Intel® Next Unit of Computing Board DCP847SKE Technical Product Specification

Total Page:16

File Type:pdf, Size:1020Kb

Intel® Next Unit of Computing Board DCP847SKE Technical Product Specification Intel® Next Unit of Computing Board DCP847SKE Technical Product Specification January 2013 Order Number: G81548-002 The Intel Next Unit of Computing Board DCP847SKE may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Next Unit of Computing Board DCP847SKE Specification Update. Revision History Revision Revision History Date 001 First release of the Intel® Next Unit of Computing Board DCP847SKE January 2013 Technical Product Specification 002 Specification clarification January 2013 This product specification applies to only the standard Intel® Next Unit of Computing Board with BIOS identifier GKPPT10H.86A. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. All Intel® Next Unit of Computing Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel Next Unit of Computing Boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Intel and Intel Celeron are trademarks of Intel Corporation in the U.S. and/or other countries. * Other names and brands may be claimed as the property of others. Copyright 2013, Intel Corporation. All rights reserved. Board Identification Information Basic Intel® Next Unit of Computing Board DCP847SKE Identification Information AA Revision BIOS Revision Notes G79416-101 GKPPT10H.86A.0026 1,2 G79416-104 GKPPT10H.86A.0036 1,2 Notes: 1. The AA number is found on a small label on the component side of the board. 2. The Intel® QS77 PCH and Intel® Celeron® processor 847 used on this AA revision consists of the following components: Device Stepping S-Spec Numbers Intel Celeron 847 Q0 SR08N Intel BD82QS77 C1 SLI8B Specification Changes or Clarifications Table 1 indicates the Specification Changes or Specification Clarifications that apply to the Intel® Desktop Board DCP847SKE. Table 1. Specification Changes or Clarifications Date Type of Change Description of Changes or Clarifications January 2013 Spec Clarification Deleted the note in Section 3.8 on page 60 regarding removing power before setting or clearing the hard disk drive password. Errata Current characterized errata, if any, are documented in a separate Specification Update. See http://developer.intel.com/products/desktop/motherboard/index.htm for the latest documentation. iii Intel Desktop Board DCP847SKE Technical Product Specification iv Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® Next Unit of Computing Board DCP847SKE. Intended Audience The TPS is intended to provide detailed, technical information about Intel Next Unit of Computing Board DCP847SKE and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. What This Document Contains Chapter Description 1 A description of the hardware used on Intel Next Unit of Computing Board DCP847SKE 2 A map of the resources of the Intel Next Unit of Computing Board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information Typographical Conventions This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type. Notes, Cautions, and Warnings NOTE Notes call attention to important information. CAUTION Cautions are included to help you avoid damaging hardware or losing data. v Intel Desktop Board DCP847SKE Technical Product Specification Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabits per second TDP Thermal Design Power xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their respective owners. vi Contents Revision History Board Identification Information .................................................................. iii Errata ...................................................................................................... iii Preface Intended Audience ..................................................................................... v What This Document Contains ..................................................................... v Typographical Conventions ......................................................................... v 1 Product Description 1.1 Overview ......................................................................................... 11 1.1.1 Feature Summary ................................................................. 11 1.1.2 Board Layout (Top) ............................................................... 13 1.1.3 Board Layout (Bottom) .......................................................... 15 1.1.4 Block Diagram ...................................................................... 17 1.2 Online Support ................................................................................. 18 1.3 Processor ........................................................................................ 18 1.4 System Memory ............................................................................... 19 1.4.1 Memory Configurations .......................................................... 20 ® 1.5 Intel QS77 Express Chipset .............................................................. 22 1.5.1 Direct Media Interface (DMI) .................................................. 22 1.5.2 Display Interfaces ................................................................. 22 1.6 Graphics Subsystem ......................................................................... 22 1.6.1 Integrated Graphics ............................................................... 22 1.6.2 USB ..................................................................................... 24 1.7 SATA Interface ................................................................................. 24 1.7.1 AHCI Mode ........................................................................... 24 1.8 Real-Time Clock Subsystem ............................................................... 25 1.9 LAN Subsystem ................................................................................ 25 ® 1.9.1 Intel 82579V Gigabit Ethernet Controller ................................ 26 1.9.2 LAN Subsystem Software ....................................................... 26 1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27 1.10 Hardware Management Subsystem ..................................................... 28 1.10.1 Hardware Monitoring ............................................................. 28 1.10.2 Fan Monitoring ...................................................................... 28 1.10.3 Thermal Solution ................................................................... 29 1.11 Power Management .........................................................................
