Trion ICP High Density Plasma Etchers Standard Operation Procedure

Wisconsin Center for Applied Microelectronics

1550 Engineering Drive Phone: 608/262-6877 Madison, WI 53706 Fax: 608/265-2614

Phantom #1 TRION Phantom ICP HIGH DENSITY PLASMA ETCHER Operation Procedures

Rev. 4/8/2018

Material Restrictions: All materials allowed for use in this equipment are listed in PDF form on the WCAM My Web Space. To view the listing following these steps:

A. Open the UW website https://mywebspace.wisc.edu for My WebSpace. B. Log on using your UW NetID and password. C. Click on the star in the upper left corner. D. Under Bookmarks click on Group Directories. E. Scroll down the list of organizations to WCAM. F. Click on WCAM. G. Double click on the first file folder to open “Approved Materials.” H. Double click on the WebsiteRpt to view the approved materials for equipment. I. Within the PDF you can perform a search.

0417cc163e0f3e34216507133dfa0ff8.doc - 1 - Phantom #1 Process Limits

Maximum Gas Flow Maximum Limits CF4 107 sccm ICP power 1250 W O2 98 sccm RF power 600 W Ar 140 sccm Chamber pressure 250mT SF6 67 sccm Helium backside cooling 10 T; 10 sccm CHF3 128 sccm C4F8 41 sccm

Pre-Check Steps

1. Log into CRESS and check out the Phantom #1 for use.

2. Check the ThermoNeslab. The system should be on and reading 20. If low level is indicated, add DI water.

3. Check front panel of Trion unit.  TC1000 should read 400  RIE & ICP power supplies should show GREEN light.

4. The computer flat panel screen should read: Standby Mode, Press Cancel to Exit

5. In the lower right of the screen the Chamber Pressure should read <5mT

Pre-Etch Chamber Clean – no wafer needed

1. Press CANCEL to exit STANDBY screen. The screen will give you a dialog saying:  Pumping Down Chamber

2. On the Main Menu screen: TRION  Press Files  Press the O2 Clean recipe on the Manual Automatic screen. Files Process Process Control Control  The O2 Clean recipe should on be displayed in the upper right-hand corner of the Main Menu screen. Vent Chamber Standby  Press EXIT to return to the Main Menu. Hardware Setup Exit Maintenance

0417cc163e0f3e34216507133dfa0ff8.doc - 2 - 3. On the Main Menu screen press Manual Process Control. The O2 Clean recipe will now be present as the default set points for the manual mode.

4. Press the Vacuum Off button, it should turn GREEN and says Vacuum On

Manual Process Control Panel Pressure Set Pressure Read Pressure BCl3 Set BCl3 Read Mode

ICP Power Set IPC Power Read ICP Ref CF4 Set CF4 Read

RIE Power Set RIE Power Read RIE Ref Cl2 Set Cl2 Read

DC Bias Read O2 Set O2 Read

CHF3 Set CHF3 Read

Prcss Time Set Prcss Time Read HBr Set HBr Read

He Press Set He Press Read He Flow Read SF6The Set SF6system Read will state, “Roughing chamber…” as shown below. Wait until the roughing is

Ion Gauge Read done (note disappears)

Roughing...

5. Press the Pressure Off button. 6. It turns GREEN and says Pressure On. Trouble Shooting: If it reads E-10 or lower, 7. Check the vacuum pressure by pressing the Ion the gauge did not turn Gauge button. The button should change to on. Wait a minute to GREEN. see if gauge comes on; else re-toggle the Ion Gauge button. Look at the “Ion Gauge Read” display for a pressure less than 5E-5 Torr.

8. Press the Ion Gauge button to toggle off the gauge before processing.

0417cc163e0f3e34216507133dfa0ff8.doc - 3 - 9. Press Gas Off button to toggle on the gas flow. The button should change to Gas On and GREEN. 10. Look at the Gas Read display to see gas flow. Let gas flow stabilize for 2 minutes. 11. Press RF Off button to toggle on the RF power. The button should change to RF On and GREEN.

MANUALLY TIME THE CLEAN Find a timer labeled Prcss Time This reads out in seconds. The etch DOES NOT automatically turn off!! It is just a stopwatch on the screen.

12. When the clean time is complete: Manual Process Control Panel Pressure Set Pressure Read Pressure BCl3 Set BCl3 Read Mode  Press RF On button to toggle off the power. ICP Power Set IPC Power Read ICP Ref CF4 Set CF4 Read

 Press Gas On button to toggle off RIE Power Set RIE Power Read RIE Ref Cl2 Set Cl2 Read the gas flow. DC Bias Read O2 Set O2 Read  Press Pressure On button to toggle CHF3 Set CHF3 Read off the pressure.  Press Vacuum On button to toggle Prcss Time Set Prcss Time Read HBr Set HBr Read

off the vacuum. He Press Set He Press Read He Flow Read SF6 Set SF6 Read

 Press Exit to return to the Main Ion Gauge Read Menu screen.

Loading Wafer

1. On the Main Menu screen press Vent Reactor button. The screen will say: a. Closing Vacuum Valve. b. Cycle Purging Chamber. c. Venting Chamber, seconds remaining XX d. The lid will automatically open. 2. Position a 4-inch wafer in the recess in the center of the chuck. 3. On the Main Menu screen press Close Lid button. The screen will say: Closing the Lid.

