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Product Line Card
Product Line Card ® CABLES Lenovo KEYBOARDS & NAS/SAN POWER SOLID STATE Accell MSI MICE D-Link PROTECTION/UPS DRIVES APC Cables by BAFO Shuttle Adesso Intel APC ADATA Link Depot ViewSonic Alaska Promise Opti-UPS Corsair StarTech.com ZOTAC Azio QNAP Tripp Lite Crucial SYBA Cooler Master SansDigital Intel EXTERNAL Corsair Synology POWER Kingston CASES ENCLOSURES Genius Thecus SUPPLIES OCZ AIC AcomData KeyTronic WD Antec PNY Antec Cremax Lenovo Apex Samsung Apex Eagle Tech Logitech NETWORKING Cooler Master WD CHENBRO iStarUSA Microsoft ASUS Corsair Compucase SIIG Razer Cisco Epower SURVEILLANCE Cooler Master Smarti SIIG D-Link FSP PRODUCTS Corsair StarTech.com Thermaltake Edimax In Win AVer Intel TRENDnet Emulex Intel D-Link In Win Vantec MEMORY Encore Electronics iStarUSA TP-LINK iStarUSA Zalman ADATA EnGenius Nspire TRENDnet Lian Li AMD Huawei Seasonic Vivotek Nspire FANS/HEATSINKS Corsair Intel Sentey Vonnic NZXT Antec Crucial Keebox Shuttle Zmodo Sentey Cooler Master Kingston NETGEAR Sparkle Power Edimax Supermicro Corsair Patriot SIIG Thermaltake Keebox Thermaltake Dynatron Samsung StarTech.com Zalman Winsis USA Enermax SYBA TABLETS Zalman Intel MONITORS TP-LINK PROJECTORS ASUS Noctua AOC TRENDnet ASUS GIGABYTE CONTROLLER StarTech.com ASUS Tripp Lite ViewSonic Lenovo CARDS Supermicro Hanns.G ZyXEL ViewSonic 3Ware Thermaltake Lenovo SERVERS HighPoint Vantec LG Electronics NOTEBOOKS/ AIC USB DRIVES Intel Zalman Planar NETBOOKS ASUS ADATA LSI ViewSonic ASI ASI Corsair Microwise HARD DRIVES ASUS Intel Kingston Promise ADATA MOTHERBOARDS -
Full Partner List
Full Partner List Partnerships: Spyder Digital SIIG Franklin Electronic Solidtek SIIG BenQ America HIVI Acoustics PC Treasures Electronics) Bags & Carry Cases Research Inc. StarTech.com Gear Head Standzout StarTech.com Blue Microphones HMDX Peerless Withings Inc 3Dconnexion STM Bags Symtek Gefen StarTech.com Thermaltake BodyGuardz Honeywell Home Pentax Imaging Xavier Professional Cable Acer Symtek Targus Genius USA Targus TRENDnet Boom HP Inc. Phiaton Corp. Yamaha Adesso Inc. Targus Thermaltake Gigabyte Technology Thermaltake Turtle Beach Braven IAV Lightspeaker Philips Zagg-iFrogz AIRBAC The Joy Factory TRENDnet Griffin Technology TRENDnet U.S. Robotics BTI-Battery Tech. iHome Philips Electronics Zalman USA Aluratek Thermaltake Tripp Lite Gripcase Tripp Lite Visiontek BUQU Incipio Technologies Planar Systems zBoost American Weigh Scales Twelve South Visiontek Gyration Twelve South XFX C2G InFocus Plantronics Zmodo Technology Corp ASUS Urban Armor Gear VOXX Electronics Hawking Technologies TX Systems Zalman USA CAD Audio Innovative Office Products PNY Technologies Belkin Verbatim weBoost (Wilson HP Inc. U.S. Robotics Zotac Canon Interworks Polk Audio Data Storage Products Victorinox (Wenger) Electronics) HYPER by Sanho Verbatim Case-Mate Inwin Development Q-See BodyGuardz Aleratec Inc Zagg-iFrogz Xavier Professional Cable Corporation Viewsonic Casio IOGear QFX Canon Computers & Tablets Aluratek Incipio Technologies Visiontek Centon iON Camera Reticare inc CaseLogic Acer ASUS Computer & AV Cables Computer Accessories InFocus VisTablet -
AMD 790GX 6 August 2008
