A New Era in Nanotechnology Research: The Industry-University-Government Cooperative Model

May 18, 2010

Michael Liehr AVP Business Development, Alliances and Consortia Professor of Nanoengineering IBM Distinguished Engineer (ret.) Michael Liehr cnse.albany.edu Environment

Pervasive Nanotechnology Computing • Post-CMOS switches • Graphene, spintronics Integrated • Nano-bio SOC/SIP/SOP New Architectures • 3-D Wafer Scale Integration Consumer • Wireless, MEMs Performance Electronics • Optical Interconnects New Materials High Performance • SOI • Low K, Air Gap Computing • High K Gates Straight Scaling • Traditional CMOS • Bipolar / BiCMOS • DRAM 70's 80's 90's 00's 10's 20's

Adapted from John Kelly III, Sr. VP. IBM at “2nd Albany Symposium on Global NanoTechnology” Michael Liehr cnse.albany.edu Lake George NY 2002 Keeping up with “More Moore” R&D Versus Revenue. A Real Crisis

106 Projected Annual Growth 5 10 Revenue: 6.5% R&D/E: 12.2% 104 M$ 103 Projected

102 Total Revenue Total R&D (Chip + Equip) 10

1 0 5 0 5 0 ‘6 ‘7 ‘9 ‘0 ‘2

R&D cost rising much faster than revenue “Tripling costs create elitism with very few haves and most have nots”

Michael Liehr cnse.albany.edu (VLSI Research ‘05) Industry Trend - Clustering

Fraunhofer, GF, Infineon GlobalFoundries CNSE IBM IMEC Leti, STM, NXP NEC Sematech Freescale SELETE, ASET TSMC Samsung

GlobalFoundries

Global R&D Competition Drives the Industry Clustering Effect Locations capable of leading-edge 300mm logic R&D: State government funded: CNSE, Federal (+ State) government funded: IMEC, Leti, Fraunhofer, Selete (Mirai), Industry proprietary: Intel, IBM JDA, Taiwan (TSMC/UMC), South-Korea (Samsung)

Michael Liehr cnse.albany.edu Nano-Fabrication Technology Drives the next Industrial Revolution

More than Moore: Diversification Opening the field to Integrated Anal./Digit. Sensors Biochips Optoelec. Wireless HV Power Passives Conversion Actuators fluidics Integration smaller players in Interacting with people 130nm and environment cooperative models 90nm Non-digital content Com System-in-package bi ni (SiP) 65nm ng S oC Information a 45nm nd Sensors Processing S E iP X Digital content : H P 32nm ighe A Photonics System-on-chip N More Moore: Miniaturization Moore: More r D V II 22nm al N (SoC) ue G S Biological ys

Baseline CMOS: CPU, Memory, Logic Memory, CPU, CMOS: Baseline t em s 25 nm Nano 15nm Y T I L Fluidics A 10nm N O 50nm 15nm I Prototype T Wireless Prototype Prototype C (DRC 2003) N (IEDM2002) (IEDM2001) U F Mechanical

(Source: 2005 ITRS) Frank Robertson, Intel Manager External Programs Michael Liehr cnse.albany.edu Albany Symposium, Lake George 2004 High Tech Education A U.S. National Economic Crisis

16.0 14.4 National Science Foundation: 13.4 “U.S. needs 2 million nano- tech savvy workers by 2014.”

6.8 Is enough being done? 5.8 4.7 Not by a long shot! ‘92 ‘02 ‘12

U.S. High Tech Jobs (Millions) U.S. High Tech All High Tech Industries High End Industries Source: Federal Bureau of Labor Statistics Michael Liehr cnse.albany.edu The CNSE Paradigm Integrated Set of Four Metrics for Success

Cross Disciplinary Intellectual State-of-the-art Assets Infrastructure

CN SE

Leveraged Life Long Public- Learning Private Educational Partnerships Programs

Michael Liehr cnse.albany.edu CNSE Cross-Disciplinary Mission

CNSE is dedicated to nanotechnology with constellations in:  Nanoscience  Nanoengineering  Nanobioscience Vision Leverage combined resources to  Nanoeconomics establish effective partnerships that will enable realization of industry technology roadmaps and pioneering nanoscale research.

