Background Statement for SEMI Draft Document 4760

Background Statement for SEMI Draft Document 4760 NEW STANDARD: MECHANICAL SPECIFICATION FOR FRONT- OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 450mm WAFERS – Design A and Design B

Note: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document.

Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.

Background

For standardization of FOSB, TF pursued the following requirements i. Interoperability with 450 FOUP, as far as shipping performance requirements allow ii. Shipping performance to protect against accidental package drop during transportation . iii. Storage capability for sufficient period iv. Transportation efficiency

In the TF activities, the following three designs were proposed and discussed Design A is assuming 2 degree draft angle for achieving the same outer dimensions and same wafer pitch as 450 FOUP. Design B is assuming 3 degree draft angle, and wafer pitch is ~11.1 mm for keeping same height as 450 FOUP. Design C is assuming 3 degree draft angle and have 12 mm wafer pitch for securing random access.

As a consensus of International 450 mm Shipping Box TF, It will be difficult to focus on one design without sufficient data, therefore design A and design B were proposed and agreed upon for prototyping and data gathering for the yellow ballot preparation. The dimensions of some items have not reached consensus in the International 450 mm Shipping Box TF, therefore this blue ballot includes two design proposals for raw Si wafer shipping; Design A • Random access (12mm pitch) • Perimeter support • Same envelope as FOUP • Assumptions: – 2 degree draft angle – Drop height assumption: • 200mm palletized shipment • 510mm individual box shipment Design B • Sequential access (reduced pitch ~11.1mm – need confirm)

i • Perimeter support • Pursue same envelope as FOUP* • Assumptions: – 3 degree draft angle – Drop height assumption: • 200mm palletized shipment • 510mm individual box shipment The main focus areas for FOSB standardization are as follows; i. FOSB Envelope The draft angle for 450 FOUP is assumed as two degree; however, wider angle might be necessary for 450 FOSB, because draft angle depends on material properties. Design A is assuming 2 degree draft angle is achievable, allowing same envelope as 450 FOUP. Design B is assuming 3 degree draft angle is necessary to accommodate material property differences from 450 FOUP. ii. Door Closing Force and Latch Key Torque Stronger force is necessary to hold wafer for quality protection during transportation The necessary door closing force and latch key torque are not clear at this moment, so that appropriate values will be decided by prototyping and data gathering. Different values are proposed in design A and in design B for door closing force. iii Door/Wafer retainer Thickness The wafer warp of 450 mm is larger than 300mm, so that wafer retaining area shall be reviewed for shipping box usage, and for keeping wafer safe during transportation from silicon suppliers to their customers. Different dimensions are proposed for design A and for design B for finding appropriate dimensions by prototyping and data gathering. The following documents are written by different formats, though the document is to be brushed up for yellow ballot in future. Design A is written by following Doc. 4570B and design B is written by following SEMI M31 (300mm FOSB). The description for Design A is written from page 1 to page 55, and that for Design B is from page 56 to page 84. This document is also prepared for receiving inputs from interested parties. The results of this informational (Blue) ballot will be discussed early September in regional TFs and in international 450 mm shipping box TF (Web/ TEL conference) on September 17 NA time / 18 JA Time.

ii Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and 2.6 450 position the 2.5 shipper. 2.4 2.3 from FOUP, the HFOSB beautomated a using transferred to methods. wafers that recommended is It processes. manufacturing (Device) IC in used be to intended not is HFOSB The manufacturing. 2.2 automated allowing while of carrier. use shipping. wafer wafer maintaining processed for and utilized storage be transportation, can manufacturing, and Si it, during been with quality conformance has in standard manufactured this be can However, HFOSB interfaces. that mechanical so written all at interchangeability and modularity ensuring while 2.1 2 limitingwithout innovativesolutions. 1.3 the willshippers. that with interact features 1.2 and 450 ship transport 1.1 1 WAFERS450mm - TOBOX TRANSPORT USED AND SHIPPING SHIP FRONT-OPENING STANDARD: PRELIMINARY FOR NEW MECHANICALSPECIFICATION Draft Document SEMI reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Semiconductor for Manufacturing —Safety of Equipment ErgonomicsSEMI S8 Guidelines Engineering SEMI UsedandWafers Specification FOUP Transport Store 450mm to for SEMI 4570—Mechanical Polished Wafers for Mechanical Diameter Handling SEMI M74―Specification 450mm 4.1 1: NOTE 4 to methods alternative include may document this etc.) handling, gathering. and prototyping data for theaddress need pitch/wafer wafer interface, load to system open/close pin/groove KC interface, port groove carrier to pin KC HFOSB, a opens/closes port load a how FIMS, 3.2 bythis fromspecified disengaged arenot shell the carrier document. and 3.1 3 the determine and practices health and safety appropriate other ofprior limitations use.applicability regulatoryor to establish to standard this of users the of responsibility NOTICE: Scope Purpose Referenced Documents Referenced and Standards Limitations This document specifies the critical dimensions and locations of the kinematic pins that will support and support will that shipper for asdimensions. references planes orthogonal three reference documentThis defines pins kinematic the of locations and dimensions critical the specifies document This 450 the in wafers restraining and supporting for volumes silicon exclusion interior the and specifies document This shipping wafer processed for dimensions 450 features and of the documentthe external This specifies used primarily is HFOSB the that assumes standard This innovation on limits minimal places that specification of level appropriate an set to intended is standard This shippers and ports load of interoperability ensure to requirements of set a define to intended is document This port load the and shippers the of dimensions the for planes reference the define to intended is document This to used be to intended shippers the for dimensions physical basic establish to is document this of purpose The SEMI Standards SEMI (i.e., methods port load and shipper mm 300 the of scale-up direct a that demonstrated been yet not has it Since to engaged be may door carrier a how to as door HFOSB 450 a inside mechanisms and methods detailed The XXX

Unless indicated,otherwise documents all cited be latestshall the published versions. This standard does not purport to address safety issues, if any, associated with its use. It is the is It use. its with associated any, if issues, safety address to purport not does standard This — Provisional Standard 450mm— Provisional Shipping for Wafer System

mm shippers.

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mm s  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and 5.1.12 5.1.11 5.1.10 5.1.9 5.1.8 5.1.7 5.1.6 5.1.5 5.1.4 5.1.3 5.1.2 5.1.1 5.1 5 the same ―Unitized loadsproduct of ISTA-3E less products 68kgor ―Individualpackaged ISTA-2A 4.3 ISO/IEC 16022 parameters texture surface definitions Profile - method ProductSurface Terms, Specifications and texture: (GPS) - ISO 4287―Geometrical 4.2 this with document. 2: NOTE reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Fax: 41.22.733.34.30; 41.22.749.01.11; Switzerland. Telephone: 1 coupling (tips) the uppermost ofwith points kinematic pins. the three 5.2.7 5.2.6 for the of reference flange. ydimensions the used automation as plane, 5.2.5 pins. coupling bythe centerlineof defined circle kinematic the three of a the center 5.2.4 5.2.3 ofdimensions door features. 5.2.2 pin. centerlineof the rear ofand kinematicpins thecoupling three of aby the defined centerline circle the center with 5.2.1 Note: HFOSB 450 — 5.2

International Organization for Standardization (ISO), ISO Central Secretariat, 1, ch.de la Voie-Creuse, Case postale ISOVoie-Creuse, for1,ch.de Secretariat, la Geneva Case 56,CH-1211 Organization Standardization(ISO), 20, International Central Terminology Abbreviations andAcronyms Standards PerformanceTesting ISTA Packaging StandardsISO Definitions unless specified, otherwise word or the ‘shipper’ ‘carrier’ herein meanused shall 450 HFOSB. KCP — KCP ― KC — HP FP — — HFOSB ― FCL EE — —CL BP horizontal plane (HP)plane horizontal (of shipper) front ― (FCL) line center flange (FP) plane facial effector — contact end edge — (CL) line center (BP) plane bilateral TIR — ― RFID OHT ―

— bilateral plane —bilateral SEMI is developing a Mechanical Interface Specification for 450 mm Load Ports intended to be used in conjunction in used be to intended Ports Load mm 450 for Specification Interface Mechanical a developing is SEMI facial plane facial effector end horizontal plane kinematic coupling center line center used generally only a this as within“term” document identify Horizontal Opening Box.to the Front Shipping kinematic pin coupling center line flange total indicator run out indicatortotal run overhead hoist transportoverhead — radio frequency identification frequency radio Horizontal Front Opening Shipping Box Horizontal Opening Front International Symbology Specification -Matrix Symbology International Data Specification 1 — the part of the carrier closest to the door. to of the closest the carrier —the part — a — — a — a horizontal line centered vertically on the carrier door used as the reference for z for reference the as used door carrier the on vertically centered line horizontal a — — vertical plane, defining defining plane, vertical a horizontal plane, defining z=0 of a system with three orthogonal planes, coincident planes, orthogonal three systemwith a of defining z=0 plane, horizontal a vertical plane, defining x=0 of a system with three orthogonal planes, coincident planes, orthogonal three with system a of x=0 defining plane, vertical an end effector designed to contact the wafer onthe toedge. the wafer end designed effector contact an a horizontal line through the center of the automation flange, parallel to the facial the to parallel flange, automation the of center the through line horizontal a http://www.iso.ch y Page =0 of a system with three orthogonal planes, coincident with coincident planes, orthogonal three with system a of =0 4

jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and how test canhow fixturesto beon KCPs duplicate rest made the to the of carrier. position a 3: NOTE . areperpendicular. orientation.). planes These wafer (horizontal 6.2 figures. be achieved will via usually feature a of position the on clarification Necessary practices. drawing mechanical standard to possible as close as be to order in used are numbers negative No planes. three of system this within coordinates define to used are numbers the origin as ( zero position at are planes These planes. these to relatively features certain of position the depict to 6.1 6 matrix ausing data 5.2.17 placed. 5.2.16 supplierstheir to customersthe wafer 5.2.15 people and contamination 5.2.14 supports. onthe droopitwafer negligible 450mm with due gravity,for rests to wafers, as 5.2.13 shippersupports withposition wafer door onthe open. 5.2.12 5.2.11 5.2.10 5.2.9 supports. wafer shipper’s 5.2.8 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This   6.3 Reference PlanesReference (HP, BP)Specification FP, FP and BP are defined as vertical planes parallel to gravity when resting on the Kinematic Coupling interface Coupling Kinematic the on resting when gravity to parallel planes vertical as defined are BP and FP used be to intended are which planes, theoretical are section definition the in described as BP and FP, HP, The Reference Baselines Reference refer the y-dimensions of flange features to the center of the flange. the flange. the center to of the y-dimensions ofrefer features flange FCL ofaresymmetricthe CL. to dimensions door features CL origin — origin effector— end internal 2D code 2D area placement code 2D box Shipping — Microenvironment plane seating wafer — deflection wafer (of shipper)rear plane ― — Centerline for the carrier door. It passes through the centers of the openings for the door pins. All the z- the All pins. door the for openings the of centers the through passes It door. carrier the for Centerline —

— Flange Centerline. Since the automation flange is offset forward of the FP by by FP the of forward offset is flange automation the Since Centerline. Flange — The top surfaces of the Kinematic Coupling Pins are not the surfaces on which the carrier rests. Appendix 3 shows 3 Appendix rests. carrier the which on surfaces the not are Pins Coupling Kinematic the of surfaces top The ) with no tolerance associated, since these ideal planes do not represent a physical feature. Only positive Only feature. a physical represent do not planes ideal these since associated, no tolerance with) the intersection of — a code identifying elements such as maker, model, version and serial number of a HFOSB, by HFOSB, a of number serial and version model, maker, as such elements identifying code a — a theoretical surface which zerocurvature. and has surface width length,zerothickness infinite and theoretical a ECC200 symbol ECC200 symbol — a protective portable container for a shipper and/or wafer(s) that is used to ship wafers from wafers ship to used is that wafer(s) and/or shipper a for container portable protective a — — the part of the shipper farthest from its the —theshipper partdoor. from farthest of — Two centerlines aredefined: centerlines —Two

— change in wafer shape (TIR) due to gravity while the wafer is resting in a horizontal a in resting is wafer the while gravity to due (TIR) shape wafer in change oaie niomn rae y a nlsr o ioae te pout from product the isolate to enclosure an by created environment localized a an end effector designed to support wafers inside of where they are contacted by the by contacted are they where of inside wafers support to designed effector end an the bottom surface of an ideally rigid flat wafer that meets the diameter specification diameter the meets that wafer flat rigid ideally an of surface bottom the — an area on the door and a and door the on area an —

the BP, FP, HP. according to ISO/IEC16022. according to Page 5 nother area on top of the shell, where a 2D code can be can code 2D a where shell, the of top on area jn l jn

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Features for Automated Handling forAutomatedFeatures Handling Shipper Envelope Envelope Shipper and those on the sides shall have a depth of of depth a have shall sides the on those and Automation Flange Automation HFOSB, 450 the of dimensions overall The (z1) ≤ x8 + z12plus x8 ≤ (z1) + tolerances plus + y4 y2 tolerances(y1) ≤ plus + x2 x2 tolerances(x1) ≤ The The The The Automation Flange Automation Automation Flange Automation Automation Flange Automation x3 . The neck below the flange shall extend extend shall flange the below neck The . z9 , except for the door frame as shown by door for frame, except as the ntpo h 5 FS sa uoainfag o aiuaigtecrir carrier. the manipulating for flange automation an is HFOSB 450 the of top On — x32 θ5 shall extend front and back from its center (from the FCL) by by FCL) the (from center its from back and front extend shall has a pattern of notches on all sides. Notches on the front and back have a depth of depth a have back and front the on Notches sides. all on notches of pattern a has shall have a thickness of of thickness a have shall and and . y28 Overall Views of 450HFOSB-Overall Views DesignA of . The flange shall have a centering feature at the intersection of the BP and BP the of intersection the at feature centering a have shall flange The . Figure 1 (x1), (y1), and (z1), and (y1), (x1), x56 z2 and diameter of of diameter and . The notches shall have an angle of of angle an have shall notches The . Page

z13 (Design A) (Design x34 , and the shipper shall have no obstructions around the around obstructions no have shall shipper the and , 6 to each side of the BP, and by by and BP, the of side each to y30 in in are given as reference dimensions because they because dimensions reference as given are d3 4 jn l jn at the top surface. The side of the centering the of side The surface. top the at . Document Document 4760Number: info θ4 . The four corners shall corners four The . y56 and y37 and y56 y3 Doc. 4760 info Doc. 4760 , and shall extend to extend shall and , Date: 2009/08/13Date: in front of front in DRAFT  SEMI See  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and constrained by the values and tolerances of and tolerances byconstrained the values 8.1.4 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This h The Automation Flange Automation Right Front shall be located forward of the FP by ( by FP the of forward located be shall Automation Flange Section at BP Automation Section Flange at Automation –Top Flange View x4 and Figure 2 Figure Figure 3 Figure y40 . Page

(Design A) (Design A) (Design A) (Design 5 7 . jn l jn y36 , h oinain n oain are location and orientation the ), Left FrontLeft Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This See See 15 30 Left Figure 4 Figure Shipper Section at BP Shipper Section at Page

- (Design A) 8 jn l jn Right Document Document 4760Number: info See See Doc. 4760 info Doc. 4760 See See 25 26 Date: 2009/08/13Date: 3 DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and behind the FP. It may be necessary for a counterweight to be placed at the rear of the 450 HFOSB to locate the locate to HFOSB 450 the of rear the at placed be of requirement. gravitymeet to this center to counterweight a for necessary be may It FP. the behind be not shall gravity of center The occupied. fully or wafers, with filled partly empty, is shipper the whether volume r20 in gravity of center the ensure to way a in designed be shall HFOSB 450 the However, HFOSB. 450 the of gravity of center the 8.2 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This of awith depth 8.4.2 depth of 8.4.1 8.4 at the FP a with of notches height of rear the to opening to forward 8.3.1 to forpin onthe theforklift. indentation carrier includes a retain forklift a notched feature The 8.3 defined about a point on the BP at at BP the on point a about defined Center of Gravity Volume Gravity of Center Front Clamp Features Clamp — Front Feature Forklift There shall be two front clamping features on the bottom of the shipper. They shall be rectangular depression rectangular be shall They shipper. the of bottom the on features clamping front two be shall There a with depression rectangular a is Each shipper. the of top the on features clamping front two be shall There from vertically extending rear the to opening an be shall there carrier, the of side each On z5 , and bounded is by y45 x and and . The surface at at surface The . z36 and be bounded andby be y — The 450 HFOSB shall have features on the sides for handling by forklift, shown in Figure 7. Figure in forklift, shown by handling for sides on the features have shall 450 HFOSB The — direction with the door closed is within a volume defined by that part of a cylinder of a radius a of cylinder a of part that by defined volume a within is closed door the with direction y46 . The surface at at surface The . The 450 HFOSB shall have provision for being clamped at the front of for 450HFOSBprovision the atshipper. have the shall front beingThe clamped ― ― x52 &x52 x53 z39 z39 z40 No specific coordinates are defined within this standard for the exact location of location exact the for standard this within defined are coordinates specific No shall extend from from extend shall , a depth of , a depth of x57 &x57 x58 y36, , and by Right Automation Location Flange See Figure 6 See z39 which is in front of the FP. The center of gravity shall be within this within be shall gravity of center The FP. the of front in is which Figure 5 Figure Shipper Section at FPShipper Section at shall extend from from extend shall Figure 6 x55 , and by y y43 &y43 y44 and an angle of an angle and Page