AMD Launches World's Fastest Motherboard GPU: AMD 790GX 6 August 2008 it the best platform for unlocking maximum AMD Phenom processor performance. Built-in ATI Radeon HD 3300 graphics provide an unmatched HD and gaming experience out of the box, with flexibility to scale to high performance configurations with the addition of one or two award- winning ATI Radeon HD 4800 series discrete graphics cards. “Today’s high definition, multimedia applications demand powerful graphics and multi-core processor performance and only AMD is delivering a truly balanced platform that accelerates these AMD 790GX Chipset - Energy Efficient workloads,” said Phil Eisler, corporate vice president and general manager, AMD Chipset Division. “The AMD 790GX chipset contains several AMD innovations that further improves both AMD today announced the availability of the multi-core AMD Phenom processor performance industry’s preeminent performance desktop and motherboard ATI Radeon graphics platform, the AMD 790GX. Packing a host of performance, the result of which are versatile innovations, the AMD 790GX integrates advanced performance PCs that deliver an eye-catching performance tuning for AMD Phenom processors, visual experience.” plus ATI Radeon HD 3300 graphics - the world’s fastest motherboard graphics processor (mGPU) – Building on the momentum of the award-winning to take media aficionados beyond HD. AMD 780G chipset, the AMD 790GX offers DirectX 10 game compatibility, allowing casual gamers to In addition to AMD validation, independent testing enjoy advanced game performance, truly lifelike 3D of the AMD 790GX chipset shows significant graphics and dynamic interactivity in the latest increases in AMD Phenom processor performance game titles. -
Vista Procedure
Qualified Vendors List – Devices 1. Power Supplies Model ipower90 500W AcBel R88 PC7063 700W Aero Cool STRIKE-X 600W EA-500D 500W EDG750 750W Antec HCP-1300 1300W NEOECO-II 650 TP-750C 750W AYWUN A1-550-ELITE 550W BQ L8-500W Be quiet PURE POWER 9 700W BitFenix FURY 650G 650W BUBALUS PG800AAA 700W MPZ-C001-AFBAT 1200W RS-350-PSAR-I3 350W CoolerMaster RS-450-AMAA-B1 450W RS-750-AFBA-G1 750W RS-850-AFBA-G1 850W AX1500i 75-001971 1500W CX-450M 450W CX-650 CX-750 HX1000 Corsair HX1200 RPS0017(RM850X) 850W SF-600 600W TX-850M 850W Vengeance 550M 550W VS-400 400W Cougar GX-1050 1050W D.HIGH DHP-200KGH-80P 1000W ERV1200EWT-G 1200W EnerMAX ERX730AWT 730W ETL450AWT-M 450W 220-P2-1200-X1 1200W EVGA SuperNova-750-G2 750W HydroX-450 450W PT-650M 650W FSP RAIDER-II 450W RAIDER 650W Huntkey WD600 600W LEPA B550-SA 550W OCZ OCZ-FTY750W 750W HIVE-850S 850W Rosewill PHOTON-1200 1200W Copyright 2017 ASUSTeK Computer Inc. PAGE 1 Devices Model S12 II SS-330GB 330W SS-1200XP3 Active PFC F3 1200W Seasonic SS-400FL 400W SSR-450RM Active PFC F3 450W PAT-800W Seventeam ST-550P-AD 550Wll SST-60F-P 600W Silverstone SST-ST85F-GS 850W Super Flower SF-1000F14MP 1000W Smart DPS G 650 650W Toughpower TPX775 775W Thermaltake TPG-0850D 850W TPD-1200M 1200W ZUMAX ZU-500G-JP 500W 2. Hard Drives 2.1. HDD Devices Type Model Hitachi HDN726060ALE610 Seagate ST2000NX0243 Seagate Seagate ST8000AS0002 SATA 6G WD6001FZWX WD60PURX WD WD60EZRX WD10J31X 2.2. -
Giga-Byte Technology Co., Ltd. Unconsolidated Financial Statements and Report of Independent Accountants December 31, 2015 and 2014
