Extreme Performance ATCA Blade with Dual Intel Xeon Processors E5-2658 and E2648L

Extreme Performance ATCA Blade with Dual Intel® Xeon® Processors E5-2658 and E2648L The ADLINK aTCA-6250 incorporates the latest dual 8-core/16-thread Intel® Xeon® processors to provide robust computing power for high-end carrier-grade applications

ADLINK Technology, Inc. (TAIEX:6166), a leading provider of trusted telecom computing products, today announced availability of the aTCA-6250, The aTCA-6250 is an AdvancedTCA® (ATCA) processor blade with robust computing power, high throughput connectivity and accelerated packet processing capabilities. Featuring dual 8-core Intel® Xeon® processor E5-2658 and E2648L (2.1 GHz/1.8 GHz) with Intel® C604 chipset, eight channels of DDR3 memory up to 128 GB, and a 400 W power supply subsystem for maximum computing performance, the aTCA-6250 provides versatile connectivity including dual 10GbE Fabric Interfaces, dual GbE Base Interfaces, quad front panel GbE interfaces, dual front panel USB and COM ports, and onboard SATA DOM socket. Dual 10GbE ports and dual hot-swappable SAS bays on the optional aTCA R6270 Rear Transition Module (RTM) provide additional network throughput and storage capabilities.

3rd Generation Intel® Core™ Processor ATX motherboard Available in July, the IMB207 is an industrial ATX motherboard, designed based on the new 22nm 3rd generation Intel® Core™ i7/i5/i3 processors in the LGA1155 socket with Intel® Q77 Express chipset. According to Intel, the next generation Intel® Core™ processor family using 22nm process technology and 3-D Tri-Gate transistors, delivers up to ~15% more CPU performance, up to 60 percent more 3D graphics performance and up to 1.8x transcode speed. The IMB207 combined with extreme computing, high bandwidth, greater energy efficiency, and powerful graphics performance is ideal for high-end industrial system applications, such as network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring. “In addition to our current range of 1st and 2nd generation Intel® Core™ processor-based ATX form factor motherboards, we are excited about the launch of IMB207 which is the 3rd generation Intel® Core™ i7/i5/i3 processor-based solution. This embedded platform supports Intel® Turbo Boost 2.0 technology, Intel® Hyper-Threading technology, Intel® HD 4000 Graphics with DX11 support, 32 GB DDR3 1600/1333 memory, and PCI Express 3.0 x16 slot. The IMB207 also supports Intel® Active Management Technology 8.0, Trusted Platform Module 1.2, SATA RAID, as well as PCIe x4 expansion for network-intensive applications," said Joseph Chou, Product Manager of Product & Marketing Division at Axiomtek. “Furthermore, this industrial grade board is integrated with a new HD graphics core for powerful graphic processing and triple-display capability through dual DisplayPort, DVI or VGA interfaces. Axiomtek’s IMB207 is an excellent solution for applications requiring powerful computing, a complete set of I/O, and high-end graphics while still maintaining low power consumption.”

congatec presents the conga-TS77 COM Express Module with support for new Intel® Core™ processor variants Deggendorf, Germany - congatec AG, a leading manufacturer of embedded computer modules, releases the conga-TS77 which supports the latest 3rd generation Intel® Core™ processor variants and the new Mobile Intel QM77 chipset. The Type 6 COM Express module offers more performance, improved energy efficiency, greater security thanks to Intel® VT (Intel® Virtualization Technology) and optional Intel® AMT (Intel® Active Management Technology) 8.0 support. The conga-TS77 is immediately available with support for the Intel® Core™ i7-3555LE (2.50 GHz, 4 MB Intel® Smart Cache, 25W), Intel® Core™ i7-3517UE (1.7 GHz, 4 MB Intel® Smart Cache , 17 W) and Intel® Core™ i5-3610ME (2.7 GHz, 3 MB Intel® Smart Cache, 35W) processors. The key innovations of the 3rd generation Intel® Core™ processors include use of 3D tri-gate transistors, 22-nanometer manufacturing and tighter integration of the graphics core. The module also features support for up to 16GB of fast dual-channel DDR3 memory (1600 MHz) and native USB 3.0.

