Aurora The Ultimate Accelerated Computing Solution

Achieve top results with uncompromised acceleration. Modularity / flexibility. Allows the best fit to business needs thanks to a choice of configurable modules The Aurora® Hi√e HPC systems are optimized to accelerate Bridge to the future. and ARM-64 based nodes workloads, offering performance, energy efficiency, Superb RAS. Based on Eurotech embedded/ruggedized density and flexibility like never before. technology. They allow the best adaptation to applications, accelerating them with the configuration that minimizes time to solution.

Why Aurora Hi√e? Features Optimized for accelerated workloads. Designed Highest density. >1 PFlops / rack to fit the application needs, the Hi√e supports multiple Extreme efficiency > 5 GFlops/Watt accelerated configurations that push the workload speed up to the top Best Flexibility. A choice of modules for Energy efficiency. Optimized architecture and direct different configurations hot liquid cooling to maximize Flops/watt and minimize the Low power CPU. Intel and ARM-64 based nodes data center PUE. Acceleration. Multiple accelerators per CPU Liquid cooling. Entirely cooled with the Aurora Direct Hot Water Cooling Scalability. Scale over hundreds of accelerators Silence. No fans needed : High Velocity HPC Systems

Aurora Hi√e is a line of complete and robust HPC systems, built on an innovative supercomputing architecture that allows acceleration, optimization and flexibility. Entirely hot water cooled, highly dense and compact, provided with software stack and monitoring tools, the Hi√e series delivers a quality, reliable HPC solution. Applications

Typical applications running on Hi√e include: Oil&Gas (seismic), Life Science (Molecular Dynamics, Quantum Chemistry, NGS), Medical Imaging, Rendering, Deep Learning, Computational Finance, Data Analytics, CAE, Physics (LQCD). The Hi√e architecture

The system building block is the Aurora Hi√e module, an innovative form factor, hot water cooled enclosure supporting different configurations of the components.

Modules provide computation and control functionality (Intel or ARM processor), acceleration (Intel Phi or Nvidia GPU) and additional functionality of storage and visualization, using sub-modules in the same form factor.

The modules are logical nodes of a large system. The nodes are hosted in the Aurora Hi√e rack in any combination up to 128 per cabinet. The High Speed Interconnect allows scaling to any size system with density over 1 PFlop/s DP per m2

AURORA SOFTWARE STACK

Intel Cluster Studio Programming tools MPSS, Bright Cluster Manager Cluster Management and libraries NVIDIA CUDA xCAT* GNU Compiler Collection*

Intel MPI Lustre Communication libraries Open MPI File systems BeeGFS MVAPICH2 NFS

Nagioss Ganglia Mathematical libraries FFTW* Monitoring and security Aurora monitoring Eurotech ESS

CentOS* Total View Scientific Linux* Debuggers Intel debuggers Operating system Red Hat GNU GDB SUSE Ubuntu*

Altair PBS Professional Aurora Drivers Resource managers TORQUE/MAUI Drivers Accelerator Drivers and schedulers SLURM* OFED *supported on ARM Save time energy and space EXAMPLES OF CONFIGURATION

Acceleration Hi√e supports different combinations of PCIe modules that can add accelerations, storage, video processing and Hi√e can be delivered with 4 GPUs or 4 coprocessors per other capabilities to the system. single CPU node, a configuration that has been proven suitable and capable to accelerate a wide range of Processor 1 x Intel E3-12xx v3 applications. Accelerators 4 x NVIDIA Tesla Energy efficency Interconnects 1 x IB FDR (2 ports)

Hi√e uses low power Intel E3-12xx v3 processors or Applied Micro X-Gene ARM-64 processors combined with Processor 1 x Intel Xeon E3-12xx v3 GPUs or coprocessors, with all components hot water Accelerators 4 x Intel Phi cooled to maximize efficiency at system and data center level. Interconnects 1 x IB FDR (2 ports)

Density Processor 1 x Applied Micro 64 bit ARM Thanks to direct water cooling, the innovative architecture Accelerators 4 x Intel Nvidia Tesla K40 and the barebones assembly, Aurora Hi√e boasts an extraordinary computational density with more than 1 Interconnects 1 x IB FDR (2 ports) PFlop/s per rack.

Processor Intel Xeon E3-12xx v3 or ARM 64 bit

PCIe cards of different functionality (NVMe, Sub-modules accelerators, storage, video cards...)

New water cooling technology

Silent, lighter and more compact

Aurora Hi√e is entirely water cooled with the improved 2nd generation of the acknowledged Aurora Direct Hot Water Cooling. This new water cooling technology, lighter and more compact, allows higher packaging density and higher effectiveness in heat extraction, maximizing efficiency and minimizing infrastructural costs. Thanks to water cooling, the systems contain no fans or other moving parts and are completely silent. Specifications

SYSTEM

Energy efficiency > 5 GFlops/Watt

Up to 750 TFlop/s DP per rack (Nvidia K40) - 880 TFlop/s per rack with GPU Boost Peak Performance DP Up to 1 PFlop/s DP per rack (Nvidia K80) - 1.5 PFlop/s per rack with GPU Boost Up to 4.5 PFlop/s SP per rack (Nvidia K80) - 1.5 PFlop/s per rack with GPU Boost

Architecture Up to 128 nodes per rack

Cooling Aurora Direct Liquid Cooling

Soldered memory, no fans, no hot spots Reliable, Available, Monitoring of system and cooling loop Serviceable (RAS) Hot swap nodes Eurotech ESS safety software

Power (peak) 166 kW fully loaded

Rack dimensions (H x W x D) 2200 x 880 x 1300 mm

NODE Up to 5.9 TFlop/s DP (Nvidia K40) - 6.8 TFlop/s with GPU Boost Peak Performance DP Up to 7.7 TFlop/s DP (Nvidia K80) - 11.8 TFlop/s with GPU Boost Up to 23 TFlop/s SP (Nvidia K80) - 35 TFlop/s with GPU Boost

E3-12xx v3 – TDP up to 84W Processor Applied Micro ARM 64-bit processor

NVIDIA® Tesla® K40, K80, M60 Intel® ™ 7120x Coprocessors and Accelerators AMD® Firepro™ NVIDIA GeForce GTX M980 NVMe storage cards

Soldered high reliability memory 32 GB DDR3 (8GB per processor core)

Storage 1 x 1 TB half slim 1.8” SATA SSD

Interconnect and Networks 2 x FDR = 112 Gbit/s

2 x 1GigE (1 x 10 GigE on ARM version) 2 x USB I/O front panel 1 x VGA 2 x FDR Infiniband

Information in this document is provided in connection with Eurotech products. Except as provided in Eurotech’s terms and conditions of sale for such products, Eurotech assumes no liability whatsoever, and Eurotech disclaims any express or implied warranty relating to sale and/or use of Eurotech products, including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.

Specifications and features subject to change without notice. All trademarks and tradenames are the property of their respective owners.

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