DOCSLIB.ORG

Renesas Electronics Corporate Presentation

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Renesas Electronics Corporate Presentation RENESAS ELECTRONICS CORPORATE PRESENTATION APRIL 2021 © 2021 Renesas Electronics Corporation. All rights reserved. WHO WE ARE Renesas Electronics Corporation is a global semiconductor company Headquarters delivering trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent Tokyo, Japan devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, ~ 19,000 employees Renesas provides comprehensive solutions for a broad range of automotive, industrial, infrastructure, and IoT applications that help Operating in shape a limitless future. 28 countries 715.7 billion yen revenue in 2020 Approx. 20,000 patents & pending applications SoC: System-on-a-chip © 2021 Renesas Electronics Corporation. All rights reserved. Page 2 OUR HISTORY Renesas is built on a strong historical foundation of technological innovation originating from Hitachi, Mitsubishi and NEC. Fueled by the Intersil and IDT integrations, Renesas is now poised to extend its share in fast-growing data economy-related markets such as infrastructure and data center, and strengthen its presence in the industrial and automotive segments. NEC Electronics Renesas Electronics Acquisition of Renesas Electronics Spin-off from NEC started operation Intersil 10th Anniversary NEC Electronics and Strengthen leadership Renesas Technology merged in the analog market 2002 2003 2010 2013 2017 2019 2020 2021 Renesas Technology Investment by INCJ Acquisition of Spin-off from Hitachi and IDT Mitsubishi merger Expanded the analog solution lineup and strengthen kit solution offerings IDT: Integrated Device Technology © 2021 Renesas Electronics Corporation. All rights reserved. Page 3 OUR PURPOSE To Make Our Lives Easier by complementing human capabilities © 2021 Renesas Electronics Corporation. All rights reserved. Page 4 GLOBAL SALES NETWORK . Global sales network operating across more than 20 countries . Comprehensive R&D capabilities and support through a global network Canada: Ottawa Germany: Duesseldorf Beijing US: Silicon Valley Korea Milpitas Shanghai San Jose Israel Taipei Hong Kong Toyosu, Tokyo India: Bangalore Malaysia Singapore Brazil: Sao Paulo Headquarters Sales Companies Branch offices Design and Application Technologies Companies As of January 1, 2021 © 2021 Renesas Electronics Corporation. All rights reserved. Page 5 GLOBAL MANUFACTURING NETWORK . 14 manufacturing facilities in Japan, China, Southeast Asia, and the US . Global partners such as TSMC and GLOBALFOUNDRIES Beijing Suzhou US: Palm bay Malaysia (2 plants) Naka Yonezawa Takasaki Oita Shiga Kumamoto-Nishiki Yamaguchi Saijo Kawashiri Manufacturing sites (Front-end: 7) Manufacturing sites (Back-end: 7) Manufacturing and Engineering Services Companies As of January 1, 2021 © 2021 Renesas Electronics Corporation. All rights reserved. Page 6 LEADERSHIP TEAM EXECUTIVE STRUCTURE Hidetoshi Shibata Shuhei Shinkai Jason Hall Shinichi Yoshioka Representative Director, SVP & CFO SVP & CLO SVP & CTO President and CEO Corporate Strategy & Finance Procurement, Legal, Accounting & Control Information Systems, HR & General Affairs SCM Automotive Solution Business Unit IoT and Infrastructure Business Unit Production and Technology Unit Takeshi Kataoka Sailesh Chittipeddi Masahiko Nozaki SVP / GM EVP *2 / GM EVP / GM Tomomitsu Maoka Chris Allexandre Hiroto Nitta Roger Wendelken SVP *1 SVP SVP SVP Deputy GM Sales and Corporate SoC Business MCU Business Digital Marketing *1: Chairman, Renesas Electronics (China) / *2: President, Renesas Electronics America CEO: Chief Executive Officer / EVP: Executive Vice President / GM: General Manager / SVP: Senior Vice President / CTO: Chief Technical Officer / CFO: Chief Financial Officer / CLO: Chief Legal Officer As of April 1, 2021 © 2021 Renesas Electronics Corporation. All rights reserved. Page 7 SOLUTION OFFERINGS Our mission is to develop a safer, healthier, greener, and smarter world by providing intelligence to our four focus growth segments: Automotive, Industrial, Infrastructure, and IoT that are all vital to our daily lives, meaning our products and solutions are embedded everywhere. Automotive Industrial Infrastructure IoT Highly reliable vehicle control, safe and secure Robust