Computer-On-Modules
ADLINK We Know COM Express
Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1. The table on the several advantages: following page shows the features for modules defined in • The carrier can contain more rugged types of connectors for revision 1 of the COM Express specification. external I/O. It is not limited to traditional connectors such as USB, Ethernet, and video. COM.0 Rev. 2.0 – Future Proof • The carrier can contain value added silicon such as FPGAs or other In 2009, PICMG formed a subcommittee to update the COM types of peripherals. Placing these devices on the carrier Express specification based on the changes in peripherals eliminates the need for traditional PCI Express or PCI expansion used in modern systems. This included support for Super cards and the mechanics associated with them. Speed USB 3.0, PCI Express Gen 2 signaling, as well as • The CPU function is decoupled from the I/O so that different additional video interfaces such as DVI, HDMI and processors can be used for different applications, ranging from low DisplayPort. The spec update created two new types to power and cost Atom™ based compute modules to Core™ i7 or support the I/O changes: type 6 and 10. Backwards other high performance multicore processor modules. compatibility with existing type 2 and 1 modules was a main • The design and maintenance of the compute module no longer objective of the specification update. becomes a task for the OEM. • The use of industry standard modules brings with it availability from multiple vendors which provides alternative solutions.
1-1 http://www.adlinktech.com/Computer-on-Module COM Express pinout types and supported features New with COM.0 Rev. 2.0 –
PCI Type 6 and Type 10 Pinouts PEG/ IDE SATA LAN USB 2.0 / Display Types Express PCI SDVO Ports Ports Ports USB 3.0 Interfaces Lanes The release of COM Express™ COM.0 Revision 2.0 brings
Type 1 Computer-on-Modules in line with current and future AB Up to 6 – – – 4 1 8 / 0 VGA, LVDS technology trends by providing for the latest graphics connector interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, Type 2 VGA, LVDS, AB/CD Up to 22 1/2 32-bit 1 4 1 8 / 0 and SuperSpeed USB 3.0. The new Type 6 pinout is based PEG/SDVO connectors on the popular Type 2 pinout, but with legacy functions Type 3 replaced by Digital Display Interfaces (DDI), additional PCI VGA, LVDS, AB/CD Up to 22 1/2 32-bit – 4 3 8 / 0 PEG/SDVO Express lanes, and reserved pins for future technologies. connectors The new Type 10 pinout is based on the Type 1 pinout with Type 6 VGA, AB/CD Up to 24 1/NA – – 4 1 8 / 4 LVDS,PEG, only the A-B connector that is used in the “Ultra” form connectors 3x DDI factor. The Type 10 pinout provides additional flexibility for Type 10 developers by freeing up pins reserved for SATA and PCIe AB Up to 4 –/1 – – 2 1 8 / 0 1x DDI connector for future technologies and using the second LVDS channel, VGA and TV-out pins to support SDVO (via DDI). Both of the □ Rev. 1 Pinouts ■ Rev. 2 Pinouts new Type 6 and Type 10 pinouts support the SPI Interface, The Right Size for the Right Job which was unavailable in COM.0 Rev. 1.0. The COM Express specification also defines three module sizes: the COM Express Type 1 vs. Type 10 comparison Compact Module, Basic Module and the Extended Module. A fourth “Ultra” size module supporting only type 1 and type 10 pinouts has COM Express been presented to PICMG for inclusion in a future release of the COM.0 rev 1.0 specification. AB 125 mm Type 1
Control LVDS & B LPC Bus CRT TV Miscella 5Vsb 12V Basic 125 x 95 4x 8x 6x Channel B neous Audio SATA USB2.0 PCIe x1 GbE LAN LVDS Control & 12V Type 2/6 compatible pinout A Channel A Miscellaneous Basic 95 mm COM Express COM.0 rev 2.0
Type 10 AB 95 mm
FAN & Control SDVO SM & 5Vsb 12V B LPC Bus select Miscella 2x RS 8x 4x RS Sing Channel neous Compact 95 x 95 Audio total SATA VD VD SPI amount USB2.0 PCIe x1 LVDS Control & 2 Serial of pins A GbE LAN TPM, reduced Type 2/6 compatible pinout Channel A Miscellaneous Type ID Compact 95 mm COM Express Type 2 vs. Type 6 comparison
COM Express 84 mm COM.0 rev 1.0 Ultra 84 x 55 Ultra Type 1/10 compatible pinout Type 2 CD
55 mm AB
D PATA IDE PCI Bus PCIe x16 (or SDVO) 12V C
Control ADLINK – We Know COM Express LVDS & B LPC Bus CRT TV Miscella 5Vsb 12V 4x 8x 6x Channel B neous Audio SATA USB2.0 PCIe x1 GbE LAN LVDS Control & 12V Although many companies develop COM Express modules, A Channel A Miscellaneous most are not actively involved in the development of the COM Express specification. In contrast, ADLINK has heavily invested in COM Express the development and maintenance of the PICMG COM Express COM.0 rev 2.0 specification over the years. ADLINK recently chaired the PICMG
subcommittee that was tasked with defining the specification Type 6 CD update known as COM Express COM.0 Revision 2.0. As a AB
leading participant in the creation of the specification, ADLINK is D USB 3.0 DDI 1 extended 2x DP, HDMI DDI 2 DDI 3 DP, HDMI DP, HDMI PCIe x16 12V signaling to PCIe x1 or upgrade four SDVO in a unique position to influence its direction. By doing so, ADLINK C USB 2.0 ports
has a deep understanding of the meaning and intention of the FAN & Control LVDS SPI & LPC Bus CRT select Miscella 5Vsb 12V B Channel B neous 4x 8x 6x total Audio amount specification and applies this knowledge in the design of our COM SATA SPI USB2.0 PCIe x1 LVDS Control & 2 Serial of pins A GbE LAN TPM, reduced Express products. Channel A Miscellaneous Type ID
1-2 Computer-On-Modules
The Economics of Modularity Drivers and BSP Reusability is key to protection of your investment. Computer-On- All modules come standard with BSP’s for Windows CE, Windows Module offer it all, from reusable design, scalability and fast time to XP Embedded, Linux, and VxWorks. Support for additional the market to a lower total cost of ownership. components on your application specific carrier board under the above operating systems can be developed on request. Green because we care We provide lead-free designs not only to satisfy future regulatory standards but also to reflect our real concern about the environ- ment – an environment that has to be shared by all of us. Proof of ADLINK’s commitment is with ISO-14001 certification. ISO-14001, Longevity is Designed in the international environmental management standard is a voluntary ADLINK’s COM modules represent an optimized Total Cost of initiative aimed at improving company environmental performance. Ownership. They have longevity designed in by only using components from the embedded roadmaps of strategic suppliers Expertise for Carrier Board Design Support that are backed by value-added technical services such as life cycle management, revision control and end-of-life (EOL) support. With product divisions that are front runners in fields such as: Data Acquisition, Test and Measurement, AdvancedTCA, CompactPCI and Video Surveillance, ADLINK can offer you a broad portfolio of Manufacturing and Quality technical knowledge to assist you in your application specific carrier ADLINK has its own SMT production line that supports the board projects. production of leadfree products. ADLINK has been ISO-9001 certified since Many 1999. ADLINK also adheres to 6 Sigma, a set Firmware Support (BIOS) of statistics and methods for improving everything a company does, from designing, manufacturing to service. By applying the rigorous Adding active components to the carrier boards usually requires a practices of 6 Sigma, we’ve been approved by industry-leading BIOS modification. We offer a whole team of BIOS engineers who partners, and achieved breakthroughs in quality performance to can extend and tune the firmware on our boards to let them behave deliver better services to our customers. exactly the way you want. We use the AMIBIOS8® provides us with excellent embedded functions such as: custom logo, OEM CMOS defaults, flat panel control, serial port console redirection, CMOS backup and trusted core support.
1-3 http://www.adlinktech.com/Computer-on-Module Selection Guide COM Express™
Basic (125 x 95 mm) Type 6 Type 2
Express-HR Express-CB/CBE Express-MV Express-MG CPU Type Intel® Core™ i7/i5 (Sandy Bridge) Intel® Core™ i7/i5/i3 (Arrandale) Intel® Core™2 Duo (Penryn) Intel® Core™2 Duo (Penryn) up 2.53 GHz with 6 MB L3 cache up 2.53 GHz with 4 MB L2 cache up 2.26 GHz with 6 MB L2 cache up 2.53 GHz with 6 MB L2 cache CPU Package BGA1288 BGA1288 BGA956 PGA478 CPU Models / Speeds Core™ i7 (quad core): i7-2715QE; Core™ i3/i5/i7 (Arrandale) i7-610E Celeron® M 722, 723 Celeron® M 575, T3100 (dual core) Core™ i7 (dual core): 620LE 620UE i5-520E i3-330E Core™2 Duo (Penryn) Core™2 Duo (Penryn) i7-2655LE, i7-2610UE, i5-2515E Celeron® M P4505 SP9300, SL9400, SL9380, SU9300 T9400, P8400 FSB Speed 1333/1066 1066/800 1066/800 1066/800 Main Chipset Intel® PCH QM67 Intel® PCH QM57 Intel® GS45 with ICH9M (SFF) Intel® GM45 with ICH9M System Memory 16 GB (max), dual channel 8 GB (max), dual channel 8 GB (max), dual channel 8 GB (max), dual channel Memory Type DDR3 non ECC at 1333 DDR3 non ECC (CB) or ECC (CBE) DDR3 at 1066/800/667 DDR3 at 1066/800/667 Soldered Memory - - - - Socket Memory Max 16 GB on two 200-pin SODIMM Max 8 GB on two 200-pin SODIMM Max 8 GB on two 200-pin SODIMM Max 8 GB on two 200-pin SODIMM Cache (L2) L2 depends on processor type L2 depends on processor type L2 depends on processor type L2 depends on processor type 3MB, 4MB or 6MB 2MB, 3MB or 4MB 1MB, 3MB or 6MB 1MB, 3MB or 6MB BIOS Type AMI EFI, American Megatrend AMI EFI, American Megatrend AMIBIOS®8, American Megatrend AMIBIOS®8, American Megatrend BIOS Features Serial Console redirection Serial Console redirection Serial Console redirection Serial Console redirection EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support BIOS Flash 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI Graphics Controller HD Graphics 3000 GMA HD with 12 execution units Intel® GMA X4500 at 533/320 MHz Intel® GMA X4500 at 533 MHz Graphics Memory Max 829 MB UMA Max 829 MB UMA Max 829 MB UMA Max 829 MB UMA Integrated Display Support CRT (QXGA) CRT (QXGA) CRT (QXGA) CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS (UXGA) 3 DDI ports for HDMI/DVI/DP & SDVO TV-out (PAL/NTSC/HDTV) TV-out (PAL/NTSC/HDTV) External Graphics Bus PCIe x16 Graphics port PCIe x16 Graphics port PCIe x16 Graphics port PCIe x16 Graphics port or SDVO port or SDVO port Compatibillity OpenGL 3.0, DirectX 10.1 OpenGL 2.1, DirectX 10 OpenGL 2.0, DirectX 10 OpenGL 2.0, DirectX 10 Parallel ATA (IDE) one channel, one device one channel, one device one channel, one device one channel, one device Serial ATA two SATA 3 Gb/s, two SATA 6 Gb/s four SATA 3 Gb/s three SATA 3 Gb/s three SATA 3 Gb/s Matrix Storage Support Yes Yes optional optional Ethernet integrated Intel GbE (10/100/1000) integrated Intel GbE (10/100/1000) integrated Intel® GbE (10/100/1000) integrated Intel® GbE (10/100/1000) USB 8 ports USB 2.0 8 ports USB 2.0 8 ports USB 2.0 8 ports USB 2.0 Audio Intel® HD Audio Intel® HD Audio Intel® HD Audio Intel® HD Audio Watchdog Yes Yes Yes Yes TPM Yes, Ver. 1.2 Yes, Ver. 1.2 Yes, Ver. 1.2 Yes, Ver. 1.2 PCI Express Support 6x PCI-Express x1 (or 1 x4) 6x PCI-Express x1 (or 1 x4) 5x PCI-Express x1 (or 1 x4) 5x PCI-Express x1 (or 1 x4) PCIe two x8, x4 or x1 (on PEG) PCI-Express x8, x4 or x1 (on PEG) PCI-Express x8, x4 or x1 (on PEG) PCI-Express x8, x4 or x1 (on PEG) PCI Suport 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz LPC Support Yes Yes Yes Yes Management Bus I2C, SMBus I2C, SMBus I2C, SMBus I2C, SMBus Power 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) Power States S0 S1 S3 S4 S5 S0 S1 S3 S4 S5 S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 Power Consumption TBD 21 W with Core™ i7-620UE at 1.2 18 W with Core™ 2 Duo SU9300 at 23 W with Core™ 2 Duo P8400 at 2.26 GHz and 2 GB memory typical 1.2 GHz and 2 GB memory typical GHz and 2 GB memory typical Operating Temperature 0°C ~ +60°C 0°C ~ +60°C 0°C ~ +60°C 0°C ~ +60°C Extended Temperature TBD selected modules: -20°C ~ +70°C selected modules: -20°C ~ +70°C - Compatibillity PICMG COM.0 R2.0, Type 6 PICMG COM.0 R2.0, Type 2 PICMG® COM Express™ R1.0, Type 2 PICMG® COM Express™ R1.0, Type 2 Dimensions Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Solid State Disk on Module optional SATA SSD 4~16 GB optional SATA SSD 4~16 GB - - BSP & Software Support Windows® XP/Xpe, Windows® 7 Windows® XP/Xpe, Vista, Windows® XP/Xpe, Windows® Vista, Windows® XP/Xpe, Windows® Vista, Linux® 2.6.x, AIDI library Windows® 7 Windows® 7, Windows® CE, Windows® 7, Windows® CE, Linux® 2.6.x, AIDI library Linux® 2.6.x, AIDI library Linux® 2.6.x, AIDI library Page Number 1-7 1-9 1-11 1-13