Recommended publications
  • Intel® Desktop Board D33217GKE
    Intel® Desktop Board D33217GKE Next Unit of Computing by Intel® • Superior processing and graphics • Stunningly small form factor • Advanced Technologies producT brief Next Unit of Computing by Intel® with Intel® Desktop Board D33217GKE 4” (10 cm) Think you know what small can do? Think again. No more compromising between performance, profile, and price. The Next Unit of Computing (NUC) is a tiny 4”×4”×2” computing device with the power of the 3rd generation Intel® Core™ i3 processor. Its lower power consumption enables innovative system designs and energy- efficient applications in places like digital signage, home entertainment, and portable uses. Superior processing and graphics Visibly smart graphics using the 3rd generation Intel® Core™ i3-3217U processor deliver amaz- ing performance and visually stunning graphics. Stunningly small form factor The 4”×4”×2” form factor unlocks a world of potential design applications, from digital signage and kiosks to portable innovations. 4” (10 cm) Advanced Technologies The NUC features two SO-DIMM sockets for expandability upto 16 GB of memory, two PCIe* mini-card connectors for flexible support of wireless and SSD configurations, BIOS vault tech- nology, fast boot and the Intel® Visual BIOS. The NUC also supports Intel® Anti-Theft™ Technol- ogy providing hardware intelligence designed to protect your device and its data if its lost or stolen. Intel® Core™ i3-3217U Processor Intel® QS77 Express Chipset 2 Intel® Desktop Board D33217GKE Features and Benefits 1 × USB 2.0 connector on the front panel
    [Show full text]
  • Draft NISTIR 8320A, Hardware-Enabled Security
    NISTIR 8320A Hardware-Enabled Security: Container Platform Security Prototype Michael Bartock Murugiah Souppaya Jerry Wheeler Tim Knoll Uttam Shetty Ryan Savino Joseprabu Inbaraj Stefano Righi Karen Scarfone This publication is available free of charge from: https://doi.org/10.6028/NIST.IR.8320A NISTIR 8320A Hardware-Enabled Security: Container Platform Security Prototype Michael Bartock Joseprabu Inbaraj Murugiah Souppaya Stefano Righi Computer Security Division AMI Information Technology Laboratory Atlanta, GA Jerry Wheeler Karen Scarfone Tim Knoll Scarfone Cybersecurity Uttam Shetty Clifton, VA Ryan Savino Intel Corporation Santa Clara, CA This publication is available free of charge from: https://doi.org/10.6028/NIST.IR.8320A June 2021 U.S. Department of Commerce Gina Raimondo, Secretary National Institute of Standards and Technology James K. Olthoff, Performing the Non-Exclusive Functions and Duties of the Under Secretary of Commerce for Standards and Technology & Director, National Institute of Standards and Technology National Institute of Standards and Technology Interagency or Internal Report 8320A 48 pages (June 2021) This publication is available free of charge from: https://doi.org/10.6028/NIST.IR.8320A Certain commercial entities, equipment, or materials may be identified in this document in order to describe an experimental procedure or concept adequately. Such identification is not intended to imply recommendation or endorsement by NIST, nor is it intended to imply that the entities, materials, or equipment are necessarily the best available for the purpose. There may be references in this publication to other publications currently under development by NIST in accordance with its assigned statutory responsibilities. The information in this publication, including concepts and methodologies, may be used by federal agencies even before the completion of such companion publications.