0417cc163e0f3e34216507133dfa0ff8.doc - 4 - Etching Process

1. On the Main Menu screen:  Press Files  Press the button for the desired recipe.  The recipe name should on be displayed in the upper right-hand corner of the Main Menu Processing screen.  Press Exit to return to the Main Menu. 2. On the Main Menu screen press Manual Process Control. Your selected recipe will now become the default set points for the manual mode. 3. Press the Vacuum Off button, it should turn GREEN and say Vacuum On

CHF3 Set CHF3 Read

He Press Set He Press Read He Flow Read SF6 Set SF6 Read The system will state, “Roughing chamber…” as shown below. Wait until the roughing is Ion Gauge Read done (note disappears)

Roughing...

4. Press the Clamp Off button to engage the electro-static chuck and it should turn GREEN and say Clamp On. 5. Check the vacuum pressure by pressing the Ion Gauge button. This should change to GREEN when turned on. Look at the “Ion Gauge Read” display for a pressure less than 5E-5 Torr. 6. Press the Ion Gauge button to toggle off the gauge before processing.

0417cc163e0f3e34216507133dfa0ff8.doc - 5 - 7. If you wish to change the setpoint of the pressure:  Press the Pressure Set button in the top left of the screen  A popup screen will appear.  Key in the new setpoint and press ENTER. 8. Press the Pressure Off button it should turn GREEN and say Pressure On. 9. If you wish to change the set point of a gas:  Press the set point button of the gas, i.e. O2 Set  A popup screen will appear.  Key in the new gas flow and press ENTER.  This change is temporary. The recipe will not be changed. 10. Press Gas Off button to toggle on all the gases. The button should change to Gas On and GREEN.  Check the Helium pressure readout. It should be flowing.  Check the process gas flow.  Let gas flow stabilize for 2 minutes. 11. If you wish to change the set point of the RF:  Press either power supply  ICP Power Set, or  RIE Power Set  A popup screen will appear.  Key in the new set point and press ENTER. 12. Set the etch timer if you would like a stopwatch on the screen.  Press PRCSS Time  A pop-up screen will appear.  Key in the time (in seconds) that you would like.  Press ENTER.

MANUALLY TIME THE CLEAN Find a timer labeled Prcss Time This reads out in seconds. The etch DOES NOT automatically turn off!! It is just a stopwatch on the screen.

0417cc163e0f3e34216507133dfa0ff8.doc - 6 - 13. Press RF Off button to toggle on the RF power. The button should change to RF On and GREEN. Look at the reflected power of both power supplies to ensure the plasma is tuning properly. 14. When the etch time is complete:  Press RF On button to toggle OFF the power.  Press Gas On button to toggle OFF the gas flow.  Press Pressure On button to toggle OFF the pressure.  Press Clamp On button to toggle OFF the electrostatic clamp.  Press Vacuum On button to toggle OFF the vacuum.  Press Exit to return to the Main Menu screen.

Unloading Wafer

1. On the Main Menu screen press Vent Reactor button. The screen will say: a. Closing Vacuum Valve. b. Cycle Purging Chamber. c. Venting Chamber, seconds remaining XX 2. The lid will automatically open. 3. Remove your wafer from the chuck. 4. On the Main Menu screen press Close Lid button. The screen will say: Closing the Lid. TRION

Manual Automatic Post-Etch Chamber Clean – no wafer needed Files Process Process Control Control

1. Press CANCEL to exit STANDBY screen. Vent Chamber Standby The screen will give you a dialog saying:  Pumping Down Chamber Hardware Setup Exit Maintenance

2. On the Main Menu screen:  Press Files  Press the O2 Clean recipe on the screen.  The O2 Clean recipe should on be displayed in the upper right-hand corner of the Main Menu screen.  Press EXIT to return to the Main Menu.

0417cc163e0f3e34216507133dfa0ff8.doc - 7 - 3. On the Main Menu screen press Manual Process Control. The O2 Clean recipe will now be present as the default set points for the manual mode.

4. Press the Vacuum Off button, it should turn GREEN and says Vacuum On

CHF3 Set CHF3 Read

He Press Set He Press Read He Flow Read SF6The Set systemSF6 Read will state, “Roughing chamber…” as shown below. Wait until the roughing is Ion Gauge Read done (note disappears)

Roughing...

5. Press the Pressure Off button. It turns GREEN and says Pressure On. 6. Check the pressure by pressing the Ion Gauge button. The button should change to GREEN. Look at the “Ion Gauge Read” display for a pressure of less than 5E-5 Torr. (If it reads E-10 or lower, the gauge did not turn on. Wait a minute to see if it comes on, else re-toggle the Ion Gauge button.) 7. Press the Ion Gauge button to toggle off the gauge before processing. 8. Press Gas Off button to toggle on the gas flow. The button should change to Gas On and GREEN. Look at the Gas Read display to see gas flow. Let gas flow stabilize for 2 minutes. 9. Press RF Off button to toggle on the RF power. MANUALLY TIME THE CLEAN The button should change to RF On Find a timer labeled Prcss Time This reads out in seconds. and GREEN. The etch DOES NOT automatically turn off!! It is just a stopwatch on the screen.

0417cc163e0f3e34216507133dfa0ff8.doc - 8 - 10. When the clean time is complete:  Press RF On button to toggle off the power.  Press Gas On button to toggle off the gas flow.  Press Pressure On button to toggle off the pressure.  Press Vacuum On button to toggle off the vacuum.  Press Exit to return to the Main Menu screen.

Idle System

1. On the Main Menu Processing screen press STANDBY. 2. The system will pump and purge the chamber and all the gas lines. The screen will give you a dialog of what the machine is doing:  Pumping down chamber 3. Once the Screen says Standby Mode, Press Cancel to Exit you are complete. Do not press Cancel. 4. Complete the logbook record of use. 5. Log off of CRESS.

0417cc163e0f3e34216507133dfa0ff8.doc - 9 -