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M M 373 ® ® XP/Xpe Award Award M (3xx series) ® ® - - - - ® Yes Yes Yes Yes 1-21 GMA 900 ® Pentium 533/400 C, SMBus ® 2 2.6.x, AIDI library I SDVO ports CRT (QXGA) CRT 0°C ~ +60°C ® Intel M: 1.1GHz up to 2.0GHz 915GM with ICH6-M 6 ports USB 2.0 Phoenix HD Audio and AC’97 DDR2 at 400/533 M: 600MHz up to 1.5GHz Express-IA533 Intel ® ® ® Windows Max 128 MB UMA S0, S1, S3, S4, S5 FWH, 4 Mbit Flash 3x PCI-Express x1 3x PCI-Express Celeron two SATA 1.5 Gb/s two SATA ® ® COM Express™ R1.0, Type 2 R1.0, Type COM Express™ ® Linux 2 GB (max), dual channel OpenGL 1.4, DirectX* 9.0 OpenGL 1.4, DirectX* one channel, two devices EEPROM CMOS backup, 512MB soldered onboard 512MB soldered Serial Console redirection Serial Console redirection 0KB, 512KB, 1MB or 2MB 12 W with Celeron Intel Intel 1x PCI-Express x1 (on PEG) 1x PCI-Express Intel 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. L2 depends on processor type type L2 depends on processor USB boot/legacy, PXE support USB boot/legacy, µFC-PGA (socket) or µFC-BGA Max 1 GB on 200-pin SODIMM PCIe x16 Graphics Port, or dual Basic Form Factor (95x125 mm) Dual channel 18-bit LVDS (UXGA) Dual channel 18-bit LVDS Marvell Yukon GbE (10/100/1000) Marvell Yukon 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), TV-out (PAL/NTSC/HDTV) optional (PAL/NTSC/HDTV) TV-out Pentium Celeron at 1.0 GHz and 512 MB DDR2 typical PICMG Vista ® 2.6.x, ® N270 ® - - Atom™ Yes Yes Yes Yes 533 1-19 GMA 950 ® ® CE, Linux C, SMBus ® µFC-BGA 2 AIDI library I Yes, Ver. 1.2 Ver. Yes, CRT (QXGA) CRT 0°C ~ +60°C DDR2 at 533 8, American Megatrend 8, American Megatrend Intel Express-AT XP/Xpe, Windows ® Intel 945GSE with ICH7M 8 ports USB 2.0 HD Audio and AC’97 8 Mbit Flash SPI ® L2 cache 512 KB Single SDVO port ® ® Max 256 MB UMA S0, S1, S3, S4, S5 3x PCI-Express x1 3x PCI-Express two SATA 1.5 Gb/s two SATA Atom™ N270 at 1.6 GHz COM Express™ R1.0, Type 2 R1.0, Type COM Express™ ® 9 W with Atom ® one channel, two devices EEPROM CMOS backup, Serial Console redirection Serial Console redirection TV-out (PAL/NTSC/HDTV) (PAL/NTSC/HDTV) TV-out OpenGL 1.4, DirectX* 9.0c OpenGL 1.4, DirectX* Intel 2 GB (max), single channel Intel (optional 5 PCI Express x1) (optional 5 PCI Express Windows 4x PCI Ver. 2.3, 32-bit, 33MHz 4x PCI Ver. Intel USB boot/legacy, PXE support USB boot/legacy, Basic Form Factor (95x125 mm) AMIBIOS selected modules: -20°C ~ +70°C at 1.6GHz and 1 GB DDR2 typical 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS Windows up to 1.6 GHz with 512 KB L2 cache up to 1.6 GHz with 512 KB L2 cache Max 2 GB on single 200-pin SODIMM PICMG Realtek RTL8111C GbE (10/100/1000) Realtek RTL8111C optional PATA SSD 512 MB up to 4 GB 4 to up MB 512 SSD PATA optional
Type 2 Type Vista ® COM Express™ COM 2.6.x, ® Basic (125 x 95 mm) Basic (125 x - - Yes Yes Yes Yes 1-17 GMA 950 ® CE, Linux M 423, 440/530 667/533 C, SMBus ® ® 2 AIDI library I Yes, Ver. 1.2 Ver. Yes, CRT (QXGA) CRT 0°C ~ +60°C 8, American Megatrend 8, American Megatrend Express-NR XP/Xpe, Windows ® Intel 8 ports USB 2.0 HD Audio and AC’97 8 Mbit Flash SPI 945GME with ICH7M ® DDR2 at 667/533 ® Max 256 MB UMA S0, S1, S3, S4, S5 ® 1MB, 2MB or 4MB two SATA 1.5 Gb/s two SATA or dual SDVO ports optional (ICH7MDH) COM Express™ R1.0, Type 2 R1.0, Type COM Express™ ® Duo (Merom/Yonah) Core™2 PCIe x16 Graphics Port, PCI-Express x1 (on PEG) PCI-Express 4 GB (max), dual channel Celeron one channel, two devices EEPROM CMOS backup, Serial Console redirection Serial Console redirection TV-out (PAL/NTSC/HDTV) (PAL/NTSC/HDTV) TV-out ® OpenGL 1.4, DirectX* 9.0c OpenGL 1.4, DirectX* Intel Intel 5x PCI-Express x1 (or 1 x4) 5x PCI-Express Windows Core™2 Duo T7400 (socket) Core™2 82573 GbE EthernetGbE 82573 (10/100/1000) 4x PCI Ver. 2.3, 32-bit, 33MHz 4x PCI Ver. ® L2 depends on processor type type L2 depends on processor USB boot/legacy, PXE support USB boot/legacy, 16 W with Core™2 Duo U7500 16 W with Core™2 Basic Form Factor (95x125 mm) AMIBIOS selected modules: -20°C ~ +70°C up to 2.2 GHz with 4MB L2 cache µFC-PGA (socket-M) or µFC-BGA µFC-PGA (socket-M) or µFC-BGA 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS Intel Windows Core™2 Duo L7400, U7500, U2500 Core™2 Max 4 GB on two 200-pin SODIMM at 1.06 GHz and 1 GB memory typical PICMG Intel
Vista ® - - - GbE (10/100/1000) Yes Yes Yes Yes 1-15 HD Audio ® M 550 (socket) ® GMA X3100 ® C, SMBus ® 2 2.6.x, AIDI library I Yes, Ver. 1.2 Ver. Yes, CRT (QXGA) CRT 0°C ~ +60°C 800/667/533 2MB or 4MB 8, American Megatrend 8, American Megatrend ® XP/Xpe, Windows ® Intel 8 ports USB 2.0 8 Mbit Flash SPI GME965 with ICH8M ® DDR2 at 667/533 Duo (Merom) Core™2 Intel optional (ICH8EM) three SATA 3 Gb/s SATA three Max 384 MB UMA S0, S1, S3, S4, S5 ® Express-MC800 or dual SDVO ports ® COM Express™ R1.0, Type 2 Type R1.0, Express™ COM ® OpenGL 2.0, DirectX 10 OpenGL 2.0, DirectX Linux Celeron PCIe x16 Graphics Port, 4 GB (max), dual channel one channel, two devices EEPROM CMOS backup, Serial Console redirection Serial Console redirection TV-out (PAL/NTSC/HDTV) (PAL/NTSC/HDTV) TV-out http://www.adlinktech.com/Computer-on-Module Intel 5x PCI-Express x1 (or 1 x4) 5x PCI-Express Core™2 Duo T7500 (socket) Core™2 Intel 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 19 W with Core™2 Duo U7500 19 W with Core™2 L2 depends on processor type type L2 depends on processor USB boot/legacy, PXE support USB boot/legacy, up 2.2 GHz with 4 MB L2 cache Basic Form Factor (95x125 mm) AMIBIOS PPGA478 (socket-P) or PBGA479 PCI-Express x8, x4 or x1 (on PEG) PCI-Express 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), single/dual 18/24-bit LVDS (UXGA) single/dual 18/24-bit LVDS Windows integrated Intel Max 4 GB on two 200-pin SODIMM Core™2 Duo (Meron) U7500, L7500 Duo (Meron) Core™2 at 1.06 GHz and 2 GB memory typical PICMG
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Extended Temperature Power States Power Consumption Compatibillity Matrix Storage Support External Graphics Bus BIOS Flash Graphics Memory Integrated Display Support BIOS Features FSB Speed Memory Type Memory Soldered Socket Memory CPU Package CPU Models / Speeds Page Number Operating Temperature Compatibillity Dimensions Solid State Disk on Module Support BSP & Software PCI Suport LPC Support Management Bus Power Parallel ATA (IDE) Parallel ATA Serial ATA Ethernet USB Audio Watchdog TPM Support PCI Express Graphics Controller BIOS Type Main Chipset System Memory Cache (L2) CPU Type Selection Guide Selection
Computer-On-Modules Compact (95 x 95 mm) Ultra (84 x 55 mm) Type 2 Type 10 Type 1
Express-LPC Express-ATC nanoX-TC nanoX-ML CPU Type Single / Dual Intel® Atom™ Intel® Atom™ Intel® Atom™ Processor E6xx from Intel® Atom™ Processor Z5xx up to 1.8 GHz with 1 MB L2 cache up to 1.6 GHz with 512 KB L2 cache 600 MHz up to 1.6 GHz from 1.1 GHz up to 1.6 GHz CPU Package FCBGA559 PBGA437 FC-BGA 676 BGA 441 CPU Models / Speeds Atom™ N455 at 1.66 GHz Intel® Atom™ N270 at 1.6 GHz E680 at 1.6 GHz, E660 at 1.3 GHz, Intel® Atom™ Z530 at 1.6 GHz Atom™ D425 at 1.8 GHz E640 at 1.1 GHz, E620 at 600 MHz Intel® Atom™ Z510 at 1.1 GHz Atom™ D525 at 1.8 GHz (dual core) FSB Speed - 533 - 533/400 Main Chipset ICH8M Intel® 945GSE with ICH7M Intel® PCH EG20T (extended temp) Intel® SCH US15W System Memory 4 GB (max), single channel 2 GB (max), single channel 2 GB (max), single channel 1 GB (max), single channel Memory Type DDR3 at 667/800 DDR2 533 DDR2 400/533 DDR2 400/533 Soldered Memory - - 512 MB up 2 GB DDR2 at 800 MHz 512 MB or 1 GB DDR2 466/533 MHz Socket Memory Max 4 GB on two 200-pin SODIMMs Max 2 GB on single 200-pin SODIMM - - Cache (L2) L2 cache 512 KB (N455/D425) L2 cache 512 KB L2 cache 512 KB L2 cache 512 KB L2 cache 1 MB (D525) BIOS Type AMIBIOS®8, American Megatrend AMIBIOS®8, American Megatrend AMI EFI, American Megatrend AMIBIOS®8, American Megatrend BIOS Features Serial Console redirection Serial Console redirection Serial Console redirection Serial Console redirection EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, EEPROM CMOS backup, USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support USB boot/legacy, PXE support BIOS Flash 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI FWH, 8 Mbit Flash Graphics Controller Intel® GMA 3150 Intel® GMA 950 Intel® GMA 600 Intel® GMA 500 Graphics Memory Max 384 MB UMA Max 256 MB UMA Max 64 MB UMA Max 256 MB UMA Integrated Display Support CRT (QXGA) 2048x1536 CRT (QXGA) 18/24-bit LVDS max 1280x768@60Hz single channel 18/24-bit LVDS (WXGA) single 18 LVDS (WXGA) 1366x768 single/dual 18/24-bit LVDS (UXGA) Encode : MPEG4, H.263, H.264; supports HDTV/DHD decode and TV-out (PAL/NTSC/HDTV) Decode : MPEG2/4, VC1, WMV9, H.264 MPEG, H.264, hardware decoding External Graphics Bus - Single SDVO port Single SDVO max 1920x1080@50Hz Single SDVO port
Compatibillity OpenGL 1.5, DirectX 9.0c OpenGL 1.4, DirectX* 9.0c OpenGL 2.1, DirectX 9.0c OpenGL 2.0, DirectX 9.0c Parallel ATA (IDE) one channel, two devices one channel, two devices - one channel, one device Serial ATA two SATA 1.5 Gb/s two SATA 1.5 Gb/s two SATA 1.5 Gb/s one SATA 1.5 Gb/s Matrix Storage Support - - - - Ethernet Intel® 82583V GbE (10/100/1000) Realtek RTL8111C GbE (10/100/1000) integrated Intel GbE (10/100/1000) Realtek RTL8111C GbE (10/100/1000) USB 6 ports USB 2.0 6 ports USB 2.0 6 ports USB 2.0, 1 client port 8 ports USB 2.0 Audio Intel® HD Audio Intel® HD Audio and AC’97 Intel® HD Audio Intel® HD Audio Watchdog Yes Yes Yes Yes TPM Yes Yes Yes Yes PCI Express Support 5x PCI-Express x1 3x PCI-Express x1 3x PCIe x1 1x PCIe x1 (optional 5 PCI Express x1) (optional 4x PCIe without PCH EG20T) (optional 2x PCIe without LAN function) PCI Suport 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz - - LPC Support Yes Yes Yes Yes Management Bus I2C, SMBus I2C, SMBus I2C, SMBus I2C, SMBus Power 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 4.75V – 14V wide range (5Vsb 4.75V – 14V wide range (5Vsb optional for ATX function) optional for ATX function) Power States S0 S1 S3 S4 S5 S0, S1, S3, S4, S5 S0 S1 S3 S4 S5 S0, S1, S3, S4, S5 Power Consumption 8 W with Atom® N455 9 W with Atom® N270 4.5 W with E620 at 600 MHz and 5 W with Atom®Z510 at 1.1 GHz and at 1.66 GHz and 1 GB DDR3 typical at 1.6GHz and 1 GB DDR2 typical 512 MB DDR2 typical 512 MB DDR2 typical Operating Temperature 0°C ~ +60°C 0°C ~ +60°C 0°C ~ +60°C 0°C ~ +60°C Extended Temperature selected modules : -20°C ~ +70°C selected modules: -20°C ~ +70°C -40°C ~ +85°C (with CPU “T” versions) selected modules: -20°C ~ +70°C Compatibillity PICMG® COM Express™ R2.0, Type 2 PICMG® COM Express™ R1.0, Type 2 PICMG® COM Express™ R2.0, Type 10 PICMG® COM Express™ R1.0, Type 1 Dimensions Compact Form Factor (95x95 mm) Compact Form Factor (95x95 mm) Ultra Form Factor (84x55 mm) Ultra Form Factor (84x55 mm) Solid State Disk on Module optional SSD 4 GB up to 8 GB optional SSD 4 GB up to 8 GB TBD optional SSD 1 GB up to 8 GB BSP & Software Support Windows® XP/Xpe, Windows® Vista Windows® XP/Xpe, Windows® Vista Windows® XP/Xpe, Windows® CE, Windows® XP/Xpe, Windows® CE, Windows® CE, Linux® 2.6.x, AIDI library Windows® CE, Linux® 2.6.x, AIDI library Win7 Embedded, Linux®, AIDI library Linux®, AIDI library
Page Number 1-23 1-25 1-31 1-33 1-6 ® 7 ® and Linux ® XP(e) / Windows ® 2.6.x BSP ® ® Gigabit LAN PHY WG82579LM ® Linux VxWorks 6.x VxWorks AIDI Library for Windows 10/100/1000 Mbps Ethernet Windows Embedded XP support package Linux Integrated on QM67 Supports up to eight ports USB 2.0 ports at 6 Gb/s and two ports at 3 Gb/s Supports two SATA with support for RAID 0,1,5,10 based Solid State Disk 8/16/32 GB Optional SATA Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 TPM 1.2 mode mode (12 V +/- 5%) and ATX AT (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 TBD Yes 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operating Non-operating: 1.88Grms, 5-500Hz, each axis Operating: 0.5Grms, 5-500Hz, each axis 6, Basic form factor 125mm x 95mm Type COM Express CE, FCC, HALT Intel Core™ i7/i5 processor and QM67 Chipset and QM67 i7/i5 processor Core™ ® Quad or Dual Core™ i7/i5 Processor Dual Core™ i7/i5 Quad or QM67 Chipset ® ® COM Express™ Type 6 Module with with 6 Module Type Express™ COM Intel 1333MHz DisplayPort /HDMI/DVI/SDVO purpose x8/4/1) graphics (or general LAN, eight USB 2.0 Intel Intel DDR3 SDRAM at Up to 16GB Dual Channel InterfacesThree Digital Display for (DDI) PCIe x16 (Gen2) for Seven PCIe x1, one 6 Gb/s, Gigabit SATA 3 Gb/s, two SATA Two
Interface Operating Systems Operating Support Standard Extended Support (BSP) Multi I/O Chipset USB SATA SSD Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption Smart Battery Support and Environmental Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification LAN Chipset
Features C (user) 2 PCH QM67 http://www.adlinktech.com/Computer-on-Module ®