infrastructure, Comfortable, safe and Lean, flexible and autonomous driving and enabling healthy lifestyles smart industry Eco-friendly electric safety and efficiency through IoT vehicles © 2021 Renesas Electronics Corporation. All rights reserved. Page 8 CORE TECHNOLOGIES Renesas is poised to address the requirements of every industry with our four pillars of core technologies AI, Security & Safety, Digital & Analog & Power Solution and Cloud Native as the key to encouraging more innovation that is finely-tuned to achieve future sustainable growth. AI A broad set of high-power and Digital & Analog & Power Solution energy-efficient embedded processors Winning Combinations that combine our complementary product portfolios INNOVATION Security & Safety Comprehensive technology and support Cloud Native that meet the industry’s stringent standards Cross-platforms working with partners in different verticals and organizations © 2021 Renesas Electronics Corporation. All rights reserved. Page 9 WHAT WE DO Renesas delivers a vast array of semiconductor products, from sensors to actuators, across the whole signal chain to help our customers realize complete system solutions. Focus verticals Sense Move / Store Compute Actuate Sensor (optical, flow, Timing ADAS/AD platform Motor solution Automotive humidity, gas, CO2, Optical Gateway OIS servo-controller temperature, Memory interface DRP / e-AI PMIC thermopile) High bandwidth MCU BMIC Sensor signal Industrial memory (“HBM”) conditioner (“SSC”) MPU SOTB NVDIMM SoC Low Iq BLE 5.0 Wireless power Infrastructure NB IoT IGBT / MOSFET 6LoWPAN RF, RF for 5G IoT © 2021 Renesas Electronics Corporation. All rights reserved. Page 10 BROAD AND SCALABLE PRODUCT PORTFOLIO Microcontrollers & Microprocessors Analog and Power Devices SoC and others Arm® Core Arm® Cortex®-M 32-bit MCUs . Analog products Arm ecosystem, Advanced security, Intelligent IoT . Clocks & timing Arm®-based High-end 32 & 64-bit MPUs . Interface & connectivity High-resolution HMI, Industrial network & real-time control . Memory & logic Arm® Cortex®-M0+ Ultra-low Power 32-bit MCUs . Power & Power management Innovative process tech (SOTB), Energy harvesting Factory automation . RF products Arm®-based 32-bit MCUs for Qualified Platform . Qualified software and tools Sensor products . Renesas Core Space & harsh environment Ultra-low Energy 8 & 16-bit MCUs Bluetooth® Low Energy, SubGHz, LoRa®-based Solutions Automotive products High Power Efficiently 32-bit MCUs Motor control, Capacitive touch, Functional safety, GUI . Sensors . Clocks & Timing Car information systems . Power Management . Video & Display 40nm/28nm process Automotive 32-bit MCUs . Power Devices . Interface Rich functional safety and embedded security features . Battery Management Safe cognitive computing © 2021 Renesas Electronics Corporation. All rights reserved. Page 11 WINNING COMBOS Based on Renesas‘ complementary product portfolios, our Analog + Power + Embedded Processing product experts have developed “Winning Combinations,” . Appliances . Medical Equipment & Solutions compelling, competitive, value-added combinations that help . Automotive . Motor Drives our customers and partners worldwide accelerate their . designs and get to market faster where high data- Building Safety & Security Network Communications processing performance is crucial. Computing & Data Center . Office Automation . Connected & Infotainment . PC, Notebooks, & Tablets . Factory Automation & Control . Robotics . Fitness & Personal Care . Test & Measurement . FPGA Solutions . Wearables . Gaming & Entertainment . Wireless Infrastructure . Grid Infrastructure . xEV . HVAC © 2021 Renesas Electronics Corporation. All rights reserved. Page 12 ROBUST ECOSYSTEM Thousands of alliance partners - a network of trained and certified design service partners - support every stage in your customers' design cycles, working together to achieve goals. Renesas’ Preferred Partner Program and other product-specific partner programs offer opportunities to create new business. We also have consortiums that specialize in the automotive and industrial fields. 