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RF Power Amplifiers
May 7, 2003 RF IF
Outline
PA Introduction z Power transfer characteristics z Intrinsic PA metrics z Linear and Non-linear amplifiers z PA Architectures Single-Stage Linear PA z Load-line theory z Transistors size z Input and Output Matching z So why is this so hard? High-efficiency PAs z Class A, AB, B and C amplifiers
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Outline (cont.)
Real-World Design Example z Selecting architecture, number of stages z Designing stages z Tuning: inter-stage match and output System specifications z Ruggedness: load mis-match and VSWR z Linearity: spectral mask (ACPR), switching transients z Noise in receive band Power Control
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PA Transfer characteristics Defining linearity:
linear non-linear (actual)
(dBm) 1
out G P Pout = Pin + G
0 Pin (dBm)
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PA Transfer characteristics Defining linearity:
PMAX P 1dB G -1 (dBm) out Gain (dB) P
Pin (dBm)
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PA Introduction: Intrinsic PA Metrics
P1dB: Output power at which linear gain has compressed by 1dB (measure of linear power handling)
PMAX: Maximum output power (saturated power) Gain: Generally taken to mean transducer gain Power delivered to load Power available from source
PAE: Power-added Efficiency
Power to load – Power from source Power from supply
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Linear and Non-linear PAs
“Linear PA” generally refers to a PA which operates at constant gain, needs to preserve amplitude information
(dBm) Designed to operate here OUT P
PIN (dBm)
Not necessarily class A (will discuss later …) Peak efficiencies often only 40 to 45 % Useful for modulation schemes with amplitude modulation (QPSK, 8-PSK, QAM)
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Linear and Non-linear PAs
“Non-linear PA” generally refers to a PA designed to operate
with constant PIN, output power varies by changing gain Designed to operate here: NOT fixed gain! (dBm) POUT adjusted through OUT P bias control
PIN (dBm)
Operation in saturated mode leads to high peak efficiencies > 50%; “backed-off” efficiencies drop quickly Useful for constant-envelope modulation schemes (GMSK)
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PA Architectures Typical 2-stage (6.012) design
VPOS
50 Ω
IREF
input 50 Ω Max power transfer?
VB2 VB1
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PA Architectures Typical 2-stage RF PA design
VPOS
inductive RF choke allows output to rise
above VPOS, doesn’t dissipate power matching network matching RF input network 50 Ω
L’s and C’s to May require additional transform load RF choke here to isolate impedance input from bias circuit VB2 VB1
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PA Architectures Typical 2-stage RF PA design
VPOS
Additional caps may be required for matching network, harmonic termination matching network matching RF input network 50 Ω
VB2 VB1
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PA Architectures Typical 2-stage RF PA design
VPOS
matching network matching RF input network 50 Ω
bond wires (at least …)
VB2 VB1
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PA Architectures Typical 2-stage RF PA design
VPOS
matching network matching RF input network 50 Ω
VB2 VB1 Consider this …
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PA Architectures
“Gain stage” is one transistor with passive elements “Active” components often limited to 2 or 3 transistors (gain stages) in signal path Transistor design very important! z Many parallel transistors – often look like mini-circuits themselves Passive components just as important as transistors! z Circuits must be tunable to account for uncertainties in determining values a priori (i.e. simulations stink – especially large-signal, RF simulations) z Q and parasitic elements of passives important
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Single-Stage Linear PA
Load-line theory: the maximum power that a given transistor can deliver is determined by the power supply voltage and the maximum current of the transistor
≈ RLOAD,opt. IMAX ⋅ 2 VPOS / IMAX (mA/mm) C or I D I
2*VPOS
VDS or VCE (V) 15 RF IF
Single-Stage Linear PA
Transistor size chosen to deliver required output power ≈ ⋅ POUT IMAX VPOS / 4
RL,opt. IMAX Quiescent point:
(mA/mm) Class A
C IMAX/2, VPOS or I D I
2*VPOS VDS or VCE (V)
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Single-Stage, Linear PA Ω Design output match to transform 50 load to RL,opt at transistor output; then design input match for gain (complex conjugate) VPOS output input match match
CJC 50 Ω
VB1
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Seems simple, so why is this so hard?