Core™ i7-2715QE 2.1 GHz (3.0 GHz Turbo), 2.1 GHz (3.0 GHz Turbo), i7-2715QE Core™ 2.2 GHz (2.9 GHz Turbo), i7-2655LE Core 1.5 GHz (2.4 GHz Turbo), i7-2610UE Core™ 2.5 GHz (3.2 GHz Turbo), i5-2515E Core™ Chipset Mobile QM67 Express ® ® ® ® ® HD Graphics 3000 at 650–1300 MHz 10.1 and OpenGL 3.0 DirectX Intel Clear Video HD Technology Advanced Scheduler 2.0, 1.0, XPDM support support for full AVC/VC1/ Video Acceleration (DXVA) DirectX decode MPEG2 hardware support with 300 MHz DAC Analog CRT Analog monitor support up to QXGA (2048 x 1536) and CRT hot plug Dual channel 18/24-bit LVDS DDI ports supporting HDMI / DVT / DisplayPort or Three SDVO 6MB L3 cache, 45W Intel 4MB L3 cache, 25W Intel 4MB L3 cache, 17W Intel 3MB L3 cache, 35W to Dual channel non-ECC 1066/1333 MHz DDR3 memory up 16 GB in dual stacked SODIMM socket Intel On Express-BASE6 (ALC888) On Express-BASE6 Integrated on Intel Sandy Bridge 32 nm process, BGA type Sandy Bridge 32 nm process, Intel 6MB (i7-2715QE), 4MB(i7-2655LE and i7-2610UE), 3MB (i5-2515E) AMI EFI with CMOS backup in 16 Mbit SPI BIOS Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug timer range to generate RESET Programmable graphics solution x16 (Gen2) bus for discrete PCI Express (2 x8 or 1 x8 with 2 x4) or or general purpose PCI Express Embedded DisplayPort (eDP) lane 7 is free, x1: Lanes 0/1/2/3/4/5/6 are 8 PCI Express occupied by GbE LPC bus, SMBus (system) , I
1-7 Express-HR Memory Chipset Integrated Video Support Feature Interface CRT Interface LVDS Digital Display Interface Audio Codec Audio Chipset Integrated in Processor Video Specifications System Core CPU
L3 Cache BIOS Monitor Hardware Debug Interface Timer Watchdog Expansion Busses
Computer-On-Modules Functional Diagram
SODIMM 2 1066/1333 MHz 1~8 GB DDR3 CPU SODIMM 2 XDP Core 1066/1333 MHz SFF26 i7-26XX /i5-26XX 1~8 GB DDR3
PCI Express x16 (Gen2) 2 x8 or 1 x8 + 2 x4 I F D DMI
CRT
Dual channel 24-bit LVDS DDI 1 DP / HDMI / DVI / SDVO 6x PCIe x1 (port 0~5) DDI 2 DP / HDMI / DVI GbE LAN PCIe x1 82579 (port 7) PCH DDI 3 HDA Audio DP / HDMI / DVI / eDP 2x SATA 6 Gb/s (channel 0/1) QM67 2x SATA 3 Gb/s (channel 2/3) PCIe x1 8x USB 2.0 (channel 0/7) (port 6)
TPM Debug SLB9635 Header LPC bus
4x GPI GPIO Monitor SPI 1 4x GP0 PCA9535 ADT7490 BIOS
SMBus SPI 2
2 BIOS I C BC
SPI
Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-HR-i7-2715QE COM Express™ Type 6 module with Intel® Core Passive Heatsinks i7-2715QE SV processor at 2.1GHz with QM67 chipset THSH-HR-BL High Profile Heatsink for Express-HR with threaded Express-HR-i7-2655LE COM Express™ Type 6 module with Intel® Core standoffs i7-2655LE LV processor at 2.2GHz with QM67 chipset Heat Spreaders ® Express-HR-i7-2610UE COM Express™ Type 6 module with Intel Core HTS-HR-RL Heatspreader for Express-HR with threaded standoffs i7-2610UE ULV processor at 1.5 GHz with QM67 Chipset Heatsink with Active Cooling Express-HR-i5-2515E COM Express™ Type 6 module with Intel® Core i5-2515E SV processor at 2.5 GHz with QM67 Chipset THSFH-HR-BL High Performance Heatsink with Fan for Express-HR with threaded standoffs
1-8
Core i7/i5/i3 i7/i5/i3 Core ® ® 7 ® and Linux ® PCH QM57 PCH QM57 ® ® XP(e) / Vista / Windows ® 2.6.x BSP ® ® Linux Embedded XP support package Linux Vxworks 6.x BSP AIDI Library for Windows Supports up to eight ports USB v. 2.0 Supports up to eight ports USB v. 3 Gb/s with optional support for RAID Four ports SATA 0,1,5,10 based Solid State Disk 8/16/32 GB Optional SATA channel 1, Master only bridge on SATA to PATA SATA On carrier (ALC888) Integrated on Intel Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 TPM 1.2 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis Integrated on Intel Integrated on QM57 with 82577LM PHY 10/100/1000 Mbps Ethernet CE, FCC Windows COM Express™ Type 2, Basic form factor 125 mm x 95 mm Type COM Express™ AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) mode (12 V +/- 5%) and ATX AT Supports S0, S1, S3, S4, S5 i7-620UE at 1.2 GHz and 2 GB memory 21 W with Core™ typical Yes Core™ i7/i5/i3 Processor Core™ i7/i5/i3 QM57 chipset ® ® Processor and QM57 Chipset QM57 and Processor COM Express™ Module with Intel Module Express™ COM 1066 MHz (optional ECC) 1066 MHz (optional x8/4/1) (or general purpose Intel Intel DDR3 SDRAM at Up to 8 GB Dual Channel x16 for graphics Six PCIe x1, one PCIe DisplayPort and Embedded 18/24-bit LVDS Gigabit LAN, USB 2.0 IDE (PATA), 3 Gb/s SATA
Extended Support (BSP) USB SATA SSD PATA Audio Codec Multi I/O Chipset Super I/O TPM Chipset Type Specifications Power Input Power and Environmental Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Audio Chipset LAN Chipset Interface Certification Systems Operating Support Standard Power States Power Consumption Smart Battery Support
Features DVMT 5.0) ® Core™ i7 / i5) i7 Core™ ® C (user) 2 http://www.adlinktech.com/Computer-on-Module
M), 4/3 MB (Intel Processor P4505 (2M Cache, 1.86 GHz) 35 W Processor ® ®
Dynamic Video Memory Technology (Intel Dynamic Video Memory Technology Mobile QM57 Core™ i7-610E Processor (4M Cache, 2.53 GHz) 35 W Processor i7-610E Core™ (3M Cache, 2.40 GHz) 35 W Processor i5-520E Core™ (4M Cache, 2.00 GHz) 25 W Processor i7-620LE Core™ (4M Cache, 1.06 GHz) 18 W Processor i7-620UE Core™ (3M Cache, 2.13 GHz) 35W Processor i3-330E Core™ Celeron ® ® ® ® ® ® ® ® AMI EFI with CMOS backup in 16 Mbit SPI BIOS Supply voltages and CPU temperature timer ranges to generate RESET Programmable graphics solution or x16 bus for discrete PCI Express (2 x8 or 2 x4 or 2 x1) or general purpose PCI Express Embedded Display Port (eDP) lane 6 is free, x1: Lanes 0/1/2/3/4/5 are 7 PCI Express as 1 x4 (on occupied by GbE; can be optionally configured 0/1/2/3) and 2 x1 (4/5) 2.3 at 33MHz, supporting 4 bus masters 32-bit PCI: PCI Rev. LPC bus, SMBus (system) , I Video capture via x1 concurrent PCI Express port PCI Express via x1 concurrent Video capture Audio-Video Path) support for Protected (Protected PAVP Intel HD Audio Playback High performance MPEG-2 decoding support WMV9 (VC-1) and H.264 (AVC) for MPEG2 VLD/iDCT acceleration Hardware support 10 DirectX Microsoft OpenGL 2.1 support Blu-ray support @ 40 Mb/s motion compensation Hardware Intermediate Z in classic rendering support by 300 MHz DAC Analog CRT Analog monitor support up to QXGA ( 2048 X 1536) Single / Dual channel 18- or 24-bit panels 2 MB (Celeron Gen 5.75 with 12 execution units 10 and OpenGL 2.1 DirectX Intel Dual channel 800/1066 MHz DDR3 memory up to 8 GB in Dual channel 800/1066 MHz DDR3 memory up to 8 GB dual stacked SODIMM socket; ECC memory for CBE series only Intel Arrandale BGA type Intel Intel Intel Intel Intel Intel 1-9 Express-CB/CBE BIOS Monitor Hardware Timer Watchdog Expansion Busses Interface CRT Interface LVDS L2 Cache Integrated in Processor Integrated Video Support Feature Video Chipset Memory Specifications System Core CPU
Computer-On-Modules Functional Diagram
DDR3 SODIMM
DDR3 Channel A with or without ECC CPU Memory 800/1066 MHz Controller Core with DDR3 SODIMM ECC i7 / i5 / i3 Channel B with or without ECC 800/1066 MHz PCIe x16 Gfx 2 PCIe x8 Embedded DisplayPort (eDP) Embedded Graphics Core
CRT
LVDS
Audio DMI FDI
CRT VGA SDVO LVDS HDMI (3x) B dual 18/24-bit DVI (3x) D HD Audio DisplayPort (3x) A C Intel GbE LAN PHY LAN (occupies PCIe x1 port 6) 82577LM MAC PCH PCIe x1 (port 0/1/2/3/4/5) PCIe x1 QM57
SATA (1 port) JM330 PATA IDE SATA to PATA PCI SATA (4 ports) 6x 33 MHz PCI SATA 2 8x s u O v2.3 I B
SATA USB P SATA (1 port) G SPI LPC SSD 2.0 SM
USB
Test SMBus Header BIOS MAX6621 LM87 I2C to GPIO GPIO Mon(T) Mon(T/V) TPM
I2C BC
LPC
Ordering Information Modules Accessories Non-ECC ECC Description/Configuration Model Number Description/Configuration Model Number Model Number Heat Spreaders ® Express-CB-i7-610E Express-CBE-i7-610E COM Express™ module with Intel HTS-CB-B Heatspreader with threaded standoffs for Express-CB/CBE Core i7-610E SV processor at Heatsink with Active Cooling 2.53 GHz with QM57 chipset THSF-CB-B Heatsink with fan and threaded standoffs for Express-CB/ Express-CB-i5-520E Express-CBE-i5-520E COM Express™ module with Intel® CBE Core i5-520 SV processor at 2.4 GHz with QM57 chipset Express-CB-i7-620LE Express-CBE-i7-620LE COM Express™ module with Intel® Core i7-620LE LV processor at 2.0 GHz with QM57 chipset Express-CB-i7-620UE Express-CBE-i7-620UE COM Express™ module with Intel® Core i7-620UE ULV processor at 1.07 GHz with QM57 chipset Express-CB-i7-P4505 Express-CBE-i7-P4505 COM Express™ module with Intel® Celeron® P4505 SV processor at 1.86 GHz with QM57 chipset Express-CB-i3-330E Express-CBE-i3-330E COM Express™ module with Intel® Core i3-330E SV processor at 2.13 GHz with QM57 chipset
1-10 Core™2 Duo Core™2 ® ® 82567LM PHY ® ICH9M ICH9M with Intel ® ® XP 32/64-bit Vista 32/64-bit Server 2003/2008 ® ® ® 2.6.x 2.6.x BSP ® ® 10/100/1000 Mbps Ethernet Embedded XP BSP Linux WinCE 6.0 BSP AIDI Library for Win32, WinCE and Linux Windows Windows Linux Supports up to eight ports USB v. 2.0 Supports up to eight ports USB v. Windows Integrated on Intel channel 3, on SATA JM20330 controller to PATA SATA Master only Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 TPM 1.2 mode mode (12 V +/- 5%) and ATX AT (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 Duo SU9300 at 1.2 GHz and 2 GB 18 W (with Core™2 memory typical) 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis 2, Basic form factor, Type COM Express™ 95 mm x 125 mm CE, FCC Integrated on Intel Four ports SATA 3 Gb/s with (optional) support for RAID Four ports SATA 0,1,5,10 Duo processor (up to 2.26 GHz) (up to 2.26 Duo processor Core™2 ICH9M-SFF chipset GS45 and ® ®
Processor and GS45 / ICH9M-SFF Chipset Chipset / ICH9M-SFF GS45 and Processor COM Express™ Module with Intel Module Express™ COM at 1066 MHz x8, x4 or x1) (or general purpose (SDTV and HDTV) Intel Intel up to 8 GB DDR3 Dual SODIMM for x16 for graphics Five PCIe x1, one PCIe and TV-out 18/24-bit LVDS Single/dual channel 2.0 Gigabit LAN, USB IDE (PATA), 3 Gb/s, SATA Interface Extended Support
USB SATA Operating Systems Operating Support Standard Multi I/O Chipset PATA Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption and Environmental Mechanical Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications LAN Chipset
Features DVMT 5.0) ® Graphics Media ® I/O Controller Hub ICH9M-SFF I/O Controller ® ICH9M http://www.adlinktech.com/Computer-on-Module ®
C M 722, FSB 800, ULV 1.2GHz M 722, FSB 800, ULV 2 ® 8 with CMOS backup in 16 Mbit SPI Flash ®
HD Audio Playback Dynamic Video Memory Technology (Intel Dynamic Video Memory Technology Core™2 Duo SP9300, FSB 1066, 2.26 GHz Core™2 1.86 GHz Duo SL9400, FSB 1066, LV Core™2 1.2 GHz Duo SU9300, FSB 800, ULV Core™2 Celeron Hub SFF Graphics Memory Controller GS45 Express ® ® ® ® ® ® ® Video capture via x1 concurrent PCI Express port PCI Express via x1 concurrent Video capture Audio-Video Path) support for Protected (Protected PAVP Intel High performance MPEG-2 decoding support WMV9 (VC-1) and H.264 (AVC) for MPEG2 VLD/iDCT acceleration Hardware support 10 DirectX Microsoft Blu-ray support @ 40 Mb/s motion compensation Hardware Intermediate Z in classic rendering support by 300MHz DAC Analog CRT hot plug Analog monitor support up to QXGA, supports CRT Single / Dual channel 18/24-bit at 25~112 MHz supported up to 1024x768 resolution NTSC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) with 6MB L2 cache, 25 Watt Intel with 6MB L2 cache, 17 Watt Intel with 3MB L2 cache, 10 Watt Intel (Small Form Factor) and Intel Supply voltages and CPU temperature timer ranges to generate RESET Programmable x16 bus for SDVO/HDMI/DisplayPort Graphics PCI Express (x8 / x4 / x1) or general purpose PCI Express 5 is occupied by GbE; free, x1: 0/1/2/3/4 are 6 PCI Express as 1 x4 0/1/2/3 x1 can be optionally configured 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters LPC, SMBus, I HDA codec on carrier to HDMI interface Audio routed Integrated on Intel GS45 GMCH integrated Mobile Intel Penryn SFF BGA type Intel AMIBIOS Accelerator 4500MHD with core render clock 533 MHz render Accelerator 4500MHD with core Mode voltage or 266 MHz @ 1.025 L.P. @ 1.05-V core Intel with 1MB L2 cache, 5.5 Watt with 1MB L2 cache, 5.5 Watt Dual stacked SODIMM sockets supporting dual channel up to 8 GB of non-ECC, 800/1066 MHz DDR3 memory, Intel 1-11 Express-MV Feature Support Feature Interface CRT Interface LVDS TV-out Monitor Hardware Timer Watchdog Expansion Busses Audio Codec HDMI Chipset Audio Video Chipset Specifications System Core CPU
BIOS Integrated Video Memory Chipset
Computer-On-Modules Functional Diagram
CPU Celeron® M Core™2 Duo
Small Form Factor: 22 x 22 mm BGA
FSB 800/1066 MHz
GMCH DDR3 800/1066 ® Channel A SODIMM socket Intel GS45 DDR-3 Small Form Factor Memory Controller Analog Graphics Core DDR3 800/1066 CRT Channel B VGA 4500MHD SODIMM socket PCIe x16 Gfx TV-out SDTV HDTV PCIe x8/x4/x1 SDVO (2) DisplayPort (3) LVDS LVDS dual 18/24-bit HDMI (2)
DMI PCIe x16 (multiplexed) Audio Audio
Intel LAN ICH Gbe PHY PCIe x1, lane 5 ® 82567LM MAC Intel ICH9M Small Form Factor AB Six CD PCIe x1, lane 0/1/2/3/4 or PCIe x4 JM30220 PCIe x1 1x SATA2 SATA / PATA IDE lanes RTC PCI SATA_0/1/2/3 3x SATA PCI 33 MHz v2.3 Bus
