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Qualcomm 3D Sonic Sensor Fingerprint

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Qualcomm 3D Sonic Sensor Fingerprint REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT Qualcomm 3D Sonic Sensor Fingerprint The second generation of biometric ultrasonic fingerprint authentication, found in the Samsung Galaxy S10 and S10 plus. Back in 2016, LeEco, a former smartphone some mask layers. Also, the Qualcomm design company in China, was the first to Biometric Integrated Circuit (QBIC) has integrate an ultrasonic sensor as a evolved in terms of circuit and power biometric fingerprint authentication handling, integrating more high voltage device. This first integration was under a circuits and more on-chip memory. metal cover at the back of the screen. But This complete analysis of the Ultrasonic the most interesting feature of such a Fingerprint Module includes analyses of sensor is its possible integration under the the sensor die and the Application Specific display without any additional compo- Integration Circuits (ASICs), along with a nents. With the integration in the latest cost analysis and price estimation for the Galaxy S10 series from Samsung, module. It also includes a physical and Qualcomm has proven that the biometric technical comparison with the previous ultrasonic fingerprint under display is now version of the sensor in the LeEco LeMax ready for very high volume production Pro and with the Synaptics’ FS9500 optical and could compete with capacitive or fingerprint sensor. Finally, a cost optical sensors. comparison is included with the Synaptics Either with the Exynos or the Qualcomm sensor. Chipset, the Samsung Galaxy S10 series is the first to feature the Ultrasonic Fingerprint Sensor directly under its COMPLETE TEARDOWN WITH display. The sensor is located on the front of the device directly glued onto the • Detailed photos Title: Qualcomm 3D organic light emitting diode (OLED) • Precise measurements Sonic Sensor material. Fingerprint • Materials analysis This report focusses on analyzing the • Manufacturing process flow Pages: 127 ultrasonic sensor and its integration with • Supply chain evaluation Date: July 2019 the display. The sensor is manufactured using Low-Temperature Polycrystalline • Manufacturing cost analysis Format: Silicon (LTPS) technology on a glass • PDF & Excel file substrate. Using ferroelectric polymer, the Selling price estimation sensor generates and processes ultrasonic • Comparison with previous version of Price: EUR 3,990 waves on the substrate. The component the fingerprint sensor in the Le Max also includes an acoustic horn structure in Pro from LeEco order to focus the ultrasonic waves. • Comparison between ultrasonic and Since the last version of the device, optical under display fingerprint Qualcomm has made several changes at the thin-film transistor (TFT) level, reusing IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY QUALCOMM 3D SONIC SENSOR FINGERPRINT TABLE OF CONTENTS Overview/Introduction Physical Comparison with LeEco Le Max Pro’s Qualcomm Company Profile and Ultrasonic Ultrasonic Sensor Technology • Integration, Structure, Die, Process Samsung Galaxy S10 Plus Teardown Manufacturing Process Flow Market Analysis • Overview Physical Analysis • Ultrasonic Sensor Process and Fabrication • Physical Analysis Methodology Unit • Module Extraction • Ultrasonic Sensor Process Flow o Display integration and cross-section • ASIC Front-End Process and Fabrication Unit • Module Assembly Cost Analysis o View, disassembly and cross-section • Cost Analysis Overview • Sensor Die • The Main Steps Used in the Economic o View, dimensions and marking Analysis o Die overview: Amplifier, power • Yield Hypotheses supply, row and column selection, • Sensor Die Cost transceivers o Front-end cost o Cross-section: transistors, o Back-end: Tests and dicing transceivers o Panel and die cost o Process characteristics • ASIC Die Cost • ASIC Component o Front-end cost o Package and die: View, dimensions and marking o Back-end: Tests and dicing o Die overview, delayering and main o Wafer and die cost block ID • Module Cost o Die cross-section Cost Comparison with the Synaptics FS9500 Under o Process characteristics Display Fingerprint Estimated Price Analysis AUTHORS Dr. Stéphane Elisabeth has joined Véronique Le Troadec has joined System Plus Consulting's team in 2016. System Plus Consulting as a laboratory He has a deep knowledge of Materials engineer. characterizations and Electronics She holds a Master degree in Micro- systems. He holds an Engineering electronics from the University of Degree in Electronics and Numerical Nantes. Technology, and a PhD in Materials for Microelectronics. RELATED REPORTS Synaptics’ Under-Display FPC1268 in the Huawei Mate 9 Qualcomm® Snapdragon Sense™ Fingerprint Scanner Inside the Pro and Huawei P10 series ID 3D Fingerprint VIVO X21 UD Smartphone The world’s first capacitive The latest in cutting-edge Optical fingerprint technology fingerprint successfully biometric fingerprint allows integration behind the integrated under glass, in authentication, in the LeMax Pro display. collaboration with TPK. smartphone from LeEco. July 2018 - EUR 3,490* April 2017 - EUR 3,490* August 2016 - EUR 3,290* REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT COSTING TOOLS Parametric IC MEMS Power Display PCB Costing Tools Price+ Price+ Price+ Price+ Price+ Process-Based MEMS Power LED 3D Package SYSCost+ Costing Tools CoSim+ CoSim+ CoSim+ CoSim+ Our analysis is performed with our costing tool MEMS CoSim+. System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from single chip to complex structures. MEMS CoSim+ Cost simulation tool to evaluate the cost of any MEMS process or device. ABOUT SYSTEM PLUS CONSULTING WHAT IS A REVERSE COSTING®? System Plus Consulting is specialized in the cost analysis of electronics Reverse Costing® is the process of disassembling a device (or a from semiconductor devices to system) in order to identify its technology and calculate its electronic systems. manufacturing cost, using in-house models and tools. A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling price of a product is available. Our services: CONTACTS • STRUCTURE & PROCESS ANALYSES • TEARDOWNS Headquarters America Sales Office Asia Sales Office 22, bd Benoni Goullin Steven LAFERRIERE Takashi ONOZAWA • CUSTOM ANALYSES Nantes Biotech Western USA & Canada Japan & Rest of Asia • COSTING SERVICES 44200 Nantes +1 310-600-8267 +81 3 4405 9204 • COSTING TOOLS France [email protected] [email protected] • TRAININGS +33 2 40 18 09 16 [email protected] Chris YOUMAN Mavis WANG Eastern USA & Canada Greater China www.systemplus.fr Europe Sales Office +1 919-607-9839 +886 979 336 809 [email protected] Lizzie LEVENEZ [email protected] [email protected] Frankfurt am Main Germany +49 151 23 54 41 82 [email protected] QUALCOMM 3D SONIC SENSOR FINGERPRINT REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT ORDER FORM Please process my order for “Qualcomm 3D Sonic Sensor Fingerprint” Reverse Costing® – Structure, Process & Cost Report Return order by: Ref: SP19465 FAX: +33 2 53 55 10 59 MAIL: SYSTEM PLUS CONSULTING Full Structure, Process & Cost Report : EUR 3,990* 22, bd Benoni Goullin Annual Subscription offers possible from 3 reports, including this Nantes Biotech report as the first of the year. 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