1000+ globally Tool Software Design Component Manufacturing Training © 2021 Renesas Electronics Corporation. All rights reserved. Page 13 SUSTAINABILITY AT RENESAS Sustainability is at the heart of what we do. Renesas’ products and solutions are contributing to a long-term sustainable society. At Renesas, we will continue to focus on making lives easier across all our local communities. Environment Social Governance . Eco-factory Products and solutions contributing to a sustainable society . Board of directors / . Eco-product auditors Energy Efficiency Safety & Security . Communications . Nomination / xEV, Energy-efficient home ADAS / AD, Smart factory compensation committees appliances / Building automation Visit Renesas.com/sustainability © 2021 Renesas Electronics Corporation. All rights reserved. Page 14 LEADERSHIP TEAM CORPORATE GOVERNANCE STRUCTURE Board of Directors Auditors . Kazuki Fukuda, Corporate Auditor (full-time) . Kazuyoshi Yamazaki, Outside Corporate Auditor (part-time) . Takeshi Sekine, Outside Corporate Auditor (part-time) . Tomoko Mizuno, Outside Corporate Auditor (part-time) Hidetoshi Shibata
Load more

Recommended publications
  • 1. Outline of Submarine Cable Systems
    NEC’s Submarine Cable System December 5, 2008 NEC Corporation Broadband Network Operations Unit Executive General Manager Masamichi Imai 1. Outline of Submarine Cable Systems 2 © NEC Corporation 2008 1-1. The History of Submarine Cables 1850:First Telegraph cable at Dover Strait 1858:First Trans-Atlantic Telegraph Cable (1876：Graham Bell invents the Telephone) 1906: Submarine Cable Tokyo-Guam 1956:First Trans-Atlantic Coaxial Cable （1963： Satellite Communications between Japan and US begins) 1964:First Trans-Pacific Coaxial Cable 1988:First Trans-Oceanic Optical Cable(1 Gb/s) 1999:Trans-Oceanic Optical Cable (640 Gb/s) 2001:Trans-Oceanic Optical Cable (1.28~Tb/s) 3 1-2. Summary of Submarine Cable Systems Station A Station B ・Burial up to sea depth of 1500m Max. Sea Depth 8,000m ・Avg 1m-3m burial (Max.15m) (at 8000m below sea level, water pressure is equivalent to holding a car on one’s thumb.) = Repeater Placed at 40Km～100km intervals ←Cables are laid in deep trenches Max. Transmission Distance 12,000~13,000km Japan to US West Coast is approx. 8,000km At least 80~100 repeaters are required. 4 1-3. Components of a Submarine Cable System Dry Side Wet Side Submarine Repeater Line Terminal Equipment Submarine Cables (inc.. fiber.) Power Feeding Equipment Supervisory System Network Protection Equipment Overall System Monitoring (SDH system) Repeater Performance Monitoring Installation Cableship 5 1-4. Technical Trends CoaxialCoaxial FiberFiber OpticsOptics Optical 40G DWDM Amplifier 10G DWDM System 2.5G DWDM 5G Single Optical Regenerator System 1.3 / 1.55 μm Coaxial Repeater System 1970 1980 1990 2000 NowNow 6 1-5.
    [Show full text]
  • Integrated Report 2018 1
    Integrated Report 2018 1 The latest information on the Maxell Group can be found on our website. Editorial Policy This report is issued for the purpose of sharing the vision of the Maxell Group, where business is based on harmonious coexistence with society. This is an integrated report that goes over the Group’s businesses and financial results as well as its CSR activities and the outcomes of these activities. This report, in the wake of the Maxell Group’s transition to a holding company in October 2017, is aimed at renewing stakeholders’ under- standing of the strengths of the new Maxell Group, the overall vision and specific measures of its new Mid-Term Plan, and the connection between both CSV business management and CSR activities and our business strategy, which is geared toward sustainable growth. The Group has worked hard to win support for its position on co-creation and co-prosperity as well as to foster anticipation for and confidence in the Group’s growth, and will continue to do so. Moreover, we include ESG information, which forms the foun- dation of corporate management, as a way to fulfill our social responsibility to all stakeholders and demonstrate the Maxell Group’s stance toward corporate governance, protection of the global environment, and social contributions. Detailed financial and CSR-related information that could not be Regarding Support for Disasters in published in full in this report is disclosed on the Company’s website. For Viewing via PDF Summer 2018 Category tabs, navigation buttons, and link buttons have been provided on each page for easy access to related pages and websites.