USB_0/1/2/3/4/5/6/7 8x USB 2.0 M S SPI LPC
Test SMBus header BIOS GPIO F75111R LM95245 LM87 TPM I2C BC
LPC
Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-MV-SP9300 COM Express™ Module with Intel® Core™2 Duo Heat Spreaders processor SP9300 at 2.26 GHz HTS-MV-B Heatspreader for Express-MV (BGA CPU) with threaded Express-MV-SL9400 COM Express™ Module with LV Intel® Core™2 Duo standoffs processor SL9400 at 1.86 GHz Passive Heatsinks ® Express-MV-SU9300 COM Express™ Module with ULV Intel Core™2 Duo THS-MV-BL Low Profile Heatsink for Express-MV (BGA CPU) with processor SU9300 at 1.20 GHz threaded standoffs for bottom mounting with long cooling Express-MV-722 COM Express™ Module with ULV Intel® Celeron® M fins (incl screws for 5 and 8 mm btb) processor 722 at 1.20 GHz Heatsink with Active Cooling THSF-MV-B High Performance Heatsink with Fan for Express-MV (BGA CPU) with threaded standoffs
1-12 Core™2 Duo Core™2 ® ® 7 ® and Linux ® I/O Controller Hub 9 Mobile (ICH9M) I/O Controller I/O Controller Hub 9 Mobile (ICH9M) I/O Controller ® ®
XP(e) / Vista / Windows ® OpenGL setup instructions) 2.6.x BSP (with Xorg ® ® Yes Linux Embedded XP support package Linux Vxworks 6.x BSP (on request) AIDI Library for Windows Supports up to eight ports USB v. 2.0 Supports up to eight ports USB v. 3 Gb/s with optional support for RAID Four ports SATA 0,1,5,10 channel 3, Master on SATA JM330 controller to PATA SATA channel) up fourth SATA to free only (can be removed On carrier (ALC888) to HDMI interface Audio routed CE, FCC Windows Integrated on ICH9M with Intel 82567LM PHY 10/100/1000 Mbps Ethernet Integrated on Intel Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 TPM 1.2 Supports S0, S1, S3, S4, S5 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis Integrated on Intel COM Express™ Type 2, Basic form factor 125 mm x 95 mm Type COM Express™ AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) mode (12 V and 5 Vsb +/- 5%) mode (12 V +/- 5%) and ATX AT Duo P8400 at 2.26 GHz and 2 GB 23 W (with Core™2 typical) memory, Core™2 Duo processor (up to 2.53 GHz) processor (up Core™2 Duo ICH9M chipset GM45 and ® ® Processor and GM45 / ICH9M Chipset / ICH9M GM45 and Processor COM Express™ Module with Intel Module Express™ COM at 1066 MHz x8, x4 or x1) (or general purpose (SDTV and HDTV) Intel Intel up to 8 GB DDR3 Dual SODIMM for x16 for graphics Five PCIe x1, one PCIe and TV-out 18/24-bit LVDS Single/dual channel 2.0 Gigabit LAN, USB IDE (PATA), 3 Gb/s, SATA Smart Battery Support
Extended Support (BSP) USB SATA PATA Audio Codec HDMI Certification Systems Operating Support Standard Chipset Interface Multi I/O Chipset Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption and Environmental Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Audio Chipset LAN
Features DVMT 5.0) ® Graphics Media ® C (user) 2 M T3100, FSB 800, 1.90 GHz with ® http://www.adlinktech.com/Computer-on-Module
M), 6/3 MB (Core™2 Duo) M), 6/3 MB (Core™2 M 575, FSB 667, 2.00 GHz with 1-MByte L2 ® ® 8 with CMOS backup in 16 Mbit SPI Flash ®
Dynamic Video Memory Technology (Intel Dynamic Video Memory Technology HD Audio Playback GM45 Express Graphics Memory Controller Hub and Graphics Memory Controller GM45 Express Hub 82801IEM (ICH9M-E) I/O Controller Core™2 Duo T9400, FSB 1067, 2.53 GHz with Core™2 Duo P8400, FSB 1067, 2.26 GHz with Core™2 Dual Celeron Celeron ® ® ® ® ® ® ® ® Video capture via x1 concurrent PCI Express port PCI Express via x1 concurrent Video capture Audio-Video Path) support for Protected (Protected PAVP Intel High performance MPEG-2 decoding support WMV9 (VC-1) and H.264 (AVC) for MPEG2 VLD/iDCT acceleration Hardware support 10 DirectX Microsoft OpenGL 2.1 support Blu-ray support @ 40 Mb/s motion compensation Hardware Intermediate Z in classic rendering support by 300-MHz DAC Analog CRT hot Analog monitor support up to QXGA and support for CRT plug Single / Dual channel 18- or 24-bit panels supported up to 1024x768 resolution NSTC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Intel 1 MB (Celeron 6-MByte L2 cache, 35 Watt Intel 3-MByte L2 cache, 25 Watt Intel Supply voltages and CPU temperature timer ranges to generate RESET Programmable x16 bus or SDVO/HDMI/DisplayPort or Graphics PCI Express (x8/x4/x1) general purpose PCI Express lane 5 is free, x1: Lanes 0/1/2/3/4 are 6 PCI Express occupied by GbE LAN; lanes 0/1/2/3 x1 can be optionally as 1 x4 configure 2.3 at 33MHz, supporting 4 bus masters 32-bit PCI: PCI Rev. LPC bus, SMBus (system), I AMIBIOS GM45 GMCH integrated Mobile Intel Socket P Intel Accelerator X4500 with core render clock 533-MHz @ render Accelerator X4500 with core 1.05 Vcore Intel cache, 31 Watt cache, 31 Watt top, one on bottom) SODIMM sockets (one on Two up to 8 GB of non-ECC, supporting dual channel memory, 800/1067 MHz DDR3 Intel 1-MByte L2 cache, 35 Watt Intel 1-13 Express-MG Feature Support Feature Interface CRT Interface LVDS TV-out L2 Cache Monitor Hardware Timer Watchdog Expansion Busses BIOS Video Chipset Specifications System Core CPU
Integrated Video Memory Chipset
Computer-On-Modules Functional Diagram
CPU Core™2 Duo Celeron® M
Socket P
FSB 800/1066 MHz
GMCH DDR3 800/1066 ® Channel A SODIMM socket Intel GM45 DDR3 Memory Controller
Analog Channel B DDR3 800/1066 VGA SODIMM socket
SDTV PCIe x16 Gfx HDTV PCIe x8/x4/x1 SDVO (2) LVDS DisplayPort (3) dual 18/24-bit HDMI (2)
HDA only
DMI
Intel Audio PHY 82567LM GbE port 5 N/A (Multifunction with LAN) ICH MAC ®
Intel ICH9M D PCI-E ports 0 / 1 / 2 / 3 / 4 six ports PCI-E x1 Small Form Factor AB C JM330 SATA (port 3) SATA / PATA PATA IDPAE (mTaAster only)
SATA ports 0/1/2 (0/1/2/3 if no PATA support) 4x SATA 2 RTC PCI PCI 33 MHz v2.3 u s O I P G USB_0/1/2/3/4/5/6/7 8x USB 2.0 SMB SPI LPC
Test SMBus Header BIOS
2 LM95235 LM87 I C to GPIO GPIO Mon(T) Mon(T/V) TPM
I2C BC
LPC
Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-MG-S COM Express™ Module with socket type for Intel® Heat Spreaders Core™2 Duo processor with GM45 and ICH9M chipset HTS-MG-S Heatspreader for Express-MG (socket CPU) with threaded Express-MG-S/T9400 COM Express™ Module with socket type Intel® Core™2 standoffs Duo processor T9400 at 2.53 GHz Passive Heatsinks ® Express-MG-S/P8400 COM Express™ Module with socket type Intel Core™2 THS-MG-S Low Profile Heatsink for Express-MG (socket CPU) with Duo processor P8400 at 2.26 GHz threaded standoffs ® Express-MG-S/T3100 COM Express™ Module with socket type Intel Heatsink with Active Cooling Dual Core Celeron® processor T3100 at 1.90 GHz THSF-MG-S High Performance Heatsink with FAN for Express-MG ® Express-MG-S / 575 COM Express™ Module with socket type Intel (socket CPU) with threaded standoffs Celeron® processor 575 at 2.00 GHz
1-14
Core™2 Duo Core™2 ® ® Server 2003 XP 32/64-bit Vista 32/64-bit ® ® ® 2.6.x 2.6.x BSP ® ® ICH8-M ® Embedded XP BSP Linux AIDI Library for Win32, WinCE and Linux Linux Windows Windows Single channel IDE with Ultra ATA 100/66/33 support Single channel IDE with Ultra ATA 3 Gb/s SATA ports Three Up to eight ports USB 2.0 Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 TPM 1.2 mode (12 V and 5 Vsb) mode (12 V) and ATX AT Supports S0, S1, S3, S4, S5 Duo U7500 at 1.06 GHz and 2 GB 19 W (with Core™2 typical) memory, 0°C to 60°C 20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis 95 mm x 125 mm 2, Basic form factor, Type COM Express™ CE, FCC Windows Intel ystems ™2 Duo processor (up to 2.2 GHz) (up to 2.2 Core™2 Duo processor chipset GME965 / ICH8M ® ® Processor and GME965 / ICH8-M Chipset Chipset / ICH8-M GME965 and Processor COM Express™ Module with Intel Module Express™ COM Intel Intel up to 4 GB DDR2 at 800MHz Dual SODIMM for x16 graphic (or x8) Five PCIe x1, one PCIe TV-out LVDS, Dual-channel 24-bit Gigabit LAN, USB 2.0 PATA, 3 Gb/s, SATA Extended Support
IDE (PATA) SATA USB Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption and Environmental Mechanical Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications S Operating Support Standard Multi I/O Chipset
Features 82566 PHY ® GMA X3100 ® ICH8-M ® http://www.adlinktech.com/Computer-on-Module C M 550, FSB 533, 2.0 GHz, with 2 ® 8 with CMOS backup in 8 Mbit SPI BIOS ® GME965 GMCH and ICH8-M Core™2 Duo T7500, FSB 800, 2.2 GHz with Core™2 Celeron Duo T7500, FSB 800, 2.2 GHz with Core™2 1.5 GHz with Duo L7500, FSB 800, LV Core™2 1.06 GHz with Duo U7500, FSB 533, ULV Core™2 ® ® ® ® ® ® AMIBIOS Supply voltages and CPU temperature timer ranges to generate RESET Programmable 5 occupied by GbE), optional x1 (0 – 4 free, 6 PCI Express configurable as x4 x8/x4/x1, or SDVO x16 or PCI Express Graphics PCI Express digital video bus 32-bit PCI 2.3 at 33MHz, supporting 6 bus masters LPC, SMBus, I 4MB L2 cache, 34 W Intel 4MB L2 cache, 34 W Intel 4MB L2 cache, 17 W Intel 2MB L2 cache, 10 W Dual stacked SODIMM sockets supporting dual channel up to 4 GB of non-ECC, 533/667 MHz DDR2 memory, Intel HDA codec on carrier Integrated on Intel ICH8-M integrated GbE MAC with Intel GME965 integrated Mobile Intel Socket P type Intel Analog CRT support up to 2048 x1536 at 60 Hz, 32-bpp Analog CRT Single / Dual channel 18/24-bit at 25~112 MHz up to 1024x768 resolution, NTSC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) 10/100/1000 Mbps with Wake-on-LAN and Alert on LAN 10/100/1000 Mbps with Wake-on-LAN support 1MB L2 cache 27 W BGA type Intel
1-15
dio BIOS Monitor Hardware Timer Watchdog Expansion Busses Memory Chipset Audio Codec LAN Chipset Chipset Au Chipset Video
Specifications System Core CPU Express-MC800 CRT Interface CRT Interface LVDS TV-out Interface
Computer-On-Modules Functional Diagram
CPU Celeron® M Core™2 Duo
SMT µFCBGA2 or µFCPGA2
FSB 533/800 MHz
GMCH Channel A DDR2 533/667 Intel® GME965 SODIMM socket DDR-2 Memory Analog Controller CRT VGA Graphic Core Channel B DDR2 533/667 X3100 SODIMM socket SDTV TV-out HDTV Gfx PCIe x16 LVDS LVDS PCIe x8/x4/x2/x1 dual 18/24-bit or 2x SDVO
DMI PCIe x16 (multiplexed) HDA Audio Audio ICH GbE ® GbE PHY PCIe x1, lane 5 Intel 82566 MAC Intel ICH8M
PCI Express PATA 1x PCIe x1, lane 0/1/2/3/4 or PCIe x4 lanes IDE0 RTC PCI SATA_0/1/3 3x SATA2 PCI 33 MHz, v2.3
USB 2.0 0/1/2/3/4/5/6/7 8x USB 2.0 SMBus SPI LPC
I2C BC
SMBus TPM GPIO GPIO Monitor Monitor F75111R LM95235 LM87 BIOS
LPC header LPC
Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-MC800-S COM Express™ Module with socket for Celeron® M or Heat Spreaders Core™2 Duo processor HTS-MC800-B Heatspreader for Express-MC800 (BGA CPU) with ® (for Intel Core™2 Duo T7500 processor at 2.2 GHz or threaded standoffs Intel® Celeron® M 550 processor at 2.0 GHz) Passive Heatsinks Express-MC800-L7500 COM Express™ Module with LV Intel® Core™2 Duo THS-MC800-B Low Profile Heatsink for Express-MC800 (BGA CPU) with L7500 processor at 1.6 GHz threaded standoffs Express-MC800-U7500 COM Express™ Module with ULV Intel® Core™2 Duo THSH-MC800-B High Heatsink for Express-MC800 (BGA CPU) with U7500 processor at 1.06 GHz threaded standoffs Heatsink with Active Cooling THSF-MC800-S High Performance Heatsink with Fan for Express-MC800 (socket CPU) with threaded standoffs
1-16 Core™2 Duo Core™2
® ® x1 (or one x4) ® XP 32/64-bit Vista 32/64-bit Server 2003 ® ® ® 2.6.x BSP 2.6.x ® ® ICH7-M ® AIDI Library for Win32, WinCE and Linux Embedded XP BSP WinCE BSP Linux Windows Windows Linux Single channel IDE with UDMA 100 support 1.5 Gb/s ports SATA Three Up to eight USB 2.0 ports Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 TPM 1.2 mode (12 V and 5 Vsb) mode (12 V) and ATX AT Supports S0, S1, S3, S4, S5 Duo U7500 and 1 GB memory) 16 W typical (with Core™2 0°C to 60°C -20°C to 80°C up to 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis 95 mm x 125 mm 2, Basic form factor, Type COM Express™ CE, FCC Windows Intel x16, five PCIe ® e™2 Duo processor (up to 2.1 GHz) processor (up to Core™2 Duo chipset 945GME / ICH7-M ating Systems ® ® Processor and 945GME / ICH7-M Chipset Chipset / ICH7-M 945GME and Processor COM Express™ Module with Intel Module Express™ COM Intel Intel up to 4 GB DDR2 at 667 MHz Dual SODIMM for One PCIe TV-out LVDS, Single/dual 18/24-bit Gigabit LAN, USB 2.0 PATA, SATA,
Extended Support
IDE (PATA) SATA USB Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption nmental and Enviro Mechanical Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications Oper Support Standard Multi I/O Chipset
Features
