october 2016 Vol. 23, No. 4 ISSN: 1074 1879 Editor-in-Chief: M.K. Radhakrishnan

Table of Contents e c h n i c a l r i e f s TECHNICAL BRIEFS...... 1 T B • Emergence of Memtronics: From Memory to Sensor, Logic and Display • EDS Tutorials at Semicon West 2016 Emergence of Memtronics: UPCOMING TECHNICAL MEETINGS...... 7 From Memory to Sensor, • 2016 IEEE International Electron Devices Meeting (IEDM) Logic and Display • 2017 IEEE Electron Devices Technology and ­Manufacturing Conference (EDTM) Muhammad Masuduzzaman and Muhammad Ashraful Alam • 2017 IEEE International Memory Workshop (IMW) Purdue University, West Lafayette, IN 47907, USA SOCIETY NEWS...... 12 • Message from EDS President-Elect • Message from the Editor-in-Chief Memory materials have recently been used not only in data • Message from EDS Vice President of Publications storage, but also in emerging applications in data sensing, • EDS VLSI Technology and Circuits Technical processing and display. What properties do these bistable ­Committee • IEEE/OSA Journal of Display Technology (JDT) materials have that attract their pervasive use in all the • Letters to the Editor major functional areas of future electronic devices? • Call for Nomination – EDS Newsletter Information sensing, processing, storing, and displaying are the four Editor-in-Chief fundamental functions of electronic devices. Whether it is a transistor Award Recipients and Call for Nominations for logic operations, a flash memory for data storage, a light emitting • 2015 Paul Rappaport Award Winners diode for display devices, or an ion-sensitive switch for biosensing ap- • 2015 EDS George Smith Award Winners • 2017 William R. Cherry Award – Call for plications, until now these key functional devices have been made of ­Nominations different combinations of metallic/semiconducting/insulating materials. • EDS Members Named Winners of 2016 Recently, however, many of the emerging devices/architectures [1] are IEEE Medals and Awards • EDS Members Recently Elected to IEEE Senior beginning to use bistable (non-volatile) memory materials or analo- Member Grade gous bistable structures (e.g., NEMS) to achieve superior performance. • 2014–2015 EDS Region 9 Outstanding Student These include neuromorphic [2] and logic-in-memory architectures Paper Award • Announcement of the EDS Masters Student [3], nanomagnetic and spintronic devices [4, 5], negative capacitance Fellowship Winners transistors [6], NEMS switch [7], atomic switch [8], correlated electron • Announcement of the EDS PhD Student devices [9], electrophoretic and other bistable passive displays [10–12], Fellowship Winners bifurcation based chemical and biosensors [13, 14], etc. A close ex- YOUNG PROFESSIONALS ...... 24 amination reveals that such widespread use of memory structures • Reflections from EDS Young Professionals in data sensing, processing, storing and displaying (as we refer by • EDS-ETC Programs • IEEE Technical Community Spotlight the term “memtronics”, signifying memory electronics) is not a mere • EDS Webinar on Nanometer-Scale III–V CMOS coincidence. In the following, we will list a few intrinsic properties of • Learn More About QuestEDS these materials that encourage their ubiquitous use in such a broader CHAPTER NEWS...... 32 range of applications. • IEEE Spokane Celebrates 103 Years of Activity (1) A binary logic device works by defining two states that are iso- • Inaugural Event of the EDS/SSCS Hawaii Chapter lated by an “energy barrier” created by some physical means MQs, DLs and Conference Reports within the system [15, 16]. The input information conditionally REGIONAL NEWS...... 47 (continued on page 3) EDS Meetings Calendar...... 55 Your Comments Solicited Your comments are most welcome. Please write directly to the Editor-in-Chief of the Newsletter at [email protected] ELECTRON DEVICES NEWSLETTER SOCIETY EDITORIAL STAFF