    [Show full text]
  • Cisco Enterprise Wireless
    Cisco Enterprise Wireless Intuitive Wi-Fi starts here 2nd edition Preface 7 Authors 8 Acknowledgments 10 Organization of this book 11 Intended audience 12 Book writing methodology 13 What is new in this edition of the book? 14 Introduction 15 Intent-based networking 16 Introducing Cisco IOS® XE for Cisco Catalyst® wireless 18 Benefits of Cisco IOS XE 19 Cisco wireless portfolio 22 Infrastructure components 29 Introduction 30 Deployment mode flexibility 32 Resiliency in wireless networks 41 Wireless network automation 58 Programmability 61 Radio excellence 63 Introduction 64 802.11ax/Wi-Fi 6 66 High density experience (HDX) 71 Hardware innovations 77 Introduction 78 Dual 5 GHz radio 79 Modularity 83 Multigigabit 85 CleanAir-SAgE 87 RF ASIC - software defined radio 89 Innovative AP deployment solutions 91 Infrastructure security 97 Introduction 98 Securing the network 100 Securing the air 109 Encrypted Traffic Analytics (ETA) 114 WPA3 119 Policy 121 Introduction 122 Security policy 123 QoS policy 132 Analytics 145 Introduction 146 Enhanced experience through partnerships 148 Cisco DNA Center – wireless assurance 150 Cisco location technology explained 156 Cisco DNA Spaces 160 Migrating to Catalyst 9800 163 The Catalyst 9800 configuration model 164 Configuration conversion tools 168 Inter-Release Controller Mobility (IRCM) 171 Summary 175 The next generation of wireless 176 References 177 Acronyms 178 Further reading 183 Preface 8 Preface Authors In May 2018, a group of engineers from diverse backgrounds and geographies gathered together in San Jose, California in an intense week-long collaborative effort to write about their common passion, enterprise wireless networks. This book is a result of that effort.
    [Show full text]
  • DDR2 SDRAM FBDIMM (DR, FB, X72) Features DDR2 SDRAM FBDIMM MT18HTF12872FD – 1GB MT18HTF25672FD – 2GB
    Preliminary‡ 240-Pin 1GB, 2GB DDR2 SDRAM FBDIMM (DR, FB, x72) Features DDR2 SDRAM FBDIMM MT18HTF12872FD – 1GB MT18HTF25672FD – 2GB For the latest data sheet, refer to Micron’s Web site: www.micron.com Features Figure 1: 240-Pin FBDIMM (MO-256 R/C B) • 240-pin DDR2 fully buffered, dual in-line memory module (FBDIMM) with ECC to detect and report PCB height: 30.35mm (1.19in) channel errors to the host memory controller • Fast data transfer rates: PC2-4200 and PC2-5300 using 533 MT/s and 667 MT/s DDR2 SDRAM components • 3.2 Gb/s and 4.0 Gb/s link transfer rates • High-speed, differential, point-to-point link between host memory controller and the AMB using Options Marking serial, dual-simplex bit lanes – 10-pair southbound (data path to FBDIMM) •Package – 240-pin FBDIMM (lead-free) Y – 14-pair northbound (data path from FBDIMM) 1 • Fault tolerant; can work around a bad bit lane in •Frequency/CL each direction – 3.75ns @ CL = 5 (DDR2-667) -667 • High-density scaling with up to 8 dual-rank modules – 3.75ns @ CL = 4 (DDR2-533) -53E (288 DDR2 SDRAM devices) per channel •PCB height • SMBus interface to AMB for configuration register – 30.35mm (1.19in) access Notes: 1. CL = CAS (READ) latency. • In-band and out-of-band command access • Deterministic protocol – Enables memory controller to optimize DRAM accesses for maximum performance – Delivers precise control and repeatable memory behavior •Automatic DDR2 SDRAM bus and channel calibration • Transmitter de-emphasis to reduce ISI • MBIST and IBIST test functions • Transparent mode for DDR2 SDRAM test support •VDD = VDDQ = +1.8V for DDR2 SDRAM •VREF = 0 .9V SDRAM C/A termination •VCC = 1.5V for advanced memory buffer (AMB) •VDDSPD = +1.7V to +3.6V for SPD EEPROM • Serial presence-detect (SPD) with EEPROM • Gold edge contacts •Dual rank • Supports 95°C operation with 2X refresh (tREFI = 7.8µs at or below 85°C; tREFI = 3.9µs above 85°C) PDF: 09005aef81a2f20c/Source: 09005aef81a2f25b Micron Technology, Inc., reserves the right to change products or specifications without notice.