ICH7-M DH http://www.adlinktech.com/Computer-on-Module ® 82573L C 2 ® M 530, 1.73GHz with 1MB L2 cache, 27 W M 440, 1.86 GHz with 1MB L2 cache, 27 W M 423, 1.06GHz with 1MB L2 cache, 5.5 W ® ® ® 8 with CMOS backup in 8 Mbit SPI BIOS ® 945GME Express Graphics Memory Controller Hub Graphics Memory Controller 945GME Express Hub 7 Mobile (ICH7-M DH) I/O Controller Celeron T2500, 2.0 GHz with 2MB L2 cache, 31 W Duo Core™ Celeron Core™2 Duo T7400, 2.16GHz with 4MB L2 cache, 34 W Core™2 Core™ Duo L2400, 1.66GHz with 2MB L2 cache, 15 W Duo Core™ U2500, 1.2 GHz with 2MB L2 cache, 9 W Duo Core™ Celeron Core™2 Duo L7400, 1.5 GHz with 4MB L2 cache, 17 W Duo Core™2 U7500, 1.06 GHz with 2MB L2 cache, 10 W Duo Core™2 ® ® ® ® ® ® ® ® ® ® ® Merom Core BGA type Core Merom BGA type Core Yonah Intel AMIBIOS Supply voltages and CPU temperature timer ranges to generate RESET Programmable 5 occupied by GbE LAN), x1 (0 – 4 free, 6 PCI Express optional configurable as x4 x16, or SDVO digital video bus Graphics PCI Express 32-bit PCI 2.3 at 33MHz, supporting 6 bus masters LPC, SMBus, I 10/100/1000 Mbps HDA (Azalia) or AC’97 codec on carrier PCIe type Intel Integrated on Intel 945GME GMCH integrated graphics supports dual independent displays Analog VGA support up to 2048 x1536 resolution Single / Dual channel 18/24-bit up to 1024x768 resolution, NTSC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Yonah Core socket type socket Core Yonah Intel Dual SODIMM sockets supporting dual channel memory, up to 4 GB of non-ECC, 533/667 MHz DDR2 Intel Merom Core socket type Core Merom Intel Intel Intel Intel Intel Intel Intel Intel
1-17
BIOS Hardware Monitor Hardware Timer Watchdog Expansion Busses Interface Audio Codec Chipset LAN Audio Chipset Video Chipset Interface CRT Interface LVDS TV-out Memory Chipset
Specifications System Core CPU
Express-NR
Computer-On-Modules Functional Diagram CPU Celeron® M Core™ Duo Core™2 Duo
SMT µFCBGA2 or µFCPGA2
FSB 533/667 MHz
GMCH Channel A DDR2 533/667 Intel® 945GME SODIMM socket DDR-2 Memory Analog Controller Graphic Core CRT VGA DDR2 533/667 250 MHz Channel B SODIMM socket SDTV TV-out HDTV PCIe x16 Gfx PCIe x1 or LVDS LVDS 2x SDVO Dual 18/24-bit
DMI PCIe x16 (multiplexed) AC97 Audio or HDA Audio ICH GbE LAN PCIe x1, lane 5 ® Intel 82573L Intel ICH7-M DH Six PCIe x1 PCIe x1, lane 0/1/2/3/4 or PCIe x4 lanes PATA 1x IDE RTC PCI SATA_0/1 2x SATA PCI 33 MHz, v2.3 Bus
USB_0/1/2/3/4/5/6/7 M 8x USB 2.0 S SPI LPC
I2C BC
SMBus TPM GPIO GPIO LM95235 LM87 BIOS
LPC header LPC
Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-NR-S COM Express™ Module with socket for Celeron® M / Heat Spreaders Core™ Duo / Core™2 Duo processor (for Intel® Core™2 Duo T7400 processor at 2.16 GHz or HTS-NR-B Heatspreader for Express-NR (BGA CPU) with threaded Intel® Celeron® M 440 processor at 1.86 GHz) standoffs Express-NR-L7400 COM Express™ Module with LV Intel® Core™2 Duo L7400 Passive Heatsinks processor at 1.5 GHz THS-NR-B Low Profile Heatsink for Express-NR (BGA CPU) with Express-NR-L2400 COM Express™ Module with LV Intel® Core™ Duo L2400 threaded standoffs processor at 1.66 GHz THSH-NR-B High Heatsink for Express-NR (BGA CPU) with threaded Express-NR-U7500 COM Express™ Module with ULV Intel® Core™2 Duo standoffs U7500 processor at 1.06 GHz Heatsink with Active Cooling Express-NR-423 COM Express™ Module with ULV Intel® Celeron® M 423 THSF-NR-S High Performance Heatsink with Fan for Express-NR processor at 1.06 GHz (socket CPU) with threaded standoffs
1-18 Atom™ Atom™ ® ® XP 32-bit Vista 32-bit ® ® 2.6.x BSP 2.6.x ® ® ICH7-M ® AIDI Library for Win32, WinCE and Linux Embedded XP BSP WinCE BSP Linux Windows Linux Single IDE channel with UDMA100 with optional 512MB - 8GB IDE-based Solid State Disk 1.5 Gb/s port SATA Two Up to eight ports USB 2.0 Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 TPM 1.2 mode (12 V and 5 Vsb) mode (12 V) and ATX AT Supports S0, S1, S3, S4, S5 9 W typical (with Atom™ N270 and 1 GB memory) 0°C to 60°C -20°C to 80°C Up to 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis 2, Basic form factor, Type COM Express™ 95 mm x 125 mm CE, FCC Windows Intel ems yst processor N270 at 1.6 GHz Atom™ processor / ICH7-M chipset 945GSE ® ® Processor N270 and 945GSE/ICH7-M Chipset 945GSE/ICH7-M and N270 Processor COM Express™ Module with Intel Module Express™ COM and TV-out (SDTV and HDTV) and TV-out Disk Intel Intel 2 GB DDR2 at 533 MHz SODIMM for up to 4 x1 or 1 x4) Three PCIe x1 (optional single/dual 18-bit LVDS High resolution CRT, Gigabit LAN, USB 2.0 (PATA), IDE SATA, IDE-based Solid State Optional 512MB~8GB
Extended Support
IDE (PATA) SATA USB Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption nmental and Enviro Mechanical Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications S Operating Support Standard Multi I/O Chipset
Features Technology ® I/O Controller Hub 7 Mobile (ICH7-M) I/O Controller http://www.adlinktech.com/Computer-on-Module ®
SpeedStep C ® 2 8 with CMOS backup in 8 Mbit SPI BIOS ®
945GSE Express Graphic Memory Controller Hub and Graphic Memory Controller 945GSE Express Hub 7 Mobile (ICH7-M) I/O Controller Graphics Media Accelerator 950 integrated into Atom™ N270, FSB 533, 1.6 GHz with 512 KB L2 ® ® ® ® Source synchronous double-pumped (2x) Address synchronous Source quad-pumped (4x) Data synchronous Source C0 - C4 low power states supported up to 2 GB of non-ECC, Single SODIMM socket memory, 400/533 MHz DDR2 Intel Intel AMIBIOS 945GSE GMCH supporting dual independent displays support up to 1600 x 1200 Analog CRT Single / Dual channel 18-bit (optional 24-bit on carrier SDVO) through supported, up to 1024x768 resolution NTSC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) cache, 2.5 W, on-die primary 32-kB instruction cache cache, 2.5 W, and 24 KB write-back data cache support (2-threads) Hyper-Threading Advanced gunning transceiver logic (AGTL+) bus driver technology Enhanced Intel Supply voltages and CPU temperature timer ranges to generate RESET Programmable 3 is occupied by GbE LAN) free, x1 (0/1/2 are 4 PCI Express as x4 optionally configured Serial Digital Video Out (SDVO) 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters LPC, SMBus, I HDA (Azalia) or AC’97 codec on carrier PCIe x1 Realtek RTL8111C 10/100/1000 Mbps Integrated on Intel Intel BGA type Intel 1-19 Express-AT Memory Chipset BIOS Interface CRT Interface LVDS TV-out Monitor Hardware Timer Watchdog Expansion Busses Audio Codec Interface LAN Chipset io Aud Chipset Chipset Video Specifications System Core CPU
Computer-On-Modules Functional Diagram CPU
Atom™ N270
FSB 533 MHz
DDR2 533 GMCH Channel A ® SODIMM socket Intel 945GSE up to 2 GB DDR-2 Analog Memory CRT VGA Controller Graphic Core SDTV 250 MHz TV-out HDTV
LVDS LVDS Single channel dual 18-bit SDVO
DMI SDVO HDA Audio Au dio ICH GbE LAN Solid State PCIe x1 port 3 Realtek Intel® ICH7-M Drive RTL8111C Four 512MB up to 8 GB AB PCIe x1 CD lanes PCIe x1 lane 0/1/2 (optional 0/1/2/3 for x4) PATA 1x IDE RTC
2x SATA PCI PCI 33 MHz, v2.3 SATA_0/1 s
8x USB Bu USB_0/1/2/3/4/5/6/7 M 2.0 S SPI LPC
I2C BC
SMBus TPM GPIO GPIO LM87 BIOS
LPC header LPC
Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-AT-N270 COM Express™ module with Intel® Atom™ N270 processor Heat Spreaders at 1.6 GHz HTS-CAT-B Heatspreader for Express-AT (BGA CPU) with threaded Express-AT-N270-4G COM Express™ module with Intel® Atom™ N270 processor standoffs at 1.6 GHz 4GB SSD Solid State Disk Passive Heatsinks THS-CAT-B Low Profile Heatsink for Express-AT (BGA CPU) with threaded standoffs
1-20 M ® Pentium ®
® M 738 and 1 GB memory) ® XP 32-bit ® 2.6.x 2.6.x BSP ® ® ICH6-M x1 lanes and one ® ® Embedded XP BSP Linux AIDI Library for Win32 and Linux Linux One Ultra ATA 100/66/33 IDE port One Ultra ATA 1.5 Gb/s ports SATA Two Up to eight USB 2.0 ports, supports legacy KB / Mouse Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 TPM 1.2 mode (12 V and 5 Vsb) mode (12 V) and ATX AT Supports S0, S1, S3, S4, S5 18 W typical (with Pentium 0°C to 60°C -20°C to 80°C Up to 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis 95 mm x 125 mm 2, Basic form factor, Type COM Express™ CE, FCC Windows Intel M Processor up to 2.1 GHz M Processor ® x16 Graphics lane ® Pentium chipset 915GME Express ® ® Processor and 915GME/ICH6-M Chipset Chipset 915GME/ICH6-M and Processor COM Express™ Module with Intel Module Express™ COM PCI Express Intel Intel 533 MHz Dual-Channel DDR2 Three PCI Express Onboard Gigabit Ethernet SDVO 2.0, LVDS, USB SATA, Extended Support
IDE (PATA) SATA USB Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption cal and Environmental Mechani Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications ing Systems Operat Support Standard Multi I/O Chipset
Features x16) ® ICH6-M http://www.adlinktech.com/Computer-on-Module ® x16 Graphics port ® M 760, 2.0 GHz, with 2MB L2 cache M 745, 1.8 GHz, with 2MB L2 cache M 738, 1.4 GHz, with 2MB L2 cache M 373, 1.0 GHz, with 1MB L2 cache ® ® ® ® Pentium Pentium Pentium Celeron Hub and Graphic Memory Controller 915GME Express Hub 6 Mobile (ICH6-M) I/O Controller ® ® ® ® ® ® Intel BGA type Intel Intel 400/533 MHz DDR2, non-ECC, unbuffered max 1 GB Channel A: SO-DIMM socket for DDR2 memory, max 512 MB DDR2 memory, Channel B: soldered Intel Intel BIOS in 1 MB FWH with console redirection Phoenix AWARD and CMOS EEPROM backup Supply voltages and CPU temperature timer ranges to generate RESET Programmable x1 lanes (one occupied by GbE LAN) Four PCI Express Six 32-bit PCI 2.3 Masters at 33/66 MHz Low Pin Count (LPC) interface for Super I/O on carrier SMBus 2.0 interface support Two Serial DVO ports (multiplexed with PCI Express Two Optional AC’97 codec on carrier Yukon-EC 88E8053 PCIe Gigabit Ethernet Controller Yukon-EC speed 10/100/1000BASE-T IEEE 802.3 compliant with Triple fully integrated ASF 2.0 functionality 915GME GMCH integrated chipset supports dual independent displays support up to 2048 x1536 Analog CRT Dual channel 18-bit Integrated on Intel Socket 479 type Intel One PCI Express
1-21
udio Express-IA533
Memory Chipset BIOS Monitor Hardware Timer Watchdog Expansion Busses
Audio Codec LAN Chipset Interface A Chipset CRT Interface CRT Interface LVDS Graphic Expansion busses Chipset Video Specifications System Core CPU
Computer-On-Modules Functional Diagram
CPU
Celeron® M Pentium® M
SMT µFCBGA or socket µFCPGA
FSB 400 /533 MHz
GMCH Intel® 915GME DDR2 400/533 Channel A SODIMM Socket DDR-2 CRT VGA Memory Controller DDR2 533 Channel B soldered onboard PCIe x16 Gfx LVDS PCIe x1 LVDS 2x 18-bit or 2x SDVO
DMI PCIe x16 (multiplexed)
Gigabit GPIO Ethernet Marvell Yukon ICH6-M 88E8053 AC97 RTC AB CD PORT 3
PORT 2 four ports PORT 1 PCI-E x1 single IDE0 PATA PORT 0
SATA1 2x SATA PCI PCI 33 MHz v2.3 SATA0 8x USB 2.0 LPC
BIOS C 2 / I s
Monitor EEPROM u
Dual B Temp CMOS Watchdog M
Voltage Backup S
LPC
Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-IA533-S/0 COM Express module with socket for Intel® Celeron®/ Heat Spreaders Pentium® M processor HTS-IA533-B Heatspreader for Express-IA533 (BGA CPU) with threaded Express-IA533-760/0 COM Express module with Intel Pentium® M 760 at 2.0GHz standoffs Express-IA533-745/0 COM Express module with Intel Pentium® M 745 at 1.8GHz Passive Heatsinks Express-IA533-738/0 COM Express module with Intel Penium® M 738 at 1.4GHz THS-IA533-B Low Profile Heatsink for Express-IA533 (BGA CPU) with Express-IA533-373/0 COM Express module with Intel Celeron® M 373 at 1GHz threaded standoffs Note: All models optional soldered memory Heatsink with Active Cooling THSF-IA533-S High Performance Heatsink with Fan for Express-IA533 (socket CPU) with threaded standoffs
1-22 DDR3
® 7 ® and Linux ® nmental XP(e) / Vista, Windows ® 2.6.x BSP ® ® I/O Controller Hub 8 Mobile (ICH8M) I/O Controller ® Linux VxWorks 6.x BSP VxWorks AIDI Library for Windows Supports up to eight ports USB 2.0 3 Gb/s SATA ports Three Single IDE channel (UDMA100) with optional 4GB ~ 8GB IDE-based Solid State Drive Windows Embedded XP / 2009 support package Linux BIOS support for legacy free or legacy with two types of BIOS support for legacy free Super I/O (Winbond W83627HG and W83627DHG) Infineon SLB9635TT1.2 TPM 1.2 Supports S0, S1, S3, S4, S5 10 W (with N455 CPU and 2 GB memory typical) Yes 0°C to 60°C -20°C to 80°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operating Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis CE, FCC Intel AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) mode (12 V +/- 5%) and ATX AT 2, COM.0 R2.0 Type COM Express™ Compact form factor 95 mm x 95 mm Atom™ Processor and ICH8M Chipset ICH8M and Processor Atom™ ® stems I/O Controller Hub 8 Mobile I/O Controller Hub ® Compact COM Express™ Module with Single/Dual Single/Dual with Module Express™ COM Compact Intel Core Dual Core Atom™ processor at 1.8 GHz Atom™ processor Single/Dual Core Intel SDRAM at 800 MHz Up to 4 GB DDR3 (optional PCIe x4) Five free PCIe x1 lanes support and LVDS CRT 2.0 Gigabit LAN, USB IDE (PATA), 3 Gb/s, SATA
USB SATA IDE (PATA) Standard Support Standard Extended Support (BSP) Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption Smart Battery Support ro and Envi Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification Sy Operating Multi I/O and Storage Chipset
