REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT Advanced System-in-Package Technology in the Apple AirPods Pro Packaging report by Belinda DUBE Laboratory Analysis by Youssef EL GMILI March 2020 – SAMPLE 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16
[email protected] www.systemplus.fr ©2020 by System Plus Consulting - SP20471 - Advanced System-in-Package Technology in the Apple AirPods Pro - Sample 1 Table of Contents Overview / Introduction 4 Manufacturing Process 145 o Executive Summary o Global Overview o Reverse Costing Methodology o Dies Front-End Process & Fabrication Unit Company Profile 8 o Packaging process Flow o Apple o Audio Module Packaging Process Flow o Physical Analysis 17 Bluetooth Module Packaging Process Flow o Full Assembly Process Flow o Summary of the Physical Analysis 29 Cost Analysis 195 o AirPods Pro TearDown 30 o Summary of the cost analysis o Audio Module System Assembly 34 o Yields Explanation & Hypotheses Module Views & Dimensions: o H1 Die Front End 203 Optical, X-Ray, Opening o Module Cross-Section: H1 Die Cost Dimensions, Internal Shielding, PCB Substrate o H1 Component Cost and Price o Audio Module 50 o Audio Module Packaging Panel Cost 208 Overview o Audio Module Process steps Audio Code Physical Analysis o Audio Module Component Cost Operation Amplifier Physical Analysis o Bluetooth Module Packaging Panel Cost 211 Audio Amplifier Physical Analysis o Bluetooth Module Process steps Touch Controller Physical Analysis LED Driver Physical Analysis o Bluetooth Module Component