    [Show full text]
  • Intel® NUC Products NUC7CJY/NUC7PJY Technical Product Specification
    Intel® NUC Products NUC7CJY/NUC7PJY Technical Product Specification Regulatory Models: NUC7JY (Kit/Mini PC) NUC7JYB (Board) February 2018 Order Number: J96982-002 Intel NUC Products NUC7CJY/NUC7PJY Technical Product Specification The Intel NUC Products NUC7CJY/NUC7PJY may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel NUC Products NUC7CJY/NUC7PJY Specification Update. ii Revision History Revision Revision History Date 001 First release of Intel NUC Products NUC7CJY/NUC7PJY Technical Product January 2018 Specification 002 Spec Change February 2018 Disclaimer This product specification applies to only the standard Intel® NUC Boards, Kits and Mini PCs with BIOS identifier JYGLKCPX.86A. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. All Intel® NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations.
    [Show full text]
  • ECE 571 – Advanced Microprocessor-Based Design Lecture 16
    ECE 571 { Advanced Microprocessor-Based Design Lecture 16 Vince Weaver http://web.eece.maine.edu/~vweaver [email protected] 4 April 2017 Announcements • HW8 was assigned, read about Newer Intel chips for Thursday • Slow getting back to you about project ideas • Sorry about voice, mild cold 1 How to save Energy in TLB? • Turn off Virtual Memory completely (aside about ARM1176 manual and caches). Can you run Linux without VM? ucLinux • TLB is similar to cache, can make similar optimizations (drowsy, sizing, etc) • Assume in current page (i.e. 1-entry 0-level TLB) (Kadayif, Sivasubramaniam, Kandemir, Kandiraju, Chen. TODAES 2005). 2 (Kadayif,Sivasubramaniam, Kandemir, Kandiraju, Chen. Micro 2002) • Use virtual cache (Ekman and Stenstr¨om,ISLPED 2002) • Switch virtual to physical cache on fly (hybrid) (Basu, Hill, Swift. ISCA 2012) • Dynamically resize the TLB (Delaluz, Kandemir, Sivasubramaniam, Irwin, Vijaykrishnan. ICCD 2013) • Try to keep as much in one page as possible via compiler. (Jeyapaul, Marathe, Shrivastava, VLSI'09) 3 (Lee, Ballapuram. ISLPED'03) 4 DRAM • Single transistor/capacitor pair. (can improve behavior with more transistors, but then less dense) • Compare to SRAM that has 6 transistors (or 4 plus hard-to make resistors with high static power) • In 90nm process, 30fF capacitor, leakage in transistor 1fA. Can hold charge from milliseconds to seconds. • DRAMs gradually lose charge, need to be refreshed. Need to be conservative. Refresh every 32 or 64ms 5 • DRAM read is destructive, always have to write back 6 Diagram DRAM Column Decoder Sense Amps word line bit line Memory Array Row Decoder SRAM WL WL !BL BL !BL BL 7 Low Level • Trench Capacitors • Stacked Capacitors 8 SIMMs/DIMMS • How many chips on DIMM? 8? 9? 9 usually means ECC/parity • Chips x1 x4 x8 bits, how many get output at a time.