Features C (user) 2 Atom™ processor 1.80 GHz at 10 W Atom™ processor Atom™ processor 1.66 GHz at 6.5 W Atom™ processor ® ® Atom™ processor 1.66 GHz at 8.5 W Atom™ processor Atom™ processor 1.80 GHz at 13 W Atom™ processor ® ® I/O Controller Hub 8 Mobile (ICH8M) I/O Controller http://www.adlinktech.com/Computer-on-Module ® 8 with CMOS backup in 16 Mbit SPI BIOS ® Atom™ Processor Clear Video Technology 82583V Gigabit Ethernet Controller Dynamic Video Memory Technology 4.0 support Dynamic Video Memory Technology I/O Controller Hub 8 Mobile (ICH8-M) I/O Controller ® ® ® ® ® MPEG2 Hardware Acceleration, ProcAmp Acceleration, ProcAmp MPEG2 Hardware up to 2048x1536@ 60 Hz resolution Analog RGB display, up to 1366x768, 18bpp Single 18-bit channel, resolution 10/100/1000 Mbps Ethernet DirectX 9 compliant Pixel Shader v2.0 DirectX clock frequency 400 MHz render and RGB 2 display ports: LVDS Intel 1 MB for D525, 512KB for N455 & D425 AMIBIOS supports SPI BIOS on carrier (COM.0 R2.0) Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug Instant on with Intel Bootloader support, OEM BIOS settings, & Statistics, ACPI 3.0, Smart Battery Management Info Board timer ranges with programmable support, Watchdog 5 is occupied by GbE; free, x1: 0/1/2/3/4 are 6 PCI Express as 1 x4 0/1/2/3 x1 can be optionally configured 2.3 at 33MHz, supporting 4 bus masters 32-bit PCI: PCI rev. LPC bus, SMBus (system), I N570: Dual Core Intel N570: Dual Core Dual SODIMM sockets support up to 4 GB of non-ECC Dual SODIMM sockets support up to 4 GB of non-ECC 667/800 MHz DDR3 memory Intel D525: Dual Core Intel D525: Dual Core On carrier (ALC888) Intel Integrated in Intel Integrated in CPU with Gen3.5+ GFX Core and render core core and render Integrated in CPU with Gen3.5+ GFX Core at 200 MHz (N455) and 400 MHz (D425/D525) frequency Intel D425: Single Core Intel D425: Single Core Intel N455: Single Core Intel N455: Single Core
1-23
udio
Interface CRT Interface LVDS Interface Feature Support Feature L2 Cache BIOS Hardware Monitor Hardware Debug Interface Embedded Features Expansion Busses
Memory Chipset
Audio Codec LAN Chipset A Chipset Integrated Video Video GPU Core
Specifications System Core CPU Express-LPC
Computer-On-Modules Functional Diagram
SODIMM 1 CRT Atom 512MB ~ 2GB DDR3
18-bit LVDS N455 SODIMM 2 D425 512MB ~ 2GB DDR3 D525 XDP N570 SFF-26
5x PCIe x1 (port 0~4)
PCI Bus D GbE LAN PCIe x1 AB 82583V (port 5) C
HDA Audio ICH8M 3x SATA (port 0~2) PATA IDE
8x USB
LPC bus
4x GPI GPIO SPI SPI BIOS 4x GP0 PCA9535
SMBus
2 I C BC
SPI
Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-LPC-N455 Compact COM Express™ Module with Intel® Atom™ Single Heat Spreaders Core Low Voltage Processor N455 at 1.66 GHz HTS-LPC-B Heatspreader for Express-LPC with threaded standoffs ® Express-LPC-D425 Compact COM Express™ Module with Intel Atom™ Passive Heatsinks Single Core Processor D425 at 1.80 GHz THS-LPC-B Low Profile Heatsink for Express-LPC with threaded ® Express-LPC-D525 Compact COM Express™ Module with Intel Atom™ Dual standoffs Core Processor D525 at 1.80 GHz Active Heatsinks Express-LPC-N570 Compact COM Express™ Module with Intel® Atom™ Dual Core Low Voltage Processor N570 at 1.66 GHz THSF-LPC-B Heatsink with Fan for Express-LPC with threaded standoffs
1-24 Atom™ Atom™ ® ® XP 32-bit Vista 32-bit ® ® 2.6.x BSP 2.6.x ® ® ICH7-M ® AIDI Library for Win32, WinCE and Linux Embedded XP BSP WinCE BSP Linux Windows Linux Single IDE channel with UDMA100 with optional 1GB ~ 8GB IDE-based Solid State Drive 1.5 Gb/s ports SATA Two Up to eight ports USB 2.0 Connected to LPC bus on carrier if needed Infineon SLB9635TT1.2 TPM 1.2 mode (12 V and 5 Vsb) mode (12 V) and ATX AT Supports S0, S1, S3, S4, S5 9 W typical (with Atom™ N270 and 1 GB memory) 0°C to 60°C -20°C to 80°C Up to 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis 2, Compact form factor, Type COM Express™ 95 mm x 95 mm CE, FCC Windows Intel ems yst processor N270 at 1.6 GHz Atom™ processor chipset 945GSE/ICH7-M ® ® Processor N270 and 945GSE/ICH7-M Chipset and 945GSE/ICH7-M N270 Processor Compact COM Express™ Module with Intel Module Express™ COM Compact and TV-out (SDTV and HDTV) and TV-out Drive Intel Intel 2 GB DDR2 at 533 MHz SODIMM for up to 4 x1 or 1 x4) Three PCIe x1 (optional single/dual 18-bit LVDS High resolution CRT, Gigabit LAN, USB 2.0 (PATA), IDE SATA, IDE-based Solid State Optional 1GB ~ 8GB
Extended Support
IDE (PATA) SATA USB Super I/O TPM Chipset Type Specifications Power Input Power Power States Power Consumption nmental and Enviro Mechanical Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications S Operating Support Standard Multi I/O Chipset
Features Technology ® I/O Controller Hub 7 Mobile (ICH7-M) I/O Controller http://www.adlinktech.com/Computer-on-Module ®
C 2 8 with CMOS backup in 8 Mbit SPI BIOS ®
Graphics Media Accelerator 950 integrated into 945GSE Express Graphic Memory Controller Hub and Graphic Memory Controller 945GSE Express Hub 7 Mobile (ICH7-M) I/O Controller Atom™ N270, FSB 533, 1.6 GHz with 512 KB L2 ® ® ® ® 945GSE GMCH supporting dual independent displays support up to 1600 x 1200 Analog CRT Single / Dual channel 18-bit (optional 24-bit on carrier SDVO) through supported, up to 1024x768 resolution NTSC/PAL HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Supply voltages and CPU temperature timer ranges to generate RESET Programmable 3 is occupied by GbE LAN) free, x1 (0/1/2 are 4 PCI Express as one PCIe x4 optionally configured Serial Digital Video Out (SDVO) 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters LPC, SMBus, I Intel AMIBIOS cache, 2.5 W, on-die primary 32-kB instruction cache cache, 2.5 W, and 24 KB write-back data cache support (2-threads) Hyper-Threading Advanced gunning transceiver logic (AGTL+) bus driver technology Enhanced Intel SpeedStep HDA (Azalia) or AC’97 codec on carrier PCIe x1 Realtek RTL8111C 10/100/1000 Mbps Intel Integrated on Intel BGA type Intel Source synchronous double-pumped (2x) Address synchronous Source quad-pumped (4x) Data synchronous Source C0 - C4 low power states supported Single SODIMM socket up to 2 GB of non-ECC, 400/533 MHz DDR2 memory Intel 1-25 Express-ATC CRT Interface CRT Interface LVDS TV-out Hardware Monitor Hardware Timer Watchdog Expansion Busses BIOS
Audio Codec LAN Chipset Interface io Aud Chipset Chipset Video Specifications System Core CPU Memory Chipset
Computer-On-Modules Functional Diagram CPU
Atom™ N270
FSB 533 MHz
DDR2 533 GMCH Channel A ® SODIMM socket Intel 945GSE up to 2 GB DDR-2 Analog Memory CRT VGA Controller Graphic Core SDTV 250 MHz TV-out HDTV
LVDS LVDS Single channel dual 18-bit SDVO
DMI SDVO HDA Audio Au dio ICH GbE LAN Solid State PCIe x1 port 3 Realtek Intel® ICH7-M Drive RTL8111C Four 512MB up to 8 GB AB PCIe x1 CD lanes PCIe x1 lane 0/1/2 (optional 0/1/2/3 for x4) PATA 1x IDE RTC
2x SATA PCI PCI 33 MHz, v2.3 SATA_0/1 s
8x USB Bu USB_0/1/2/3/4/5/6/7 M 2.0 S SPI LPC
I2C BC
SMBus TPM GPIO GPIO LM87 BIOS
LPC header LPC
Ordering Information Modules Accessories Model Number Description/Configuration Model Number Description/Configuration Express-ATC-N270 Compact COM Express™ module with Intel® Atom™ N270 Heat Spreaders processor at 1.6 GHz HTS-ATC-B Heatspreader for Express-ATC (BGA CPU) with threaded Express-ATC-N270-4G Compact COM Express™ module with Intel® Atom™ N270 standoffs processor at 1.6 GHz with 4GB SSD Solid State Disk Passive Heatsinks Express-ATC-N270-8G Compact COM Express™ module with Intel® Atom™ N270 processor at 1.6 GHz with 8GB SSD Solid State Disk THS-ATC-B Low Profile Heatsink for Express-ATC (BGA CPU) with threaded standoffs
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e t s O O O d rs i r r on S 1 2
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® D2 Description/Configuration COM Express™ Reference Carrier Board in ATX form factor in ATX Carrier Board Reference COM Express™ be D
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nbo o CI IDE P Five PCI Express slot / SDVO slot PCI Express x16 Graphic Legacy 32-bit PCI slots Two step execution Dual LPC BIOS, single LPC Super I/O (enable/disable) Card CF Card or Express Integrated POST Code Battery or Powered / AT ATX Functional Diagram COM Express Carrier Design Guide Provides detailed information on designing your own custom carrier board for COM Express modules. Download from the Express-BASE product webpage at www.adlinktech.com Ordering Information Ordering Carrier Model Number Express-BASE
Features http://www.adlinktech.com/Computer-on-Module x1 slots ®
C, module control signals, flat panel control signals signals, flat panel control C, module control 2 COM Express™ Revision 2.0 COM Express™
® Supports Type 1 and Type 2 Basic form factor modules 1 and Type Supports Type 305 mm x 244 mm (AT/ATX) 32-bit PCI™ v2.3 slots Two Five PCI Express One PCI Express x16 / SDVO slot One PCI Express LPC bus header Two x 220-pin (Type 2) x 220-pin (Type Two displays DB15 on Rear I/O panel for VGA/CRT headers supporting dual channel LVDS onboard Two I/O panel, Mic/Line-in on Mic/Line-in/Speakers on rear S/PDIF on header header, One 40-pin header connectors Four SATA One socket onboard I/O panel 10/100/1000BASE-T compatible RJ45 on rear I/O panel, two on header and one through Four + two on rear Card Mini Express I/O panel, one header onboard One DB-9 on rear I/O panel One DB-25 on rear 34-pin header One header for Smart Battery management communications (connects to ADLINK BattMan board) I/O panel) 6-pin mini DIN (on rear Two 8-pin header SMBus, I Onboard diagnostics for BIOS POST code data and address diagnostics for BIOS POST code data and address Onboard on LPC bus Allows single step BIOS execution sockets for secondary LPC & SPI BIOS Onboard ALC880 High Definition Audio Codec Winbond WF83627HG on LPC PICMG Reset, Power LED, HDD LED, Buzzer connector ATX Standard mini switch RESET button and ATX Onboard 1-27 Express-BASE Dimensions Expansion Busses
Connectors COM Express™ CRT LVDS Audio IDE PATA IDE SATA PCIe Mini Card LAN USB 2.0 Serial Port Parallel Port FDD Smart Battery KB/Mouse Digital I/O Connectors Feature Active Components Active Audio BIOS / Debug POST LEDs Secondary BIOS Super I/O Specifications tor Fac Form Interface Module Core Miscellaneous Power Switches
Computer-On-Modules COM Express™ Type 6 Reference Carrier Board Express-BASE6 in ATX Form Factor
Features Seven PCI Express x 1 slots PCI Express x16 / SDVO slot Supports three Digital Display Interfaces (DDI) with HDMI/DVI/DisplayPort output LPC based Super I/O Dual BIOS (SPI and LPC) Conforms to COM Express™ Carrier Design Guide
Specifications Functional Diagram
Analog VGA (CRT) USB0 Form Factor DB15 USB 2.0/3.0 ® USB1 Core Module Interface PICMG COM Express™ Revision 2.0 34-pin Header Dual Channel LVDS USB 2.0/3.0 USB2 USB 2.0/3.0 Supports Type 6 Basic form factor modules Flat Panel Control signals 8-pin Header Dimensions 305 mm x 244 mm (ATX) USB3 USB 2.0/3.0 LAN Expansion Busses Seven PCI Express x1 slots RJ45 Transformer USB4 One PCI Express Mini Card slot USB5 4x SATA0 One PCI Express x16 / SDVO slot SATA USB6 USB 2.0 SATA SATA1 USB7 BIOS / Debug SATA SATA2 PCIe lane 0 POST LEDs Onboard diagnostics for BIOS POST code data and address SATA SATA3 PCIe x1 PCIe lane 1 on LPC bus PCIe x1 Audio 7.1 PCIe lane 2 Secondary BIOS Onboard sockets for secondary LPC & SPI BIOS Audio PCIe x1 Channel HDA PCIe lane 3 Codec PCIe x1 ALC888 S/PDIF out PCIe lane 4 Active Components PCIe x1 PCIe lane 5 Audio Realtek ALC888 High Definition Audio Codec PS/2 KB/MS PCIe x1 Super I/O LPC Super I/O Winbond WF83627DHG on LPC bus COM1 Winbond PCIe lane 6 W83627DHG PCIe x1 Digital I/O I2C to GPIO bridge PCA9535 COM2 Express PCIe lane 7 Card LPC Connectors Header COM Express™ Two x 220-pin (Type 6) DDI1 4GPI – 4GPO Header DDI CRT DB15 on Rear I/O panel for VGA/CRT display Adapter DDI2 SMBus Card slot LVDS Onboard 34-pin header Header (PCI x16 w/ proprietary pinout) DDI3 Digital Display Interface Supports three DDI ports to HDMI/DVI/DIsplayPort output by GPIO Header adapter card (PCIe x16 slot with proprietary pinout) PCA9535 I2C Flat Panel Control Onboard 8-pin header Header Audio Mic/Line-in/Line-out on I/O panel EEPROM SATA Four SATA connectors PCIe x16 PCIe x16 slot PCIe Mini Card One socket onboard Feature / Control Signals Header LAN 10/100/1000BASE-T compatible RJ45 on I/O panel nd SPI USB 2.0 Four USB 2.0 on I/O panel, 2 SPI BIOS Four USB 2.0/3.0 on I/O panel Serial Port One DB-9 on I/O panel One onboard 10-pin header Ordering Information Smart Battery One 10-pin header for Smart Battery management Modules communications (connects to ADLINK BattMan board) LPC Debug Onboard 20-pin header Model Number Description/Configuration KB/Mouse Two 6-pin mini DIN (on rear I/O panel) Express-BASE6 COM Express Type 6 Reference Carrier Board in ATX Feature Connectors SMBus, I2C, module control signals form factor Miscellaneous Reset, Power LED, HDD LED, Buzzer
COM Express Carrier Design Guide Provides detailed information on designing your own custom carrier board for COM Express modules. Download from the Express-BASE6 product webpage at www.adlinktech.com