    [Show full text]
  • Leading Optical Device Manufacturers Release Common Specifications for 40 Gbit/S Solutions Based on XLMD Optical Device Multi-Source Agreement
    Leading Optical Device Manufacturers Release Common Specifications for 40 Gbit/s Solutions Based on XLMD Optical Device Multi-Source Agreement Multi-Source Agreement Enables Multiple Vendors to Produce 40 Gbit/s Optical Devices Based on a Unified Standard TOKYO, JAPAN & SAN DIEGO, CA: February 21, 2008 – Eudyna Devices Inc., Mitsubishi Electric Corp., NEC Electronics Corp., Oki Electric Industry Co., Ltd., Opnext Inc. and Sumitomo Electric Industries, Ltd., today announced, in advance of OFC/NFOEC, common specifications for pigtail type optical devices based on the 40 Gbit/s Optical Device Multi-Source Agreement (XLMD-MSA*1), introduced by the six companies in March 2007. The newly available XLMD-MSA specifications detail the external-modulation laser transmitter devices with built-in driver ICs and the PIN-TIA*2 receiver devices that comply with 40 Gbit/s interface standard for SONET OC-768*3. 10 Gbit/s optical transmission interfaces are widely deployed in Metropolitan Area Networks (MAN), Local Area Networks (LAN) and Storage Area Networks (SAN). These networks currently form the backbone of broadband infrastructure, consequently increasing the popularity of 40 Gbit/s optical transmission interfaces. The XLMD-MSA aims to establish compatible sources of 40 Gbit/s optical transmitter and receiver devices embedded into the 40 Gbit/s optical transceiver modules. This agreement will accelerate the growth of the 40 Gbit/s transceiver module market, providing advanced solutions to high capacity network and storage systems. All members will promote the MSA-compliant products in order to achieve consistent customer delivery and market growth. The XLMD-MSA specifications for compatible optical devices include: Mechanical dimensions and pin assignments of pigtail type optical devices High speed electrical interface using a dual SMPM*4 connectors Optical and electrical characteristics The specifications are now available at the XLMD-MSA web site.
    [Show full text]
  • 2SK3446 Datasheet
    To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. 4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples.
    [Show full text]
  • Internal Round Table Discussion: the Potential of the Field Solutions Business
    Internal Round Table Discussion: The Potential of the Field Solutions Business Our field solutions (FS) business undertakes the maintenance, repair, and modification of semiconductor production equipment supplied by the TEL Group to customers, and until now responsibility for these business activities was spread over multiple organizations, including post-sales divisions. In October 2009 these activities were unified and our FS business launched. Employees involved in this area conducted a round table discussion of the potential for FS business (the discussion was held on June 28, 2010). Generating innovation in the FS business local situations and creating ideas independently. Asano: I feel that the equipment modification business, Moderator: Business models in the world are changing which was inactive only a few years ago, has really changed. dramatically. From now on not only cutting-edge but also Our company is now calling this a period of innovation and low-cost and other numerous semiconductor applications growth. In the FS business, too, we intend to construct new are going to become necessary, especially when aiming business models and generate innovation. at developing countries. Is there a relationship between Sakamoto: I think that one way to generate innovation is the background to these times and the launching of the FS through interpersonal communication. By expanding our business? FS business, our close communication with customers has Kaminaga: In our FS business, the entire TEL Group is become livelier than ever before and this has promoted responding to the polarization of the market into competing innovation. Moreover, by making use of the broad knowledge with cutting-edge technology and effectively utilizing existing and know-how we have accumulated in developing both devices and production lines through the sale of TEL-certified hardware and software, we provide consulting services for used equipment and other efforts.