    [Show full text]
  • Content Creation Solution Brief
    Content Creation Solution Brief Intel® NUC delivers stunning visuals and edge-of-your-seat performance in an ultra-small package. Powered by a visibly smart 3rd generation Intel® Core™ i5 processor on a 4-by-4 inch board and enclosed in a tiny case, the Intel NUC is big on performance yet surprisingly small in size. It’s an ideal form factor that can be easily transported to the studio, while packing the horsepower to record, mix, create, and play back amazing audio and video content. Intel NUC is the definitive crowd-pleaser for today’s prosumer. B007 Multiscreen Content Creaton Setup Technologies This section offers a guideline for the hardware and software needed to design Intel NUC into a small form factor prosumer solution. Included in Intel NUC Kit: • Intel NUC – DC53427HYE • VESA Bracket • Power Adapter Hardware Needed Quantity Item Manufacturer Model 1 Intel® NUC DC53427HYE Intel® Intel® Next Unit of Computing Kit DC53427HYE 2 Memory Any 4 GB DDR3 1600 SODIMM 1 Storage Intel Intel® Solid-State Drive 525 Series 240 GB mSATA 1 Intel® Centrino Wireless Intel Intel Centrino 6235 IEEE 802.11n Mini PCI Express* Bluetooth* 4.0 - Wi-Fi/Bluetooth Combo Adapter 2 Display Port Capable Displays Any Any 1 HDMI Capable Display Any Any 1 USB Audio Interface Any Any 2 Reference Monitor Speakers Any Any 1 External Storage Any Any USB or Network Attached Storage Software Needed Item Manufacturer Model Pro Tools* Avid® Technology, Inc. http://www.avid.com/ Windows* 7 Microsoft* http://windows.microsoft.com Note: For more information on the software listed in this table, contact the manufacturer of the software directly.
    [Show full text]
  • Bringing Two SGET Standards Together
    boards & solutions + Combined Print Magazine for the European Embedded Market November 06/15 COVER STORY: Modular embedded NUC systems with Qseven modules Bringing two SGET Standards together SPECIAL FEATURES: SPECIAL ISSUE Boards & Modules Industrial Control Industrial Communications Industrial Internet-of-Things VIEWPOINT Dear Readers, And once again its show time! Beside the exhibition Embedded World in springtime there is another import- ant event for the embedded com- munity in Germany: SPS IPC Drives in fall. This year this international exhibition for industrial automa- tion will be held from 24th to 26th of November in the Exhibition Cen- tre in Nuremberg. More than 1,600 exhibitors including all key players in this industry will present their innovations and trend-setting new products as well as future technolo- gies. Main focus of many exhibitors this year will be Industrie 4.0. To simplify it for visitors getting infor- mation about this important topic the organizer created for the first time the “Industrie 4.0 Area” in Hall 3A. In this area there will be the joint stand and forum “Automation meets IT” which will present data based business models as well as IT based automation solutions for the future digital production. The joint stand “MES goes Automation“ will show how the use of MES optimizes order processing and production processes. The special show space SmartFactory will demonstrate the multi-vendor intelligent factory of the future. Industry associations ZVEI in hall 2 and VDMA in hall 3 will offer competent lectures and panel discussions about actual topics. The joint stands “AMA Centre for Sensors, Test and Measurement” and VDMA´s “Machine Vision” in hall 4A as well as “Wireless in Automation” will inform visitors extensive about the respective topics.