1-28 2011/1/20 下午 02:28:54 Accessories PSU Heatsink This Computer-on-Module Starter Kit gets you going with you going Kit gets Starter This Computer-on-Module in no time Verification and Software Design Board Carrier BSPs, Libraries Express™ Module COM Express™ CPU, Memory Carrier Board Express-BASE Reference and heatsink) Thermal Solution (heatspreader Guide, and User Manuals Schematics, Design with Documentation, Drivers, ADLINK USB stick Memory • COM Express™ module of your choice • COM Express™
• Socket-type CPU of your choice • Memory of your choice heatsink) • Thermal solution of your choice (heatspreader, Optional Items Includes Carrier Board Carrier http://www.adlinktech.com/Computer-on-Module Module COM Express COM Express , WinCE, Embedded XP ®
1-29
BSP for Linux - USB Stick with documentation, drivers, libraries, and - USB Stick with documentation, drivers, libraries, - PCI 2-slot riser card - CF adapter - TV out cable - SATA cable - SATA - IDE cable - Carrier Design Guide and product manuals - Carrier Design Guide and product
The Starter Kit consists of a COM Express™ core module with size ATX reference carrier board that offers one PCI Express graphics slot x16 , four PCI USB TV-out, Express 2,0, x1 LVDS, Gigabit slot, LAN, two SDVO, and PCI CRT, slots, Serial ATA, included. Super I/O. All necessary cables are Starter Kit - COM Express Express - COM Kit Starter
Standard Items Standard carrier board reference • Express-BASE • Accessory kit: Contents
Computer-On-Modules C112-09-P29-30-100-0103.indd 29 2011/1/20 下午 02:28:57 1-30 Please refer to page 9-39 Please refer for detailed information Select a core module, memory, module, memory, Select a core CPU (for socket thermal solution, and to your needs type) according Contact an ADLINK sales in your region representative Get the speci c part number for your starter kit Flat Panel Transfer Board Flat Panel Transfer Please refer to page 9-39 Please refer for detailed information
ADLINK provides a “tailor made” Starter Kit service. We let you choose your preferred core core your preferred let you choose We Starter Kit service. a “tailor made” provides ADLINK needs. development application solution to suit your speci c module and thermal How to order Starter Kit – COM Express Kit – COM Starter order How to BattMan Smart Battery Management System Reference ADLINK also provides a set of Engineering Test Tools to save you time and expedite Tools a set of Engineering Test ADLINK also provides your application development C112-09-P29-30-100-0103.indd 30 2011/1/20 下午 02:28:54 Accessories PSU Heatsink This Computer-on-Module Starter Kit gets you going with you going Kit gets Starter This Computer-on-Module in no time Verification and Software Design Board Carrier BSPs, Libraries Express™ Module COM Express™ CPU, Memory Carrier Board Express-BASE Reference and heatsink) Thermal Solution (heatspreader Guide, and User Manuals Schematics, Design with Documentation, Drivers, ADLINK USB stick Memory • COM Express™ module of your choice • COM Express™
• Socket-type CPU of your choice • Memory of your choice heatsink) • Thermal solution of your choice (heatspreader, Optional Items Includes Carrier Board Carrier http://www.adlinktech.com/Computer-on-Module Module COM Express COM Express , WinCE, Embedded XP ® - IDE cable cable - SATA - TV out cable - CF adapter - PCI 2-slot riser card and - USB Stick with documentation, drivers, libraries, BSP for Linux - Carrier Design Guide and product manuals - Carrier Design Guide and product The Starter Kit consists of a COM Express™ core module with size ATX reference carrier board that offers one PCI Express graphics slot x16 , four PCI USB TV-out, Express 2,0, x1 LVDS, Gigabit slot, LAN, two SDVO, and PCI CRT, slots, Serial ATA, included. Super I/O. All necessary cables are Starter Kit - COM Express Express - COM Kit Starter Contents Items Standard carrier board reference • Express-BASE • Accessory kit:
Computer-On-Modules C112-09-P29-30-100-0103.indd 29 7 ® EG20T PCH PCH EG20T ® ® XP / Windows ® / Moblin Atom™ Processor E6xx and EG20T PCH EG20T E6xx and Processor Atom™ ® ® ® Linux Embedded XP WinCE 6.0 Linux 6.x VxWorks QNX AIDI Library Realtek RTL8211CL 10/100/1000 Mbps Six USB 1.1/2.0 host ports and one USB 1.1/2.0 client port 1.5 Gb/s and 3 Gb/s ports supporting SATA Two with SDIO/MMC supporting SDHC speed class 6 (shared GPIO) TBD 2x One RS-232 (RX/TX) and one CAN (AX/RX) port (optional RS-232 w/o CAN) Windows Integrated in Intel mode mode and ATX 4.75 V – 21 V wide range, supports AT (with additional 5 Vsb) Supports S0, S1, S3, S4, S5 5W at 5V typical, 3W idle Yes 0°C to 70°C or industrial grade -40°C to 85°C -20°C to 80°C or industrial grade -40°C to 85°C 90% at 60°C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis 10 COM.0 R2.0 Type PICMG COM Express™ Ultra size 84 mm x 55 mm (3.3” x 2.17”) CE, FCC, HALT Integrated in Intel Platform Controller Hub EG20T Platform Controller ® ating Systems Atom™ Processor E6xx from 600 MHz up to 1.6 GHz 600 MHz up to 1.6 E6xx from Atom™ Processor ® Ultra size COM Express™ Type 10 Pinout Compatible Pinout Compatible 10 Type COM Express™ size Ultra with Intel Module for USB, LAN, SDIO, Serial & CAN bus and SATA for USB, LAN, SDIO, Up to 2 GB soldered DDR2 SDRAM at 800 MHz soldered DDR2 Up to 2 GB and SDVO support 24-bit LVDS lanes 4x PCI Express x1 Optional Intel 10 Pinout R2.0 Type COM Express™ COM.0 x 55 mm Ultra form factor 84 +70°C or -40°C to +85°C Operation at 0°C to Intel
Extended Support (BSP) PHY Speed USB SATA SDIO port SDIO storage Serial and CAN Oper Support Standard LAN GbE MAC Specifications Power Input Power Power States Power Consumption Smart Battery Support ental ironm and Env Mechanical Operating Temp Storage Temp Humidity Shock Vibration Compatibility Mechanical Certification Multi I/O and Storage Chipset
Features
® C (user) 2 Hyper-Threading and Intel Hyper-Threading ® Atom™ Processor E6xx Atom™ Processor Atom™ Processor E6xx Atom™ Processor http://www.adlinktech.com/Computer-on-Module ® ® Atom™ E680 / E680T*, 1.6 GHz, 3.9 W TDP Atom™ E660 / E660T*, 1.3 GHz, 3.3W TDP Atom™ E640 / E640T*, 1.0 GHz, 3.3W TDP Atom™ E620 / E620T*, 600 MHz, 2.7W TDP ® ® ® ® Intel Intel Intel (* T versions support -40°C to +85°C wide operating range) temperature support Intel All processors Virtualization Technology 512 KB on all processors 512 MB, 1 or 2 GB DDR2 at 800 MHz Soldered bootloader or AMI UEFI BIOS License-free Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug Instant on with Intel Bootloader support, OEM BIOS settings, & Statistics, ACPI 3.0, Smart Battery Management Info Board timer ranges with programmable support, Watchdog x1 (0/1/2/3, port 3 is optionally used for 4 PCI Express EG20T PCH; no PCIe x4 support) LPC Bus, SMBus (system) , I Multi-channel audio stream, 32-bit sample depth, sample Multi-channel audio stream, rate up to 192 kHz support for ALC888) On carrier (standard MPEG2, MPEG4, VC1, WMV9, H.264 and DivX MPEG4, H.264 (baseline at L3) maximum with depths color pixel 24-bit or 18- channel Single of up to 1280x768 @ 60 Hz. Pixel clock rate resolution between 19.75 MHz (minimum) and 80 MHz (maximum). Serial digital video output supporting devices for DVI, TV-out, of up to 1280x1024 @ 85 Maximum resolution analog CRT. Hz and pixel clock rate up to 160 MHz. Integrated in Intel Integrated in Intel Intel 4 GPI and 4 GPO (shared with SDIO on optional EG20T) 4 GPI and 4 GPO (shared SPI (supports BIOS only)
1-31
dio nanoX-TC
L2 cache Memory BIOS Monitor Hardware Debug Interface Embedded Features Expansion Busses Characteristics Audio Codec Decoding Encoding Interface LVDS SDVO High Definition Audio Au 2D/3D Graphic Engine Video Specifications System Core CPU
Computer-On-Modules Functional Diagram
Soldered Memory BIOS 512 MB ~ 2 GB DDR2
SPI
LPC bus
® XDP Intel Atom™ SFF-26 18/24-bit LVDS Processor SDVO HDA Audio E6xx(T) 3x PCIe x1 (port 1~3)
PCIe x1 (port 0)
PCIe x1 (port 0)
CAN bus (Ax/Rx) UART (Tx/Rx)
2x SATA (port 0,1)
6x USB Host ® 1x USB Client Intel Platform Controller Hub LAN PHY RTL8211CL EG20T
SDIO/MMC port 0 h c t 4x GPI GPIO Swi 4x GP0 PCA9535
SMBus
2 I C BC
Ordering Information Modules Accessories Model Number Description Model Number Description nanoX-TC-E680-1G Intel® Atom™ E680 processor at 1.6GHz with PCH EG20T Heat Spreaders nanoX-TC-E680T-1G Intel® Atom™ E680T processor at 1.6GHz with PCH EG20T, HTS-nXTC-B Heatspreader for nanoX-TC with threaded standoffs for Industrial grade temperature range from -40°C to 85°C bottom mounting nanoX-TC-E660-1G Intel® Atom™ E660 processor at 1.3GHz with PCH EG20T HTS-nXTC-BT Heatspreader for nanoX-TC with throughole standoffs for nanoX-TC-E660T-1G Intel® Atom™ E660T processor at 1.3GHz with PCH EG20T, top mounting Industrial grade temperature range from -40°C to 85°C Passive Heatsinks nanoX-TC-E640-1G Intel® Atom™ E640 processor at 1.1GHz with PCH EG20T THS-nXTC-B Multidirectional Heatsink for nanoX-TC with threaded nanoX-TC-E640T-1G Intel® Atom™ E640T processor at 1.1GHz with PCH EG20T, standoffs for bottom mounting Industrial grade temperature range from -40°C to 85°C nanoX-TC-E620-1G Intel® Atom™ E620 processor at 600 MHz with PCH EG20T nanoX-TC-E620T-1G Intel® Atom™ E620T processor at 600 MHz with PCH EG20T, Industrial grade temperature range from -40°C to 85°C
1-32
® XP 32-bit Vista 32-bit ® ® 2.6.26 and up 2.6.x BSP C Library for Win32, WinCE and Linux ® ® 2 Embedded XP BSP WinCE BSP Linux AIDI I Windows Linux 4.75V ~ 14V wide range input support, with optional 5Vsb for 4.75V ~ 14V wide range input support, with optional 5Vsb support ATX Supports S0, S1, S3, S4, S5 typical) 5 W (with Atom Z510 and 512 MB memory, 0°C to 60°C -20°C to 80°C 10% to 90%, storage: 5% to 95% (non condensing) 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis 1 COM.0 Type PICMG COM Express™ Ultra size 84 mm x 55 mm (3.3” x 2.17”) CE, FCC Windows Single channel IDE with UDMA (33/66/100) connects to Single channel IDE with UDMA (33/66/100) connects to State Disk of 1 GB up to 8 GB Solid onboard bridge to SATA PATA port One SATA one MB/s; 480 to up transfers of capable ports 2.0 USB Eight port optionally configurable as USB client Atom™ Processor Z5xx and US15W Chipset US15W Z5xx and Processor Atom™ ® 8 BIOS ® Atom™ Processor Z530/Z510 Atom™ Processor Hub US15W System Controller ating Systems ® ® Ultra size COM Express™ Type 1 Pinout Compatible Module Module Compatible 1 Pinout Type COM Express™ size Ultra Intel with Intel Intel 2 without LAN) One PCIe x1 (opt. and SDVO 18/24-bit LVDS USB 2.0, SDIO, LPC GbE LAN, SATA, AMIBIOS GB up to 8 GB Solid State Disk: 1 x 55 mm footprint Ultra Compact 84 Extended Support
Power Specifications Power Input Power Power States Power Consumption ental ironm and Env Mechanical Operating Temp. Storage Temp. Humidity Shock Vibration Compatibility Mechanical Certifications Oper Support Standard Multi I/O IDE (PATA) SATA USB
Features on System Controller Hub on System Controller ® System Controller Hub US15W System Controller http://www.adlinktech.com/Computer-on-Module ® High Definition Audio codec on carrier board High Definition Audio codec on carrier board ® C 8 with CMOS backup in 8 Mbit LPC Flash 2 ® Atom™ processor Z530 at 1.6 GHz with 533 MHz FSB, Atom™ processor Z510 at 1.1 GHz with 400 MHz FSB, Atom™ processor Hub US15W System Controller ® ® ® 2.3 watts TDP, supports Hyper-Threading 2.3 watts TDP, Intel 2.0 watts TDP 400/533 MHz 512/1024 MB non-ECC, unbuffered Soldered DDR2 Intel AMIBIOS Supply voltages and CPU temperature timer ranges to generate RESET Programmable x1 PCI Express Two LPC bus SMBus / I Supports Intel Integrated on Intel GMA 500 integrated on Intel Intel US15W with full HD HW Ultra low power integrated 3D graphics core video decode engine and dual independent display support Analog VGA not supported Single channel 18/24-bit at 25~112 MHz May be used for any external display device (HDMI/DVI, includes EDID and and LVDS); VGA/CRT analog TV, EDID-less support, and a 160 MHz pixel clock Gigabit Ethernet PCI Express Controller Realtek RTL8111C and Alert on LAN 10/100/1000 Mbps with Wake-on-LAN support
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dio nanoX-ML Memory Chipset BIOS Hardware Monitor Hardware Timer Watchdog Expansion Busses Type Au Chipset Video Chipset Specifications System Core CPU Features Interface CRT Interface LVDS SDVO Chipset Interface LAN
Computer-On-Modules Functional Diagram
Intel® Atom™ Z510/Z530
FSB 400/533 MHz
® Intel US15W DDR-2 DDR2 400/533 Memory soldered Controller
LAN
SDVO VO GbE RT8111C S D two Graphics Core PCIe x1 200 MHz EIDE PATA 1x PATA Slave SSD Solid State Drive r
e 1 GB up to 8 GB t s a 0
LVDS LPC HDA SDIO/ 8x M N
n e 18/24-bit A Audio MMC USB 2.0 PATA to L la
, SATA Bridge x1 BC e I C P C P C T A L 2 I A SMBus S