GIGA-BYTE TECHNOLOGY CO., LTD. UNCONSOLIDATED FINANCIAL STATEMENTS AND REPORT OF INDEPENDENT ACCOUNTANTS DECEMBER 31, 2015 AND 2014 --------------------------------------------------------------------------------------------------------------- For the convenience of readers and for information purpose only, the auditors’ report and the accompanying financial statements have been translated into English from the original Chinese version prepared and used in the Republic of China. In the event of any discrepancy between the English version and the original Chinese version or any differences in the interpretation of the two versions, the Chinese-language auditors’ report and financial statements shall prevail. ~1~ GIGA-BYTE TECHNOLOGY CO., LTD. UNCONSOLIDATED FINANCIAL STATEMENTS AND REPORT OF INDEPENDENT ACCOUNTANTS DECEMBER 31, 2015 AND 2014 TABLE OF CONTENTS Pages FRONT COVER 1 TABLE OF CONTENTS 2 REPORT OF INDEPENDENT ACCOUNTANTS 3 ~ 4 UNCONSOLIDATED BALANCE SHEETS 5 ~ 6 UNCONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME 7 UNCONSOLIDATED STATEMENTS OF CHANGES IN SHAREHOLDERS’ EQUITY 8 UNCONSOLIDATED STATEMENTS OF CASH FLOWS 9 ~ 10 NOTES TO UNCONSOLIDATED FINANCIAL STATEMENTS 11 ~ 76 1. HISTORY AND ORGANIZATION 11 2. THE DATE OF AUTHORIZATION FOR ISSUANCE OF THE UNCONSOLIDATED FINANCIAL STATEMENTS AND PROCEDURES FOR AUTHORIZATION 11 3. APPLICATION OF NEW STANDARDS, AMENDMENTS AND INTERPRETATIONS 11 ~ 14 4. SUMMARY OF SIGNIFICANT ACCOUNTING POLICIES 14 ~ 23 5. CRITICAL ACCOUNTING JUDGMENTS, ESTIMATES AND KEY SOURCES OF ASSUMPTION UNCERTAINTY 23 ~ 24 6. DETAILS OF SIGNIFICANT ACCOUNTS 24 ~ 40 7. RELATED PARTY TRANSACTIONS 40 ~ 42 8. PLEDGED ASSETS 42 9. SIGNIFICANT CONTINGENT LIABILITIES AND UNRECOGNISED CONTRACT COMMITMENTS 42 10. SIGNIFICANT DISASTER LOSS 42 11. SIGNIFICANT EVENTS AFTER THE BALANCE SHEET DATE 42 ~2~ Pages 12. OTHERS 43 ~ 50 13. SUPPLEMENTARY DISCLOSURES 50 ~ 62 14. -
G262-ZR0 HPC Server - 2U DP SXM4 A100 4-GPU Features
G262-ZR0 HPC Server - 2U DP SXM4 A100 4-GPU Features • Hardware-level root of trust support • Supports NVIDIA HGX™ A100 with 4 x SXM4 GPU • Supports NVIDIA® NVLink® and NVSwitch™ technology • Up to 600GB/s GPU to GPU interconnection • Dual AMD EPYC™ 7003 Series processors • 8-Channel RDIMM/LRDIMM DDR4, 16 x DIMMs • 2 x 1Gb/s LAN ports (Intel® I350-AM2) • 1 x dedicated management port • 4 x 2.5" Gen4 U.2 NVMe/ SATA hot-swap HDD/SSD bays • Ultra-Fast M.2 with PCIe Gen4 x4 interface • 6 x Low profile Gen4 x16 expansion slots • 1 x OCP 3.0 Gen4 x16 mezzanine slot • 3000W 80 PLUS Platinum redundant power supply Specification Dimensions 2U (W448 x H86.8 x D800 mm) Backplane I/O 4 x 2.5" NVMe/ SATA hybrid ports Speed and bandwidth: PCIe Gen4 or SATA 6Gb/s Motherboard MZ62-HD5 Rev. 3.0 TPM 1 x TPM header with SPI interface CPU AMD EPYC™ 7003 Series processors Optional TPM2.0 kit: CTM010 Dual processors, 7nm technology, cTDP up to 280W Up to 64-core, 128 threads per processor Power Supply Dual 3000W 80 PLUS Platinum redundant power supply Compatible with AMD EPYC™ 7002 Series processors AC Input: 100-240V Chipset System on Chip System Aspeed® AST2500 management controller Management GIGABYTE Management Console (AMI MegaRAC SP-X) Memory 8-Channel DDR4 memory, 16 x DIMM slots RDIMM/LRDIMM modules up to 128GB supported OS Windows Server 2016 / 2019 3DS RDIMM/LRDIMM modules up to 256GB supported Compatibility RHEL 8.3 (x64) or later Memory speed: Up to 3200/ 2933 MHz SLES 12 SP5 (x64) / 15 SP2 (x64) or later Ubuntu 18.04.5 LTS (x64) / 20.04 LTS (x64) -
Flash Memory Summit Pocket Guide 2017
