Background Statement for SEMI Draft Document 5971

Semiconductor Equipment and Materials International 3081 Zanker Road San Jose, CA 95134-2127 Letter (Yellow) Ballot0Letter Phone: 408.943.6900, Fax: 408.943.7943 (Yellow) Ballot0Letter (Yellow) Ballot00Informational (Blue) Ballot0Document Under Development0Letter (Yellow) Ballot0Letter Ballot0 Background Statement for SEMI Draft Document 5971 Reapproval of SEMI T19-0311, Specification for Device Marking

Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this Document.

Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.

Background Per SEMI Regulations 8.9.1, the Originating TC Chapter shall review its Standards and decide whether to ballot the Standards for reapproval, revision, replacement, or withdrawal by the end of the fifth year after their latest publication or reapproval dates.

The Traceability Japan TC Chapter reviewed and recommended to issue SEMI T19 for a reapproval ballot.

Review Information

Task Force Review Committee Review Group: 5 Year Review Task Force Traceability Japan TC Chapter Date: TBD Friday, December 16, 2016 Time & Time Zone: TBD TBD Location: TBD Tokyo Big Sight Conference Tower City, State/Country: TBD Tokyo, Japan Leader(s)/Authors: N/A Yoichi Iga(Self) Hirokazu Tsunobuchi (Keyence) Standards Staff: Chie Yanagisawa (SEMI Japan) Chie Yanagisawa (SEMI Japan) 81.3.3222.5863 / [email protected] 81.3.3222.5863 / [email protected]

If you need a copy of the document in order to cast a vote, please contact the following person within SEMI. Chie Yanagisawa SEMI Standards, SEMI Japan Tel: 81.3.3222.5863 Email: [email protected]

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This is a Draft Document of the SEMI International Standards program. No material on this page is to be construed as an official or adopted Standard or Safety Guideline. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.

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Doc. 5971  SEMI Letter (Yellow) Ballot0Letter (Yellow) Ballot0Letter (Yellow) Ballot00Informational (Blue) Ballot0Document Under Development0Letter (Yellow) Ballot0Letter Ballot0 SEMI Draft Document 5971 Reapproval of SEMI T19-0311, SPECIFICATION FOR DEVICE MARKING

Note: Per SEMI Procedure Manual (NOTE 19), a reapproval Letter Ballot should include the Purpose, Scope, Limitations, and Terminology sections, along with the full text of any paragraph in which editorial updates are being made.

1 Purpose 1. The purpose of this document is to establish a standard specification of marking on semiconductor devices to identify individual device by unique identification code and possible optional information to suggest a part of manufacturing information.

2 Scope 1. The specification document ranges from bare semiconductor dice to be packaged or assembled devices. 2. While the document specifies physical interface of marking depending on one or more available technologies, it doesn’t restrict specific means of writing, reading alignment and so on. 3. The document also handles a part of logical interface about the information of the marking. 4. This document does not specify specific means to mark (writing) nor to identify (reading) the mark but guide possible ones implicitly with geometric requirements. NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.

3 Limitations 1. Depending on types of semiconductor devices including their structure and manufacturing process, a part or whole of this specification may not be effective. Users of this standard are required to take care of this specification before producing or during designing process. 2. This standard doesn’t recommend to put a marking on all device products. It is believed that the marking is expected to such device products that have good balance among device price, writing/reading costs including tools, degree of necessity and so on. 3. Because this specification is prepared based on semiconductor devices, the other devices are out of the scope of this standard. However, it could be applied to such devices if implementing the description of this document doesn’t hinder property of the devices at least physically. Users of this standard for such devices are responsible for all of the implementation and application of this specification.

4 Referenced Standards and Documents 1. SEMI Standards SEMI T13 — Specification for Device Tracking: Concepts, Behavior and Services SEMI T14 — Specification for Micro ID on 300 mm Silicon Wafers 2. ISO/IEC Standard1 ISO/IEC 16022 — International Symbology Specification – Data Matrix

1 International Organization for Standardization, ISO Central Secretariat, 1 rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30; http://www.iso.ch

Doc. 5971  SEMI Letter (Yellow) Ballot0Letter (Yellow) Ballot0Letter (Yellow) Ballot00Informational (Blue) Ballot0Document Under Development0Letter (Yellow) Ballot0Letter Ballot0 NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

5 Terminology 1. Abbreviations and Acronyms 1. DDM — die device mark 2. DM — device mark 3. PDM — packaged or sealed device mark 4. SIP — system in package; refer to the SEMI Standards Compilation of Terms (COTs). 2. Definitions 1. alignment bar, of data matrix code symbol — a solid line of contiguous filled cells abutting a line of alternately filled and empty cells. [ISO/IEC 16022] 2. binary value — a value to evaluate a cell of data matrix code symbol. A dot in the data matrix code symbol indicates the binary value 1. The absence of a dot indicates the binary value 0. 3. border column — the outermost column data matrix code symbol. This column is a portion of the finder pattern. 4. border row — the outermost row of data matrix code symbol. This row is a portion of the finder pattern. 5. cell, of data matrix code symbol — the area within which a dot may be placed to indicate a binary value. 6. complex device — a device which consists of more than one subcomponent device. They may be piggy backed, stacked, flipped over, soloed on additional substrate and so on. They may or may not be interconnected. SIP and Hybrid IC devices are a part of examples. 7. data matrix code symbol — a two-dimensional array of square cells arranged in contiguous rows and columns. In certain ECC200 symbols, data regions are separated by alignment patterns. The data region is surrounded by a finder pattern. [ISO/IEC 16022] 8. device mark — marking placed on the surface of semiconductor device to identify the individual device. This is the general term of such mark as die mark and packaged or sealed device mark. 9. die mark — marking placed on the surface of semiconductor die to identify the individual die; more formally die device mark. 10. dot, in a cell of data matrix code symbol — a physical difference to evaluate the value of a cell of data matrix code symbol. The physical difference may be protrusion, hollow, material/density/phase difference and so on, depending on technology of marking. 11. finder pattern, of data matrix code symbol — a perimeter to the data region. Two adjacent sides contain dots in every cell; these are used primarily to define physical size, orientation and symbol distortion. The two opposite sides are made up of cells containing dots in alternate cells. [ISO/IEC 16022] 12. hybrid IC — words listed in the SEMI Standards Compilation of Terms (COTs). Refer to the COTs. 13. identification, contained in data matrix code symbol — a code to identify an individual device uniquely with manufacture’s assigned code in the same model of products or pointer to external data for such specific purpose as verification. 14. packaged or sealed device mark — marking placed on the surface of packaged or sealed semiconductor device to identify the individual device; that is, often the individual die in the package.

Doc. 5971  SEMI Letter (Yellow) Ballot0Letter (Yellow) Ballot0Letter (Yellow) Ballot00Informational (Blue) Ballot0Document Under Development0Letter (Yellow) Ballot0Letter Ballot0 NOTICE: SEMI makes no warranties or representations as to the suitability of the standard(s) set forth herein for any particular application. The determination of the suitability of the standard(s) is solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature respecting any materials or equipment mentioned herein. These standards are subject to change without notice. By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights are entirely their own responsibility.

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