Intel® Celeron® M Processor 530

Addendum to ® Celeron® M Processor 500 Series for Mobile Intel® 945 Express Chipset Family Datasheet

August 2007

Order Number: 317984-001US INFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. The product described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Hyper-Threading Technology requires a computer system with an Intel® ® 4 processor supporting HT Technology and a HT Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See http://www.intel.com/ products/ht/Hyperthreading_more.htm for additional information. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://developer.intel.com/technology/architecture-silicon/intel64/. BunnyPeople, Celeron, Celeron Inside, , Centrino logo, Core Inside, Dialogic, FlashFile, i960, InstantIP, Intel, Intel logo, Intel386, Intel486, , IntelDX2, IntelDX4, IntelSX2, , Intel Inside, Intel Inside logo, Intel. Leap ahead., Intel. Leap ahead. logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel Viiv, Intel vPro, Intel XScale, IPLink, , Itanium Inside, MCS, MMX, Oplus, OverDrive, PDCharm, Pentium, Pentium Inside, skoool, Sound Mark, The Journey Inside, VTune, , and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2007, Intel Corporation. All Rights Reserved.

Intel® Celeron® M Processor 530 Datasheet Addendum August 2007 2 Order Number: 317984-001US Contents

1.0 Introduction ...... 5 1.1 Terminology ...... 6 1.2 References ...... 6 2.0 Package Mechanical Specifications Addendum...... 7 2.1 Processor Component Keep-Out Zones...... 7 2.2 Package Loading Specifications ...... 7 2.3 Processor Mass Specifications ...... 7 3.0 Thermal Specifications Addendum ...... 13

Figures 1 1-MB Configuration Micro-FCPGA Processor Package Drawing (1 of 2) ...... 8 2 1-MB Configuration Micro-FCPGA Processor Package Drawing (2 of 2) ...... 9 3 1-MB Configuration Micro-FCBGA Processor Package Drawing (1 of 2) ...... 10 4 1 MB Configuration Micro-FCBGA Processor Package Drawing (2 of 2) ...... 11

Tables 1 Thermal Specifications ...... 13

Intel® Celeron® M Processor 530 August 2007 Datasheet Addendum Order Number: 317984-001US 3 Intel® Celeron® M Processor 530

Revision History

Date Revision Description

August 2007 001 Initial release

Intel® Celeron® M Processor 530 Datasheet Addendum August 2007 4 Order Number: 317984-001US Introduction

1.0 Introduction

This document is an addendum to the Intel® Celeron® M Processor 500 Series for Mobile Intel® 945 Express Chipset Family Datasheet.

The purpose of this addendum is to document the mechanical packaging and thermal features specific to the Intel® Celeron M processor 530 and available only to Intel embedded customers. Please refer to the master Intel® Celeron M Processor 500 Series Datasheet for all other specifications relating to this processor.

In this document, the Intel® Celeron® M Processor 530 will be referred to as the processor.

The following list provides some of the key features of this processor: • Supported by the Intel® 945 Express Chipset Family •Single Core • On-die, primary 32-kB instruction cache and 32-kB write-back data cache • On-die, 1-MB second level shared cache with Advanced Transfer Cache Architecture • 533-MHz Source-Synchronous Front Side Bus (FSB) • Supports Intel Architecture with Dynamic Execution • Data Prefetch Logic • Supports both Micro-FCPGA and Micro-FCBGA packaging technology • MMX, Streaming SIMD Extensions (SSE), Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3), and Supplemental Streaming SIMD Extensions 3 (SSSE3) • Digital Thermal Sensor (DTS) • Execute Disable Bit support for enhanced security • Intel® 64 architecture (formerly Intel® EM64T) • Architectural and performance enhancements to the Core micro-architecture.

Note: Intel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel 64. The processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http:// developer.intel.com/technology/architecture-silicon/intel64/ for more information including details on which processors support Intel 64 or consult with your system vendor for more information.

Note: Unless specified otherwise, all references to the processor in this document are references to the Intel Celeron M processor 530 with a 533-MHz FSB.

Intel® Celeron® M Processor 530 August 2007 Datasheet Addendum Order Number: 317984-001US 5 1.1 Terminology

Term Definition

Refers to the interface between the processor and system core logic (also known as Front Side Bus (FSB) the chipset components).

Intel® 64 64-bit memory extensions to the IA-32 architecture.

FCPGA Micro flip-chip Package

FCBGA Micro flip-chip Ball Grid Array Package

1.2 References

The following documents should be used as references for this document:

Document Order Number1

Intel® Celeron® M 500 Series For Mobile Intel® 945 Express Chipset Family 316205 Datasheet

§ §

Intel® Celeron® M Processor 530 Datasheet Addendum August 2007 6 Order Number: 317984-001US Package Mechanical Specifications Addendum

2.0 Package Mechanical Specifications Addendum

The processor is available in two packages: 478-pin Micro-FCPGA and 479-pin Micro- FCBGA. Package mechanical dimensions are shown in Figure 1 through Figure 4 and provide details on processor keep-out zones, package loading specifications, and processor mass specifications.