President Vice President of Publications Editor-In-Chief Samar Saha and Products M.K. Radhakrishnan Prospicient Devices Hisayo Momose NanoRel E-mail: [email protected] Yokohama University E-mail: [email protected] E-mail: [email protected] President-Elect Fernando Guarin Vice-President of Regions/ REGIONS 1-6, 7 & 9 UK, Middle East & Africa GlobalFoundries Chapters Eastern, Northeastern & South- Jonathan Terry E-mail: [email protected] M.K. Radhakrishnan eastern USA (Regions 1,2 & 3) The University of Edinburgh NanoRel Mukta Farooq E-mail: [email protected] Treasurer E-mail: [email protected] GlobalFoundries Subramanian S. Iyer E-mail: mukta.farooq@ Western Europe UCLA Vice President of Technical globalfoundries.com Jan Vobecky E-mail: [email protected] Committees & Meetings Abb Switzerland Ltd. Central USA & Canada Ravi Todi E-mail: [email protected] (Regions 4 & 7) Secretary GlobalFoundries E-mail: [email protected] Karim S. Karim Simon Deleonibus University of Waterloo REGION 10 CEA-LETI E-mail: [email protected] Australia, New Zealand & E-mail: simon.deleonibus.1992@ IEEE Newsletters South East Asia ieee.org Theresa Smith Southwestern & Western USA P Susthitha Menon IEEE Operations Center (Regions 5 & 6) Universiti Kebangsaan Jr. Past President E-mail: [email protected] Kyle H. Montgomery Malaysia Albert Z.H. Wang Air Force Research Laboratory E-mail: [email protected] University of California, Riverside Operations Director E-mail: [email protected] E-mail: [email protected] James Skowrenski Latin America (Region 9) Northeast Asia IEEE Operations Center Joao Antonio Martino Kuniyuki Kakushima E-mail: [email protected] Sr. Past President University of Sao Paulo Tokyo Institute of Technology Paul K.L. Yu E-mail: [email protected] E-mail: [email protected] University of California at San Diego Membership Administrator E-mail: [email protected] Joyce Lombardini REGION 8 East Asia IEEE Operations Center Eastern Europe Ming Liu E-mail: [email protected] Vice President of Membership Daniel Tomaszewski Institute of Microelectronics and Services Institute of Electron Technology E-mail: [email protected] Tian-Ling Ren E-mail: [email protected] Tsinghua University Scandinavia & Central Europe South Asia E-mail: [email protected] Mariusz Orlikowski Manoj Saxena Lodz University of Technology University of Delhi E-mail: [email protected] E-mail: [email protected] IEEE prohibits discrimination, harassment, and bullying. For more information, visit http://www.ieee.org/web/aboutus/whatis/policies/p9-26.html.

EDS Board of Governors (BoG) Contributions Welcome Elected Members-at-Large Elected for a three-year term (maximum two terms) with ‘full’ voting privileges Readers are encouraged to submit news items concerning the Society and its members. Please send your ideas/articles directly to either Editor- 2016 Term 2017 Term 2018 Term in Chief or the Regional Editor for your region. The e-mail addresses of all Regional Editors are listed on this page. E-mail is the preferred form of A. Escobosa (2) Z. Celik-Butler (2) N. Bhat (1) submission. R. Huang (1) S. Chung (2) D. Camacho Montejo (2) Newsletter Deadlines L. Lunardi (1) M. Farooq (1) S. Deleonibus (1) M. Ostling (2) P. Fay (1) M. Ieong (1) Issue Due Date M.K. Radhakrishnan (2) C. Lilley (1) M. Polavarapu (1) J. Swart (1) D. Misra (1) R. Todi (1) January October 1st X. Zhou (2) H. S. Momose (1) D. Verret (2) April January 1st T.L. Ren (2) July April 1st October July 1st

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IEEE Electron Devices Society Newsletter (ISSN 1074 1879) is published quarterly by the Electron Devices Society of the Institute of Electrical and Electronics Engineers, Inc. Headquarters: 3 Park Avenue, 17th Floor, New York, NY 10016-5997. Printed in the U.S.A. One dollar ($1.00) per member per year is included in the Society fee for each member of the Electron Devices Society. Periodicals postage paid at New York, NY and at addi