Mission Create a financially and 5 m Nanoscale Science technically competitive environment to

SiO2 Nanobioscience empower the industry

Carbon 4 nm with manufacturing advantages through Nanotube Pt Nanoscale Engineering vertically integrated partnerships. Nanoeconomics

Michael Liehr cnse.albany.edu Shared State-of-the-Art Facilities

NanoFab 300 South 2  800K ft2 facilities $50M, 150K ft NanoFab 300 Central NanoFab 300 North 32K Cleanroom $50M, 100K ft2 2 2 Completed: 3/04 $175M, 228K ft  80K ft 300mm cleanrooms 15K Cleanroom 35K Cleanroom Completed: 1/09 Completed: 12/05  $5.5B investments  2500+ R&D jobs on site  Expansion plans NanoFab 200 $16.5M, 70K ft2 4K Cleanroom Completed: 6/97

NanoFab 300 East $100M, 250K ft2 Completed: 3/09

Michael Liehr cnse.albany.edu State-of-the-Art Wafer Processing Capability

• Full complement of state-of-the-art 300mm wafer tools

• Designed for 32nm node & beyond but  Unit process, module and full flow capability.  Compatible with previous generations:  65nm industry-standard low-power process

• Capacity of 25 integrated wafer starts per day.  24/7 operation  Capacity upgrades readily possible

193 nm immersion EUV Alpha Demo Tool scanner, NA 1.2

Michael Liehr cnse.albany.edu CNSE Alliance Model

Michael Liehr cnse.albany.edu SEMATECH’s Role

 Lead industry-wide initiatives  Set industry direction by building industry consensus and driving large industry projects  Develop infrastructure and standards Next generation to bridge R&D to manufacturing factories  New / improved tools, materials, processes Next generation Materials and tool technologies development  Manufacturability is the driver for technical programs  Drive manufacturing productivity and cost reduction ITRS Standards  Develop leading-edge technology Roadmap development  Foundation for industry breakthroughs

Source: Sematech Michael Liehr cnse.albany.edu SEMATECH Success Factors

 Commitment from top level executives, long-term support  Industry and government champions  Industry leadership  Government-industry-university partnership  A clear, pre-competitive mission  Accelerate commercialization by addressing common challenges, per industry roadmap • Building technology infrastructure • Strengthening manufacturing base  Broad representation of industry, broad network of partners  Chipmakers and universities, national labs (Sandia, NIST), research institutes, equipment/materials manufacturers  Leveraging of government and industry funds  Member-driven organization  Assignees

Source: Sematech Michael Liehr cnse.albany.edu Equipment Development Center @ CNSE

EDC CNSE Equipment Suppliers  Leading edge process technology A  World class lithography capability  Integrated device builds B CNSE wafers  Inline E-test data delivery C  State-of-the-art metrology / test  Tools / base flows SPC controlled D  Proven track record of productivity E and IP protection  Leading partners – IBM, Sematech  Equipment development EUV Exposure Center Under discussion  Demo capability on integrated wafers  High volume capability  Access to world-class metrology  Access to advanced materials

Michael Liehr cnse.albany.edu IBM Joint Development Partnership Albany’s Role

IBM Semiconductor Technology Development Model Common Platform Manufacturing Model

Packaging

Advanced Fundamental Technology Design Semiconductor Worldwide Research Development center collaborators R&D Manufacturing Design Compatibility Reference Screen new Innovation in Multi-company Process design flows materials & integrated device co-located joint synchronized processes & process development fabricators technology (GDSII compatible) GDSII Libraries Foundry bulk Compatibility and IP Patterning solutions Equipment IBM, Chartered, Foundry bulk High-k / metal gate Applied Materials, Samsung, Device structures ASML, Tokyo IBM, Chartered Infineon, & Samsung Technology design kits Stress techniques Electron Freescale, Interconnects STMicro Ultra low-k Research High perf. SOI Process and Packaging IBM, GF, Toshiba, High perf. SOI IBM & Chartered Manufacturing Design manual STMicro, Freescale IBM, GF, SPICE models Freescale Compatibility

IBM Almaden & Albany Nanotech IBM East Fishkill USA, Korea, 90 nm, 65 nm, 45 nm, Yorktown Center Singapore 32 nm process platforms

• Proprietary research and development • Shared infrastructure • Joint programs Source: IBM Michael Liehr cnse.albany.edu CNSE Proof-of-Concept Chip Strategy

Testbeds and Infrastructure Development  Built on current and future open source masksets  Multi-Project-Wafer (MPW) Concept – university / SME opportunity  Offering to start with 65nm industry standard bulk low- VB300 E-beam Litho power technology Minimum CD, 15 nm +/- 10% at 100 um field • Radio-frequency (RF) enabled

In-house / Partner  32nm capability under development Libraries and IP License model  Personalization options Mask build Partner  Tech transfer support into volume manufacturing Tape-out Partner Enablement (kit) Partner

Models Buy / Build capability BEOL Characterization Build capability / Partner Test_ARRAY Groundrules, design manual Build capability Reliability In-house Feature development In-house / Partner Device Test 1 MB Arrays 1 MB Yield Management In-house / Partner SRAM SRAM Integration In-house / Partner OPC Partner PFA In-house Process Development In-house / Partner Equipment suppliers Partner / In-house Materials suppliers Partner / In-house