(Design A) (Design (Design A) (Design 47 & y4847 & to to . 9 See Figure 7. See y46 . There shall be no obstruction at the top of the of top the at obstruction no be shall There . x54 . θ6 to the outside of the shipper. There shall be shall There shipper. the of outside the to See Figure 27. See jn l jn . Left Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: z51 to to z39 DRAFT  , and , SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and the kinematic coupling pins, and will be in the proper location only when the the when only location pins gravity.coupling by proper the in be will and pins, coupling kinematic the the of dimensions the of all Also, interface. FIMS the 4: NOTE reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This radius the of center The carrier. the on surface groove mating angled the height a at symmetry of axis the on centered r1 radius of cylinder a of intersection the as seen be can and line axis center vertical its about symmetric radially is pin each 1, Table in defined and 8 Figure in shown As underneath. pins six with mate that 10) § in (specified features 9.1 9 8.7 8.6 for provision no is there Consequently, situation. abnormal handles. manual an from manual that recovering anticipated when is occur It only activities. will maintenance handling or production normal during handling manual for heavy too 8.5 and a sphere of radius radius of sphere a and Requirements for Kinematic Coupling forKinematicRequirements Pins Coupling ieai opigPnSaeShape Pin Coupling Kinematic — Rails Conveyor areprovided: manual temporary handles If — Handling Manual  

When the temporary handles are installed, automated handling of the shipper automated be areinstalled, ofshall handling blocked. the thehandles temporary When handles installed. when arenot shipper the the overallof the handles fortemporary increase size not shall onthe 450 HFOSB attaching Features It is recommended that the front clamp features not be used for pulling the HFOSB from the undocked position into position undocked the from HFOSB the pulling for used be not features clamp front the that recommended is It See section 15. A fully-loaded 450 mm HFOSB will have a mass of about 24 kg, which means it will be will it means which kg, 24 about of mass a have will HFOSB mm 450 fully-loaded A r4 (which establishes the tip of the pin and might contact a flat plate). The radius radius The plate). flat a contact might and pin the of tip the establishes (which — The physical alignment interface on the bottom of the carrier consists of consists carrier the of bottom the on interface alignment physical The — Front Clamp& ForkliftFront Features z3 Figure 7 below the HP. An additional radius radius additional An HP. the below 450 450 HFOSB (such as the wafer location, etc.) are defined with reference to reference with defined are etc.) location, wafer the as (such HFOSB Page

(Design A) (Design 10 jn l jn 5 450 HFOSB is held in place on the kinematic the on place in held is HFOSB r3 is defined by the intersection of a of intersection the by defined is Document Document 4760Number: info r3 establishes the contact with contact the establishes Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI r4 is  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and For reference only, the rear primary kinematic pin is located on the BP and on a circle with radius radius with circle a on and BP the on radius with BPcircle located and rear is ona pin onthe secondary located is pin kinematic primary rear the only, reference For radius with of angle an at BP the to respect with symmetrically distance with BP the across distance with of distance a at located are pins primary front The pin. primary the for of FP the from distance a at BP, the on rear located The are carrier. door) the the from up (farthest pick pins to used arm robotic a on use for pins secondary the designated are pins inner the and nest, or primaryuse set aredesignated vehicle for ona pins outer load ofthe port shown Figurepins each in 11.The 9.2 z4 by given features all of 4287, ISO by defined as roughness, finish surface blend radius ofthe A HP. radius of circle horizontal the with pin the of symmetry of axis the through plane vertical reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This exclusion or features. of other the edge the with conveyor rail interfere than less no be shall groove the of end outermost the and origin, the than closer no be than farther no be shall grooves KC front the of end of physical error) an(lead-in handoffwith offset during a 10.3 be shall wall opening be shall each of angle dihedral the HP), the to (parallel 10.2 angle at the centerlines their have grooves front two the while BP, the along locations centerline its pin has groove rear kinematic The the origin. the through from passing radii along located are grooves the of centerlines The locations. pins 10.1 this describedshownFigure in 9. of in groove section the 450HFOSBand onthe bottom surface are kinematic value the properlead-in of ordertoIn achieve 10 have zero tolerance because they only and physical because offsets not features. they define zerotolerance have Requirements Groove Coupling for Kinematic

Kinematic Coupling Groove Length Length Groove Coupling Kinematic Finish and Shape Groove Coupling Kinematic Location Groove Coupling Kinematic Kinematic Coupling Pin Location Pin Coupling Kinematic θ2 r22 x18 with respect to the FP respectto with for the primary kinematic coupling pins and radius radius and pins coupling kinematic primary the for z12 from the BP. The front secondary pins are located at a distance of of distance a at located are pins secondary front The BP. the from r24 beneath the HP. This should effective the This of HP. beneath half-width resultan in from the origin. The innermost end of the rear KC groove shall be no farther than farther no be shall groove KC rear the of end innermost The origin. the from r5 is applied at the intersection of applied is at the x19 from the BP. For reference only, the front kinematic coupling pins are located are pins coupling kinematic front the only, reference For BP. the from . s — The KC pins are arranged in three sets with two pins in each set, as set, each in pins two with sets three in arranged are pins KC The — s — In order to ensure capture of either the primary or secondary K-pin secondary or primary the either of capture ensure to order In — s — Grooves shall be provided to capture both primary and secondary and primary both capture to provided be shall Grooves — s Kinematic Pin Coupling r15 and control contact pressures, certain characteristics of characteristics the andpressures, controlcertain contact Figure 8 θ2, r8 Page — When viewed along the axis of symmetry of the groove the of symmetry of axis the along viewed When — and circumferentially equidistant on a circle about the origin the about circle a on equidistant circumferentially and from the origin, and the outermost end of the grooves shall grooves the of end outermost the and origin, the from r15 11 r1

, a minimum The specified. , a lengthis innermost groove and and θ1 r16 to the vertical. The height of the groove at the at groove the of height The vertical. the to r3 r26 r9 . , and at the intersection, andof at the See Figure 11. See jn l jn See Figures 10 & 11 Figures 10& See from the origin. The KC grooves shall not shall grooves KC The origin. the from for the secondary kinematic coupling pins. coupling kinematic secondary the for y16 r1 from the FP, symmetric across the BP the across symmetric FP, the from , , r3 , , r4 y18 Document Document 4760Number: info , and and , r34 for the secondary pin and and pin secondary the for y17 at the mouthgroove. of at the r5 r2 from the FP, symmetric FP, the from . Dimensions Dimensions . . at the height height the at Doc. 4760 info Doc. 4760 r3 Date: 2009/08/13Date: and and

r4 r27 . r2 r33 R , and the and , z4 , , DRAFT a 1 z3 below  is the from , and , SEMI y15  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Kinematic Groove Coupling Kinematic CouplingKinematic Offset Figure 10 Figure 9 Page 12

jn l jn Document Document 4760Number: info

Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Bottom –Kinematic Pin View Coupling Locations Figure 11 Page

(Design A) (Design 13 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and 11.1 11 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This pad info the pads, sensing placement the with As pads. info of radius a have sensing features the from separate be mechanical would optional the pins side, port lockout load the On features. lockout mechanical and pads info the between difference no is there side, shipper the From side. each on feature lockout mechanical one and pads info three of row one with 11.3.1 11.3 of height a at be shall areas Figure 13. sensingSee of allows placement. fail-safe theconfiguration carrier flat The forklifts. with use for pins, KC rear the of front in is third the and pin, KC secondary rear the of side either on located Are areas” flat circular the of Two pins. KC secondary and primary the between distance the as same the approximately is centers (at origin the from distance same the outer approximately the with at pins, center KC front the to symmetrically located three are and areas flat elongated elongated four The of located. set areas a flat circular of consist These pins. coupling kinematic the onto grooves coupling kinematic 11.2.1 11.2 extends center area The is carrier extending and rails the conveyor within carrier of the BP along the centered areas a that determine to features the use opaque flat, three of consist can features The Information). Related the KCPs in discussion the (see misplaced if using even present, systems other or port load The sensing. for areas 11.1.1 Requirements FeaturesSurface for Bottom Presence Sensor Feature Presence Info Pads & Mechanical Lockout Features Mechanical Info Pads& Features Sensor Placement The info pads and mechanical lockout features of the 450 HFOSB are located symmetrically about the BP, the about symmetrically located are HFOSB 450 the of features lockout mechanical and pads info The the of placement proper confirm to locations defined provide to intended are features sensing Placement opaque flat, three provide to designed are HFOSB 450 the of bottom the on features sensing presence The x22 r21 r21 to each side of the BP, and the outer areas extend from areas and eachsideextend of to the outer the BP, mm (flat or hole per customer option). The flat surface shall be at at be shall surface flat The option). customer per hole or (flat mm

Figure 12 Bottom FeaturesBottom Page

(Design A) (Design 14 z23. x21 Because the KC pins are not symmetrical, this symmetrical, not are pins KC the Because and and jn l jn y22 ), The distance from the outer to inner to outer the from distance The ), y21 Document Document 4760Number: info x20 to the front and rear of the FP. of the rear and front the to to to x9. Doc. 4760 info Doc. 4760 z50 Date: 2009/08/13Date: below the HP, the below

DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and be interchangeable.be to intended not are they that highlight to F) thru (A lettered are Pads Info the and 2) & (1 numbered are pads lockout The pins). lockout mechanical (no only sensors info for reserved are six other the lockout; mechanical for reserved of distances at BP 11.3.2 of a supporting loaded fully be HFOSB capable must than tolerance relaxed more a (with reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This The info pads and mechanical lockout features are located located are features lockout mechanical and pads info The x24 m mm, Presence, Placement,tag Info-Padsand placement RFID Presence, 2 x25 mm, mm, z23) x26 . Hole “depth” shall be at at be shall “depth” Hole . m,adand mm, Figure 13 Figure Figure 14 Page x27

mm from the BP. The two features nearest the FP are FP the nearest features two The BP. the from mm (Design A) (Design (Design A) (Design 15 y24 z24 mm from the FP, and symmetrically about the symmetrically about and the FP, frommm . For the mechanical lockout feature, the flat the feature, lockout mechanical the For . jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760

Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and and and at centered volume cylindrical of consists feature Each pins. coupling kinematic front the than FP the to closer 13.1 13 15. x by defined volume the within placed be must present, if tag, 12.1.1 12 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This force maximum the consider should suppliers Carrier operation. removal and insertion door generated their design designingin shipper when the hold feature.carrier’s down the during occur that forces 5: NOTE the following: 13.2 at of Thisthe FPsurface the intersection to and plane HP). parallel sloping meets height by bounded carrier the of bottom the to Requirements for Shipper Hold-Down Features Requirements Hold-Down for Shipper RFIDTag Placement-VolumeOptional y38 y38 feature. feature. 13.2.2 deformation. or damage permanent 13.2.1   The hold-down features are provided by a pair of structures located symmetrically about the BP and slightly and BP the about symmetrically located structures of pair a by provided are features hold-down The This configuration provides the load port with several options for holding the shipper in place not limited to limited not place in shipper the holding for options several with port load the provides configuration This z8 The RFID tag placement volume specifies the volume where an RFID tag can be placed. The entire RFID entire The placed. be can tag RFID an where volume the specifies volume placement tag RFID The

with top and bottom surfaces dimensioned from the HP and and HP the from dimensioned surfaces bottom and top with sloping plane with or without contacting the incline. plane contacting orsloping with the without onthe pressshelf to opening and and/or throughdown therotates Teerectangular passes that shape A slopeor and hookshape the shelf, against presses that the A joins (with a small but unspecified blend radius) a sloping plane of angle angle of plane sloping a radius) blend unspecified but small a (with joins The force generated at the bottom hold down feature is related to the wafer retention forces and the door sealing door the and forces retention wafer the to related is feature down hold bottom the at generated force The Door opening and closing shall operate correctly with a force of of force a with correctly operate shall closing and opening Door of direction any in force a withstand to able be shall feature hold-down (each) Either See Figure 18. See Sensor Pad & Cross-SectionSensor Pad Hole y34, y35 y34, RFID Tag Placement Volume TagRFID Placement Figure 15 and and Page

(Design A) (Design From the bottom of the opening, a vertical surface of surface vertical a opening, the of bottom the From 16 29 , y , 26 z6 z6 , y , jn l jn with radius radius with 27 , z37 and z38 as shown in Figures 13 and 13 Figures in shown as z38 and z37 , f002 f002 applied to either (each) hold-down (each) either to applied z6 Document Document 4760Number: info r7 . See Figures 16&See 17. . Each volume has an opening an has volume Each . θ3 above the horizontal (and horizontal the above Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: 01f001 DRAFT without  SEMI x28  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Hold-Down Section atHold-Down x28=50mm Hold-Down Feature Locations Hold-Down Figure 16 Figure 17 Page

(Design A) (Design A) (Design A) 17 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date:

DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and The vacuum pad areas, door seal areas, frame seal areas and door sense areas shall be at a distance of of distance a at be shall areas sense door and areas seal frame areas, seal door areas, pad vacuum The 14.3 application. vacuum for spaces reserved and area, sensing door HFOSB the areas, seal with mate that surfaces have must frame its and door HFOSB The Port. Load mm 450 for Specification Interface Mechanical the to conforms that port load 14.2 14.1 14 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This 14.8 Figure 23. 14.7 aresymmetrical about thePins BP. 14.6 for pinsprovided door at by defined 14.5 keys. mustfrom theremovable that door not the beis latch door such the on holes key latch the HFOSB, the from door HFOSB the unlocks that position the toward 45° than more turned of clearance is length there their full to are inserted port on the keys latch 14.4 reserved areas and spaces. than these the plane facial Requirements for CarrierDoor plane The spaces for vacuum application include the four of the circles bounded by by bounded circles the of four the include application vacuum for spaces The a with mate to designed be must frame its and door The HFOSB. 450 the of front the on is door shipper The vertical the wafers HFOSBintendedbewith a orientation. not to opened in is The The openings for the frame pins are circular on the left side with thearecircular frame openingspins onthe for left diameter The diameter with side the left on are circular pinsdoor the for openings The theDoor openings forPins other aresymmetrical and aboutFeatures than Frame doorthe CL. features HFOSB area the in door carrier the of panel outer the of thickness the rotation, key latch unobstructed for allow To both port, the FIMS pressed against HFOSB is the when so that designed be HFOSB also must the of door The when the door is closed and latchedand closed door is the when r23 r23 See Figure 19. See shall be be shall y10 x45 . Clearance of y39 shall be provided for latch keys at at keys latch for provided be shall y39 of Clearance . . The latchkeys and door pins shall be located on the centerline (CL). onthe latchkeysdoorbe centerline(CL). shall pins located . The and Figure 18 Figure Hold-Down Devices . No surface on the HFOSB door may project further from the facialfrom further project mayHFOSB door the on surface No Page

(Design A) (Design A) 18 jn l jn y39 . Furthermore, when the latch keys arelatch keys the when Furthermore, . d4 d5 , and are slots on the right side. See side.right on the slots are , and , and areslots, and ontheside. right Document Document 4760Number: info x46 r28 and and r28 . Clearance of of Clearance .