Emerson Network Power Rugged Processing Blade Now Verified by Cisco for Secure Unified Communications in Federal and Defense Applications Interoperability with Cisco Unified Communications Manager and VMware virtualization software helps simplify and accelerate deployment Emerson Network Power, a business of Emerson and the global leader in enabling Business-Critical Continuity™, today announced that its rugged 3U CompactPCI® processing blade is now verified by Cisco for secure unified communications solutions in federal and defense applications. The CPCI7203, running VMware® virtualization software, has completed interoperability verification testing for the Cisco Unified Communications Manager, enabling a new generation of scalable and highly available collaborative communications platforms for government agencies and network-centric defense applications. "Validation of the Emerson Network Power CPCI7203 processing blade will enable quicker and easier transition from legacy deployed PBX systems and simplify maintenance to help reduce total cost of ownership," said Paul Virgo, marketing director for the Embedded Computing business of Emerson Network Power. "In today’s security-conscious environment, the ability to collaborate with encrypted communications is more important than ever. Emerson is pleased to expand its capabilities in this area and receive this affirmation from Cisco."

Kontron previews new digital signage solution based on the 3rd generation Intel® Core™ processors Upgraded open pluggable specification-compliant system offers cutting-edge technologies, simplifies integration and speeds time-to-market of intelligent digital signage applications Eching, Germany – Kontron previewed its open pluggable specification (OPS) compliant solution based on the 3rd generation Intel® Core™ processors at the 4th Annual Shanghai International Digital Signage & Touch Technology Show. Giving OEMs the cutting-edge features and capabilities needed for more intelligent digital signage systems, Kontron’s OPS solution will deliver excellent performance per watt ratios, an increase in graphics and computing performance, upgraded manageability features and improved security, as well as an increase in uptime provided by remote management capabilities. Kontron’s digital signage solution is fully compliant with the OPS specification created by Intel® to help standardize the design and development of digital signage applications that must integrate a diverse range of display technologies. The computing foundation utilizes the Kontron COM Express® basic Computer-on-Module (COM) COMe-bIP6, which gives OEMs a modular approach that enables optimized and cost-effective scalability of application-specific implementations in terms of graphics and processing performance. COMs also offer a clear migration path that developers can source for future digital signage upgrades, thereby future-proofing customers’ technology investments. It integrates the powerful 3rd generation Intel® Core™ processor and the Mobile Intel® QM77 Express Chipset.

PICMG 1.3 PEAK 886VL2 Gives Performance A Quantum Leap with 3rd Gen Intel® Core™ Processors NEXCOM PEAK 886VL2 PICMG 1.3 full-size single board computer based on the 3rd generation Intel® Core™ processor family paired Intel® Q77 Express chipset gives system performance a quantum leap. PEAK 886VL2, based on 22nm 3rd generation Intel® Core™ processor integrated with Intel® HD Graphics 4000 shows a huge increase in performance per watt, imaging processing capabilities, I/O bandwidth and data security. With high scalability and flexible expansion, PEAK 886VL2 meets different levels of performance demand for applications such as factory automation, AOI, medical imaging and video surveillance. PEAK 886VL2 supports a wide selection of LGA 1156 socket type processors, ranging from quad-core 3rd generation Intel® Core™ i7-3770 processor to dual-core Intel® Pentium® G2120 processor. With Integrated Intel® HD Graphics 4000 and up to 16GB dual channel DDR3 1333/1600 SDRAM, PEAK 886VL2 supports DirectX 11, OpenGL 3.1 and OpenCL 1.1 and increases 3D imaging processing by 2.9 times, compared with the previous generation processors. Based on the Intel® 22nm technologies, PEAK 886VL2 also uplifts the overall performance by 19 percents while keeps TDP within 77W.