Determining IMAX is not so easy z For BJTs, one reference suggested that “the best way of estimating its value is to build an optimized class A amplifier and observe the dc supply current.”1
z Somewhat easier for depletion-mode GaAs FETs – IMAX often corresponds to VGS = 0V z Values don’t scale linearly with transistor size Optimal load resistance only a theoretical number z Transmission line effects, parasitic L’s and C’s significant at RF z Common practice is to vary the load of an actual transistor to determine the peak output power: the load-pull measurement (Noticing a distinct pattern of “empirical” design emerging?)
1 RF Power Amplifiers for Wireless Communications, Steve Cripps, Artech House, Boston, 1999.
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Seems simple, so why is this so hard?
Now consider the problem for multiple stages … double the trouble z Typical single-stage gain only 10 – 15 dB z Inter-stage match now required to match input impedance of 2nd stage to desired output impedance of 1st stage. Problems with matching circuits: z Large matching ratios → high Q circuits for simple L matches z Multi-segment matches use valuable real estate, add cost Transistor itself maters – a lot! z Many parallel transistor z Ballasting, balancing and layout extremely important
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High-efficiency PAs
Input signal swing turns on transistor – conduction for only part of sinusoidal period
IMAX
(mA/mm) Class A C or I
D Quiescent point: I Class AB to B
VDS or VCE (V)
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High-Efficiency PAs Conduction Angle: C
Class A: or I α π
D = 2 I π 2π 3π ωt C
Class AB: or I α π α π
D < < 2 I π 2π 3π ωt C
Class B: or I α π
D = I π 2π 3π ωt Class C: α < π
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High-Efficiency PAs
Assume output match will filter out non-linearities caused by discontinuous conduction:
output input match match
50 Ω
50Ω transformed
to RL,opt: V All harmonics B1 filtered out
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High-Efficiency PAs
If all harmonics filtered out, then voltage output at load is a pure sinusoid, despite discontinuous conduction OUT V π 2π 3π ωt
IMAX C I
π 2π 3π ωt
Energy stored in reactive elements delivers current to the load during transistor off-portion of cycle
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High-Efficiency PAs
Now consider peak efficiencies Calculate fundamental component of current* α/2 π I + I cos(ωt) dωt Idc = (1/2 )∫ Q pk −α/2 α/2 π I cos(ωt) cos(nωt) dωt In = (1/ ) ∫ pk −α/2
IMAX − Ipk = IMAX IQ C I
IQ
2π ωt α/2 * There are many texts which cover reduced-conduction angle calculations. See for example Principles Of Power Electronics, Kassakian, Schelcht and Verghese, Ch. 3.
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High-Efficiency PAs α − − From phasor plot: cos( /2) = IQ / Ipk = IQ / (IMAX –IQ) Put it all together and do the math, you get:
I 2sin(α/2) – αcos(α/2) I = MAX dc 2π 1 – cos(α/2) I α – sinα I = MAX 1,0-p 2π 1 – cos(α/2)
Assume VOUT the same for all classes:
V1,0-p = VPOS
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High-Efficiency PAs
Summary of PA “ideal” peak efficiencies
P (I /2) /√2 ⋅ V /√2 Class A: 1 ==MAX POS 50 % ⋅ Pdc (IMAX /2) VPOS P (I /2) /√2 ⋅ V /√2 Class B: 1 ==MAX POS 78 % π ⋅ Pdc (IMAX / ) VPOS
Class C: Ideally can go to 100%, but P1 drops steadily beyond α=π, goes to 0 at 100%!
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High-Efficiency PAs
What happened to our load line?
z For class B fundamental RL,opt = VPOS/(IMAX/2) – Didn’t change
IMAX
(mA/mm) Class A C or I D
I ?