2017 FLASH MEMORY SUMMIT POCKET GUIDE AUGUST 8-10 SANTA CLARA CONVENTION CENTER AUGUST 7 PRE-CONFERENCE TUTORIALS Contents 3 4 Highlights 6 Exhibitors 8 Exhibit Hall Floor Plan 11 Keynote Presentations 2017 Sponsors Gold Sponsors Mobiveil Executive Premier Sponsors SANBlaze Technology Samsung SD Association SK Hynix Bronze Sponsors AccelStor Toshiba America ADATA Technology Electronic Components Apeiron Data Systems ATP Electronics Premier Sponsors Broadcom Brocade Communications Hewlett Packard Enterprise Systems Development Cadence Design Systems Intel Calypso Systems CEA LETI Marvell Semiconductor Celestica Micron Technology CNEX Labs Microsemi Epostar Electronics Excelero NetApp FADU Seagate Technology Fibre Channel Industry Assoc. Foremay Silicon Motion Technology Hagiwara Solutions Western Digital IBM JEDEC Platinum Sponsors Kroll Ontrack Crossbar Lam Research Maxio E8 Storage Mentor Graphics Everspin Technologies Newisys Innodisk NVMdurance NVXL Technology Lite-On Storage Sage Microelectronic NGD Systems SATA-IO Nimbus Data SCSI Trade Association Silicon Storage Technology One Stop Systems SiliconGo Microelectronics Radian Memory Systems SNIA-SSSI Synopsys Smart IOPS Tegile SMART Modular Teledyne LeCroy Technologies Teradyne Transcend Information Swissbit UFSA Symbolic IO ULINK Technology Viking Technology UNH-IOL UniTest Emerald Sponsors VARTA Microbattery VIA Technologies Advantest Virtium Amphenol Xilinx Dera Storage Participating Organizations Diablo Technologies Chosen Voice Gen-Z Consortium Circuit Cellar Connetics USA Hyperstone -
Certain Graphics Processors and Products Containing the Same
UNITED STATES INTERNATIONAL TRADE COMMISSION Washington, DC NOTICE OF RECEIPT OF COMPLAINT; SOLICITATION OF COMMENTS RELATING TO THE PUBLIC INTEREST AGENCY: U.S. International Trade Commission. ACTION: Notice. SUMMARY: Notice is hereby given that the U.S. International Trade Commission has received a complaint entitled Certain Graphics Processors and Products Containing the Same, DN 3285; the Commission is soliciting comments on any public interest issues raised by the complaint or complainant’s filing pursuant to the Commission’s Rules of Practice and Procedure. FOR FURTHER INFORMATION CONTACT: Lisa R. Barton, Secretary to the Commission, U.S. International Trade Commission, 500 E Street S.W., Washington, D.C. 20436, telephone (202) 205-2000. The public version of the complaint can be accessed on the Commission's Electronic Document Information System (EDIS) at https://edis.usitc.gov, and will be available for inspection during official business hours (8:45 a.m. to 5:15 p.m.) in the Office of the Secretary, U.S. International Trade Commission, 500 E Street, S.W., Washington, D.C. 20436, telephone (202) 205-2000. General information concerning the Commission may also be obtained by accessing its Internet server at United States International Trade Commission (USITC) at https://www.usitc.gov . The public record for this investigation may be viewed on the Commission's Electronic Document Information System (EDIS) at https://edis.usitc.gov. Hearing-impaired persons are advised that information on this matter can be obtained by contacting the Commission's TDD terminal on (202) 205-1810. SUPPLEMENTARY INFORMATION: The Commission has received a complaint and a submission pursuant to § 210.8(b) of the Commission’s Rules of Practice and Procedure filed on behalf of ZiiLabs Inc., Ltd. -