Portwell’s New 1U Rackmount Network Appliance Increases Average LAN Throughput by 80 Percent New CAR-3030 series supports Intel® Sandy Bridge and scalable to latest Intel Ivy Bridge CPUs CAR-3030, the latest offering from American Portwell Technology, Inc. (http://www.portwell.com), is a 1U rackmount network security appliance that supports Intel’s second generation Core™ i7/i5/i3 processor (formerly codenamed Sandy Bridge) with Intel H61 PCH and DMI 5GT/s chipset, and is scalable to Intel’s latest third generation Core i7/i5/i3 processor (formerly codenamed Ivy Bridge). The new CAR-3030 network security appliance also features dual-channel 1066/1333 MHz DDR3 memory modules up to 16GB, PCI-E x8 expansion (with up to two Generation 2.0 bypass segments), LGA-1155 socket, up to 10 Gigabit Ethernet ports, optional dual 10G SFP+LAN module, 80 Plus power supply and 6 onboard Ethernet ports with 2 bypass segments.

Swissbit presents the new F-200 Series CFastTM Card Bronschhofen, Switzerland – With the new F-200 series CFastTM card and the SATA CompactFlash card, Swissbit has extended its successful CFastTM portfolio with a new processor technology, which has enabled it to design SLC storage cards with a capacity of up to 64GB. The F-200 series includes an SATA II (Spec 2.6) interface and is compatible with ATA7 and ATA8. Thanks to their reliability, comprehensive monitoring methods, optimized TCO (Total Cost of Ownership) and guaranteed long-term availability, these cards are particularly suitable for use in the following sectors: industry, automation, medicine and transportation as well as communication and networks. The high level of reliability is achieved through well designed wear leveling, read disturb management and the BCH-ECC (Bose-Chaudhuri- Hocquenghem-Codes) unit, which can correct up to 24 bits per 1024 bytes using a tried-and-tested procedure. What’s more, only SLC (Single Level Cell) flash storage cells are used, which have been tested to ensure the highest level of reliability, and specially developed and optimized algorithms for flash handling. Thanks to TRIM command support for 4 KB random write access, the F-200 series can achieve a value of up to 600 IOPS (Input/Output operations per second), which is unusually high for CFastTM cards.

Small Isolated Digital I/O Signal Conditioning Boards for Industrial Embedded Computer Systems Arlington, TX - WinSystems a supplier of PC/104 Single Board Computers (SBCs) and I/O modules, introduced two new isolated digital signal conditioning and termination boards for OEM embedded computer system designers. These small form factor boards are needed in applications requiring signal isolation between a computer and its monitoring/control points.The ISM-TRM-RELAY has 16 independent, Single Pole Double Throw (SPDT) relays. The ISM-TRM-COMBO provides a combination of eight optically isolated inputs, eight optically isolated outputs, and eight Form C relays on one board. To insure reliable connection with easy removal and insertion with field wiring, industry-standard, 3.5 mm pluggable connectors are used. WinSystems' ISM-TRM-RELAY has 16 independent Form C relays on board. There are two signal lines, Normally Open (NO) and Normally Closed (NC) plus a Common associated for each relay. The contacts can handle 6A @ 250VAC/24VDC for applications requiring medium current capacity plus isolation. X-ES Adds 3U CompactPCI Module to Line of Intel® Core™ i7 Processor-Based Products Middleton, WI – Extreme Engineering Solutions (X-ES) introduces the XPedite7431, a conduction- or air- cooled 3U CompactPCI Single Board Computer (SBC) supporting 2nd and 3rd generation Intel® Core™i7 processors. With a dual- or quad-core processor and 8 GB of memory, the XPedite7431 is an ideal platform for air-cooled industrial and communications applications, as well as deployed conduction- cooled military applications. In addition to 3U CompactPCI, X-ES is supporting 3rd generation Intel® Core™ i7 processors across our five other industry-standard form factors: COM Express, 3U VPX, 6U VPX, 6U CompactPCI, and 6U VME. The XPedite7470 3U VPX Single Board Computer (SBC), the XCalibur4401 6U CompactPCI SBC, the XPedite7450 COM Express module, and the XPedite7431 are currently available. Please contact X- ES Sales for more information.