VPOS 2VPOS
Class B is here! VDS or VCE (V)
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High-Efficiency PAs
What happened to our load line?
z For class B fundamental RL,opt = VPOS/(IMAX/2) – Didn’t change
quasi-static In quasi-static picture, resistance I MAX presented to
(mA/mm) Class A transistor output cut C I /2 in half. But average MAX resistance is the or I
D same for class A I
VPOS 2VPOS
Class B is here! VDS or VCE (V)
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High-Efficiency PAs
Now consider “linearity” z Clearly the current waveforms are far from linear BUT …
z Overall POUT vs. PIN transfer function can still be quite linear, especially for true Class B where output current waveform is symmetrical with respect to input waveform C or I D I π 2π 3π ωt Because conduction angle is constant,
POUT changes proportional to PIN
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Real-World Design Example
IDEAL: Design each stage independently z Determine required gain – number of stages
z Determine POUT for each stage
z Determine RL,opt for each stage z Determine input impedance for each stage z Design matching networks for inter-stage, load and input REALITY:
z IMAX doesn’t scale nicely with transistor size. Without good IMAX numbers, can’t determine RL,opt. Need to do load-pull. z Even load pull measurements have limited accuracy for very large transistors z Designs are very empirically driven!
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Real-World Design Example GSM 900 MHz, GaAs HBT PA Design
POUT = 33 dBm (linear) = 2 W
VCC = 3.5V 2 Ω RLOAD = VCC / 2*POUT = 3
IMAX = 2*VCC /RLOAD = 2.33 A (Note: expect saturated power to be ~ 35 dBm) Input power: constant-envelope +5 dBm
Gain = POUT –PIN = 27 dB. Expect roughly 10 dB per stage
3 STAGE DESIGN
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Real-World Design Example → Stage 1: Gain = 10 dB POUT = 15 dBm 2 Ω z RL1 = VCC / 2*POUT = 194
z IMAX = 2*VCC /RLOAD = 36 mA
z Chose class A: IDC = IMAX/2 = 18 mA (18 mA insignificant compared to 2.33 A) → Stage 2: Gain = 10 dB POUT = 25 dBm Ω z RL2 = 19.4
z IMAX = 360 mA
z Still probably class A (maybe AB): IDC = IMAX/2 = 180 mA → Stage 3: Gain = 7 dB POUT = 33 dBm Ω, z RL2 = 3 IMAX = 2.33 A π z Class B: IDC = IMAX/ = 742 mA
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Real-World Design Example A note on “Gain” Taking a very simplistic view of common emitter stages:
z gm1 = IC / VTh = 18 mA / 0.025 V = 0.696 S ⋅ → z gm1RL1 = 0.696 194 = 135 NOT 10 dB! BUT … Ω z re1 = 1/gm1 = 1.44 Ω z re2 = 1/gm2 = 0.144 Ω z re3 = 1/gm3 = 0.035
1. Remember it’s power gain, not voltage gain. Can lose voltage at input match. 2. It’s pretty tough not to get significant degeneration!