Doc. 4760 info Doc. 4760 located at located Date: 2009/08/13Date: See Figure 22. See y40 x49 x49 y 4 from the from shall be shall DRAFT &  z31. SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and blend radii of blend radii 14.10 Thereis blend radiusbottom. a 14.9 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This The frame seal area is bounded by bounded is area seal frame The The door seal area is bounded by by bounded is area seal door The r31 & & r32 at the outer and innerrespectively. outer edges and at the r30 & r36 at the corners. r36 & at x11 & x64 & x11 x47 450 HFOSB Door Features450 HFOSBDoor & & Figure 20 Figure Figure 19 Figure x48 Shipper Door Frame on the sides, and by by and sides, the on on the sides, by by sides, the on Page

(Design A) (Design A) (Design A) (Design 19 z27& z34 z27& jn l jn z32 & & z33 z33 on the top, and by by and top, the on on the top and bottom. There are There bottom. and top the on Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: z28 & z44 & z28 DRAFT  on the on SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Section at Door Centerline - Looking Door the Side - DownSection Centerline on Left at Figure 21 Figure 22 Carrier Door Door Carrier Page

(Design A) (Design (Design A) (Design 20 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 See See Date: 2009/08/13Date: 23 DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and the outer surface of the door is less than or equal to to equal or than less is door the of surface outer the is position 14.12 the when only location pins gravity.coupling by proper the in be will and pins, coupling kinematic the the of dimensions the of all Also, interface. FIMS the 6: NOTE front clampthe bottom features. 14.11 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This of height with edge vertical ofconsisting a surface guiding 15.3 at the BP diameter of are (cylinders) holes The FP. the on volumes cylindrical 15.2 the HP. below radius by bounded are corners outer four the and edges, by defined are surfaces conveying the of edges guiding bounded by ofsurfaces the edges conveying symmetrictheare origin.The to surfaces inner continuous smooth, provide to meant are surfaces rail conveyor The 24. Figure in given is view bottom The 26. and 15.1 features. other relationships to exclusion 450HFOSB the conveyorareas, define that rails, of and their aspects the section certain This specifies 15 14.15 with) is keysload port (towill whichof the a latch engage door carrier 14.14 will occur wafers damage opening closingto upon and the door. 7: NOTE 14.13 the torque without limit exceeding operate Requirements for Conveyor Rails ovyrGiigSraeSurface Guiding Conveyor Holes Pin Forklift Cylindrical Rail Conveyor Dimensions Surface Rail Conveyor Door Closing Force Force Closing Door Features Clamp Front See RelatedR1-7for discussion. Information See more Torque Latch of(y9)Thickness Door

y32. It is recommended that the front clamp features not be used for pulling the HFOSB from the undocked position into position undocked the from HFOSB the pulling for used be not features clamp front the that recommended is It Shipper suppliers should design their products to keep this force required to close as small as possible to ensure no ensure to possible as small as close to required force this keep to products their design should suppliers Shipper f234. The depth of the holes is depth of the holes The The application of of application The — — The maximum torque required to turn each of the latch mechanisms individually on the on individually mechanisms latch the of each turn to required torque maximum The — The force required to push the carrier door into the carrier shell to its fully seated fully its to shell carrier the into door carrier the push to required force The —

—y58 See Figure 7Section —

See section 8.4. Figure 7 shows the top front clamp features and Figure 27 shows 27 Figure and features clamp front top the shows 7 Figure 8.4. section See —. The external edges of the conveyor rails will provide a physical conveyor physical a provide will rails conveyor the of edges external The —. Frame Pin Right Side Pin and Door - Frame Area f234 z46. to the door shall push the door fully closed, so that the outermost point of point outermost the that so closed, fully door the push shall door the to — The conveying surface extends below the HP, as shown in Figures 25 Figures in shown as HP, the below extends surface conveying The — f230 Figure 23 Figure . 450 450 y4 y4 HFOSB (such as the wafer location, etc.) are defined with reference to reference with defined are etc.) location, wafer the as (such HFOSB – Holes are provided on all four conveyor rails, defining rails, conveyor four all on provided are Holes – Page from the BP. With the door in this position, the latches shall latches the position, this in door the With BP. the from r35

x5 (Design A) (Design A) 8 and and z10 21 . The conveying surface forms a plane at a distance distance a at plane a forms surface conveying The . above the conveying surface. No part of the HFOSB the of No part surface. conveying the above y5 . A blend radius radius blend A . d1 f230 jn l jn , centered on the FP at distances x37and on x37and distances at FP the on centered , 5 450 . HFOSB is held in place on the kinematic the on place in held is HFOSB Document Document 4760Number: info r11 connects the corners of the of corners the connects x6 Doc. 4760 info Doc. 4760 and and Date: 2009/08/13Date: y6 , and the outer DRAFT  SEMI z11  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and 15.3.1 r10 that Note surface. guiding conveyor the of outside volume the occupy may reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This applies to parts of the carrier that are above to of areabove that the carrier parts applies The conveyor guiding surfaces shall be opaque for the purpose of sensing. conveyorthe purpose presence guiding befor shall The opaque surfaces Conveyor Locations Rail Figure 25 Figure 24 Figure z10. Page

(Design A) (Design A) (Design 22 jn l jn r35 applies to the guiding surface while surface guiding the to applies Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date:

DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Figure 26 Figure Figure 27 Conveyor Rails Conveyor Rails Conveyor Front Clamps Page

(Design A) (Design (Design A) (Design 23 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and pick-up volumeafter the door opened. pick-up is 16.1.3 betweenand and from out moved sag wafer are of discussion for supports 1 Information wafer the If outside. the on 16.1.2 volume. 2 than more contact backside eliminate to selected been have Dimensions wafers. the of edges the from in mm 2 extends 16.1.1 16 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Requirements Features Support for Wafer

mm away from the edge of a wafer, when it is within either the wafer pick-up volume or wafer set down set wafer or volume pick-up wafer the either within is it when wafer, a of edge the from away mm The shipper shall have features to constrain the wafer along all axes so the wafer will be within the wafer the within be will wafer the so axes all along wafer the constrain to features have shall shipper The by bounded are areas support wafer The contacts wafer of Location See Figures 28, 29 & 30. Figures 28,29& See y11 &y11 y19 , may be used for, maysupport. be used wafer HFOSB Section (Between WaferSupports) — — 450 mm wafers mm 450 See Figures 31&See 32 . At the rear of the shipper, an optional additional area, bounded by by bounded area, additional optional an shipper, the of rear the At . Figure 28 Figure r35 & r36 & r35 Page

shall be handled or contacted within an exclusion area that area exclusion an within contacted or handled be shall

(Design A) (Design A) towards the front and rear, by by rear, and front the towards 24 . x13 h ae elcinwl nrae increase. will deflection wafer the jn l jn Document Document 4760Number: info x13 on the inside and and inside the on Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: See Related See DRAFT  SEMI x50 x14 ,  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Figure 29 Figure Figure 30 Wafer Support Area Wafer Slots Page

(Design A) (Design (Design A) (Design 25 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Wafer Pick-Up Side View Figure 32 Figure 31 Figure Wafer Pick-Up Volume Page

(Design A) (Design A) (Design 26 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Wafer Set-Down Side View Side Wafer Set-Down Wafer Set-Down VolumeWafer Set-Down Figure 34 Figure 33 Figure Page

(Design A) (Design A) (Design 27 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This wafer The increase. will gravity under deflection wafer the BP, the from apart farther moved are supports wafer As supplier. shipper the to up left is requirements these meeting for method The wafer. first the below effectors end for of tolerance the within contained be shall wafer each holding features supporting the to coupling kinematic the from shipper the in variations height actual of sum the that means This tolerance. no with distances absolute as given are planes) seating wafer nominal and plane) datum horizontal the above plane seating wafernominal bottom the of 16.2.1 16.2 Requirements for WaferPitch for Slot Requirements Vertical Dimensions Dimensions Vertical — Figures 4 & 5show the vertical dimensions of the shipper. Note that that Note shipper. the of dimensions vertical the 5show & 4 Figures — z21 with no further stack-up at each higher wafer. wafer. higher each at stack-up further no with

Wafer Extraction Side ViewWafer Extraction Wafer Extraction Volume Figure 36 Figure Figure 35 Page

(Design A) (Design (Design A) (Design 28 jn l jn z17 Document Document 4760Number: info z15 (the distance between adjacentbetween distance(the specifies the space reservedspace the specifies Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: z14

(the height (the DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and ae etn ln. Bten te tm hn te wfr i e on ad we t i ikd u, including up, picked shipper. or ofmoved out into the is it when and 16.2.8 down than set more by is position set-down wafer wafer its the from nor displaced its it shall originalslot. perimeter), be from when rotated be time not shall the wafer the Between transportation, plane. seating wafer r13 16.2.7 volume.extraction 8: NOTE volume. containedpick-up the wafer the bottom wafer in be of shall entire 16.2.6 bounds of 1 extra an provide 16.2.5 is section cylindrical is height and its plane this of bottom The opening. door the to out extended radius with section 16.2.4 32 volumeSee31& figures pick-up on bound is the wafer by the ofdefined wafer the thelocationof carrier, pushedthe rear is toward the wafer movement. When larger the to corresponding radius of circle a of outside move to wafer a allow not shall carrier the placed, been has wafer the Once carrier. on the of side the bound to wafer smaller the to corresponding radius of circle a within carrier the 16.2.3 and seatingits plane is wafer height nominal radius with 16.2.2 ( tolerance 0.50 than more allow to designed are 0.50 than more no be will deflection wafer that assumes budget pitch reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This 17.2 Figure 37. 17.1 17 secondary the from HFOSB the of removal automated for allow to designed packaging. be package secondary this that recommended is It packaging. secondary from performance shipping require generally and orientation vertical a in shipped be to required are wafers that noted be should It shipping. including handling, subsequent during movement 16.2.10 the to due closed is door the when than different be retaining structure.wafer may open is door when position wafer It that closed. noted is be door should HFOSB when transportation during damage the preventing for slot the of surface the contacting 16.2.9 and a vertical axis at the origin. Its top and bottom are the upper and lower tolerance of of tolerance lower and upper the are bottom and top Its origin. the at axis vertical a and Requirements Effector for InternalEnd Exclusion Volume The maximum reach into maximumlimited is by the reach carrier The by defined areas support wafer the between stay shall shipper the into reaching effectors end Internal Wafer Retaining Structure Retaining Wafer Extraction and Insertion Wafer Volume Pick-Up Wafer the then shipper, the of rear the toward pushed then is and volume set-down wafer the in placed is wafer a If dimension of definition the for extraction wafer of implications The Volume Extraction Wafer on tolerance the of implications The Volume Set-Down Wafer

Wafer Retaining Wafer r12 z21 If the wafer is not pushed toward the rear of the shipper, then the wafer may only be somewhere within the wafer the within somewhere be only may wafer the then shipper, the of rear the toward pushed not is wafer the If r12 ) after transport in the shipper. in ) after transport ) needs to be reduced needs accordingly. be ) to and a vertical axis axis vertical a and

mm of horizontal clearance once the wafer is picked up from wherever it ends up (within the (within up ends it wherever from up picked is wafer the once clearance horizontal of mm r18 z49 which has a vertical axis axis vertical a has which — When the HFOSB is closed, the wafers must be retained in the HFOSB to prevent to HFOSB the in retained be must wafers the closed, is HFOSB the When — . See Figures 35 & 36. Figures 35& See ― The wafer pick-up volume shall be defined by a cylindrical section with radius with section cylindrical a by defined be shall volume pick-up wafer The ― ― The open space for the wafer set-down volume consists of a cylindrical section cylindrical a of consists volume set-down wafer the for space open The ― ― The open space for the wafer extraction volume shall include a cylindrical a include shall volume extraction wafer the for space open The ― — The slot is usually designed that wafers are suspended in the slot without slot the in suspended are wafers that designed usually is slot The — y14 in front of the origin. The bottom of this cylindrical section is is section cylindrical this of bottom The origin. the of front in

— The extraction volume is the maximum space available for a wafer to be to wafer a for available space maximum the is volume extraction The — mm of deflection, the thickness of the wafer support, ( support, wafer the of thickness the deflection, of mm r12 r12 z22 . for wafer positioning are as follows. The wafers shall be placed in placed be shall wafers The follows. as are positioning wafer for See also Figure 30. also See y14 See Figures 33&See 34. in front of the origin. The vertical cross section at the FP is FP the at section cross vertical The origin. the of front in Page r6

, See y11 29 r12 , and Figures 31 & 32. Figures 31& . There are two exceptions to this limit on wafer on limit this to exceptions two are There . y19

mm above end effector, so if wafer supports wafer if so effector, end above mm . jn l jn r12 r18 z22 to avoid touching the edge of the of edge the touching avoid to are as follows. The carrier shall carrier The follows. as are above the nominal wafer seating wafer nominal the above Document Document 4760Number: info z21 Doc. 4760 info Doc. 4760 around the nominal the around 7θ7 Date: 2009/08/13Date: z17 – z16 – z17 (6.3 mm along mm (6.3 z49 above the above DRAFT x13 ) or its or )  SEMI

See  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This End Effector Exclusion Area Exclusion End Effector Figure 37 Figure Page

(Design A) (Design 30 jn l jn Boundary Area Boundary End Effector End Effector Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date:

DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and Note: All linear dimensions are indimensions angular all dimensions degrees. mm, arein linear Note: All are Table 1 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This r8 r7 r6 r5 r4 r3 r2 r1 f234 f230 f002 f001 d7 d6 d5 d4 d3 (d2) d1 θ7 θ6 θ3 (θ2) θ1 θ4 θ5 Symbol Used (Design A)CarrierandKCDimensions 14. 14. 12 14. 14 2 13.2. 1 13.2. 23 23 20 21 2, 3 3 24 shownnot 7 2 5 17 11 9 11 16 28 8 8 8 8 8 Figure ≤ ≤ ≥ ≥ 10.0 6.5 ±0.2 6.5 ±0.2 10.6 ±0.5 51. 0 (17) 8.0 ±0.5 ≤ ±0.5degrees45 ±0.5 45 degrees ±0.5 45 degrees 30.0 2degrees± (34.0 degrees) degrees±6 45 ≤ ≥ ≥ 2.0 ±0.1 15.0 ±0.05 30.0 ±0.05 14.0 0 ± 10.0 ±0.025 Value Specified 1.6 1.6 degrees 1.7 1.7 Nm N 141 N 175 136 30 245 227 N 227 n/a FP automation of flange to surfacePerpendicular Side (BP FP) Vertical & HP BP (BP FP) Vertical & Origin x26, y29 Origin radius Blend of & Centerline KCP definedCircle by of Centerline KCP of Centerline KCP Door Key Latch feature applied hold Force to down direction at point,in Applied any any & (x43 x42), CL ( x46 x45, (BP FCL) feature & flange Automation centering (BP FCL) feature & flange Automation centering x37 x40 & x40 x41 , , CL and , FP y32, BP Datum From Measured CL Page ), ), CL 31 r2 & z3 z4 jn l jn transportation and opening.transportation door door pick-up, including closing, waferbetween set-down wafer and rotation any Maximum of wafer of retainer Side forklift feature notches surfaces automationSide of flange feature of flange Edge automation centering of feature Incline hold-down groove of of Axispin-mating symmetry front coupling groovekinematic angleDihedral to surface planar of Groove for KCPs Groove Front end KinematicInnermost of Coupling feature volume of Cylindrical hold-down boundary EE Rear of exclusion area adjacentand surfaces between Surface KCP surface contact surface KCP Top of (sphere) surfaceContact of KCP contact KCP surface to Circle define of center curvature of (Side) Cylindrical surface KCP of to shipperForce close door latch(each key) required operateTorque to latches door and during opening closing that must Force shipper withstand that feature the must shipper withstand. that anyForce the one down hold of for Pin Diameter slot Door of for Diameter slot Frame Pin of Diameter opening frame pin of pin Diameter door opening atDiameter top depression of atDiameter bottom depression of of Diameter conveyor pin rail hole Document Document 4760Number: info Feature Measured To Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This x5 x4 x3 x2 (x1) R r36 r35 r34 r33 r32 r31 r30 r29 r28 (r27) (r26) (r25) r24 r23 (r22) r21 r20 r19* r18 (r16) r15 r13 r12 r11 r10 r9 a 1 Symbol Used 10 11 21 21 20 21 21 11 11 11, A1-1 11 21, 23 11 13 6 A1-1, A1-2 11 10 31, 32 33, 34 24 6, 24, 28 11 5, 5, 24,25 5 2 6, 7, 20, 28, 28 1, 5, 11, 20, 9.1 ¶ 28 29 35, 35, 36 Figure ≥ ≤ ≥ 21.0 23.0 ≥ ≥ (194) (160) (225) ≥ ≥ (206.5) ≥ ≤ ≤ ≥ (145) ≥ ≤ 227 +1/-0 ≥ ≤ ≥ 235 ± 1 ± 235 ±1 150 300±0.5 ≤ (555) ≤ ≥ ≥ Value Specified 121 10 10 23.5 20 30 231 14 10.0 17 r12 15 226 314 218 277.5 277.5 0.30 µm 229 200 19 + + 1.0 Center of Center Info, placement and BP, x Origin Origin N/A Origin x Radius Blend Origin Origin BP BP BP n/a n/a Origin Origin Groove KC Centerline Origin radius Blend radius Blend radius Blend x44 x38,z31 Origin Origin Origin Origin key latch Origin pads Lock-Out =190, =190, =0, , CL , & Datum From Measured y36 y14 Page y =75 x45 32 , , CL jn l jn Extent of areaExtent pad of center gravity the of shipper surfaceOuter of contains cylinder the radius Blend of extractionRadius wafer volume of Location Rear KCP Secondary direction in horizontal misalignment any in: CorrectableLead 450 HFOSB of pick-upRadius wafer volume of set-downRadius wafer volume radius conveyorBlend of rail edges rails limit carrierOuter ofand conveyor for KCP Groove rear end Kinematic Outermost of Coupling surface edge sideOuter of conveyor rail of flange Edge automation on carrier of flangeWidth automation edge shipperOuter of width shipper Overall of per Roughness pin surface Kinematic finish wall HFOSB Inner of boundary waferInner of support half-width Effective of groove KCP for KCPs Groove Rear end KinematicInnermost of Coupling of seal Edge door area of Corners door of opening Corners door of sense Boundary door area reservedArea for pads vacuum of Location Rear KCP Primary of Secondary Location Front KCPs of mm Radius 450 diameter wafer for KCPs Groove Front end Kinematic Outermost of Coupling Clearance of Primary Location Front KCPs Document Document 4760Number: info Feature Measured To 4287 ISO Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This x48 x47 x46 x45 x44 x43 x42 x41 x40 x38 x37 x34 x33 x32 x31 x30 x29 x28 x27 x26 x25 x24 x23 x22 x21 x20 x19 x18 x14 x13 x12 x11 x10 x9 x6 Symbol Used 24 5 2 2 2 2 16 13 13 13 13 13 13 13 13 11 11 29, 37 29, 37, 2 28, 37, A1- 20, 28, 13 13 24 21 21 20 21 21,23 23 23 23 23 21, 23 13 Figure 450±1 ≤ 250±0.5 12±1 ±0.5 210 ±0.38 60 50±0.5 25±1 ±0.5 50 145±1 115±1 85±1 55±1 55±1 ≥ 141±1 ≤ 132.65 ±0.05 171.20±0.05 ≤ ≥ ≥ 193±1 ≥ ≤ ≥ 257 ±0.25 272 220 142 220 ≥ ±0.25 272 ≥ ≥ Value Specified 30 160 259 220 3.0 1.0 132 50 135 5 243. 220 10 2 BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP BP atCentered BP atCentered atCentered BP BP BP BP BP BP BP BP BP BP Edge of Edge flange Datum From Measured Page x43 x41 x44 33 ,CL jn l jn Center of Center rear sense placement area of Edge central sensepresence area of placementCenter invalidsense area edge sideInner of presence sense area of secondaryLocation front KCP of primary Location front KCP of waferExtent rear support structure extent waferInner of support surface edge EE Inner of exclusion area for door Opening shipper of Center placement areasense Edge presenceOuter of sense area surface edge sideInner of conveyor rail door seal widthdoor of door Side HFOSB frame pin Left door pin Left key Latch r22 of for door Center opening right pin of for pin Length slot door of for Center opening r24 frame pin of pin for Length slot frame of keyWidth latch clearance pin Forklift hole of flangeSide automation neck Flange Automation notch Flange Automation chamfer Flange Automation Notch Flange Automation Notch of placement Side RFID volume of featureCenter hold-down of Pad (3 / Center right)info left 6 of Pad 2 / Center right)Info ( left 5 of Pad left 4 Center Info (1 / right) of padCenter lock-out (1 / right) left 2 Document Document 4760Number: info Feature Measured To Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This y19 y18 y17 y16 y15 y14 y12 y11 y10 y9 y8 y6 y5 y3 y2 (y1) x66 x64 x63 x62 x61 x60 x59 x58 x57 x56 x55 x54 x53 x52 x50 x49 Symbol Used 4, 4, 28, 37, 28, 29, 37, 24 24, 25, 26 4, 6, , 28, 2, 3 4, 6, 28 31, 33, 35 1, 11, 28, 7 20 2 13 13 24 24 27 27 2 7 7 7 7 5, 28 21 36, 36, 33, 34, 35, 4, 28, 31, 11 11 11 11 32 6 28, 29, 37 22 Figure ≥ ≤ ±0.25 220 ±0.25 235 246.25 ±0.5 ±0.5 300 ±0.5 150 ≤ (481.75) ±1 276 ≥ ±0.5 150 ±1 102 ±1 154 ±0.2 10 470±1 ≤ ≥ .5± 14 .5± 14 ≤ ≤ ≥ ≥ 200 ≥ ±0.05 145 89.5 ±0.05 115.5 ±0.05 ±0.05 194 ≤3.0 >0, ±1 162 ≥ 3.00±0.25 3.25 ±0.25 Value Specified 275.5 257 211.25 211.25 180 235 217 260 210 250 229 228 200 BP BP surface side conveyor of Left guiding surface side conveyor of Left guiding BP BP of edge automation flange edge carrierOuter of BP BP BP BP BP FP FP FP FP FP FP FP FP surface door Front of (y4) FP FP FP FP FP FP n/a BP BP flange Side automation Right of Datum From Measured Page 34 jn l jn Inner centerInner ofsense placement pad centerInner ofsense placement pad fork hole Left lift surface side conveyorOpposite of guiding side bottom clampInner of front side bottom clampOuter of front of depth notches of for Depth notch forklift side optional featureInner of forklift side top clampingInner of front feature feature side top clampingOuter of front wall shipper Inner of reservedSpace for pads vacuum rear waferrear support structure extent IEE Inner of exclusion neararea of Location rear KCP secondary of secondaryLocation front KCP of primary Location front KCP of Location Rear KCP Primary of Center edge automation Front of flange of waferExtent rear support structure keyslatch for Space unobstructed of rotation sealing Inner surface door to between extent IEE Inner of exclusion area surfacerail edge Front RearInner of & conveyor surfacerail edge Front RearOuter of & conveyor surface shipper Front of of Rear shipper depth shipperOverall of surfaceOuter of lift fork feature side frameOuter seal of area Notch Front Depthof handling Depthof flange Document Document 4760Number: info Feature Measured To x12 r12 and Doc. 4760 info Doc. 4760 x13 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This y56 y55 y54 y53 y52 y51 y50 y48 y47 y46 y45 y44 y43 y41 y40 y39 y38 y37 y36 y35 y34 y32 y31 y30 y29 y28 y27 y26 y25 y24 y23 y22 y21 Symbol Used 27 7 7 7 7 22 22 22 6 16, 17 16, 17 24 2 4 2 2 4, 13, 15 4, 13, 15 13 13 13 13 13 3 4 2 13 13 24 13 27 16, 16, 17 3 Figure 3.5 3.5 ±0.5 ≥ ≥ ≤ 3.5 ±0.5 ≥ ≥ ≥ ±0.5 75 ≤ ±1 12 ±0.5 60 ±0.5 90 ±1 450 ±0.5 14 ≥ ±0.5 90 ±1 12 ≤ ≥ ±1 194 ±1 120 ±1 74 ±1 151 ≥ ≤ ≤ ±0.5 150 ±1 48 ±1 125 ±0.2 10 ±1 95 ≥ Value Specified 180 120 196.25 230 120 222.75 12 12 12 132 195.75 230 225 30 FP of flange Edge automation FP FP FP FP FP FP FP FP FP FP FP of flangeFront automation FP FP surface of guiding Front Conveyor FP FP Frame Surface HFOSB Front of FP FP FP Frame Surface HFOSB Front of Surface FrameFront of Surface Door Front of Surface Door Front of FP FP FP FP FP Edge of Flange Edge Automation Datum From Measured Page 35 jn l jn Front and forklift Front rear holes of Depth notches of flangeBack door Flange notch Automation Flange Automation chamfer of placementRear RFIDvolume of placement Front RFID volume of Center rear sense placement areas of Out and Row Info pads Lock of Center placement areasense of Center placement sense NOT area of presenceEdges side sense area Rear side automationRear of flange neck volume of Rear wafer exclusion mapping Notch centerInner ofsense placement pad centerInner ofsense placement pad fork pin Front lift hole Sense Placement Pad forklift for side bottom clampRear of front side bottom clampFront of front limit surfaceRear of for forklift side forklift Front of feature side front Rear of clamping feature side front featureFront of clamping Clearance Frame forPin Clearance Door for pin Clearance Latchkeysfor of featureCenter hold-down neck and of Front rear automation flange of center gravity of Center cylinder the containing edgeRear of opening hold-down edge hold-down Front of opening Document Document 4760Number: info Feature Measured To Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This z30 z28 add z27 z24 z23 z22 z21 z20 z18 z17 z16 z15 z14 z13 z12 z10 z9 z8 z7 z6 z5 z4 z3 z2 (z1) y51 Symbol Used 4 4 4 3, 5 14, 25, 26 9,10,4, 5 25, 26 3, 17 17 7 8 8 5 1, 4, 5 4 20, 20, 21 20 14 34, 36 30, 32 shownNot 4, 20, 26 30 30 1, 4, 5 14 Figure ≥ 12.0 ±0 ≥ ≥ ±0.0 36 7.5±0.5 ±1 20 ≥ ≥ ±1 382 ±1 334 ±0.2 6 ±0.5 11 ≥ 24.543 ±0 15.0 ±0 ≥ (≤404) (≤356) ≤ ≤ ±0.5 20 6.8 ±0.50 0 ±0.25 3 ≥ Value Specified 12 178 10 8 12 9 21 17 52.25 15 8 hold-down featurehold-down horizontal Lower surface inside HP of FrameTop Door HP HP of flangeTop automation n/a Surface FPSB Front of Frame HP HP HP planeseating above z49 eachwafer nominal plane nominal Each wafer seating HP surface top Top of wafer slot plane nominal Each wafer seating seatingwafer plane surface each Top ofnominal of wafer top Height first slot HP of Top carrier HP ( running Conveyor surface flange surface automationBottom of HP z11 Datum From Measured ) Page 36 jn l jn Lower edge edge hold-own Lower of incline featuredown horizontal Lower surface hold- inside of front featureBottom upper clamp of r3 Center radius surface top (r1) on centerline definePoint KCP to KCP of depressionBottom centering all of Over height shipper of Thickness Door door – Center CL the Horizontal Line of activenot & and pads hole InfoLockout when of within Top space placement sense of Surface placement pads sense volumesdown of extractionTop wafer and set- wafer plane actual Each nominal seating wafer of door Bottom shipper opening planeseating point topwaferAny above nominal pitch) (wafer nominal Adjacent wafer planes seating support surface nextBottom of higher wafer Clearance top first slot below of wafer nominal seatingBottom wafer plane surface automationBottom offlange of GroovesBottom KC edge conveyorTop of guiding surface Clearance use automation for of flange of Top shipper Document Document 4760Number: info Feature Measured To Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and (z45) (z44) (z35) (z34) (z1) (y1) (x36) (x1) Symbol Used reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This in tolerance the Table R1.1 of figure significant last the to down or up rounded be should tolerances practice. withaccordance good engineering specified with dimensions for values in Measured dimension the of figure significant last the to down or up rounded practice. withaccordance good engineering be should tolerance specified without dimensions for values Measured in parentheses. are Reference dimensions are dimensions in all mm. otherwisenoted, Unless z51 z50 z49 z48 z46 (z45) (z44) z43 z40 z39 z38 z37 z36 (z35) z33 z32 z31 (z42) z34 Symbol Used Derivation ofReferenceDimensions 7 14 34, 36 17 25 20 4, 20 20 7 7 15 15 7 20 20 21 21 21 (340) (314) (166) (157) 356) (≤ 481.75)(≤ (518) 555) (≤ Value 4, 4, 20 Figure ≤ ±1 20 0.7 ≥ ≥ (12) ≥ ±1 163 ≤ ≥ ≥ (190.0) 179 ≤ Value Specified 74 10 10 4 157 129 z42 + z43 z42 + z20 z19 + z42 z30 + z19 z30 - z12 z8 + y2 + y4 x39 + x39 x2 + x2 Formula 11 9 (388) (362) 376±1 5 2 (≤ +246.25+0.5) 235 (≤ 277.5 (≤ + 277.5) ≤ (334 +1 + (334 20 +1 +1) (311 154) - (12 + 328) (12 + 12) (154 + (311 + 3) (311 + (259+259) HP of featureTop forklift HP HP HP of frameBottom door CL CL CL CL CL HP HP plane nominal Each wafer seating featurehold-down horizontal Lower surface inside running Conveyor surface n/a n/a HP Datum From Measured Page 37 jn l jn Bottom of flangeBottom door of retainer Top forklift feature of featureTop forklift of placement Top RFID volume of placement Bottom RFID volume of front featureTop lower clamp of door Bottom carrier flange & of opening Top bottom edges door & of Top bottom edges door seal Door area pads of spaceCenter reserved vacuum for Bottom of featureBottom forklift active of and padsHeight info lockout when slots) between center (To the volume extraction of extractionBottom wafer volume. featuredown horizontal Upper surface hold- inside of for pin Depth opening forklift of flangeHeight door of opening Height door of flangeTop door Document Document 4760Number: info Feature Measured To Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Page 38 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and determine the distance from the HP ( from the distance the floor to determine of tolerances the by limited accuracy an with HP the represent would A1.1.1 A1.1 accuracy.and purpose expected the on depending HP, the establishing for jig/fixture, a implement to ways two least at are There Introduction on vote procedures CarriersCommittee Physical Interfaces & NOTICE for the MEASURING PLANE FIXTURES HORIZONTAL 1 APPENDIX reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This KC the radius the tolerance of ontop of the pins. from A1.2.3 and measurements alignments. neededfor is fixture precise A1.2.2 it a450HFOSB,contact of resting real since is onthe thepins. same points KC ups as stack- tolerance similar cause would grooves KC using method Any wafer. first the of height the reflect to position A1.2.1 A1.2

EmulatingKC Grooves X Surface Top of KCPs In the example in shown in Figure A1-2, the HP adjustment/alignment would be completely independent completely be would adjustment/alignment HP the A1-2, Figure in shown in example the In of type This fixture. a such affect not would pins KC the of points upper the on radius the of tolerances The a at be to designed be may surface upper the where grooves, KC the emulate would fixture precise more A surface lower The pins. KC three the of top on plate flat a setting by HP the establish can fixture simple A

m SEMI of part official an is appendix this in material The : m

r4=nominal fr o RR335 m r3=Maximum th e Flat plate precisionFlat tolerance stack-up plate limitedby H

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( e date of approvaldate r3=Minimum

l r15 jn l jn ( and and doc# r3 ) and was approved by International by approved was and ). . Such a method will be suitable to suitable be will method a Such . See Figure A1-1.See r4=nominal Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: HP DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This

r4=Maximum m fro m the r3=Minimum HP Precision independent of is KCPtopsurface ust sure ust the KC KC Plate Figure A1.1 Page Level 40 r3=Maximum jn l jn r4=Minimum Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: HP DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and o ulfcto upss h are upir my cos o poie mr eald wfr saig plane seating wafer detailed more provide to choose may supplier carrier the end to user. data measurement the purposes, qualification For is method measurement A2.1.3 A2.1.2 located symmetric planes intersection the at is plane seating wafer the purposes, inspection A2.1.1 A2.1 on vote procedures CarriersCommittee Physical Interfaces & NOTICE ofWAFERMEASUREMENT SEATING PLANES 2 APPENDIX reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Suggested MethodSuggestedforWafer Measuring PlanesSeating Three front measurement points cannot characterize the entire wafer wafer entire the characterize cannot points measurement front Three Wafer for that, planelimitedany it wafernot to method, Although specific is recommended measurement is seating h aeili hsapni sa fiilpr fSM SEMI of part official an is appendix this in material The : height at each of the 25slots atheight eachofis the of the the recommended recommended 30 degrees from BP.30 degrees from front of the wafer and the the and wafer the of front for the the for Wafer Plane MeasurementWafer Plane can be can

t purpose of of purpose o be measured from HP, and single crystal wafers and HP, o besinglecrystal are measured from measured at three points at the front of the HFOSB. HFOSB. the of front the at points three at measured Figure A1.1 Page BP and two points are are points two and BP ongoing inspection during the manufacturing of a HFOSB.a of manufacturing the during inspection ongoing 41 ( date of approvaldate jn l jn ( doc# seating seating ) and was approved by International by approved was and ). at the intersection of the wafer and wafer the of intersection the at Document Document 4760Number: info plane perfectly; therefore, therefore, perfectly; plane Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: to beto used. One point One DRAFT  SEMI this  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and A3.1.6 A3.1.6 A3.1.5 A3.1.4.6 A3.1.4.5 A3.1.4.4 A3.1.4.3 A3.1.4.2 A3.1.4.1 A3.1.4 BP. the FP afor and reference provide A3.1.3 standard. A3.1.2 A3.1.1 A3.1 on vote procedures CarriersCommittee Physical Interfaces & NOTICE FORCARRIER MEASURING OFMETHOD GRAVITY CENTER 3 APPENDIX reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This 2) (x19 265.3 mm and(y17= × 234.5 mm Ly + y18). 1: NOTE Suggested Method Using MethodCellsSuggestedUsing Load Derivation Ly0Calculation: of Variables to order in Ports Load mm 450 for Standard SEMI Relevant the to conform should pins the of location The this in defined Pins Coupling Kinematic the to similar point support a provide should cells load the of Each cells. measured byusing gravity) COG (center be load three of can The carrier’s