AAEON Industrial Motherboard: IMBM-B75A Directed at Cost-effective and Multi-display Applications (Taipei, Taiwan) AAEON, a leading industrial computer manufacturer, announced its newest industrial motherboard encompassing a 3rd generation Intel® Core™ processor and Intel® B75 Express chipset. Built on the 22nm process technology, this motherboard supports faster and more efficient performance, along with the latest technological advancements. The IMBM-B75A is a Micro-ATX form factor with an Intel® Core™ i7-3770 or i5-3550S LGA 1155 processor and Intel® B75 Express chipset. Moreover, up to 32GB of DDR3 1066/1333/1600 (1600 for 3rd generation processor) memory is feasible with four DIMMs. Its five SATA connectors allow storage requirements to be met with ease. Additionally, this board offers five COM ports, six USB2.0 ports, four USB3.0 ports, three Audio jacks, one keyboard/mouse and an eight-bit Digital I/O. Users can also increase board functionality with one PCI-Express[x16], one PCI-Express[x4], two PCI and an optional onboard TPM.

7/2 Network Security Appliances Go Faster & Securer with Intel® Xeon® E3-1200v2 Upgrade NEXCOM's 1U network security appliances, NSA 5130, NSA 5130HA and NSA 5131 are faster, more reliable and secure than before with its new upgrade to Intel® Xeon® Processor E3-1200v2 Family. This new update will further enhance network and computing performance, support newer security features, and improve bandwidth utilization—all with lower power consumption. Therefore, they are the ideal platform for high-end Unified Threat Management (UTM), next generation firewalls, network routers, WAN optimization and all types of network security applications. The upgraded network security appliances can further secure business assets using the latest technology from the Intel® Xeon® Processor E3-1200v2 Family. Advanced security features such as automatic data correction, Intel® OS Guard, Intel® Secure Key, Intel® AES-NI and Intel® TXT will protect network and crucial data while delivering unsurpassed performance and reliability.

6/22 X-ES Introduces Rugged COM Express® Module with 3rd Generation Intel® Core™ i7 Processor for Small Form Factor Systems Middleton, WI – Extreme Engineering Solutions, Inc. (X-ES) introduces XPedite7450, a rugged COM Express® module that complies with the PICMG COM Express Basic form factor (95mm x 125mm) and supports an enhanced Type 6 pinout. The XPedite7450 can be hosted on a standard COM Express carrier card or a custom carrier card built to include additional end-user requirements, or it can be integrated into an X-ES XPand6000 Small Form Factor (SFF) rugged system. Based on the 3rd generation Intel® Core™ i7 quad-core processor, the XPedite7450 operates at up to 2.2 GHz to deliver enhanced performance and efficiency, making it an excellent processor mezzanine for commercial, industrial, and military applications. Designed and tested for the harshest military, aerospace, and industrial environments, the XPedite7450 includes enhancements above and beyond commercial COM Express modules.

6/22 Fanless Industrial System with Intel ® Atom N2800 Lanner Electronics has released the newest low power consuming, fanlees, industrial PC, the LEC-7050. Utilizing the latest Intel Atom N2800 (1.8GHz), the LEC-7050 is positioned to take over the economical digital signage and other industrial automation tasks. It features a +24V industrial environment DC input and like other Lanner products can be mounted via VESA, DIN-Rail or on a rack. “Positioning-wise Lanner has wanted to create a product that could succeed the LEC-7020 in price, but have increased power and more features for applications and maintain the small form factor size,” said Eric Chiu, Lanner’s Applied Computing Director. “Besides just the upgrade in the Intel Atom, we have added some features to make the LEC-7050 more attractive to customers while maintain the approximate price point. The appliance now utilizes DDR3 memory, has total Two Mini-PCIe expansion slots. These changes enable the appliance to thrive in industrial settings across many different applications.”