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Real-World Design Example
Efficiency calculations:
z IDC1 = 18 mA, IDC2 = 180 mA, IDC3 = 742 mA z Total DC Current: 940 mA
P (I /2) /√2 ⋅ V /√2 1 ==MAX POS 62 % ⋅ Pdc IDC VPOS
z Realistically may get as high as 55%
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Real-World Design Example: Load-Pull
After initial “guesses” at transistor sizes, load-pull to determine actual target load for matching circuits
Load pull: Vary ZL Plot contours of constant power RF input PMAX
P – 1dB ZL MAX
PMAX – 2dB
VB
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Real-World Design Example: Load-pull Notes on load-pulling: Most accurate on probe station, but insertion loss of probes prevents it from being useful for large transistors (“Insertion loss” is RF code word for resistance) Bonded devices on evaluation board must be carefully de- embedded Even using electronic tuners, accuracy is poor for very large transistor (i.e. for loads in the 2 – 5 Ω range)
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Real-World Design Example: The Circuit
VPOS
GaAs die
RF input 50 Ω
VB2 VB2 VB1
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Real-World Design Example: The Circuit
VPOS
Inter-stage match
RF input 50 Ω
VB2 VB2 VB1
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Real-World Design Example
VPOS
printed L inductor L BOND BOND + TL + TL LBOND RF input 50 Ω
Lparasitic + LVIA VB2 VB2 VB1
LBOND + LVIA 39 RF IF
Real-World Design Example
VPOS
may need to add feedback for stability
RF input 50 Ω
VB2 VB2 VB1
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Real-World Design Example: Tuning
Example of inter-stage match, 1st to 2nd stage Ω RL1 = 194 (?) Both are really ZIN2 = 30 – j10 (?) just guesses
Transmission line
Bond wire
Z RL1 IN2
* Go to Winsmith: test
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Real-World Design Example: Tuning
Example of inter-stage match, 2nd to 3rd stage Ω RL2 = 19.4
ZIN3 = 2 – j2
Transmission line
Bond wire Off-chip
R ZIN3 L2 Bond wires * Go to Winsmith: test2
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System Specifications
Ruggedness z 50 Ω load is for antenna in free space. Place antenna on a metal plate and can easily get VSWR of 4:1 z Typical PA specs are: don’t oscillate at up to 4:1, survive up to 10:1 (!) − Γ⋅ + V1 = V1 + V1 V1 V1 t = t1 z − V1 t t = t2
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System Specifications
Linearity z For linear PAs, Adjacent Channel Power Ratio (ACPR) is very important raised cosine filter
ch. ch. B ch. C A (dBm/Hz) Density (PSD) Power Spectral −∆ ∆ fc f fc fc+ f
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System Specifications
Linearity z For linear PAs, Adjacent Channel Power Ratio (ACPR) is very important 3rd order distortion
ch. ch. B ch. C A (dBm/Hz) Density (PSD) Power Spectral −∆ ∆ fc f fc fc+ f
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System Specifications
Linearity z For linear PAs, Adjacent Channel Power Ratio (ACPR) is very important
ch. ch. B ch. C A (dBm/Hz) th 5th order 3rd order 3rd order 5 order Density (PSD) Power Spectral distortion distortion distortion distortion −∆ ∆ fc f fc fc+ f
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System Specifications
Linearity z For linear PAs, Adjacent Channel Power Ratio (ACPR) is very important ∆f 30 kHz Pwr. Ch. B ACPR = Pwr. Ch. A (dBm/Hz) Density (PSD) Power Spectral −∆ ∆ fc f fc fc+ f
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System Specifications
Linearity z For non-linear PA in TDMA systems, harmonic spurs and switching transients are most common measure of linearity
Signal ramping µ profile must fall (dBm) 577 s within time mask GSM burst OUT P time
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System Specifications
Noise in receive band: z Obvious spec. in systems where Tx and Rx are operating at the same time (FDD)
30 kHz 30 kHz
45 MHz (dBm/Hz) Density (PSD) Power Spectral Tx Rx
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System Specifications
Noise in receive band: z Obvious spec. in systems where Tx and Rx are operating at the same time (FDD) z Not so obvious spec in TDD system. Problem primarily of ω ω ω ω mixing by the PA (2 2 – 1 or 2 – 1 )
45 MHz (dBm/Hz) Density (PSD) Power Spectral Tx Rx
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Power Control
For linear PA, expected to operate at constant gain. Power
control is therefore a function of PIN.
Role of bias circuitry is to maintain constant gain over PIN, temperature (PTAT?).
Power transistor
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Power Control
For non-linear PA, expected to operate at constant PIN. Power control is achieved by varying gain.
External control signal VAPC
On-chip bias circuitry Power transistor
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