    [Show full text]
  • Japanese Semiconductor Manufacturing
    +44 20 8123 2220 [email protected] Japanese Semiconductor Manufacturing Industry Development and Strategies of Key Players https://marketpublishers.com/r/JE397FCA2F5EN.html Date: August 2019 Pages: 29 Price: US$ 1,260.00 (Single User License) ID: JE397FCA2F5EN Abstracts The Japanese semiconductor industry, which previously operated under the IDM (Integrated Device Manufacturer) model, not only was a leader in Asia, but also had a unprecedented role in the world. After many years passed, Japan was too slow to adjust to structural changes in the industry, causing it to gradually lose its edge. This report covers the current status and future development of the industry as it gears itself towards new application markets such as autonomous vehicles and explores strategies of key players, including Toshiba, Panasonic, Fujitsu, Renesas Electronics, and Sony. Japanese Semiconductor Manufacturing Industry Development and Strategies of Key Players +44 20 8123 2220 [email protected] Contents 1.INDUSTRY STATUS 1.1 Toshiba is the Only Japan’s Semiconductor Brand Left on Top 10 Player List 2. DEVELOPMENT OF JAPAN'S KEY PLAYERS 2.1 Toshiba 2.1.1 Japan’s No. 1 Semiconductor Manufacturer, Ranked 8th in the World 2.1.2 NAND Flash is Toshiba’s Main Semiconductor Revenue Source 2.1.3 Toshiba Memory Corporation (TMC) Spun off to Fix Accounting Issues 2.2 Panasonic 2.2.1 Missed Market Changes, Poor Operations, No Longer a Top-ranked Company 2.2.2 Tightening Belts to Focus on Sensors 2.3 Fujitsu 2.3.1 Ranked 20th in the World, with no Standout
    [Show full text]
  • Innovation Network Corporation of Japan (INCJ)
    Innovation Network Corporation of Japan (INCJ) 2017 February 8 Our philosophy ○ The basic philosophy of Innovation Ｎｅｔｗｏｒｋ Corporation of Japan (INCJ) is "open innovation". By promoting open innovation, Japanese companies can escape from the pyramid type industrial structure and will dramatically strengthen the productivity and competitiveness of Japanese industry. ○ In order to advance open innovation, it is important to utilize not only debt but also equity as risk money. ○ INCJ has promoted open innovation through (1) investment in venture companies, (2) restructuring and integration of business, and (3) utilization of overseas management resources. 【Basic policy】 In investing, INCJ emphasizes on the following matters, unlike the private sector. Focus on not only profitability and feasibility but also social significance (investment impact) Provide relatively mid- to long-term risk money (emphasis on long-term investment collection ratio (MoC), not investment return rate (IRR)) Investment in areas where risk is high only for private sector (private enterprises, collaboration with private funds) 【Investment criteria】 (1) Alignment with social needs, (2) Growth and (3) Innovation Innovation Network Corporation of Japan (INCJ) 1 Overview Innovation Network Corporation of JAPAN (INCJ) Structure Launched July 2009 with a 15-year lifetime Established under the Law on Special Govt. investment: ¥286bn Private investment: ¥14.01bn Measures for Industrial Revitalization Govt. guarantee: ¥1,800bn (26 companies & 2 individuals) Overall investment capacity of ¥2 trillion Collaboration , cooperation Shareholders Private enterprises Government of Japan (investment of ¥286bn) Private funds 26 Corporations (¥14bn in total, ¥500m each*) In alphabetical order Asahi Kasei Corporation Mitsubishi Corporation Sumitomo Mitsui Banking Canon Inc. Mitsubishi Heavy Industries, Corporation Management Development Bank of Ltd.