IBIS Open Forum Minutes
IBIS Open Forum Minutes Meeting Date: November 20, 2014 Meeting Location: Yokohama, Japan VOTING MEMBERS AND 2014 PARTICIPANTS Altera David Banas, Kundan Chand, Hsinho Wu ANSYS Lan Chen, Minggang Hou, Jianbo Liu, Peng Wang Shulong Wu, Guoli Yin, Jizhi Zhao, Tommy Chien Elly Dong, Milkman Hsuan, Winny Huang Stanley Hangwei Kuo, James Wang Jean Yacchin Wang, Jerry Wang, Benson Peishen Wei Jack Wu, Tinghao Yeh, Tohru Watanabe*, Shigeru Sano* Applied Simulation Technology Fred Balistreri, Norio Matsui Cadence Design Systems Ambrish Varma, Brad Brim, Joy Li, Kumar Keshavan Ken Willis, Yingxin Sun, Joshua Luo, John Phillips Aileen Chen, Lanbing Chen, Zhiyu Guo, Jinsong Hu Rachel Li, Lavia Liu, Ping Liu, Yubao Meng Feng Miao, Zuli Qin, Haisan Wang, Hui Wang Yitong Wen, Clark Wu, Benny Yan Rong Zhang, Wenjian Zhang, Alex Zhao Zhangmin Zhong, Kent Ho, Thunder Lay, Skipper Liang Paddy Wu, Candy Yu, Ian Yu, Ikuo Masuko* Morihiro Nakazato* Ericsson Anders Ekholm*, Zilwan Mahmod*, Feng Shi Wenyan Xei Huawei Technologies Jinjun Li, Xiaoqing Dong, Zanglin Yuan, Han Li Haiping Cao, Yu Chen, Peng Huang, Hongxing Jiang Xueping Jiao, Aojie Li, Xusheng Liu, Zipeng Luo Longfang Lv, Luya Ma, Xiao Peng, Wenju Sheng Jianhua Wang, Shengli Wang, Huichao Weng Zhengrong Xu, Gezi Zhang, Zhenyi Zhu Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak, Jon Powell, Riaz Naseer Udy Shrivastava, Mustafa Yousuf, Jimmy Jackson Pietro Brenner, Todd Bermensolo, Denis Chen Jimmy Hsu, Cucumber Lin, Jeff Loyer, Thomas Su IO Methodology Lance Wang*, Michelle -
Turning Data Into Insight with IBM Machine Learning for Z/OS
Front cover Turning Data into Insight with IBM Machine Learning for z/OS Samantha Buhler He Sheng Yang Guanjun Cai Dai Yi John Goodyear Xavier Yuen Edrian Irizarry Hao Zhang Nora Kissari Zhuo Ling Nicholas Marion Aleksandr Petrov Junfei Shen Wanting Wang Redbooks International Technical Support Organization Turning Data into Insight with IBM Machine Learning for z/OS August 2018 SG24-8421-00 Note: Before using this information and the product it supports, read the information in “Notices” on page vii. First Edition (August 2018) This edition applies to IBM Machine Learning for z/OS version 1.1.0. © Copyright International Business Machines Corporation 2018. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . vii Trademarks . viii Preface . ix Authors. ix Acknowledgements . xi Now you can become a published author, too! . xi Comments welcome. xii Stay connected to IBM Redbooks . xii Chapter 1. Overview . 1 1.1 Challenges of exponential data growth . 2 1.2 Trends in artificial intelligence and cognitive systems. 2 1.3 IBM’s approach to artificial intelligence and cognitive systems. 3 1.4 IBM Machine Learning for z/OS: An enterprise machine learning solution. 4 1.5 Unmatched capabilities of Machine Learning for z/OS . 4 1.5.1 Secure IBM Z platform for running machine learning with data in place. 5 1.5.2 Full lifecycle management of models . 5 1.5.3 Enterprise grade performance and high availability . 6 1.5.4 Flexible choice of machine learning languages and scoring engines . -
G:\Release Manual\P4\VIA\8Vm533
