Further reproduction prohibited without permission. 3.4.3 Consideration of Sheath S ize and Arcing for Plasma Source Immersion Ion Implantation ............................ .............................................................. 78 4 MAGIC Modeling of PSII Process .......................................................89 4.1 Introduction to PSII Modeling ........................................................................... 89 4.2 Modeling of PSII Process .....................................................................................92 4.2.1 Collisionless Model of PSIIProcess .........................................................92 4.2.2 Modeling of PSII Process ........................................................................ 95 4.3 Introduction to MAGIC Code .............................................................................. 95 4.4 MAGIC Modeling of PSII Process ........................................ 96 4.4.1 Potential Structure, Field Distribution, Ion and Electron Distribution ... 98 4.4.2 Ion Flux Distribution .......................................... 109 4.5 Summary............................................................................................................116 5 Pattern Writing by Implantation in a PSII System ...........................120 5.1 Present Direct Write Technology ....................................................................... 120 5.2 Pattern Writing by Implantation .........................................................................123 5.2.1 Strategy