    [Show full text]
  • ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan
    ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan Shozo Saito Chairman, ISSM2020 Organizing Committee Device & System Platform Development Center Co., Ltd. Shuichi Inoue, ATONARP INC. It is our great pleasure to announce that The 28th annual International Symposium on Semiconductor Manufacturing (ISSM) 2020 will be held on December 15-16, 2020 at KFC Hall, Ryogoku, Tokyo in cooperation with e-Manufacturing & Design Collaboration Symposium (eMDC) which is sponsored by TSIA with support from SEMI and GSA. The program will feature keynote speeches by world leading speakers, timely and highlighted topics and networking sessions focusing on equipment/materials/software/services with suppliers' exhibits. ISSM continues to contribute to the growth of the semiconductor industry through its infrastructure for networking, discussion, and information sharing among the world's professionals. We would like you to cooperate with us by supporting the ISSM 2020. Please see the benefit of ISSM2020 sponsorship. Conference Overview Date: December 15-16, 2020 Location: KFC (Kokusai Fashion Center) Hall 1-6-1 Yokoami Sumidaku, Tokyo 130-0015 Japan +81-3-5610-5810 Co-Sponsored by: IEEE Electron Devices Society Minimal Fab Semiconductor Equipment Association of Japan (SEAJ) Semiconductor Equipment and Materials International (SEMI) Taiwan Semiconductor Industry Association (TSIA) Endorsement by: The Japan Society of Applied Physics Area of Interest: Fab Management Factory Design & Automated Material
    [Show full text]
  • PUBLIC SUBMISSION Posted: November 20, 2020 Tracking No
    Page 1 of 2 As of: 11/23/20 10:03 AM Received: November 18, 2020 Status: Posted PUBLIC SUBMISSION Posted: November 20, 2020 Tracking No. 1k4-9k60-8cjw Comments Due: December 03, 2020 Submission Type: Web Docket: PTO-C-2020-0055 Request for Comments on Discretion to Institute Trials Before the Patent Trial and Appeal Board Comment On: PTO-C-2020-0055-0001 Discretion to Institute Trials Before the Patent Trial and Appeal Board Document: PTO-C-2020-0055-0452 Comment from Japan Business Machine and Information System Industries Association Submitter Information Name: Hideaki Chishima Address: Lila Hijirizaka 7FL 3-4-10, Mita Minato-ku, Tokyo, Japan, 1080073 Email: [email protected] Phone: +81-3-6809-5495 Fax: +81-3-3451-1770 Submitter's Representative: Hideki Sanatake Organization: Japan Business Machine and Information System Industries Association General Comment Dear Sir, This post is for Japan Business Machine and Information System Industries Association (JBMIA) to submit its comments in response to solicitation of public comments by USPTO as announced in Federal Register / Docket No. PTO-C-2020-0055. The comments are attached hereto. JBMIA is a Japanese incorporated association which was renamed in 2002 from Japan Business Machine Makers Association established originally in 1960. JBMIA consists of 40 member companies engaged in business machine and information system and 5 supporting companies. Almost all of the member companies have actively filed patent applications in the USA. https://www.fdms.gov/fdms/getcontent?objectId=0900006484967b2a&format=xml&sho... 11/23/2020 Page 2 of 2 Sincerely, Hideaki Chishima (Mr) Intellectual Property Committee Secretariat Attachments JBMIA Comment (finnal) https://www.fdms.gov/fdms/getcontent?objectId=0900006484967b2a&format=xml&sho..
    [Show full text]
  • NEC Electronics and Renesas to Integrate Business Operations Establishment of the World’S Third Largest Semiconductor Company
    NEC Electronics and Renesas to Integrate Business Operations Establishment of the World’s Third Largest Semiconductor Company KAWASAKI, Japan, TOKYO, Japan, April 27, 2009 -- NEC Electronics Corporation (NEC Electronics; TSE: 6723), Renesas Technology Corp. (Renesas), NEC Corporation (NEC; TSE: 6701), Hitachi, Ltd. (Hitachi; TSE: 6501 / NYSE: HIT), and Mitsubishi Electric Corporation (Mitsubishi Electric; TSE: 6503) today agreed to enter into negotiations to integrate business operations at NEC Electronics and Renesas. 1. Background and goals of business integration NEC Electronics was established in 2002, separating from NEC, and Renesas was established in 2003, integrating semiconductor units at Hitachi and Mitsubishi Electric. Both as leading semiconductor companies, NEC Electronics and Renesas provide a wide variety of semiconductor solutions, primarily specializing in microcontroller units (MCUs). In light of fierce global competition in the semiconductor market, NEC Electronics and Renesas have agreed to explore the possibility of business integration in order to further strengthen their business foundations and technological assets while increasing corporate value through enhanced customer satisfaction. By integrating the world’s two largest MCU suppliers (*1), the new company will provide one of the most competitive MCU product lineups throughout the world. NEC Electronics and Renesas both focus on the fast-growing field of system-on-chip (SoCs) products. NEC Electronics is a leading producer of SoCs for digital consumer electronics, while Renesas is a well established manufacturer of SoCs for mobile phones and automotive applications. By reinforcing the companies’ respective strengths and development resources the new company will provide globally competitive SoC products. In terms of the discrete semiconductor business, both companies will define strategies to enhance the competitiveness of analog and discrete products that generate synergies with MCUs.