When you installing AGP card, please make sure the following notice is fully understood and practiced. If your AGP card has "AGP 4X (1.5V) notch"(show below), please make sure your AGP card is AGP 4X (1.5V). AGP 4X notch Caution: AGP 2X card is not supported by GA-8VM533. You might experience system unable to boot up normally. Please insert an AGP 4X card. Example 1: Diamond Vipper V770 golden finger is compatible with 2X/4X mode AGP slot. It can be switched between AGP 2X(3.3V) or 4X(1.5V) mode by adjusting the jumper. The factory default for this card is 2X(3.3V). The GA-8VM533 (or any AGP 4X only) motherboards might not function properly, if you install this card without switching the jumper to 4X(1.5V) mode in it. Example 2: Some ATi Rage 128 Pro graphics cards made by "Power Color", the graphics card manufacturer & some SiS 305 cards, their golden finger is compatible with 2X(3.3V)/4X(1.5V) mode AGP slot, but they support 2X(3.3V) only. The GA-8VM533 (or any AGP 4X only) motherboards might not function properly, If you install this card in it. Note : Although Gigabyte's AG32S(G) graphics card is based on ATi Rage 128 Pro chip, the design of AG32S(G) is compliance with AGP 4X(1.5V) specification. Therefore, AG32S(G) will work fine with GA-8VM533 based motherboards. The author assumes no responsibility for any errors or omissions that may appear in this document nor does the author make a commitment to update the information contained herein. -
GA-VT890P Intel® Coretm 2 Duo / Pentium® D / Pentium® 4 / Celeron® D LGA775 Processor Motherboard
GA-VT890P Intel® CoreTM 2 Duo / Pentium® D / Pentium® 4 / Celeron® D LGA775 Processor Motherboard User's Manual Rev. 1001 12ME-VT890P-1001R * The WEEE marking on the product indicates this product must not be disposed of with user's other household waste and must be handed over to a designated collection point for the recycling of waste electrical and electronic equipment!! * The WEEE marking applies only in European Union's member states. Motherboard GA-VT890P Motherboard GA-VT890P Jan. 5, 2007 Jan. 5, 2007 Copyright © 2007 GIGA-BYTE TECHNOLOGY CO., LTD. All rights reserved. The trademarks mentioned in the manual are legally registered to their respective companies. Notice The written content provided with this product is the property of Gigabyte. No part of this manual may be reproduced, copied, translated, or transmitted in any form or by any means without Gigabyte's prior written permission. Specifications and features are subject to change without prior notice. Product Manual Classification In order to assist in the use of this product, Gigabyte has categorized the user manual in the following: For quick installation, please refer to the "Hardware Installation Guide" included with the product. For detailed product information and specifications, please carefully read the "Product User Manual". For detailed information related to Gigabyte's unique features, please go to "Technology Guide" section on Gigabyte's website to read or download the information you need. For more product details, please click onto Gigabyte's website at www.gigabyte.com.tw Table of Contents Item Checklist ................................................................................................................. 6 Optional Accessories ...................................................................................................... 6 GA-VT890P Motherboard Layout .................................................................................