    [Show full text]
  • Intel Next Unit of Computing Kit DC53427HYE UCFF, 1 X Core I5 3427U / 1.8 Ghz, RAM 0 MB, No HDD, HD Graphics 4000, Gigabit LAN, No OS, Vpro, Monitor : None
    Siewert & Kau Computertechnik GmbH Walter-Gropius-Str. 12a DE 50126 Bergheim Telephone: 02271 - 763 0 Fax: 02271 - 763 280 E-Mail: [email protected] Internet: http://www.siewert-kau.com Intel Next Unit of Computing Kit DC53427HYE UCFF, 1 x Core i5 3427U / 1.8 GHz, RAM 0 MB, no HDD, HD Graphics 4000, Gigabit LAN, no OS, vPro, Monitor : none. A revolution in ultra-compact device design, Intel NUC packages a fully scalable, computing solution in the smallest possible form factor, complete with the Intel Core i5 processor. This computing device provides a flexible, customizable engine to drive digital signage, kiosks, and intelligent computing for small spaces, or anywhere else you can imagine. General information Intel Category Desktops & Servers Article number 103267 BOXDC53427HYE Technical specifications Product Description Intel Next Unit of Computing Kit DC53427HYE - Core i5 3427U 1.8 GHz - Monitor : none. Type PC barebone Platform Technology Intel vPro Technology Form Factor Ultra compact form factor Processor 1 x Intel Core i5 (3rd Gen) 3427U / 1.8 GHz ( 2.8 GHz ) ( Dual-Core ) Processor Main Features Hyper-Threading Technology, Intel Execute Disable Bit, Enhanced Intel SpeedStep Technology, Intel Virtualization Technology, Intel Turbo Boost Technology 2, Intel 64 Technology Cache Memory 3 MB Cache Per Processor 3 MB RAM 0 MB (installed) / 16 GB (max) - DDR3 SDRAM Hard Drive No HDD Monitor None. Graphics Controller Intel HD Graphics 4000 Audio Output Integrated - 7.1 channel surround Networking Gigabit LAN OS Provided No operating
    [Show full text]
  • Q2 Matrix Final.Xlsx
    Points on Intel Components and ODM chassis Q2 2014 Form Factor Eligble SKU SKU Description Points Desktop BX80646I74770 Intel® Core™ i7-4770 Processor 30 Desktop CM8064601464303 Intel® Core™ i7-4770 Processor 28 Desktop BX80646I74770K Intel® Core™ i7-4770K Processor 32 Desktop CM8064601464206 Intel® Core™ i7-4770K Processor 30 Desktop BX80646I74770S Intel® Core™ i7-4770S Processor 30 Desktop CM8064601465504 Intel® Core™ i7-4770S Processor 28 Desktop BX80646I74771 Intel® Core™ i7-4771 Processor 30 Desktop CM8064601464302 Intel® Core™ i7-4771 Processor 28 Desktop BX80633I74930K Intel® Core™ i7-4930K Processor 55 Desktop CM8063301292702 Intel® Core™ i7-4930K Processor 53 Desktop BX80646I54440 Intel® Core™ i5-4440 Processor 18 Desktop CM8064601464800 Intel® Core™ i5-4440 Processor 16 Desktop BX80646I54440S Intel® Core™ i5-4440S Processor 18 Desktop CM8064601465804 Intel® Core™ i5-4440S Processor 16 Desktop BX80646I54570 Intel® Core™ i5-4570 Processor 18 Desktop CM8064601464707 Intel® Core™ i5-4570 Processor 16 Desktop BX80646I54570S Intel® Core™ i5-4570S Processor 18 Desktop CM8064601465605 Intel® Core™ i5-4570S Processor 16 Desktop BX80646I54670 Intel® Core™ i5-4670 Processor 20 Desktop CM8064601464706 Intel® Core™ i5-4670 Processor 18 Desktop BX80646I54670K Intel® Core™ i5-4670K Processor 22 Desktop CM8064601464506 Intel® Core™ i5-4670K Processor 20 Desktop CM8064601465703 Intel® Core™ i5-4670S Processor 20 Desktop BX80633I74820K Intel® Core™i7-4820K Processor 30 Desktop CM8063301292805 Intel® Core™i7-4820K Processor 28 Desktop BX80633I74960X