ADLINK Launches Express-IBR with 3rd Generation Intel® Core™ Processors with Support for SuperSpeed USB 3.0 and PCI Express Gen 3

Latest COM Express® Type 6 Module is based on the proven Express-HRR design, but with a 25 percent increase in CPU performance and 50 percent increase in graphics performance ADLINK Technology, Inc., a leading global provider of ruggedized embedded products, announces the release of its latest Ampro by ADLINK™ Extreme Rugged™ COM Express® module, the Express-IBR for airborne and vehicle-mounted military computers and human machine interfaces (HMI) applications required to function in harsh environments. The Ampro by ADLINK™ Express-IBR is a COM Express Type 6 module that supports the quad-core and dual-core 3rd generation Intel® Core™ i7 processors and Mobile Intel® QM77 Express chipset. Following ADLINK’s Rugged By Design methodology, the Express- IBR is ideal for use in environments prone to severe shock, vibration, humidity, and extended temperature ranges. “ADLINK’s Express-IBR is equipped with the 3rd generation Intel® Core™ processor, which utilizes Intel’s new 3D tri-gate transistor technology and 22nm process technology,” said Jeff Munch, CTO of ADLINK Technology and chair of the COM Express COM.0 R2.1 Sub-committee. “This platform delivers higher performance per watt over previous-generation processors – a feature that is critical for rugged applications requiring high performance in high temperature environments.”

6/21 New Kontron embedded motherboard supports 3rd generation Intel® Core™ processors High-quality Kontron Flex-ATX embedded motherboard now available with best-in-class performance Eching, German – Kontron has announced its new embedded motherboard, the Kontron Flex-ATX KTQ77/Flex, built on the 3rd generation Intel® Core™ processors. With long-term availability, up to 20% enhanced computing power, 50% more graphics performance and up to 40% overall increased performance per watt compared to designs based on the 2nd Generation Intel® Core™ processors, it is Kontron’s highest performing ATX-compliant embedded motherboard to date. Combined with comprehensive connectivity and the latest serial I/O performance including PCIe 3.0, USB 3.0 plus parallel expansion ports such as PCI, it is the ideal platform for upgrading existing designs and developing new applications in nearly all vertical markets. The feature-packed Kontron KTQ77/Flex provides OEMs and developers everything they need for their individual applications directly off the shelf. The integrated Intel® Turbo Boost technology 2.0 and improved Intel® AVX and SSE instruction sets provide computing-intensive high-performance applications in the industrial automation, medical and military markets increased floating point operations and vectorial calculations with reduced power consumption. For applications requiring massive parallel computing power, the new embedded motherboard supports Open™ CL 1.1 and offers a PCI Express 3.0 graphics port for a programmable, high-end general purpose graphics processing unit (GPGPU). For graphics-intensive applications such as gaming and digital signage, the integrated Intel® HD 4000 graphics features 30% more execution units for increased graphics capabilities. OEMs and designers benefit from twice the HD media and 3D graphics performance enabling an improved user experience and stunning visuals. Even multi-screen applications with simultaneous presentation on three independent displays are possible without the need for a dedicated graphics controller. Moreover, with 2x DisplayPort, 1x CRT and LVDS, the new embedded motherboard offers ample possibilities to connect all industry-relevant monitor types. With support for DirectX® 11, OpenGL® 3.1 and OpenCL™ 1.1 developers can now also use the latest APIs to accelerate their software application design. Finally, the embedded feature connector which is implemented, supporting up to 160 GPIO, analog-to-digital converter (ADC) and digital-to-analog converter (DAC), minimizes the need for individual I/O boards and thus reduces the bill of material and development time

6/12 VersaLogic in lockstep with Intel® brings Copperhead—the embedded industry’s benchmark for single board computer performance VersaLogic Corp., in collaboration with Intel’s elite Early Access program, has announced Copperhead — a new benchmark for embedded single board computer (SBC) performance. The "Copperhead" is powered by a 3rd Generation Intel Core™ processor. Its performance level, combined with the high-speed PCIe expansion site, enables the integration of complex high-bandwidth functions, such as Digital Signal Processing and video processing. These applications have historically been performed with large chassis-based systems and custom hardware. "The Copperhead's dual- or quad-core performance allows high-end compute-bound and video-bound applications to now be tackled with just a single embedded computer board, not a set of boards in a rack. This opens exciting new opportunities for automating high-end applications which need to be more portable, rugged, or lower cost than previous CPU architectures allowed," said Len Crane, President of VersaLogic.