    [Show full text]
  • Renesas Electronics Announces Share Issue Through Third-Party Allotment, and Change in Major Shareholders, Largest Shareholder W
    Renesas Electronics Announces Share Issue through Third-Party Allotment, and Change in Major Shareholders, Largest Shareholder who is a Major Shareholder, Parent Company and Other Related Companies TOKYO, Japan, December 10, 2012 – Renesas Electronics Corporation (TSE: 6723, hereafter “Renesas” or “the Company”), a premier supplier of advanced semiconductor solutions, at a meeting of the board of directors held today, resolved to issue shares through Third-Party Allotment to The Innovation Network Corporation of Japan (“INCJ”), Toyota Motor Corporation, Nissan Motor Co., Ltd., Keihin Corporation, Denso Corporation, Canon Inc., Nikon Corporation, Panasonic Corporation and Yaskawa Electric Corporation, and (hereafter the “scheduled subscribers”). In implementing the Third-Party Allotment, one of the scheduled subscribers, INCJ, is required to file for regulatory approval in relation to business mergers with competition authorities in various countries, and the payment pertaining to the Allotment of Third Party Shares is subject to approval from all the applicable regulatory authorities. Furthermore, implementation of the Third-Party Allotment will result in changes to major shareholders, the largest shareholder who is a major shareholder, the parent company and other related companies, as outlined herein. I. Outline of the Third-Party Allotment 1. Outline of the offering February 23, 2013 through September 30, 2013 (Note 1) The above schedule takes into account the time required by the competition authorities of each country where INCJ, one of the (1) Issue period scheduled subscribers, files application, to review the Third-Party Allotment. Payment for the following total of shares is to be made promptly by the scheduled subscribers after approval from all applicable antitrust authorities, etc.
    [Show full text]
  • DIRECTV® Universal Remote Control User's Guide
    DirecTV-M2081A.qxd 12/22/2004 3:44 PM Page 1 ® DIRECTV® Universal Remote Control User’s Guide DirecTV-M2081A.qxd 12/22/2004 3:44 PM Page 2 TABLE OF CONTENTS Introduction . .3 Features and Functions . .4 Key Charts . .4 Installing Batteries . .8 Controlling DIRECTV® Receiver. .9 Programming DIRECTV Remote . .9 Setup Codes for DIRECTV Receivers . .10 Setup Codes for DIRECTV HD Receivers . .10 Setup Codes for DIRECTV DVRs . .10 Programming to Control Your TV. .11 Programming the TV Input Key . .11 Deactivate the TV Input Select Key . .11 Programming Other Component Controls . .12 Manufacturer Codes . .13 Setup Codes for TVs . .13 Setup Codes for VCRs . .16 Setup Codes for DVD Players . .19 Setup Codes for Stereo Receivers . .20 Setup Codes for Stereo Amplifiers . .22 Searching For Your Code in AV1 or AV2 Mode . .23 Verifying The Codes . .23 Changing Volume Lock . .24 Restore Factory Default Settings . .25 Troubleshooting . .26 Repair or Replacement Policy . .27 Additional Information . .28 2 DirecTV-M2081A.qxd 12/22/2004 3:44 PM Page 3 INTRODUCTION Congratulations! You now have an exclusive DIRECTV® Universal Remote Control that will control four components, including a DIRECTV Receiver, TV, and two stereo or video components (e.g 2nd TV, DVD, or stereo). Moreover, its sophisticated technology allows you to consolidate the clutter of your original remote controls into one easy-to-use unit that's packed with features such as: z Four-position slide switch for easy component selection z Code library for popular video and stereo components z Code search to help program control of older or discon- tinued components z Memory protection to ensure you will not have to re- program the remote when the batteries are replaced Before using your DIRECTV Universal Remote Control, you may need to program it to operate with your particular com- ponent.
    [Show full text]