CompactPCI PP B7x/msd

PP B8x/msd N, E, K - Series

6U CompactPCI Processor Board based on Intel® Xeon® E or 9th Generation Intel® Core™ i3 Processor Key Features PP B7x/msd and PP B8x/msd are single slot air-cooled CompactPCI® boards, allowing customers to easily migrate to the latest generation of Intel® processors for longer system life-cycles.

 PP B7x/msd supports workstation processor performance with enterprise-class graphics capabilities using an Intel® Xeon® E Processor  PP B8x/msd is a lower cost board using a 9th Generation Intel® Core™ i3 Processor  Two XMC/PMC module slots for local I/O expansion  Local solid-state storage options

1x 2x 1x Gigabit USB 2x PMC/XMC2 PMC/XMC1 RS232 2.0 DisplayPort Front I/O Front I/O

DDR4 RS/ 232 2 x UEFI 422 E TPM ECC BIOS DRAM

2

O O

/ /

C C C C

I I

M M M M

4 4

2 1

P P

X X P USB2.0 P Processor: x8 or Board Intel Xeon E Logic 2 x4 or x8 9th Gen. Intel Core i3 x4 Bat 2 2 x PCI-X 100 SATA600 SPI DMI 3.0

Intel CM246 PCH x2 PCIe to PCI-X Bridge

A A

B B

T T x2

S S A A Quad E

U U

S S

PCIe Ethernet Board IPMI Intel I 350-AM4 Logic to PCI User User Bridge 2 2 Switch Switch 4 64-bit 15 PCI-66

IPMB0 1x 2x HD 1x 2x I/O is user switchable : 2x Ethernet 1x 4x 15x 1x 1x PMC2 PMC1 CompactPCI IPMB1 RS232/ SATA Stereo USB USB 1x or 2x USB 3. 1; 10/100/1000 Mbps Gigabit USB GPIO RS232 DVI-D Rear I/O Rear I/O 422 300 Audio 2.0 2.0 1x or 2x SATA 300 (PICMG 2.16) Ethernet 2.0

J1/J2 J5 J3 Optional J4 J1/J2 J3 J5

Concurrent Technologies Plc 4 Gilberd Court, Colchester, Essex, CO4 9WN, UK Tel: +44 (0)1206 752626 Concurrent Technologies Inc. 400 West Cummings Park, Suite 1300, Woburn, MA 01801, USA Tel: (781) 933 5900 email:[email protected] www.gocct.com

All companies and product names are trademarks of their respective organizations. Specification subject to change; E and OE.