    [Show full text]
  • Intel® NUC Ecosystem Enabling Specification
    Intel® NUC Updated: May 25, 2016 The shape that fits the future Table of Contents . Peripheral Suppliers . Chassis Suppliers . Lid Suppliers . VESA Extension Bracket . Expansion Board . Kiosk Stand . Mini UPS . Display Emulator 2 Peripheral Suppliers MODULE MODULE MODULE MODULE MANUFACTURER PART NUMBER SIZE SPEED SO-DIMM MEMORY * ADATA* AM1L16BC8R2-B1NS 8 GB 1601 MHz ADATA AM1L16BC4R1-B1MS 4 GB 1600 MHz ADATA AM1L16BC8R2-B1QS 8 GB 1600 MHz ADATA AM1L16BC4R1-B1PS 4 GB 1600 MHz ADATA* AXDS1600GC4G9-2 4 GB 1600 MHz A-DATA* AD73I1A0873EG 1 GB 1333 A-DATA EL73I1B1672ZU 2 GB 1333 A-DATA AD3S1333C2G9 4 GB 1333 A-DATA AD7311C1674EV 4 GB 1333 Apacer* 78.A2GC6.9L1 2 GB 1333 Centon Electronics M1050.01 8 GB 1600 MHz Centon Electronics M1051.01 8 GB 1600 MHz Centon Electronics M1052.01 8 GB 1600 MHz Crucial* CT51264BF160BJ 4 GB 1600 MHz Crucial CT102464BF160B.M16FED, CL11 8 GB 1600 MHz Crucial-Ballistix* BLS2K8G3N169ES4, CL9 8 GB x 2 1600 MHz Crucial* CT8G3S160BM 8 GB 1600 MHz Crucial CT51264BF160BJ.C8FER 4 GB 1600 MHz Elpida EBJ10UE8BDS0-DJ-F 1 GB 1333 Elpida EBJ21UE8BDS0-DJ-F 2 GB 1333 Elpida EBJ21UE8BFU0-DJ-F 2 GB 1333 G.Skill* F3-1866C11S-4GRSL 4 GB 1866 MHz G.Skill F3-1866C11S-8GRSL 8 GB 1866 MHz G.Skill F3-1866C10S-4GRSL 4 GB 1866 MHz Cont… 4 Peripheral Suppliers MODULE MODULE MODULE MODULE MANUFACTURER PART NUMBER SIZE SPEED SO-DIMM MEMORY * G.Skill F3-1866C10S-8GRSL 8 GB 1866 MHz G.Skill F3-1333C9S-4GSL 4 GB 1333 MHz G.Skill F3-1333C9S-8GSL 8 GB 1333 MHz G.Skill F3-1600C11S-4GSL 4 GB 1600 MHz G.Skill F3-1600C11S-8GSL 8 GB 1600 MHz G.Skill
    [Show full text]
  • Abkürzungs-Liste ABKLEX
    Abkürzungs-Liste ABKLEX (Informatik, Telekommunikation) W. Alex 1. Juli 2021 Karlsruhe Copyright W. Alex, Karlsruhe, 1994 – 2018. Die Liste darf unentgeltlich benutzt und weitergegeben werden. The list may be used or copied free of any charge. Original Point of Distribution: http://www.abklex.de/abklex/ An authorized Czechian version is published on: http://www.sochorek.cz/archiv/slovniky/abklex.htm Author’s Email address: [email protected] 2 Kapitel 1 Abkürzungen Gehen wir von 30 Zeichen aus, aus denen Abkürzungen gebildet werden, und nehmen wir eine größte Länge von 5 Zeichen an, so lassen sich 25.137.930 verschiedene Abkür- zungen bilden (Kombinationen mit Wiederholung und Berücksichtigung der Reihenfol- ge). Es folgt eine Auswahl von rund 16000 Abkürzungen aus den Bereichen Informatik und Telekommunikation. Die Abkürzungen werden hier durchgehend groß geschrieben, Akzente, Bindestriche und dergleichen wurden weggelassen. Einige Abkürzungen sind geschützte Namen; diese sind nicht gekennzeichnet. Die Liste beschreibt nur den Ge- brauch, sie legt nicht eine Definition fest. 100GE 100 GBit/s Ethernet 16CIF 16 times Common Intermediate Format (Picture Format) 16QAM 16-state Quadrature Amplitude Modulation 1GFC 1 Gigabaud Fiber Channel (2, 4, 8, 10, 20GFC) 1GL 1st Generation Language (Maschinencode) 1TBS One True Brace Style (C) 1TR6 (ISDN-Protokoll D-Kanal, national) 247 24/7: 24 hours per day, 7 days per week 2D 2-dimensional 2FA Zwei-Faktor-Authentifizierung 2GL 2nd Generation Language (Assembler) 2L8 Too Late (Slang) 2MS Strukturierte
    [Show full text]