Ly0 = Ly × (F1+ (F2–F3)/ Ly0 F2 F3) = F2F3)× Ly Ly0 =(F1 + (F2–F3)× F2Ly –F2Ly0 ×+ ×F1 Ly0F3 Ly = × –F2 Ly0 × Ly0) F2(Ly- ×+ Ly0) - F1 Ly0F3 (Ly = × 2× Lx / (F2- (F1+Lx0 F3)/ = F2 F3) F2F3)× 2 f3) Lx Lx0/ =(F1 + (F2- × F2Lx 2+×/ F3Lx ×/ F3 Lx0 ×F1 Lx0= × + × 2–F2 Lx0 / Lx0) F3(Lx= × × 2+ F2 (Lx F1 Lx0/ Lx0) 2- + × h aeili hsapni sa fiilpr fSM SEMI of part official an is appendix this in material The : Ly0 – the distance from the rear KCP from the COG.Ly0 to –the distance rear to fromLx0 –the distance BP the COG. KCPs rear toKCP betweenthe front and parallel the Ly the –theBP distance KCP theLx/2 –theBP eachfront to distance from to betweenthe front parallel KCPs. Lx the –theFP distance weight toof the carrier. forceF1, due F3the oneachpin & F2 –the downward Derivation Lx0 of For the Primary KCPs Lx = 342.4 mm (x18 × 2) and Ly = 309.5 mm (y15 + y16). For the secondary KCPs Lx = Lx KCPs secondary the For y16). + (y15 mm 309.5 = Ly and 2) × (x18 mm 342.4 = Lx KCPs Primary the For Calculation: Page 42 ( date of approvaldate jn l jn ( doc# ) and was approved by International by approved was and ). Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Center of Gravity MeasurementCenter of Figure A1.1 Page 43 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and Load port experiences utility loss (such as EMO, vacuum loss, electrical failure, etc.), the door pins may be used to used be may pins door the etc.), failure, electrical loss, vacuum EMO, as (such loss utility experiences port Load the When pins. door the disengaging or engaging Neither of result a as change should positions door HFOSB nor FOUP the door. port load the on while door HFOSB the of displacement maximum the limit to used only be should R1.1.8 the ofHFOSB passes as light shell. attenuated it beam is through R1.1.7 pin door HFOSB the between tolerance the than larger FIMSpins.holes and door be frame its and door HFOSB the between tolerance the R1.1.6 of direction R1.1.5 contaminated particles.may distribute and 1: NOTE the for holes the that recommended with lead-in pins have of capability. a door the HFOSB openings onthe door is it easier, opening door automated and manual both make To pins. door the R1.1.4 for Load Interface Specification 450mm Ports. SEMIMechanical relevant R1.1.3 R1.1.2 the shell. aaround framework as attached R1.1.1 R1.1 ( on publication for approved was information related This Committee. Carriers & Interfaces Physical International NOTICE APPLICATIONNOTES 1 RELATED INFORMATION reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This signifies covering. areas complete red the R1-1, Figure of area yellow the in shown is covering Partial covered. completely be may gap air bottom and/or top the mm, 181 exceeds error placement plus half-height the If covered. partially be may gap air bottom and/or top error placement plus the width mm 179 exceeds error placement plushalf-height the Ifcovered. completely be may half side gap a mm, 259 exceeds the If covered. partially be may gap side a mm 257 exceeds error placement plus plus half-width If ofpositioningthese error door be the sothecarrier its should values. 179±0.5, size kept below the is door port load the of half-width The opened. is door carrier the when sides all on clear kept is gap this so door, port load the on placement its of accuracy the with coordinated be shoulddoor the carrier of size The opened. is itwhen door the carrier volumeof the displace to minienvironment for methods Possible circumference. R1.1.10 door’s HFOSB the with the HFOSB door.and frame along HFOSB the between slope a by Ports positioning Interface and motion latch Mechanical by positioning Load include SEMI may this accomplishing relevant mm the in 450 tolerance pin for door the and Specification tolerance (self) HFOSB the of sum than HFOSB the of latching during or larger door HFOSB the and frame HFOSB door the between clearance the keep should capability positioning This door). HFOSB the of return either (during sequence close door the during frame location R1.1.9 Hole Pin Door the and Ports, Load mm a in HFOSB.tolerance 450 for Specification Interface Mechanical SEMI relevant the d231 in &z238 by x239, defined tolerances Pin the Door accommodate todesigned beshould Holes PinDoor the of diameter The Ports. Load mm 450 for Specification Interface Mechanical SEMI relevant the in specified the Area Seal to related issue design HFOSB a is tolerances these Balancing Frame. Door HFOSB the of edge inner the and Door HFOSB the of edge outer the between clearance the than less be should Holes Pin Door the and Pins Door the between clearance The off. fall not does door HFOSB the that ensure to and position, door’s HFOSB the maintain date of approval Notes: It is recommended that the HFOSB have a capability to roughly position the HFOSB door in the HFOSB the in door HFOSB the position roughly to capability a have HFOSB the that recommended is It pins door The recommended. not is door port load the to lead-in door HFOSB for pins door the of use The the when triggered is that detector optical an with light of beam a uses sensor presence carrier of type One that recommended is it closed, or opened is door HFOSB the when generation particle minimize to order In any the HFOSBin onthe bothbottomAlthough able themust a retaining of withstand to force features be of of tolerance position the than larger much be to likely is HFOSB the of door the of tolerance position The Dimension in defined areimplicitly Skewness, tolerances. and the geometric rock, stiffness warp, be can but HFOSB, the of shell plastic the into molded be to need not do features handling automation The

There is a gap between the load port door and door frame, which allows clean air from the EFEM the from air clean allows which frame, door and door port load the between gap a is There : This related information is not an official part of SEMI SEMI of part official an not is information related This : If the bottom of the HFOSB does not extend below the bottom conveyor rail, the conveyor rail may become may rail conveyor the rail, conveyor bottom the below extend not does HFOSB the of bottom the If f001, continuously applied stress may resultplastic deformation. appliedin stress continuously may ) by the International Physical Interfaces & CarriersCommittee. Interfaces by Physical the International y4 is given as a maximum based on the maximum distance to the port door specified in the in specified door port the to distance maximum the on based maximum a as given is See Figure R1-1.See

x233 = 257±0.25 mm, and the half-height is is half-height the and mm, 257±0.25 = ( doc# jn l jn ) and was derived from the work of the of work the from derived was and Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT z233  SEMI =  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and collide. to required thanrather down forced be will volume, it the extraction above inserted is wafer a ifsothat surfaces vertical of clear torque The mechanism. detent a using R1.1.15 1°) ± 90 = ψ and 1° ± 0 exceed mechanism not such should a detent overcome = (ψ rotation their of points end the while 1°) ± 90 both into = snap mechanisms hole (ψ key latch HFOSB HFOSB the have to is the this accomplish to to method One door closed. is HFOSB HFOSB the locks that position the in and open is HFOSB the while Ports Load mm 450 for Specification Interface Mechanical SEMI relevant the in defined as 1° ± 0 = (ψ HFOSB the R1.1.14 door the of producemovement in not the HFOSB will R1.1.13 axis rotation in discrepancy any for than nothalfadjust can more way. ontheof hole, inside the latch therotate latchkey key pushes to is this of purpose key latch the of side one only if A4-2, Figure in shown As The mechanism. hole key latch the and key latch the between positions. key latch the with compliance R1.1.12 hole location error. should latch key the HFOSB’s mechanism for compensate R1.1.11 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This `` Doorposition

position in unlocksfrom the that HFOSB holes be recommendedIt thedoor is that latchmaintained key holes be enough rotatelatchkept requiredsmall it to key that recommendedIt the is that torque HFOSB for position their in flexibility some have mechanisms hole key latch lead-in the This that holes. recommended key is latch its It on mechanism lead-in a have HFOSB the that recommended is It

0.00mm 1.00mm 2.00mm 3.00 mm It is recommended that the space approximately 2 mm above z18 (above the top wafer support) be kept be support) wafer top the (above z18 above mm 2 approximately space the that recommended is It tolerance Z:177.0 X:255.0 Coordinating Carrier Door Size and Placement Accuracy Size Carrierand Door Placement Coordinating Gap Clear Z:178.0 X:256.0 Covered Partially Partially Figure R1.1 Page x f2 and and Z:179.0 X:257.0 30 (as defined in Table 1of this Table in document). defined 1of 30 (as 45 z directions during latch key directionsrotation. during latch

jn l jn Z:180.0 X:258.0 Gap CoveredGap See Figure R1-2. See Document Document 4760Number: info Z:181.0 X:259.0 Doc. 4760 info Doc. 4760 Door Door Date: 2009/08/13Date: size DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Latch FOUP door coverLatch key key hole block Displacement Enabled by Enabled Displacement Key Latch HoleBlock Flexibility Around 0 9 e r o f e b s p o t s n o i t a t o r y e k h c t a L 0 9 l l u f e t a t o r n a c y e k h c t a L Need for Latch Key Latch HoleFlexibility for Need Figure R1.2 Figure R1.3 Page Top View 46 Front View jn l jn Cross-Section ° ° Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and Table R1.1 Table R1.1 HFOSBs this forto andchosen: beof standard the theoptions R1-1can used communicating compliance Table R1.2 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Section 11.3 11.3 11.3 11.3 11.3 11.3 11.3 11.3 17.1 Carrier Checklist Options

Lockout Lockout 2 Pad Lockout 1 Pad info F pad height info E pad height info D pad height info C pad height info B pad height info A pad height Rear wafer support Optional Feature or or or or or or or or or

down (pad down present) (pad up missing) (pad down present) (pad up missing) (pad down present) (pad up missing) (pad down present) (pad up missing) no yes down (pad down present) (pad up missing) (pad down present) (pad up missing) (pad down present) (pad up missing) (pad down present) (pad up missing) Page 47 jn l jn Choice Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and R2.2.2 R2.2.2 0.2mm. is seatingsoitaerror. errorfully testing, onthepins, This not KC always positive resultsthe carrier is in R2.2.1.3 the wafers below. the wafer has effector movedfrom upaway end two between inserted the since is mm 1.6 be will effector clearance on effect end the up, picked been an has wafer a Once When mm. 3.2 by reduced is clearance surface. top concave a and surface top convex a with wafers produced has warp the wafers, mm 300 With 1.6mm. be would warp the size, wafer mm 450 to extrapolated R2.2.1.2 wafer the without pads the between droop force 0.50mm. the value thehas committee of used participants, task by some done simulations and for ISMI by allows made measurements the pads on Based effector structure. effector end end the touching the of end height the of the design that the is by 30 at degrees measuring determined for reason The be wafer. with effector will end the deflection for budget the the to add to effector, considered not end is and effector the by lifted been has wafer the Once stroke. effector end of line the from angle degree 30 a at and points pick-up effector end the above directly supports R2.2.1.1 considered: addition, wafers.safe In theissues of following were handling for needed is supports wafer and wafers between space much how determine to document this and ports, load R2.2.1 R2.2 Polished Wafers for Mechanical Diameter Handling SEMI M74—Specification 450mm R2.1.1 R2.1 ( on publication for approved was information related This Committee. Carriers & Interfaces Physical International NOTICE DIMENSIONSDETERMINING for CONSIDERATIONS 2 RELATED INFORMATION reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This this can obtained approach: from ofbe Aadvantages number surface. R2.4.2 materials. carrier 300 450 of 300 current R2.4.1 R2.4 0.7 start within ofvolumes to support. nominalandthe 0.5mm next wafer above seating extend plane mm wafer the So offset.. be to volumes the causes it position, nominal their above supports wafer to the serves raise error placement carrier the Since error. placement carrier the and planes wafer the of tolerance to minus R2.3.1 R2.3 date of approval   

mm pin would have provided a contact pressure that could have exceeded safe deformation limits for the likely the for limits deformation safe exceeded have could that pressure contact a provided have would pin mm Conveyor rail can be moved inward from the edge, so that the conveying surface does not define the lateral the define not does surface conveying the structures rails and the 300 (as in the the forklift did carrier the conveyor both of envelope that so edge, the from inward moved be can rail Conveyor better be can their intended for purposes.optimized features both that so features, door the and surfaces conveying the for heights separate Provides discussion below). the groove the detailed in of of discussion during handoff(more this or capture area to the “lead-in” be spacecan used increase vertical More

Kinematic Coupling Kinematic SystemCoupling Discussion Referenced and Standards Documents mm carriers is estimated to be 24 be to estimated is carriers mm Height ofwaferHeight extraction set-down and volumes The key structure of the 450 HFOSB bottom consists of a pedestal extending below the lowest HFOSB door HFOSB lowest the below extending pedestal a of consists bottom HFOSB 450 the of structure key The the make to try to was HFOSB 450 the to concept coupling kinematic the scaling in approach central The supports wafer between clearance the to equal is dimensions volumes set-down and extraction of height The thehasAfter testingdiscussion committee of pitch settledona 12mm. wafer and mm 450 for standard SEMI the for draft the M74, SEMI in specifications the considered committee PIC The Semi Standards carrier placement error placement carrier warp induced process gravity under deflection wafer : This related information is not an official part of SEMI SEMI of part official an not is information related This :

mm style of pin the plan if possible. While mass of fully loaded 300 loaded fully of mass While possible. if plan the pin of style mm ) by the International Physical Interfaces & CarriersCommittee. Interfaces by Physical the International — 300 mm wafers have had process induced warp as great as 1 mm. When this is this When mm. 1 as great as warp induced process had have wafers mm 300 — — the maximum misalignment of the carrier that is expected, based on prototype on based expected, is that carrier the of misalignment maximum the —

— the deflection caused by gravity of a wafer resting on the carrier the on resting wafer a of gravity by caused deflection the — kg. The increased weight load of the 450 HFOSB meant that the existing the that meant HFOSB 450 the of load weight increased The kg. Page 48 ( doc# jn l jn ) and was derived from the work of the of work the from derived was and

mm carriers was 7.6 was carriers mm Document Document 4760Number: info Doc. 4760 info Doc. 4760

mm HFOSB).mm Date: 2009/08/13Date:

kg, the mass the kg, DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and Table R1.1 Table R1.1 R2.4.4 for used geometry the with along below, shown is 300 and selected was “B” differentgeometry Several considered, materials. were groove geometries carrier the and them between pressure contact the by created deformation the R2.4.3 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This  

mm systems.mm (bottom-most) wafer. This is important because it is that dimension which defines the height of the wafer the of height the defines which dimension that is the floor. above planes it because first important the of is plane This the and pins wafer. coupling (bottom-most) kinematic the of top the between height additional requiring without features these Adding the than HP) from (farther lower slightly info lockout, pad, (presence,placement, etc.).sensing features made for ballots) later (in be defined be can can that structures transport rails) from separate areas conveyor providing surfaces, conveying the of (interior base pedestal The Relative contact stress Radius (mm) Major Radius (mm) Minor Pin (mm) Diameter Carrier Mass Carrier (kg) Force (Newtons) In all cases the materials analyzed were stainless steel for the KCPs stainless for analyzedandthe grooves. the In were plasticfor steel the cases materials all 300 at those to shape in similar are themselves pins coupling kinematic The Applied angle Applied Force per Force pin Math.Equiv. Stress Ratio Stress Description Design Result Contact Stress at Kinematic CouplingPins Contact StressatKinematic below Used 300 for mm 53,071,124 0.92 24.84 74.53 7.6 45 degrees 5 15 7.127 12 Current mm 300 KCP the plane of the kinematic coupling pins allows these advantages to be made be to advantages these allows pins coupling kinematic the of plane the 300 (Shape mm A) Page 11.585 20 20 pin offset 4 transition mm with radius mm 1.34%higher stress 53,783,837 0.92 78.52 235.54 24 45 degrees 8 30 49 450 mm B) 450 (Shape jn l jn Document Document 4760Number: info

mm, but are scaled up to controlto up scaled are but mm, Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and R2.4.7 R2.4.7 handling. causebad can wafer and seating improper causes issue stickiness The port. load and tool placed arbitrarily an for pins the by capture proper FOUP axes motionensure rotateaxis additional ato to causedafor around vertical of the need AMHS handoffs,and with issues caused issue lead-in The properly. seating from pin the prevented that “stickiness” or lead-in improper R2.4.6 300 be thus thanof noworse that should their 12 from increased 300 for that R2.4.5 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This R2.4.8 from volume exclusion an of plane upper an specifying as of to not shall loadfeatures port or sensing) (unrelated enter. shelf which thought be can distance the Conversely, shelf. or port load the for height KCP taller 45 a in results This height. at HFOSB increased and range capture angle between (trade-off) groove the specifying and lead-in, of range improved for height increased an allows so Doing pins. coupling kinematic the with mates which carrier the of surface groove the   AMHS vehicles and systems may be able to have better speed and reliability the betterfactories. able and for andhave mayto speed systems AMHS be vehicles its around HFOSB the of Rotations angle 15 to up of “lead-in” or “capture” Increased To describe the capture, consider R2-2: To describefigure the capture, 450 the in approach the issues, these of both address help To 300 for issue common One exceed not should stress contact relative the HFOSB, 450 loaded heavily most the for even that is goal The

mm. To that end, the contact radius is increased from 15 from increased is radius contact the end, that To mm.