Specification

6U CompactPCI Processor Board Stereo Audio Optional Built-In Test (BIT) Support  air-cooled 6U CompactPCI® computing board  Intel® High Definition Digital Audio (build option 1)  Power-on BIT, Initiated BIT, Continuous BIT utilizing an Intel® Xeon® processor based on Coffee via J5: Board Security Packages Lake-H and Coffee Lake-H Refresh  optional CoDec on optional RTM  Trusted Platform Module (TPM 2.0)  optional Rear Transition Module (RTM) Serial Interfaces  option for Sanitization Utility Software Package Central Processor  up to 3 x serial interfaces:  option for proprietary board-level security features ® ®  6-core Intel Xeon Processor E-2176M:  1 x Tx/Rx RS232 accessed via a front panel CompactPCI Interface  12 Mbytes Smart Cache, 2.7 GHz 60-way high-density connector  compliant with PICMG 2.0 R3.0; 3.3V or 5V  Intel® UHD Graphics 630  1 x RS232/422 via on-board header or J5 signaling levels (universal signaling support) th ®  4-core 9 Generation Intel Core™ i3-9100HL  1 x RS232 via optional J4  33/66 MHz, 32/64-bit interface accessed via J1/J2 Processor:  J5 (or on-board header) and J4 RS232 interfaces connectors  6 Mbytes SmartCache, up to 1.6 GHz support Tx, Rx, RI, CTS, RTS, DSR, DTR and DCD  PICMG 2.1 R2.0 Hot Swap compliant  range of performance/power factory build options  J5 (or on-board header) RS422 interfaces support  operates as System Slot controller or in a Peripheral  utilizes the Intel® CM246 Platform Controller Hub Tx and Rx slot (auto-selected on insertion to ) DRAM  16550 compatible UARTs  option to disable CompactPCI interface (Satellite Mode):  16 or 32 Gbytes soldered DDR4 ECC DRAM: Graphics Interfaces  receives power from CompactPCI  single bit error correction  up to three independent graphics interfaces  ®  board can be hot swapped  dual channel architecture 2 x DisplayPort v1.2 graphics interfaces via a front panel 60-way high-density connector:  accessible from processor and CompactPCI® bus Safety  up to 1920 x 1200 @ 60Hz  PCB (PWB) manufactured with a flammability rating Mass Storage Interfaces  resolution is dependent on the device driver of UL94V-0  up to four SATA interfaces accessed via J5:  1 x DVI-D graphics interface via optional J4: Electrical Specification  2 x SATA300 interfaces (build option 1)  up to 1920 x 1200 @ 16M colors  typical current figures (based on 6-core CPU (45W)  0, 1 or 2 x SATA300 interfaces - user selectable, ® as alternatives to USB 3.1 (Gen 1) ports  support for Microsoft DirectX 12, OpenGL 4.5 16 GBytes DRAM): under Windows® and Linux® and OpenCL 2.1  2 x SATA600 interfaces for optional on-board:  +5V @ 6.8A Other Peripheral Interfaces  SATA Flash Drive Module  +3.3V @ 3.2A   2.5-inch SATA drive (disables PMC/XMC Site 1) PC Real Time Clock  +12V and -12V, both @ 0.0A  watchdog timer; 32-bit Long Duration Timer with  1 x M.2 SSD site on-board supporting:  +12V and -12V are not required, but are routed to processor interrupt ability; chipset timer PMC/XMC sites  Type 2242, 2260 and 2280 device  voltages monitor; CPU temperature and board Environmental Specification  x4 PCIe interface (M-key) temperature monitors; all accessible via IPMI  ®  operating temperature: NVM Express (NVMe™) logical device interface  2 x USB 2.0 ports accessed via a front panel 60-way  NVMe 1.3 compatible high-density connector  0°C to +55°C (N-Series)   resides within PMC/XMC Site 1 and 2 areas  2 x USB 2.0 ports accessed via on-board header extended operating temperatures (based upon selected processor performance/power option): Gigabit Ethernet Interfaces  up to nine USB ports accessed via rear panel I/O:  -25°C to +70°C (E-Series)  up to four 1 Gigabit Ethernet interfaces  4 x USB 2.0 ports via optional J4  -40°C to +70°C (K-Series)  1 x front panel interface via an RJ45 connector  2 or 3 x USB 2.0 ports (build option 1) via J5   2 x rear interfaces via J3:  0, 1 or 2 x USB 3.1 (Gen 1) ports via J5 - user -40°C to +85°C (K-Series)

 support for PICMG® 2.16 R1.0 - Packet Switching selectable, as alternatives to SATA300 ports  non-operating temperature: -40°C to +85°C Backplane (build option) or via an optional RTM  15 x GPIO signals accessed via optional J4  5% to 95% Relative Humidity, non condensing:  1 x rear interface via optional J4  independent legacy speaker output via J3  K-Series includes humidity sealant  implemented by an Intel® I350-AM4 controller IPMI Mechanical Specification Dual PMC/XMC Interfaces  PICMG 2.9 R1.0 (System Management):  6U form-factor:  dual PMC/XMC interfaces:  implements IPMB0/IPMB1 interfaces 9.2 inches x 6.3 inches (233mm x 160mm)   front panel I/O  Baseboard Management Controller single slot: 0.8 inches (20.3mm)  connectors: IEC-1076-4-101 for J1-J5:  PMC sites support:  supports 8 Kbytes of non-volatile memory  J4 is a factory build option  PMC P14 rear I/O via J5 Software Support  operating shock: 20g, 11ms, ½ sine  PMC P24 rear I/O via J3  supports Linux® and Windows®  operating vibration:  32/64-bit, 33/66MHz PCI bus  for other operating systems contact Concurrent 5Hz-2000Hz at 2g, 0.38mm peak displacement  64-bit, 100MHz PCI-X™ bus Technologies for further information, e.g. VxWorks Legacy Board Compatibility  5V and 3.3V signaling Firmware Support  PP B7x/msd and PP B8x/msd rear plug compatibility  XMC sites support:  UEFI 2.7 boot firmware (BIOS): with the popular PP B1x/msd family  both support x8 PCI Express® (PCIe®)  dual BIOS SPI Flash EPROMs  XMC site 2 can also support 2 x4 PCI Express  implements Secure Boot  PCIe Gen 1, Gen 2 (and optionally Gen 3)  implements Intel® Boot Guard  XMC VPWR +5V  optional Fast Boot solution using the  XMC connector type (build option) determines the Intel® Firmware Support Package (FSP) maximum PCIe operational speed:  LAN boot firmware included  up to Gen 2, VITA 42 XMC (color black)  up to Gen 3, VITA 61 XMC 2.0 (color white)

Datasheet Code 1826/0320 Please contact your local Concurrent Technologies sales office for further details on board build options and accessories. © Concurrent Technologies 2020