Michael Liehr cnse.albany.edu 3D Integration

 The next step in subsystem integration Metrology  The convergence of Silicon & Packaging  Stepping stone for “More than Moore”

Xray tomography (via voids)

 Core packaging capability  3Di w/ multi-wafer chip stack for 32 / 22 nm nodes Infrared  Far-BEOL semiconductor processing & C4 bump Scanning Microscopy  Module bond, assembly & test Acoustic Microscopy

3DI Process Flow Wafer – Wafer Bonding

Combine partner silicon and packaging R&D teams Ion beam image Bond interface Electron beam image to focus and develop the 3D Unit Process and Void free Cu filled TSVs Integrated flow.

Michael Liehr cnse.albany.edu System-Level Operational Model

F I Traditional E NTEMS MOP SIC L D

I N Virtual IDM T Model NT EMS MOP SIC E G R A T I IDM Model NT MOP O EMS SIC N

NanoTech Co.’s Equip. & Material MEMS, Opto, System Integration (NT) Suppliers (EMS) Power… (MOP) Co.’s (SIC)

Michael Liehr cnse.albany.edu SRC and Sematech CNSE Strategy

SRC / NRIs SEMATECH

Novel Materials Infrastructure (Equipment, ESH) Device Concepts / Metrology Architectures Tool Development Metrology Development Exploratory Devices Reliability Mechanisms Module Integration Early Reliability

CNSE Faculty CNSE Engineering

Novel Materials Process Development Metrology CoC Integration and Derivatives NRI Participation / Leadership Early Prototyping Metrology / FA Services

10/20 9 7 5 3 1 0 Years to Manufacturing Semiconductor Space 3D and Packaging Space

Michael Liehr cnse.albany.edu SRC Nanoelectronics Research Initiative Finding the Next Switch Mission: Demonstrate novel computing devices capable of replacing the CMOS FET as a logic switch in the 2020 timeframe . Find devices that show significant advantage over ultimate FETs and enable the industry to extend the historical cost and performance trends of scaling . Leveraging industry, university, and both state & fed government funds, and driving university nanoelectronics infrastructure

Notre Dame Purdue Illinois-UC Penn State Michigan UT-Dallas SUNY-Albany GIT Harvard Cornell GIT Purdue RPI Columbia Caltech MIT NCSU Yale UVA

Over 30 Universities in 20 States Columbia Harvard Purdue UVA Yale UC Santa Barbara Stanford UC Los Angeles Notre Dame UC Berkeley U. Nebraska/Lincoln UC Irvine U. Maryland UC Santa Barbara Cornell Stanford Illinois UC Caltech U Denver UC Berkeley Portland State UT-Austin Rice Texas A&M MIT U Iowa UT-Dallas ASU Notre Dame Northwestern U. Maryland NCSU Illinois UC Brown Source: Michael Liehr cnse.albany.edu U Alabama SRC Nanobioscience Biological systems are inherently nano in scale. Nanobioscience combines the tools, ideas and materials of nanoscience to address biologically relevant questions. Cancer Stem Cells Diagnostics Drug Delivery Biosensors Prosthetics Medical Devices

Michael Liehr cnse.albany.edu CNSE. The Educational Programs

M.S./Ph.D. in M.S./Ph.D. in Nanoscience; Nanoscience and M.S./Ph.D. in Undergraduate Nanoengineering Nanoengineering Nano-Engineering

09/04 09/05 09/06 01/10 TBD

Dual M.S. in Undergraduate Nanotechnology Nanoscience Degrees Management (”Nano-MBA”)

Michael Liehr cnse.albany.edu Preparing the Technical Workforce “GetNANO”

● Partners: Hudson Valley Community College and CNSE.

● Provides HVCC students with hands- on training in CNSE’s cleanroom facilities.

● Makes New York’s workforce “tech- ready:” operate complex equipment in tech plants.

Michael Liehr cnse.albany.edu Summary

 “More Moore” has led to an industry consolidation. • Government-university-industry collaboration models are required in this increasingly complex and costly ecosystem. • Ease of transfer into manufacturing is key to accelerating R&D timelines. • SRC and Sematech play vital roles in providing novel concept pipelines and pre- manufacturing / infrastructure learning.

 “More than Moore” opens opportunities for SME partnership models. • Technological breakthroughs driven by smaller players have significant impact potential. • We expect game-changing developments in applying Nanotechnology to energy, biomedical and urban infrastructure. • The US must maintain a vibrant infrastructure in this field.

 Government-university-industry collaboration models have to provide education and training for future technical leaders • We have to inform and encourage support in the general population.

Michael Liehr cnse.albany.edu