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Background Statement for SEMI Draft Document 4404 New Standard: Specification for Handshake Method of Single Substrate for Handling Off/On Tool in FPD Production

Note: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document.

Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.

Background Statement: Regardless of substrate size, general cost reduction is important subject of concern in flat panel display (FPD) production. This tendency has become remarkable with the migration to large substrate sizes. In the FPD fab, the substrate is transferred between AMHS/Robot and process equipment. Each FPD fab uses different handshake method for substrate transfer, which creates issues such as increase in cost, as well as delay in delivery and testing for both panel manufacturers and suppliers. Standardizing substrate transfer handshake method can solve those issues mentioned above.

All of the voting results will be adjudicated at Japan FPD Factory Automation Committee meeting on October 26, 2007 in conjunction with FPD International 2007 at Pacifico Yokohama, Japan.

If you have any questions, please contact to the Single Substrate Handling I/F Task Force co-leader: Yasunobu Otogawa, [email protected] Informational (Blue) Ballot1000A (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and transfer between different pieces of process equipment. process of betweendifferent pieces transfer 2.4 transferring fromequipment. process to for systems method, singlesubstrate singlesubstrates transfer the 2.3 2.2 the buffersand equipment. process the system transfer substrate single the and equipment process the between and system transfer substrate single the between 2.1 2 and equipment, as installation well as of costproduction reduction. in design, the in improved efficiency result in willthis expected that It is fab.FPD each at different currently are which 1.2 single orderto theequipmentin process issues. transferring to for solve these substrates testing. and delivery in delay as well cost, as in as increase such issues hand, other the On of use combined extensive the 1.1 1 inSubstratefor Production Off/OnFPD Handling Tool Standard:New Specification Handshake for ofSingle Method Draft Document SEMI #4404 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This process the to similar be to assumed in shown is substrates single of transfer the for mechanism The increasing. is process 4.1 4 thisin document. recovery 3.5 error Therefore, assistance. operator need may and equipment this in defined document. arenot procedures the to specific procedures proprietary 3.4 defined systems document. not theequipmentis process this transfer in and 3.3 3.2 signal. and the the operationtransfereachhandshake mechanism of between 3.1 3 the determine and practices health and safety appropriate other ofprior limitations use.applicability regulatoryor to establish to standard this of users the of responsibility NOTICE: Scope Purpose Background Limitations The single substrate transfer handshake that is defined in this standard may also be applied to single substrate single to applied be also may standard this in defined is that handshake transfer substrate single The standard This transferring for handshakespecification singlesubstrates includes:The substrates single of operation transfer the with associated handshake the to limited is standard this of scope The substrates, single transferring for methods handshake the standardize to is specification this of purpose The with transfer, substrate single for demand the production, FPD in sizes substrate large to migration the to Due Due to the migration to large glass substrate sizes in FPD production, the demand for a single substrate transfer substrate single a for demand the production, FPD in sizes substrate glass large to migration the to Due defined not is implementation for design logical The states. logical are standard this in defined states signal The are these However, procedures. recovery error require transfer substrate single for signals handshake The substrate single the between transferred are that data process substrate single the as such data of transfer The of not specification theis handshakesignals physical this in layout ordefined The electrical relation the define not does it while signal handshake each for procedure control the defines standard This   

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LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000A (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This specification this that consider not do we Therefore, the physical oftechnology. determine aspect the to interfaces.needs of each progress the between with along determined change be to likely to are are specifications interface These specification. s this in defined not are 7.4 interlock process).of procedures proprietary systems,the two between and/or assistance operator procedures recovery define to recommended is require it Instead, given. is definition standard no equipment, may the to specific procedures recovery Because specification. this 7.3.3 ubstrate ubstrate COMPT BUSY S_REQ R_REQ VALID Connector Type, Signal and Pin Assignment Pin and Signal Type, Connector Recovery Procedures from Timeout Errors Timeout from Procedures Recovery t ransfer ransfer Sender s ystem and and ystem s ingle p rocess rocess Examples Interlock Timeout of s ubstrate ubstrate e quipment. Currently, there are numerous interface methods available and they and methodsavailable interface are numerous there Currently, quipment. TR1 t ransfer ransfer TS1

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The recovery procedures from timeout errors are not defined in defined not are errors timeout from procedures recovery The Connector type, signal and pin assignment and signal voltages signal and assignment pin and signal type, Connector Figure 5 Figure Page TR2 TS2 10 p rocess rocess Error Error TS3 e TR3 quipment (e.g.quipment Monitoring TS4 TS5 , pause, restart and completion andrestart pause, S_REQ R_REQ VALID COMPT BUSY Document Number: Document Receiver Doc. Date: 4404 DRAFT

 6/1/2018 SEMI s ingle 4404 

LETTER (YELLOW) BALLOT Informational (Blue) Ballot1000A (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and the risk of infringement of such rights are entirely their own suchresponsibility. infringementareentirely rights their the of risk of this in mentioned items any and copyrights, or rights patent such any with of determination that advised expressly are standard this connection of Users standard. in asserted copyrights or rights position patent no any takes of (SEMI) validity the International respecting Materials and Equipment Semiconductor standard, this of publication By without change notice. to subject are standards These herein. mentioned equipment relevant or other materials and any sheets, respecting data literature, product labels, product user. instructions, manufacturer's the to of refer responsibility to the cautioned solely are is Users standard the of suitability the of determination The application. particular NOTICE: reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any for herein forth set standards the of suitability the to as representations or warranties no makes SEMI Page 11 Document Number: Document Doc. Date: 4404 DRAFT

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LETTER (YELLOW) BALLOT

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