6/12 Portwell Announces PICMG 1.3 SHB ROBO-8111VG2AR Featuring The Latest 22NM Intel® Processors American Portwell Technology, Inc. announces the Portwell ROBO-8111VG2AR full size PICMG 1.3 System Host Board (SHB) which provides high performance graphics and flexible PCI Express expansion, and is ideal for a wide range of applications across several fields including Factory Automation, Image Processing, Kiosk, Medical, and Military. ROBO-8111VG2AR is based on the 3rd generation Intel® Core™ processors and the latest Intel® Xeon® processors manufactured on 22nm process technology with energy efficient architecture. Portwell’s ROBO-8111VG2AR features two-channel DDR3 long DIMMs up to 16GB and ECC to support the Intel® Xeon® processor E3-1275v2 and the Intel® Xeon® processor E3-1225v2. The PCI Express 3.0 from the Intel® Xeon® processors provides three flexible combinations, one PCIE x16, two PCIE x8 or one PCIE x8 plus two PCIE x4 lanes for versatile applications. The Intel® Xeon® processors on LGA 1155 socket are paired with the Intel® C216 chipset.

6/11 SHB120 is a PICMG 1.3 SBC, an ideal all-in-one embedded solution for gaming, digital signage, visual inspection instruments based on 3rd Generation Intel® Core™ Processors Axiomtek is pleased to introduce SHB120, a high-performance PICMG 1.3 full-size CPU card designed for the latest 22nm 3rd generation Intel® Core™ processors using LGA1155 socket, delivering significant performance, power savings and graphics enhancements. Based on the 3rd generation Intel® Core™ i7/ i5/ i3 processors with Intel® Q77 Express chipset, the SHB120 supports Intel® Turbo Boost 2.0 technology, Intel® Hyper-Threading technology, Intel® HD Graphics, and PCI Express 3.0 x16 slot. This outstanding single board computer also supports 16 GB DDR3 1600/1333 unbuffered memory, SATA RAID, PCIe x4 expansion, as well as Intel® Active Management Technology 8.0 for network-intensive applications. With the integrated Intel® HD 4000 graphics engine with DirectX 11 technology, the SHB120 offers advanced 3D graphics and dual display view via DVI and VGA or optional DisplayPort. This high cost per performance value single board computer is ideal for applications in network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring. “Axiomtek’s newest SHB120 single board computer is a mainstream platform designed for the new 3rd generation Intel® Core™ i7/ i5/ i3 processors, providing extreme computing and high bandwidth with great energy efficiency and graphics performance. This new generation of Intel® Core™ processor using 22nm architecture delivers up to 15% more CPU performance, up to 60% more 3D graphics performance and up to 1.8x transcode speed. Even while exhibiting advanced performance in both computing and graphics, the SHB120 still maintains low power consumption. Axiomtek’s SHB120 is fully compatible with our PICMG 1.3 full-size passive backplanes, and we offer various industrial housing enclosures and have the capability to assist with any customer's industrial integration requirements." said Roger Shyu, Product Manager of Product & Marketing Division at Axiomtek.

6/4 MSC Vertriebs Announces COM Express™ Modules Now Support the Newest Dual-Core Intel® Core™ Processors Deliver increased processing, graphics and video performance with lower power The dual-core variants of the Intel® Core™ processor family of the third generation (code name "Ivy Bridge") that have just been introduced by Intel® are now also available on the newest COM Express™ modules from MSC Vertriebs GmbH. Based on an innovative 22nm process technology by Intel®, the processor family is manufactured with three-dimensional transistors in order to achieve higher performance with lower power dissipation. As a result, the new COM Express™ modules now deliver increased processing, graphics and video performance relative to the earlier platform. MSC delivers two new COM Express™ module families that support the Type 2 (MSC CXB-6SI) or Type 6 (MSC C6B-7S) pin-outs. Besides the first products with the Quad Core Intel® Core™ i7-3615QE (with 45 W maximum total power dissipation) and Intel® Core™ i7-3612QE (maximum 35 W TDP), which have already been announced in April, the more economical Intel® Core™ i3 and i5 versions with two processor cores are now also available. The COM Express™ modules are offered with Intel® Core™ i5- 3610ME (35 W TDP), Intel® Core™ i3-3210ME (35 W TDP) or Intel® Core™ i3-3217UE (17 W TDP) processors.