Ordering Information Modules Accessories Model Number Description Model Number Description nanoX-ML-51/512-0 Ultra COM Express™ Type 1 compatible module with Intel® Heat Spreaders Atom™ processor Z510 at 1.1 GHz and 512 MB DDR2 HTS-nML-B Heatspreader for nanoX-ML (BGA CPU) with threaded nanoX-ML-53/512-0 Ultra COM Express™ Type 1 compatible module with Intel® standoffs Atom™ processor Z530 at 1.6 GHz and 512 MB DDR2 Passive Heatsinks nanoX-ML-51-512/4G Ultra COM Express™ Type 1 compatible module with Intel® Atom™ Processor Z510 at 1.1 GHz, 512 MB memory and THS-nML-B Low profile Heatsink for nanoX-ML (BGA CPU) with 4 GB SSD storage threaded standoffs nanoX-ML-53-512/4G Ultra COM Express™ Type 1 compatible module with Intel® Atom™ Processor Z530 at 1.6 GHz, 512 MB memory and 4 GB SSD storage nanoX-ML-51-1024/4G Ultra COM Express™ Type 1 compatible module with Intel® Atom™ Processor Z510 at 1.1 GHz, 1GB memory and 4 GB SSD storage nanoX-ML-53-1024/4G Ultra COM Express™ Type 1 compatible module with Intel® Atom™ Processor Z530 at 1.6 GHz, 1GB memory and 4 GB SSD storage
1-34 COM Express™ ® C, module control signals, flat panel control signals signals, flat panel control C, module control 2 x1 (5 slots, 1 PCIe Mini Card slot) 1 PCIe Mini Card x1 (5 slots, Connector AB only, one 220-pin (Type 1) one 220-pin (Type Connector AB only, 34-pin header Onboard Mic/Line-in/Line-out on I/O panel connectors SATA Two (USB + PCIe x1) One socket onboard 10/100/1000BASE-T compatible RJ45 on I/O panel Five on I/O panel, one Mini-USB (client only) and one through PCIe Mini Card DB-9 on I/O panel Two One header onboard One header for Smart Battery management communications (connects to ADLINK BattMan board) I/O panel) 6-pin mini DIN (on rear Two SD socket for bootable storage or function extension SMBus, I Reset, Power LED, HDD LED, Buzzer connector ATX Standard mini switch RESET button and ATX Onboard ® COM Express™ Type 1 Reference Carrier Board Board Carrier Reference 1 Type Express™ COM Bridge PCIe-to-PCI onboard with Carrier Design Guide ress Six PCI Exp slots bridge, two PCI™ PCIe-to-PCI slot SDVO ADD2 card (enable/disable) LPC based Super I/O multiplexed on GPIO SDIO/MMC support, and SPI) Dual BIOS (both LPC Compatible with PICMG Connectors COM Express™ LVDS Audio SATA PCIe Mini Card LAN USB 2.0 Serial Port Parallel Port Smart Battery KB/Mouse SDIO/MMC Connectors Feature Miscellaneous Power Switches
Features http://www.adlinktech.com/Computer-on-Module Mini Card slot Mini Card x1 slots ® ®
COM Express™ Revision 1.0 COM Express™
® C to GPIO bridge PCA9535 2 Supports Type 1 Basic and Ultra form factor modules 1 Basic and Ultra Supports Type 305 mm x 240 mm (AT/ATX) Five PCI Express One SDVO ADD2 slot LPC bus header Two 32-bit PCI™ v2.3 slots Two One PCI Express PLX PEX8505 switch with PCIE0 input from module PLX PEX8505 switch with PCIE0 input from PEX8505 PLX PEX8112 bridge with PCIe x1 input from switch Winbond WF83627DHG on LPC bus Realtek ALC888 High Definition Audio Codec I Onboard diagnostics for BIOS POST code data and address diagnostics for BIOS POST code data and address Onboard on LPC bus sockets for secondary LPC & SPI BIOS Onboard PICMG 1-35 nanoX-BASE Dimensions Expansion Busses
PCI Express Switch PCI Express to PCI Express PCI Bridge Super I/O Audio Codec Digital I/O Active Components Active BIOS / Debug POST LEDs Secondary BIOS Specifications Factor Form Interface Module Core
Computer-On-Modules Functional Diagram
USB0 USB1 4-port Single Channel LVDS Header NC USB Flat Panel Control Signals USB3 Header
USB4 PCIe x16 Slot SDVO Flat cable in RJ-45 USB5 & LAN 2-port USB USB2 Mini USB
SATA SATA0 USB6 s
PCIe (x1) s SATA1 Card SATA CI pre P x E Mini
PCIe (x1) PCIE0 (x1) PCIe PCIe x16 Slot Switch PCIe (x1) PEX 8505 PCIe x1 Slot PCI Audio
Audio 7.1 HDA / AC’97 e Codec Channel (x ALC888 1 ) AB PCI PCIe to PCI Slot PCI bridge GPIO / SDIO PCI SDIO / MMC PEX 8112 PCI Slot
PCIE1 (x1) Header PCIe x1 Slot PCIE2 (x1) PCIe x1 Slot SMBus Header PCIE3 (x1) PCIe x1 Slot
Header GPIO PCA9535 LPT1 I2C Header COM1
COM2 EEPROM Super I/O LPC Winbond IrDA Feature / Control Signals W83627DHG Header PS/2 KB/MS
LPC nd 2 LPC BIOS
Ordering Information Carrier Model Number Description nanoX-BASE COM Express™ Type 1 Reference Carrier Board with onboard PCIe to PCI bridge
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2011/1/20 下午 02:28:03 PSU Accessories FPTB ADD2 This Computer-on-Module Starter Kit gets you going with you going Kit gets Starter This Computer-on-Module in no time Verification and Software Design Board Carrier BSPs, Libraries COM Express™ Type 1 core module 1 Type COM Express™ or heatsink) Thermal solution (heatspreader Carrier Board nanoX-BASE Reference flat panel evaluation kit LVDS Guide, and User Manuals Schematics, Design with Documentation, Drivers, ADLINK USB stick Heatsink
LVDS Panel LVDS Includes Linux, Embedded XP • Accessory kit: flat panel cabling - LVDS SDVO, USB cables - SATA, - Power cord and BSP for - USB stick with documentation, drivers, libraries, manuals - Carrier Design Guide and product 1/10 Module Carrier Board Carrier COM Express Type Type COM Express http://www.adlinktech.com/Computer-on-Module
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SDIO/MMC slot, USB 2.0, Gigabit LAN and Super I/O. ADLINK also additional provides development tools including a veri ed thermal solution and cabling accessories. power supply, ADD2 DVI card, conversion board, panel, LVDS-to-TTL 10.1” LVDS
The nanoX Starter Kit consists of a COM Express™ 1 Type core module with size ATX reference carrier board that provides four PCI x1 Express slots, one PCI x16 Express slot (x1 link), two PCI slots, an SDVO/ADD2 slot, one PCIe Mini slot, Card one Starter Kit - nanoX Kit Starter Optional Items module of your choice 1 core Type • COM Express or heatsink) • Thermal solution of your choice (heatspreader • nanoX-BASE reference carrier board • nanoX-BASE reference flat panel • 10.1” (1024 x 600) LVDS • SDVO to DVI adapter • Flat panel transfer board power supply • ATX Standard Items Standard Contents
Computer-On-Modules 09-37-38-100-0103.indd 37 2011/1/20 下午 02:28:07 1-38 Please refer to page 9-40 to page 9-40 Please refer for detailed information Select a core module and thermal Select a core to your needs solution according Contact an ADLINK sales in your region representative Get the speci c part number for your nanoX Starter Kit LPC POST Debug Card Please refer to page 9-39 Please refer for detailed information
ADLINK provides a “tailor made” Starter Kit service. We let you choose your preferred core core your preferred let you choose We Starter Kit service. a “tailor made” provides ADLINK needs. development application solution to suit your speci c module and thermal How to order Starter Kit – nanoX Starter order How to BattMan Smart Battery Management System Reference ADLINK also provides a set of Engineering Test Tools to save you time and expedite Tools a set of Engineering Test ADLINK also provides your application development 09-37-38-100-0103.indd 38
2011/1/20 下午 02:28:03 PSU Accessories FPTB ADD2 This Computer-on-Module Starter Kit gets you going with you going Kit gets Starter This Computer-on-Module in no time Verification and Software Design Board Carrier BSPs, Libraries COM Express™ Type 1 core module 1 Type COM Express™ or heatsink) Thermal solution (heatspreader Carrier Board nanoX-BASE Reference flat panel evaluation kit LVDS Guide, and User Manuals Schematics, Design with Documentation, Drivers, ADLINK USB stick Heatsink
LVDS Panel LVDS Includes Linux, Embedded XP • Accessory kit: flat panel cabling - LVDS SDVO, USB cables - SATA, - Power cord and BSP for - USB stick with documentation, drivers, libraries, manuals - Carrier Design Guide and product 1/10 Module Carrier Board Carrier COM Express Type Type COM Express http://www.adlinktech.com/Computer-on-Module The nanoX Starter Kit consists of a COM Express™ 1 Type core module with size ATX reference carrier board that provides four PCI x1 Express slots, one PCI x16 Express slot (x1 link), two PCI slots, an SDVO/ADD2 slot, one PCIe Mini slot, Card one SDIO/MMC slot, USB 2.0, Gigabit LAN and Super I/O. ADLINK also additional provides development tools including a veri ed thermal solution and cabling accessories. power supply, ADD2 DVI card, conversion board, panel, LVDS-to-TTL 10.1” LVDS Starter Kit - nanoX Kit Starter Optional Items module of your choice 1 core Type • COM Express or heatsink) • Thermal solution of your choice (heatspreader Contents Items Standard carrier board • nanoX-BASE reference flat panel • 10.1” (1024 x 600) LVDS • SDVO to DVI adapter • Flat panel transfer board power supply • ATX
Computer-On-Modules 09-37-38-100-0103.indd 37 Useful time saving tools to expedite expedite tools to time saving Useful development application your Flat Panel Transfer Board for LVDS-to-TTL signal for LVDS-to-TTL Board Flat Panel Transfer conversion flat panel display HannStar 10.1” LVDS (HSD100IFW1-A00) cable to connect HannStar HSD100IFW1-A00 LVDS or flat panel display to FPTB, Express-BASE, LVDS nanoX-BASE cable FPTB LVDS-to-LVDS Description/Configuration Description/Configuration Smart Battery Reference Platform for COM Express™ Platform for COM Express™ Smart Battery Reference modules (includes two Smart Batteries) PEG x16 MXM-II carrier board (w/o MXM graphics module) PEG x16 MXM-II carrier board (w/o MXM graphics module) PEG x16 MXM-III carrier board Radeon™ E4690 GPU MXM-III module based on ATI Description/Configuration The BattMan Smart Battery Management Reference System supports System Reference Management Battery Smart BattMan The mobile Express COM for power ATX provides and Batteries Smart two embedded systems. The BattMan easily implement battery power in COM Express based system applications allows developers high mobility. requiring to Contents • BattMan module Smart Batteries • Two cabling • Power adapter and drivers schematic, reference board • USB disk with BattMan and documentation Ordering Information Ordering Model Number FPTB LCD 10.1” TFT 30P to 34P+8P cable LVDS cable for FPTB LVDS Note: Included in the Starter Kit - nanoX. Ordering Information Ordering Model Number StarterKit-Battman The Flat Panel Transfer verificationLVDS of Board and TTL flat (FPTB) panel displays with Express-BASE supports prototyping and nanoX-BASE carrier and boards and is equipped with an LVDS-to- TTL converter to allow users to implement TTL displays with Express COM systems that support LVDS only. and TTL displays. Onboard for LVDS supports backlight control PWM circuitry ADLINK’s ADLINK’s PCIe x16 MXM carrier graphics expansion using a Mobile PCI boards Express Module (MXM). The allow for MXM discrete carrier PCIe board series supports MXM-II modules, allowing developers to evaluate, and prototype verify MXM and MXM-III graphics board carrier custom the into integration full before modules graphics design. Model Number MXM2CR MXM3CR MXM3-E4690 Ordering Information Ordering http://www.adlinktech.com/Computer-on-Module
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PCIe x16 MXM Carrier Board Flat Panel Transfer Board Flat Panel Transfer
BattMan Smart Battery Smart Battery BattMan System Reference Management Engineering Test Tools Test Engineering
Computer-On-Modules PCIe x16-to-two-x8 Adapter Card The ADLINK PCIe x16-to-two-x8 adapter card allows the use of two PCIe x8 add-on cards from a single PCIe x16 slot.
Ordering Information Model Number Description/Configuration P16TO28 PCIe x16-to-two-x8 adapter card
LPC POST Debug Board LPC POST debug board with secondary LPC BIOS and POST status LED. Can be easily connected to the LPC debug port on the Computer-on-Module to monitor BIOS POST status. A single step switch is provided for BIOS debug verification.
Ordering Information Model Number Description/Configuration LPC_DEBUG_2 LPC POST debug board with secondary LPC BIOS
COM-T6T2 Adapter Board The COM-T6T2 adapter board allows COM Express Type 6 modules to be backwards compatible with Type 2 carrier boards. A SATA- COM Express Type 6 to Type 2 Conversion to-PATA converter and PCIe-to-PCI bridge are onboard to provide signal conversion to the required COM Express Type 2 interfaces. The SDVO port is rerouted to correspond with the Type 2 pin definition (no PCIe x16).
Ordering Information Model Number Description/Configuration COM-T6T2 COM Express Type 6 to Type 2 adapter card (w/ SDVO)
T6-DDI Video Adapter Card The T6-DDI Video Adapter Card provides connector access to COM Express Type 6 module Digital Display Interface (DDI) outputs. COM Express Type 6 DDI to HDMI/DVI/DisplayPort HDMI, DVI and DisplayPort outputs are provided. The T6-DDI is installed on the ADLINK Express-BASE6 Type 6 carrier board using a PCIe x16 slot with proprietary pinout.
Ordering Information Model Number Description/Configuration T6-DDI COM Express Type 6 DDI-to-HDMI/DVI/DisplayPort adapter card
1-40 Mouser Electronics
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