mm to 20 to mm Shape A Shape

mm. The resulting wear on the grooves mating to the 450 the to mating grooves the on wear resulting The mm.

mm FOUP was the occasional problem with the kinematic coupling caused by caused coupling kinematic the with problem occasional the was FOUP mm z axis of a few degrees can still allow enough capture range so that 450 that so range capture enough allow still can degrees few a of axis

Shapes from Table R2-2Shapes fromTable

mm counterparts. mm counterparts.

mm ( mm Figure R1.2 Figure Shape B Shape Page r15 ) in all directions when the HFOSB is oriented properly in properly oriented is HFOSB the when directions all in ) 50

mm standard has been to define key aspects of aspects key define to been has standard mm jn l jn

±6 degrees ( degrees ±6

mm to 30 to mm Document Document 4760Number: info θ1

mm and the pin diameter is diameter pin the and mm

) allows for a good balance good a for allows ) mm kinematic coupling pins coupling kinematic mm Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI

mm  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This at surface conveying the of junction vertical the for defined been yet be has radius blend No up. to 9mm least at extending surface) called guiding is rails conveyor the of edges outside the standards, R2.4.13 primary the transfersecondary side to to and from pins. the carrier from front forwardthe loadsapproximately onthe the keep pins front to equal. were kinematicpins moved gravity, coupling of center in change the for of compensate To number counterweight. a for any need the for eliminates also but weight-balanced HFOSB), the in be wafers all will feature handling critical (the handling HFOSB simpler of only not advantage the has so Doing wafers. the of center the and FP the of forward be to this allow and flange, automation R2.4.12 to andcomplexity added speeds in handling. of limited This transfer wafers on the number carrier. depending magnitude in changed that torques gravitational with deal to had HFOSB the handled that systems other or AMHS R2.4.11 case. 300 the in than misalignment angular for tolerance greater a allow will angularly aligned properly is which case R2.4.10 than 15 is the groove theso that openinglarger of the point, of tip the at not plane, 45-degree the at is point contact thethat the fact andpin the of shape the of because R2.4.9 The location of the kinematic coupling pins was designed to allow a forklift to pass under the carrier from the from carrier the under pass to forklift a allow to designed was pins coupling kinematic the of location The Figure R2-2 shows how the specification ensures that even a 15 a even that ensures specification the how shows R2-2 Figure At 450 At 300 at issue Another 15 a Ensuring possible. also is handoff during HFOSB the of misalignment angular An

In keeping with the philosophy of explicitly designating guiding and sensing surfaces in the 450mm the in surfaces sensing and guiding designating explicitly of philosophy the with keeping In

mm, the approach has been to align the center of mass of the carrier with the center of the of center the with carrier the of mass of center the align to been has approach the mm,

mm was the fact that the wafer center was not the center of mass of the carrier. Thus carrier. the of mass of center the not was center wafer the that fact the was mm Kinematic Pin Coupling Detail and Groove

mm to guarantee amm 15 guarantee to Figure R1.1 Figure Page 51 jn l jn

mm offset cancorrected. offset be mm

mm offset can be captured. Note that Note captured. be can offset mm Document Document 4760Number: info x5 and and Doc. 4760 info Doc. 4760 y5

with material (for material with mm lead-in for the for lead-in mm Date: 2009/08/13Date: DRAFT  SEMI

mm  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and Table R1.1 Table R1.1 the table. werein placed submitted R2.5.1 R2.5 new and handling.during transport possible enabling unit, conveyor performance vibration improve should and undulating, or twisting same as such issues carrierhandling avoid will the mass the of to center close centered on and length same orientations the rails the four Having factory. the in approaches loading of and handling any in HFOSB the of conveyance R2.4.14 the of flange door any of surface bottom the shell. for also but features “pedestal” for only not true is This 8mm. least to external mechanics, volume sensing the corresponding any and rails edge conveyor the for volume a provide To 0.5mm). than less be to suggested is radius (blend sharp relatively be to meant is corner that but surface, guiding vertical the and surface reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Forces on Forces CarrierDoorthe on The values in the following table are based on estimates provided by several parties. The highest values highest The parties. several by provided estimates on based are table following the in values The The conveyor rails have been defined as having a square footprint centered at the origin. This will allow will This origin. the at centered footprint square a having as defined been have rails conveyor The Carrier DoorForces Transport Shock ‘Wafer ShockMass’Transport Force25Retention WafersWafer (N) (G) AfterTransportFrom Point to Point A B Wafers ThatBe In VolumeWill Pick-Up CrossSlotting Without Assuranceand Load Shock Wafer RetentionCapability SealForce (N)Shell Total Shell SealForce/Length (N/mm) Shell SealPerimeter (mm) (mm) Shell SealWidth Shell SealHeight(mm) Total Seal Door Force (N) SealForce/Length Door (N/mm) SealPerimeter Door (mm) SealWidth Door (mm) SealHeight Door (mm) x5 and and y5 from the BP and FP is defined as clear of HFOSB features up to the height of at of height the to up features HFOSB of clear as defined is FP and BP the from Shell Gasket Seal Forces DoorSeal Gasket Forces Wafer Retention ForcesRetention Wafer (N) Page 52 0.025

1744 45.1

0.06 358 938 560 342 105 514 122 1 jn l jn port port companies. determinedload by Should be BlueBallot BlueBallot BlueBallot BlueBallot Calculated Calculated Document Document 4760Number: info

Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and to doorto closing. apply not forces Gasket Seal Shell and Pressure Internal The N. 227 or N 122 plus N 105 is force closing door the R2.5.2 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This The Wafer Retention force and Door Seal Gasket force must be applied in order to close the carrier door. So door. carrier the close to order in applied be must force Gasket Seal Door and force Retention Wafer The Page 53 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: Not Applicable During Open/Close Cycle DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and “lead-in” for the 450 HFOSB door into its shell, some slight horizontal motion may occur during the door closing door the during occur may motion horizontal slight some shell, its into door HFOSB 450 the for “lead-in” some minimum environment In hold the inside carrier, given ontheneededto typefact, may depend of seal set, and not still are values the 450mm At FOSBs. for 110N to up and FOUP for 9N were these 300mm, At shell. HFOSB R3.1.2 bythe hold-down. is norsupport shell plane the carrier thealtered wafer neither that so small relatively kept than be to meant is more force This weight). no carrier loaded the of to 10% under well or expected 40N, to 20N but defined, yet not are values (actual small be to expected is feature hold-down carrier the onto device hold-down load-port the by exerted force downward “maintenance” any maintained; is shell carrier proper its to true frame and port the load between seal(optional?)return the and doorbe OPEN its with docked is the carrier where case the for to expected should also is HFOSB statement This 450 gravity. beyond the forces external etc.) for need the port, without pins the load on seating the bumping a following cart example, push, For (human forces. force external “upset” other for small need the without position seated proper the to down slide to expected always is carrier the gravity, only of presence the an in for is, that work-around coupling; a kinematic non-functional be otherwise to intended NOT is hold-down The understand to NOT. WAS standard and the WAS function of hold-down users the what prospective for important was it felt team Standards the Information, Related R3.1.1 port and provide AMHSto systems support, multiplenamely:the load useshold-down for and R3.1 ( on publication for approved was information related This Committee. Carriers & Interfaces Physical International NOTICE HOLD-DOWN CARRIER FEATURE 3 RELATED INFORMATION reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This an usedretention event). for during such feature only (if it to be “g” to would need the weights is multiple onthe themaintain carrier orderofsothat holder several be could the fastest of the atworst deceleration ofthe time the EMO.caseof robot, robotic this In the motion direction differentupon eventsin directions, from depending may these Thebe robotic EMOforces event. duringperhaps a tipping to used unwanted or the arealsobyhelp carrier, designed the prevent sliding AMHSto be system of features lifters) The the 450HFOSBkinematicpins. hold coupling Hold-down to maybyrobotic the need secondary R3.2 130%?). (say HFOSB 450 loaded a the describednext isin paragraph of value thestop” “emergency function This consistentwith weight the weight. carrier maximum be the of should 200% maximum be which would value possible carrier, One the factor. the safety a on times force feature “alarm” above maximum hold-down the on significantly force away” force “tear minimum a a sets this Conversely, at set be to have an trigger could would force switch it the that imply switch, would functionality This force-actuated hold-down. a against a operate to attempting when had alarm lifters semi-automatic handoff these If generation example). next for cart, (to-be-developed) lifting assisted the through this avoid to mechanically a (using fashion “semi-automated” a in removed beto carriers for opportunity still an is there protocol, able be should systems automated While R3.1.3 theirposition seated off onthe pins. up Grooves Coupling Kinematic front the push to operation door-closing the of tendency the against act to door, the toward and downward be would force resultant the of direction The motion). small some after only but applied be one of can force large a profile that (so slack non-elastic force a with spring heavy the a with parallel in of force) constant the (for spring analogs light physical various the as such this, accomplish could designs Multiple process. date of approval     n AH rnfr dvcs (oos G, OS t., fre o aod ls f HOB drn rapid during HFOSB of loss avoid to forces etc.), OHS, AGV, (robots, acceleration/deceleration/EMO devices transfer AMHS On loadforce portsimpede andremoval to unauthorized shelves, On load force ports, Force duringaction door-closing that counter On to seal load ports, Force frame-to-shell On for

The final Load-Port hold-down functionality is to prevent unauthorized removal of the carrier during use. during carrier the of removal unauthorized prevent to is functionality hold-down Load-Port final The Interactions. Hold-Down Port Load AMHS Hold-Down Interactions.AMHS The hold-down features on the bottom of the 450 HFOSB are meant to interact with their 450HFOSBwith counterparts onthe bottom aremeantinteract hold-downof to features the The : This related information is not an official part of SEMI SEMI of part official an not is information related This : During door opening (and especially door closing) there may be substantial forces being applied to the to applied being forces substantial be may there closing) door especially (and opening door During ) by the International Physical Interfaces & CarriersCommittee. Interfaces by Physical the International

AMHS systems (such as RGV, AGV, stocker crane end effectors, or other endAMHS or systems AGV,effectors, other crane as stocker (such RGV,

The load port is the primary user of the hold-down feature. In this In feature. hold-down the of user primary the is port load The

( doc# jn l jn ) and was derived from the work of the of work the from derived was and Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and course). The point of this related information of the standard is not to pick a design, but to allow multiple allow to but design, a pick to not is standard the of information related the thebasic address problemunderstand to but multipleinnovations requirements. this of point of motions, and The forces different with (but keys course). E62 the to shape in similar keys, shape “T” for or access, vertical their about rotate stylewhich keys the “V”-shaped by by access “hook” allow applied would rear be the a to to feature this of forces support “mirroring” The forward hooks. and will downward supports shelf, that way and and a in slope standards door, carrier 30-degree the the toward its simply facing retainer with to feature, functions (door-side) multiple front do The to features implementation. fewer using of philosophy standards 450mm the with keeping in applications, differing for methods access differing allow to designed is feature hold-down HFOSB R3.2.1 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Hold-Down Feature Shape to Support Different Hold-Down Elements. Hold-Down Different Support to Shape Feature Hold-Down Page 55 jn l jn Document Document 4760Number: info The shape and size of the 450 the of size and shape The Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and R4.1.4.3 R4.1.4.3 port door wouldthenalready). be the carrier the touching load load port proposal likely 3 a see could center HFOSB the at sensor R4.1.4.2 BP 5 wouldallow side motion ofeither the of 19 full a allows BP and R4.1.4.1 sensor LED common most the infrared, R4.1.4 and red to least (at opaque flat, a spotcenter of the wafer. aboutwavelengths) the define to lifting is human-steered standard 450mm (using the delivered in “semi-automatically” be may they taken approach The misplaced.is HFOSB a 450 when detect to able be to still needs load port Thus the assistance). 450mm, at “hand-delivered” be not be still therefore must It will carriers though misplaced. Even grooves. the in seated not is but pins the atop sitting say, location were, carrier the if even functional that occupying carrier the if even location, occupied an to occur R4.1.3 processing yethandoff. andfor (orplaced may loaded or carrier but present, maybe something) is not correctly a R4.1.2 bottom. carrier sensing andareas onthe theplacement presence is of these example R4.1.1 carrierthe on side. AMHS makersalwaysand thatanddid used locations methods afeature not have corresponding createdwere problems sensingby inpurpose,as leaving areas port locationand undefined load R4.1 ( on publication for approved was information related This Committee. Carriers & Interfaces Physical International NOTICE ANDPRESENCE PLACEMENTAREASCARRIER 4 RELATED INFORMATION reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This technology patented such all or any identifying for responsible held be not shall Equipment (SEMI) International Materials Semiconductor and above. identified those than other items copyrighted or technology patented to subject standard be this may standard this of implementing elements some that possibility of the to drawn also purpose is Attention discrimination. the unfair without for world the throughout applicants to available made that be asserting will SEMI with licenses statement a filed has Inc. Entegris, rights. patent copyrightedby covered of invention use an require of or may material standard this with compliance that possibility the to called is attention user’s The without change notice. to subject are standards These herein. mentioned equipment relevant or other materials and any sheets, respecting literature, data product labels, product user. instructions, the manufacturer's to of refer responsibility to the cautioned solely are is Users standard the of suitability the of determination The application. particular NOTICE: bottom. carrier in slip openpins cavities the into R4.2.1 R4.2 misalignment of load ontheport. adjacent the loadcarrier with port door or possiblewouldinterfere the carrier would be before degrees with few a detected only be port load to a on carrier that noticed the be should allow it (although will orientation port) angular arbitrary load the on likewise sensor corresponding the (and center carrier R4.1.4.4 bottom slotthe carrier.near the of spot largerin dark or bottomansubstrate thanwouldrequire that a / opaque or Misplacement plate, farther the door. date of approval Placementsensing positivefalse One key ofLearned”the “Lessons 300mm from the thatconsiderablewas standards A carrier placement false positive may occur due to offset placement of a carrier on the load port if the KC the if port load the on carrier a of placement offset to due occur may positive false placement carrier A

: This related information is not an official part of SEMI SEMI of part official an not is information related This : Typical tests used are to move the carrier:Typical used tests move the areto SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any for herein forth set standards the of suitability the to as representations or warranties no makes SEMI The purpose of Presence sensing is to alert the manipulating device (load port, robot, AMHS device) that (load device sensingport, istherobot, manipulating AMHS device) The of alert purpose Presence to In the case of a load port, the presence sensing is primarily to ensure that automated deliveries do not do deliveries automated that ensure to primarily is sensing presence the port, load a of case the In This 450mm standard, defines specific locations and characteristics for sensing and information. One information. and sensing for characteristics and locations specific defines standard, 450mm This Leftward or rightward a fixed distance from seated, and still be detectable. The area centered on the FP the on centered area The detectable. be still and seated, from distance fixed a rightward or Leftward Forward a fixed distance. The band proposed in this ballot would extend 30mm from the FP, so that a that so FP, the from 30mm extend would ballot this in proposed band The distance. fixed a Forward Rotations about the carrier center (of a few degrees, or a right angle, or reversed). The band at the at band The reversed). or angle, right a or degrees, few a (of center carrier the about Rotations Backward a fixed distance. Again, the band would ensure detection up to a motion of 3 of motion a to up detection ensure would band the Again, distance. fixed a Backward ) by the International Physical Interfaces & CarriersCommittee. Interfaces by Physical the International

cm in either direction to be detected. An alternate proposal that limits the band to 5 to band the limits that proposal alternate An detected. be to direction either in cm

cm forward movement and still be detectable (note under the current the under (note detectable be still and movement forward cm

cm either left or right to be detected (more if sensors were left angled). orbeifcm sensors either to (more right detected Page 56 ( doc# jn l jn ) and was derived from the work of the of work the from derived was and Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date:

cm away from away cm DRAFT  SEMI

cm  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and expressly advised that determination of any such patent rights or copyrights and the risk of infringement of such of infringement of risk the and are their own responsibility. areentirely rights copyrights standard or this rights of patent such Users any of standard. determination this that in advised expressly mentioned item any with connection in asserted copyrights or rights patent any of validity the respecting position no takes SEMI standard, this of publication By items. copyrighted or reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Page 57 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and 21 for gathered data yellow ballot. and 20.1 20 automated ausing methods. to FOUP the from transferred be wafers that recommended is It processes. manufacturing IC in used be to intended not makers. device at carrier another to transfer and inspection and acceptance in used also and suppliers 19.2 been maintaining for utilized wafer has standard this However, that interfaces. so mechanical written all at interchangeability and modularity ensuring while 19.1 19 maintaining quality. (typically ICmanufacturers),wafer suppliers theirwhile to customers 18.1 18 WAFERS 450mmAND TRANSPORT SHIP TO BOX USED SHIPPING OPENING STANDARD: FORMECHANICALSPECIFICATION NEW DocumentDraft reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Fax: 41.22.733.34.30; 41.22.749.01.11; Switzerland. Telephone: 2 22.1.1 22.1 22 NOTICE: ISO/IEC 16022 21.2 SEMI AUX Shipping System Wafer Standard 450mm SEMI XXX— for 4599B Document SEMI Draft SEMI Wafers SEMI Polished Wafers for Mechanical Diameter Handling SEMI M74―Specification 450mm 21.1 responsibility of the users of this standard to establish appropriate safety and health practices and determine the determine and practices health and safety appropriate of limitationsapplicability regulatoryorto other prior use. establish to standard this of users the of responsibility NOTICE:

International Organization for Standardization (ISO), ISO Central Secretariat, 1, ch.de la Voie-Creuse, Case postale ISOVoie-Creuse, for1,ch.de Secretariat, la Geneva Case 56,CH-1211 Organization Standardization(ISO), 20, International Central Limitations Scope Purpose Terminology Referenced StandardsDocuments and This standard is is standard This Si in inspection after FOSB to wafers silicon raw loading in used is FOSB the that assumes standard This innovation on limits minimal places that specification of level appropriate an set to intended is standard This the specifies standard This Abbreviations andAcronyms StandardsISO Standards SEMI Draft DocumentDraft Draft Document 4624 - 4624 Document Draft

2D – Unless otherwise indicated, all documents cited shall be theversions. latestpublished otherwise documents all cited be shall Unless indicated, This standard does not purport to address safety issues, if any, associated with its use. It is the is It use. its with associated any, if issues, safety address to purport not does standard This 16 two dimensional twodimensional — Listcarrier of

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lsi plastic rn-pnn hpigbx(OB sdt hpship to used (FOSB) box shipping front-opening echanical Interface Specification for 450 mm Load Specification 450mm Port for echanical Interface r Identificationr Codes FOSB a emnfcue ncnomnewt t n and it, with conformance in manufactured be can s http://www.iso.ch Page 58

, and and , jn l jn is to be revised based on the prototyping the on based revised be to is Document Document 4760Number: info 45 0 mm wafers from wafer from wafers mm 0

FRONT- Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: The The hs those FOSB DRAFT can be can  FOSB SEMI is  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and 22.2.6 22.2.5 port. locations onthe load pin kinematic front the between midway and port, load the on pin kinematic rear the of location the through passes 22.2.4 quality. (typicallywafer ICmanufacturers), theirwhile suppliers maintaining to customers wafer 22.2.3 placed. 22.2.2 using 22.2.1 22.2 22.1.12 22.1.11 22.1.10 22.1.9 22.1.8 22.1.7 22.1.6 22.1.5 22.1.4 22.1.3 22.1.2 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This sensors mechanical 22.2.17 22.2.16 supports. onthe droop itwafer negligible 450mm with due gravity,for rests to wafers, as 22.2.15 box 22.2.14 22.2.13 22.2.12 22.2.11 the uppermost with points kinematicpins. thecoupling three coincident (tips) of 22.2.10 22.2.9 kinematic pin. of 194mmthe andrear front located in the BP 22.2.8 supports. 22.2.7 ofdimensions door features. wafer supports with the supports with wafer Definitions D front (offront f e c one opensubstrates. holds that or structure more —an carrier plane the planes, orthogonal three with system a of x=0 defining plane, vertical a — (BP) plane bilateral 450 a and door the on area an — area placement code 2D a of number serial and version model, maker, as such elements identifying code a — code 2D — KCP ― KC — HP FP — FOSB EE — —CL BP ata ata acial plane (FP) — a vertical plane, defining y=0 of a system with three orthogonal planes, perpendicular to perpendicular planes, orthogonal three with system a of y=0 defining plane, vertical a — (FP) plane acial nd effector — an end effector designed to support wafers wafers support to designed effector z end an for — effector reference nd the as used door carrier the on vertically centered line horizontal a — (CL) line enter wafer seating plane — the bottom surface of an ideally rigid flat disk that meets the diameter specification diameter the meets that disk flat rigid ideally an of surface bottom the — plane seating wafer the on resting is wafer the while gravity to due (TIR) shape wafer in change — deflection wafer (of rear hascurvature. width infinite length,zerothickness which and ―a surface zero and theoretical plane planes, orthogonal three and ofFP. theorigin —theBP intersection with system a of z=0 defining plane, horizontal a — (HP) plane horizontal TIR — ― RFID OHT ― hpig bx box shipping boxshipping — bilateral plane —bilateral M FOSB facial plane facial effector end atrix — horizontal plane kinematic coupling center line center kinematic pin coupling total indicatortotal runout front-opening front-opening shipping boxshipping shipping boxshipping overhead hoist transportoverhead — — radio frequency identification frequency radio ECC200 symbolECC200 . capacity — the number of substrates —the number capacity a that a front opening shipping box box shipping opening front a esn as — srae n te bto f te the of bottom the on surfaces — pads sensing shipping box ) — the part of) the —the part ) — the part of) the —the part shipping box according to ISO/IECaccording 16022. door open. door shipping boxshipping shipping boxshipping with a front-opening interface front-opening a with Page 59 nother closestthe door. to farthest from door. farthest its shipping box area on top of the shell, where a 2D code can be can code 2D a where shell, the of top on area for for jn l jn transferring hpig box shipping holds. , used used , Document Document 4760Number: info wafers from from wafers to ship ship to o rgeig otcl or optical triggering for Doc. 4760 info Doc. 4760 45 the carrier’s wafer carrier’s the 0 mm wafers from wafers mm 0 Date: 2009/08/13Date: FOSB shipping DRAFT  SEMI , by ,  INFORMATIONAL BALLOT    Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and are derived from other dimensions. See Table other See dimensions. Table from are derived 24.1 24  practices. drawing mechanical standard to 23.2 possible as close as be to order in figures. be positionfeature achieved ofwill via usually a onthe clarification Necessary used are numbers negative No within of coordinates system planes. Onlypositiveareused define three to this perpendicular. numbers are mutually planes three All field. gravity the of gradient the to parallel are ideally and planes vertical as defined are BP and FP no with z) y, (x, feature. donot a idealphysical since associated, planes represent these tolerance zero position at are planes These planes. these to relatively features certain of position the depict 23.1 23 22.2.23 of the the rear 22.2.22 22.2.21 supplierstheir to customers.the wafer 22.2.20 people. and contamination 22.2.19 with portcomplies that FIMS SEMI SEMI with complies interior its that (so cassette 22.2.18 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This ReferencePlanesFP, (HP,BP)Specification dimensions ofaresymmetricthe CL. to dimensions door features CL Shipp The overall dimensions of the 450 450 the of dimensions overall The Baselines — Reference to used be to intended are which planes, ideal are section definition the in described as BP and FP, HP, The — Centerline for the carrier door. It passes through the centers of the openings for the door pins. All the z- the All pins. door the for openings the of centers the through passes It door. carrier the for Centerline — wafer set-down volume — the open space for inserting and setting down a wafer volume—the the openinsertinganddown in set-down a spacefor setting wafer to pushed been has wafer the if wafer a of bottom entire contains that space the — volume pick-up wafer the for from a volume— the extracting wafer open extraction space wafer from product the isolate to from wafers ship to used is that wafer(s) and/or carrier a for container portable protective a — box enclosure shipping an by created environment localized a — minienvironment SEMI with complies (that box a — (FOUP) pod unified front-opening (z1) ≤ x8 (z1) ≤ y2 ≤ +(y1) y4 x2 ≤ (x1) ing Box ing shipping boxshipping max *2 + z1 + Envelope max 1 . One centerlines centerlines Doc. 4599B Doc. FOSB is 2 , (x1), (y1), and (z1), are given as reference dimensions because they because dimensions reference as given are (z1), and (y1), (x1), , . defined: Overviews of 450 FOSB areshown Figure 1. in Overviews of 450FOSB ). Doc. 4570B Doc. Page 60 ) and with a front-opening interface (that mates with a with mates (that interface front-opening a with and ) jn l jn Doc. 4570B Doc. Document Document 4760Number: info shipping box

) with a non-removable a with ) Doc. 4760 info Doc. 4760 shipping boxshipping . Date: 2009/08/13Date: DRAFT .  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This     Key: 25.1 25 Requirements     Door onfrontDoor Rear featureOptional featureRequired The The RFID Tag Placement Volume TagRFID Placement Holes for latch keys that lock the door to keys for lock that the door the F latch Holes code area placement 2D door Automated FOSB has the following components and sub-components: has thecomponents following and Figure1

Overall Views ofOverall Views 450 I Page M S interface when the door is unlatched from the door unlatched the box when is interface 61 FOSB jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and     reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This 2. Vacuum figure for AreaPads.See Door and Area Sense Opening, 25.4.1 appropriate by support designretaining orwafer techniques. other other each touching from restrained be must wafers the removed, door the with orientation vertical 25.4 flange). handling robotic the of edges the as (such minimum or maximum a just not and tolerance a has that dimensions) of out called is radius another unless the of surface the on area an feature is feature required a Here specifically. required every to applies radius this that also Note supplier. FOSB the of surface the on area an is feature required a Here specifically. out called is radius another unless feature required the to up is radius the on bound lower The much. too off rounded not are features all required the of that ensure radius to minimum) the a (not on maximum a limits as specified these are features that required Note particles. and wear cause might that stresses large with patches contact to up of radius a have also may features convex required All build-up. contaminant prevent to 25.3 a capabilitycorrects athat lead-in provide SEMI in defined as underneath pins six with mate that entity top the on standard) this in specified (not features of consists stocker) a in or vehicle a 25.2                 Bottom clamp featureBottom clamp a and 1 matekinematicpins that coupling provide with 3 features 2 6 7 Bottom Sides zone exclusion End effector retainerWafer with 25wafersCassette supports for Interior Top

Door Radii Outer and Inner Couplings Kinematic pads Info sensing pads carrier Lockout Door features features Door Folk feature lift Front feature clamp area placement 2D code Automation forpads vacuum Reserved area Door sensing areas presence Holes for Front clamp feature clamp feature Front — It is recommended that the the that recommended is It —

pin holespin door flange flange – Door has features such as Door Seal Area, Frame Seal Area, Latch Key Opening, Door Pin Door Opening, Key Latch Area, Seal Frame Area, Seal Door as such features has Door pins — The physical alignment mechanism from the the from mechanism alignment physical The —

— All required concave features may have a radius of up to to up of radius a have may features concave required All —

Doc.4570B FOSB FOSB . The three features that mate with the kinematic coupling pins must pins coupling kinematic the with mate that features three The . not be vertical when it is opened or closed. When the the When closed. or opened is it when vertical be not misalignment of upto misalignment See Figure 2-4. See Page FOSB 62 supplier. Note also that this radius applies to every to applies radius this that also Note supplier. FOSB 5 mm lead-in mm jn l jn r 42 specified by a dimension (or intersections (or dimension a by specified in any in horizontal direction. FOSB to the tool load-port (or a nest on nest a (or load-port tool the to Document Document 4760Number: info r 40 to allow cleaning and cleaning allow to Doc. 4760 info Doc. 4760 r 41 Date: 2009/08/13Date: to prevent small prevent to FOSB DRAFT is in a in is  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and is a slot. See ais Figure slot. 25.4.5 about the BP. PinsDoor aresymmetrical 25.4.4.3 2. pins Figure door See (CL). for centerline the Clearance on located be (x44). shall pins door at and latchkeys The y39 (x45). at by y40 by provided provided be shall be shall keys latch for Clearance y10. be shall r23 by defined 25.4.4.2 FOSB 25.4.4.1 the FIMS boththeir keyslength. to full onthe portagainst and areinserted latch 25.4.4 spaces. the reserved and FP the from y4 of distance a at the on surface No latched. and be closed is door the when shall areas sense door and areas seal frame areas, seal door areas, pad vacuum 25.4.3 of the because SEMI to conforms 25.4.2 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This respectively. edges r31 r32 and Thereareblend & given radiiat inner the is byx48andof outer z32. area 25.4.7 Thereareblend radii r30bottom. 25.4.6 , the latch key holes on the door shall be such that the door is not removable from the latch beis shall keys. key such from holestheremovable onthethat door door not , the latch The opening for the door pin on the left side is circular with diameter (d4), and the opening on the right side right the on opening the and (d4), diameter with circular is side left the on pin door the for opening The the when keys latch and door the between clearance is there that assures y39 Dimension The z31. & x49 at located and r28 by bounded circles four the are application vacuum for spaces The t of pins door and keys latch of sizes and features The The door seal area is bounded by x47 on the sides, and by z33 on the top and bottom. The width of the seal the of width The bottom. and top the on z33 by and sides, the on x47 by bounded is area seal door The area bounded &andonthe on the is top, byx64onthe by frame x11sides, z28 seal & by z27 z43 z34 & The FOSB area the in door carrier the of panel outer the of thickness the rotation, key latch unobstructed for allow To the unlocks that position the toward 45° than more turned are keys latch the When different door features are symmetrical about the CL. Features other than the openings for Frame Pins and Pins Frame for openings the than other Features CL. the about symmetrical are features door Doc.4599B 5 . door size of door FOSB. size . However, .

and r36 at the inner and outer corners respectively. atouter the innerand corners r36 and Figure2 The location of latch keys and door pins is not the same as 450 FOUP, 450 as same the not is pins door and keys latch of location The T he location of latch key and door pin are specified in specified 1. pin and Table locationof door latch are key he

450 FOSB Door FeaturesFOSB Door Page FOSB 63 door may project further from the FP than these areasthese than FP the from further project may door he

door must be designed to mate with a port that port a with mate to designed be must door jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 FOSB Date: 2009/08/13Date: FOSB door from the from door is pressed is DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and x47 and z33 are the limits for the door and any variation in anyposition z33the doorvariation onthe its load arethefor port limits and door.x47 and obstructed. not is opening door port load the and door port load the between gap the so controlled be shall door port 25.4.8 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Neither the the Neither FOSB door opening nor the frame opening is specified. But the door and its position on the load the on position its and door the But specified. is opening frame the nor opening door Figure3

450 Page FOSB Door FrameFOSB Door 64 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and door is equal to y4 from the FP. With the door in this position, the latches shall operate without exceeding the exceeding without operate shall latches the position, this in door the f230the limit latch for keys.torque With FP. the from y4 to equal is door the of surface outer the that so closed, fully door the push shall door the to f234 of application The f234. is position 25.4.11 quality wafer during transportation.keeping 25.4.10 structure.retaining when transportation during damage that position beshould of noted wafer the preventing for slot the of surface the contacting 25.4.9 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This by only gravity. the when only location proper the in be will and pins, coupling kinematic the of dimensions the of all Also, interface. FIMS 2: NOTE of awith depth 25.5.2 depth of 25.5.1 25.5 closingdoor capabilities). the of function intended the to impact negative without direction the in 25.4.14 described positions angular the to turned are keys latch for Load Interface Specification 450mm Ports SEMIMechanical relevant door the when unlatched completely or latched 25.4.13 port willonthe of a engage) keys load 25.4.12 will occur wafers damage opening closingto upon and the door. 1: NOTE Front Clamp Features Clamp —The Front There shall be two front clamping features on the bottom of the the of bottom the on features clamping front two be shall There the of top the on features clamping front two be shall There Wa no ensure to possible as small as close to required force this keep to products their design should suppliers Carrier A door should be able to withstand a force when applied to one of the retaining features of theupto retaining appliedone toforcefeatures doorto be of when should able a withstand A Unlatching and Latching Door Torque Latch Force Closing Door Door of Rear z It is recommended that the front clamp features not be used for pulling the the pulling for used be not features clamp front the that recommended is It 5, fer Retaining Structure Retaining fer and bounded is by z 36 and be bounded andby be ( — The maximum torque required to turn each of the latch mechanisms (with which the latch the which (with mechanisms latch the of each turn to required torque maximum The — y 60 Figure5 ) — — ) —The force required to push the carrier door into the carrier shell to its fully seated fully its to shell carrier the into door carrier the push to required force —The x 15 FOSB

— The slot is usually designed that wafers are suspended in the slot without slot the in suspended are wafers that designed usually is slot The — Detail H – Frame Pin andPinDetail –FrameDoor - Pin Area H RightSide & x & FOSB FOSB has a a has shipping box 16 x ― The door of the the of door The ― 15 , and by shall have provision for being clamped at the front of the at havethe shall front being clamped for provision & x & is different from that ofwhenis that due FOUP the wafer theto door differentclosed from is Figure4 y 60 16 FOSB

, and by y  43

door is door f230. 100

(such as the wafer location, etc.) are defined with reference to the to reference with defined are etc.) location, wafer the as (such & y & Page 450 mm to hold wafers in large area at front wafer retainer for retainer wafer front at area large in wafers hold to mm 44. y FOSB Door FOSB Door 43 65 FOSB See Figure & y & 44 must be designed so that the door is completely is door the that so designed be must FOSB FOSB . FOSB

See Figure jn l jn FOSB 15 is held in place on the kinematic coupling pins coupling kinematic the on place in held is for FOSB for (e.g., shell deformation, wafer positions, wafer deformation, shell (e.g., . Each is a rectangular depression with a with depression rectangular a is Each . . FOSB .