2.1 Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep- out zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted in the keep- out areas. The location and quantity of the capacitors may change but will remain within the component keep-in. See Figure 2 and Figure 4 for keep-out zones.

2.2 Package Loading Specifications

Maximum mechanical package loading specifications are given in Figure 1 and Figure 3 for the Micro-FCPGA and the Micro-FCBGA packages respectively. These specifications are static compressive loading in the direction normal to the processor. This maximum load limit should not be exceeded during shipping conditions, standard use condition, or by the thermal solution. In addition, there are additional load limitations against transient bend, shock, and tensile loading. These limitations are more platform specific and should be obtained by contacting your field support. Moreover, the processor package substrate should not be used as a mechanical reference or load-bearing surface for the thermal or mechanical solution.

2.3 Processor Mass Specifications

The typical mass of the Micro-FCPGA and the Micro-FCBGA packages are given in Figure 1 and Figure 3. This mass includes all the components that are included in the package.

Intel® Celeron® M Processor 530 August 2007 Datasheet Addendum Order Number: 317984-001US 7 Figure 1. 1-MB Configuration Micro-FCPGA Processor Package Drawing (1 of 2)

G1 H B B1 1

G2 C2 B2

H2

J2 J1 C1 A Bottom View Top View

478 Pins

A Front View

MILLIMETERS SYMBOL COMMENTS Side View MIN MAX B1 34.95 35.05 B 34.95 35.05 Die 2 Underfill C1 10.5 Package Substrate C2 13.8

F2 0.89 F 0.37 MAX 3 1.903 2.163 F 2 G1 31.75 BASIC F3 G2 31.75 BASIC 0.65 MAX H1 15.875 BASIC H2 15.875 BASIC ø0.356 M CAB ø0.254 M C 2.03±0.08 C J1 1.27 BASIC

J2 1.27 BASIC P 0.255 0.355 0.65 MAX oP P DIE 689 kPa Detail A W 6g Scale 20 Keying Pins A1, A2

B6150-01

Intel® Celeron® M Processor 530 Datasheet Addendum August 2007 8 Order Number: 317984-001US Package Mechanical Specifications Addendum

Figure 2. 1-MB Configuration Micro-FCPGA Processor Package Drawing (2 of 2)

4X 7.00

4X 7.00

4X 5.00 Side View Edge Keep Out Corner Keep Out Zone 4X Zone 4X Top View

ø0.305±0.25 13.97 ø0.406 M CAB ø0.254 M C 1.625 6.985

1.625

13.97

6.985

1.5 Max Allowable Component Height Bottom View

B6210-01

Intel® Celeron® M Processor 530 August 2007 Datasheet Addendum Order Number: 317984-001US 9 Figure 3. 1-MB Configuration Micro-FCBGA Processor Package Drawing (1 of 2)

G1 B B 1 B H1

G2 C2 B2

H2

J2

C J1 1 A Bottom View Top View 479 Balls

M

A Front View Detail B Scale 50

MILLIMETERS SYMBOL COMMENTS MIN MAX B1 34.95 35.05

B2 34.95 35.05 C Side View 1 10.5 C2 13.8

F2 0.89

F3 1.903 2.163 Die Underfill G1 31.75 BASIC Package Substrate G2 31.75 BASIC

H1 15.875 BASIC ø0.203 L CAB F2 ø0.071 L H2 15.875 BASIC F3 C J1 1.27 BASIC

J2 1.27 BASIC N M 0.61 0.69 0.203 N 0.6 0.8 Detail A P DIE 689 kPa Scale 20 W 6g

B6597-01

Intel® Celeron® M Processor 530 Datasheet Addendum August 2007 10 Order Number: 317984-001US Package Mechanical Specifications Addendum

Figure 4. 1 MB Configuration Micro-FCBGA Processor Package Drawing (2 of 2)

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. 4X 7.00 4X 7.00

4X 5.00 Side View Edge Keep Out Corner Keep Out Zone 4X Zone 4X Top View

13.97 1.625 6.985

1.625

13.97

6.985

0.55 Max Allowable Component Height Bottom View B6598-01

§ §

Intel® Celeron® M Processor 530 August 2007 Datasheet Addendum Order Number: 317984-001US 11 Thermal Specifications Addendum

3.0 Thermal Specifications Addendum

A complete thermal solution includes both component and system level thermal management features. The processor requires a thermal solution to maintain temperatures within operating limits.

Caution: Any attempt to operate the processor outside operating limits may result in permanent damage to the processor and potentially other components in the system.

The system/processor thermal solution should remain within the minimum and maximum junction temperature (Tj) specifications at the corresponding thermal design power (TDP) value listed in Table 1.

Table 1. Thermal Specifications

Core Processor Die Thermal Design Symbol Frequency Unit Notes Number Variant Power & Voltage

TDP 530 1.73GHz 1M Configuration 31 W 1,2,3,4

Note: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 3. At Tj at 100°C 4. The units will display processor family ID 06F6h

§ §

Intel® Celeron® M Processor 530 August 2007 Datasheet Addendum Order Number: 317984-001US 13