They shall be rectangular depression rectangular be shall They 18 Document Document 4760Number: info from the undocked position into the into position undocked the from .

. FOSB Doc. 4760 info Doc. 4760 door is closed. It closed. is door Date: 2009/08/13Date: shipping box. shipping f 002 DRAFT in any in  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and side domains (which contain the parts of the the of parts the contain (which domains side 25.8 wafer is wafer bottom the wafer2,etc.). upis 1,the next number wafer number (so top to bottom from order increasing in numbered are slots wafers the and coupling, 25.7 container secondary its and FOSB package. secondary from510mm. dropa of ofheight the container wafer by prevent accidental to breakage beshould designed a from support require generally and orientation vertical a in shipped typically are wafers that noted be should It shipping. including handling, subsequent during movement 25.6 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This minimum maximum only have or that dimensions). most the figures, following and this In wafer). Numbering and Orientation Wafer Retaining Wafer Internal Horizontal Internal NOTE 1: NOTE Figure6 hntethe When —

Detail I- - SectionCenterline atLookin Detail Door

Dimensions Dimensions FOSB door FOSB — Figure Figure — h aes utb oiotlwe h the when horizontal be must wafers The — FOSB

heavy lines are used for surfaces that have tolerances (not surfaces (not tolerances have that surfaces for used are lines heavy scoe,tewfr utb eandi h the in retained be must wafers the closed, is 7 shows a cross-section of the horizontal boundaries of the the of boundaries horizontal the of cross-section a shows higher than than higher Page 66 z 25 above the the above jn l jn g Down on Right Side the HP and lower than than lower and Document Document 4760Number: info FOSB Doc. 4760 info Doc. 4760 is placed on the on placed is Date: 2009/08/13Date: z FOSB 15 above the top the above to prevent to

DRAFT  FOSB SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This leftthe is upto of tolerance the within height actual of sum the that means the in variations This tolerance. no with distances absolute as given are planes) seating wafer the above plane seating wafer nominal bottom the of height 25.9 Vertical Dimensions Dimensions Vertical FOSB FOSB supplier. Table supplier. Table from the kinematic coupling to the supporting features holding each wafer must be contained be must wafer each holding features supporting the to coupling kinematic the from z 21 with no further stack-up at each higher wafer. The method for meeting this requirement this meeting for method The wafer. higher each at stack-up further no with — Figures Figures — Figure7 1 8 defines all dimensions for dimensions all Figures defines –

10 Top View ofTop View FOSB Internal Dimensions show the vertical dimensions of the internal internal the of dimensions vertical the show Page 67 HP ) and and ) jn l jn z 1 7 8 (the distance between adjacent nominal adjacent between distance (the – 10 . Document Document 4760Number: info FOSB Doc. 4760 info Doc. 4760 . Note that that Note . Date: 2009/08/13Date: DRAFT z 14  SEMI (the  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Figure8

Side ViewFOSB Dimensions BP Side of at Page 68 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This Figure9

Figure10 Cross FOSB InternalDimensions FP Section of at Cross-Section of Wafer Slot FPCross-Section of at Page 69 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and Its top and bottom are the upper and lower tolerance of andtolerance arethe upper lower of andIts top bottom radius with section cylindrical a by defined is volume pick-up wafer The volume. the of rear the toward pushed not is wafer the of rear 25.9.3 r volumeabove set-down the wafer the is of front the out bottom extrusion the includes also volume its extraction and plane seating wafer nominal the above radius with 25.9.2 further than extend ¶ (see the of rear the toward pushed is wafer the on bound larger the to corresponding radius of the of side the FOSB on tolerance the of positioning wafer for implications The is section radiuswith 25.9.1 1 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This x12. and 25.10.2 25.10.1 Figure x13. See 25.10 2 + 1) are as follows. 1) areas 2 + within a circle of radius corresponding to the smaller bound on on bound smaller the to corresponding radius of circle a within 8 Wafer Pick-Up Volume Pick-Up Wafer Volume Extraction Wafer Volume Set-Down Wafer End Effectors ― end effectors reaching into the carrier shall stay between the wafer support areas defined by defined areas support wafer the between stay shall carrier the into reaching effectors end ― Effectors End .9.3). When the the When .9.3). If an end effector width extends beyond x13, it shall not extend beyond y8 when the width is between x13 between is width the when y8 beyond extend not shall it x13, beyond extends width effector end an If y11, into and maximumlimited is byy19. r6, the reach carrier The z FOSB 1 r r 8 12 18 above the nominal wafer seating plane and its bottom is is bottom its and plane seating wafer nominal the above FOSB and a main axis main parallel and and a to and a main axis parallel to and and to parallel axis main a and , then the entire bottom of the wafer must be contained in the wafer pick-up volume. However, if the However, volume. pick-up wafer the in contained bemust wafer the of bottom entire then the , 11 y . 20 from the . Once the wafer has been placed, the the placed, been has wafer the Once . FOSB door FOSB — If a wafer is placed in the wafer set-down volume and is then pushed toward the toward pushed then is and volume set-down wafer the in placed is wafer a If — — The open space for the wafer set-down volume consists of a cylindrical section cylindrical a of consists volume set-down wafer the for space open The — FP — The open space for the wafer extraction volume includes a cylindrical section cylindrical a includes volume extraction wafer the for space open The — z 49 . is is . The implications for wafer extraction of for extraction of the definition . Thedimension wafer implications opened Figure11 FOSB FOSB y r , the wafers may slide forward, but it is recommended that they not they that recommended is it but forward, slide may wafers the , 14 12 , then the wafer may only be somewhere within the wafer extraction wafer the within somewhere be only may wafer the then , y , the location of the wafer is defined by the wafer pick-up volume pick-up wafer the by defined is wafer the of location the , 1 Wafer Extraction Volume in front of the nominal wafer centerline. The top this frontcenterline.The cylindrical of in of wafer the nominal . There are two exceptions to this limit on wafer movement. When movement. wafer on limit this to exceptions two are There . 4 in front of the the of front in Page z 21 around the nominalaround seating plane. wafer FOSB z r 70 49 12 above the nominal wafer seating plane. The wafer The plane. seating wafer nominal the above are as follows. The wafers should be placed in the in placed be should wafers The follows. as are must not allow a wafer to move outside of a circle a of outside move to wafer a allow not must FOSB origin r 12 of this cylindrical section and the portion of portion the and section cylindrical this of l jn z 1 to avoid touching the edge of the wafer to wafer the of edge the touching avoid to . The top of this cylindrical section is is section cylindrical this of top The . 5 above the nominal wafer seating plane. seating wafer nominal the above r Document Document 4760Number: info 1 3 and a main axis at the the at axis main a and Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: r 18 DRAFT (  origin r SEMI 18 z 22

 .  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and 25.11 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This top the at d3 of diameter and z2 of an θ4. have angle shall side of thefeature centering The surface. of depth a have shall feature centering The center. its at feature centering a have 25.17 y12. See Figureand 25.16 Figure 14 illustrated in 25.15 for provision no is there Consequently, situation. abnormal handles. manual permanent an from manual recovering that anticipated when is occur It only activities. will maintenance handling or production normal during handling manual for heavy too 25.14 outer maximum the volumeis ¶ ofplacement in dimensions thedefined FOSB. RFIDTag within contained be must and plane datum bilateral the on centered rear bottom the at located the for view bottom and 25.13 capacity FOUP 25.12 25.11.2 25.11.1 Wafer Mapping ― A volume shall be reserved for mapping. volume reserved wafer Mapping ―A be Wafer shall The The x4 by constrained are location and orientation Its FP. the of front in centered be shall flange automation The Flange Automation Dimensions External Capacity and Pitch Manual Handling — — Handling Manual It shall extend from y55 to y9 and shall have a width of x12. from y9a y55andof It extend to shall have width shall seating top HPplane. above above wafer from nominal z25 the z26 the It extend upto shall center of the flange is located x63 and y54 relative to its side and front respectively. The flange shall flange The respectively. front and side its to relative y54 and x63 located is flange the of center . 8 and 9 8 and . FOSB — On top of the 450 450 the of top On — — — . — Figures Figures — A fully-loaded 450 mm FOSB will have a mass of about 24 kg, which means it will be will it means which kg, 24 about of mass a have will FOSB mm 450 fully-loaded A Wafer pitch is set by z17 for 11.1mm for z17 by set is pitch Wafer . Table Table . 13 1 Figure12 defines all of the dimensions. If an identification tag is used, it must be must it used, is tag identification an If dimensions. the of all defines – 18 respectively show the side view, rear view, top view, robotic flange, robotic view, top view, rear view, side the show respectively FOSB, there there FOSB, End Effector ExclusionEnd Effector Page 71 is an automation flange for manipulating the the manipulating for flange automation an is . . 8.19 T jn l jn he he . FOSB capacity Document Document 4760Number: info is 25 as the same as 450 as same the as 25 is Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: FOSB as FOSB DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and flange for a height of z9, except for the door frame as shown thebyy30Figure door z9,in for frame except as a of for height flange the around obstructions no have shall carrier the and z13, of thickness a have shall flange The sides. the have on y54 and shall corners four The y29 at and θ5. back, and front of the on x63 angle and x33, x31, an x30, at located are have Notches y28. and shall x32 of size notches with chamfers The x56. of depth a have shall sides the on those 25.18.1 BP, extend shall the FPFP. front y37 in andand of y56 behind the of side each to x34 extend shall flange the below neck The x3. by side opposite the to carrier) the of front 25.18 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This The flange shall extend shall its fromfrontextendviewed flange shall the back side its sideright (as byfrom y3,The and from The flange has a pattern of notches on all sides. Notches on the front and back have a depth of y31 and y31 of depth a have back and front the on Notches sides. all on notches of pattern a has flange The Figure13 Top View Page 72 of FOSB jn l jn 8 . Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This with of notchesheight at the be FP a shall of rear the to opening the of top to forward 25.19.1 15-17 25.19 . The forklift feature includes a notched indentation for a pin to retain the carrier onthe forklift. the carrier retain a featurenotchedto for pin . Theincludesindentation a forklift Forklift Feature Forklift On each side of the carrier, there shall be an opening to the rear extending vertically from from vertically extending rear the to opening an be shall there carrier, the of side each On y45 ? . The horizontal surface at surface . The horizontal — The 450 FOUP shall have features on the sides for handling by forklift, shown in Figure in shown forklift, by handling for sides the on features have shall FOUP 450 The — y46 ? . The surface at at surface The . z20 Figure14 z19 ? ? , a depth of , a depth of

shall extend from extendshall from Automation Flange z19 Page ? shall extend from from extend shall x55 73 and an angle of an angle and y45 ? jn l jn to to y46 x17 . ? θ6 There shall be Thereshall noobstructionat the ? ? to the outside of the carrier. There carrier. the of outside the to . Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: z35 ? to to z19 DRAFT  ? , and , SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This feature 25.20.2.2 deformation. or damage permanent 25.20.2.1 incline.See planeFigure contacting18. orsloping with the without • • the following: 25.20.2 z6. FP surface plane andof HP).sloping meetsat This the intersection the to parallel (and horizontal a the above (with θ3 angle of joins plane sloping z7 a radius) height blend unspecified but of small surface vertical a opening, the of bottom the From r7. and y35 y34, by bounded carrier the of bottom the to opening an has volume Each r7. radius with z6 and HP at surfaces bottom and top with y38 and x28 at centered volume cylindrical of consists feature Each pins. coupling kinematic front the than FP the to closer 25.20.1 bythe couplings action of the pushing the kinematic the retaining 25.20 A hook shape that presses against the slope or and hookshape the shelf, against presses that the A A Tee shape that passes through the rectangular opening and rotates to press down on the shelf and/or the and/or shelf the on down press to rotates and opening rectangular the through passes that shape Tee A Hold Down Features Down Hold This configuration provides the load port with several options for holding the the holding for options several with port load the provides configuration This BP and structures pair slightly areprovidedsymmetricallyabout the of hold-downbylocated a features The Either (each) hold-down feature shall be able to withstand a force in any direction of f001 without f001 of direction any in force a withstand to able be shall feature hold-down (each) Either Door opening and closing shall operate correctly with a force of f002 applied to either (each) hold-down (each) either to applied f002 of force a with correctly operate shall closing and opening Door FOSB onto the kinematic couplings. kinematic the onto

iueFigure — Figure15 18 show Front Features Clampand Forklift s

w etrso h otmo h the of bottom the on features two This may be needed to prevent the the prevent to needed be may This FOSB Page against theinterface. front-opening against 74 jn l jn Document Document 4760Number: info FOSB FOSB FOSB from being knocked off knocked being from in place not limited to limited not place in that may be used for used be may that Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and 25.21 in generated force maximum the carriertheir design designing carrier’swhen the hold feature. down consider should suppliers Carrier operation. removal and insertion door the during occur that 3: NOTE reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This FOUP of must a supporting feature, loaded fully lockout be the flat capable mechanical r21 of radius a z50 be shall at surface have features pad info the pads, sensing placement mechanical optional the the On features. side, lockout mechanical port and pads load info the between difference no is there side, carrier the From side. eachon feature lockout mechanical one and pads info three of row one with BP, the about symmetrically located are 25.22 and primary the placement. Figure 1 symmetrical,configurationcarrier arenot pins this sensingSee of allows fail-safe the between distance the as KC the Because z23. of height a at be shall areas flat The forklifts. with use same for pins, KC rear the of front in is third the the approximately and pin, KC secondary rear the is of side either on located Are areas” centers flat x2 circular the of Two pins. (at inner KC secondary origin to the from outer distance the same the from approximately distance at center outer the with pins, KC front the to symmetrically located are areas flat elongated The located. areas flat circular three and elongated four of a set of consist These pins. coupling kinematic the onto grooves coupling kinematic the of placement proper confirm 25.21.2 from areasx9. andx20 extend to the outer BP, y21 the within carrier the of to FP the features the use can KCPs using systems other or along centered areas opaque flat, three ofconsist features The . port misplaced if even present, is carrier athat determine load The sensing. for areas opaque flat, three provide 25.21.1 pin sensor mechanical a that so lead-in with the kinematic couplings. interfere function of the cannot pins coupling kinematic with mate that features the with conjunction in designed be must pads sensing S Info Pads & Mechanical Lockout Features Lockout Mechanical & Pads Info ensing Pads ensing The force generated at the bottom hold down feature is related to the wafer retention forces and the door sealing forces sealing door the and forces retention wafer the to related is feature down hold bottom the at generated force The Placement Sensor Features Sensor Placement Presence S ens — As shown in Figure 1 Figure in shown As — z

Figure16 below the HP, (with a more relaxed tolerance than z23). Hole “depth” shall be at z24. Forthe be shall than z23).“depth” at z24. relaxedHole the(with tolerance HP, a more below or Features or 2 3 above above Port Locations BottomPort Features & Clampand Hold Down HP — The presence sensing features on the bottom of the 450 FOUP are designed to designed are FOUP 450 the of bottom the on features sensing presence The —

. It is recommended that the areas surrounding all of the carrier sensing pads be pads sensing carrier the of all surrounding areas the that recommended is It . to the front and rear of the FP. The center area extends x22 to each side of the of side each to x22 extends area center The FP. the of rear and front the to — Placement sensing features are intended to provide defined locations to locations defined provide to intended are features sensing Placement —

lockout pins will be separate from the sensing info pads. As with the with As pads. info sensing the from separate be will pins lockout 7 , when the the when , — The info pads and mechanical lockout features of the the of features lockout mechanical and pads info The — Page FOSB 75 is fully down on the kinematic coupling, the carrier the coupling, kinematic the on down fully is

(flat or hole per customer option). The flat The option). customer per hole or (flat jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: 1 and y22), The y22), and 8 . DRAFT  FOSB SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and ubrd ( ) ad te If as ae ltee A tr F o ihih ht te r o nedd t be to intended not are they that highlight to F) thru (A are lettered pads are lockout Pads The Info pins). the lockout interchangeable. and mechanical (no 2) only & sensors (1 info for numbered reserved are six other the lockout; mechanical for reserved are the BP nearest features two The BP. from the x27 x26, and x24, x25, of distances at BP 25.22.1 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This The info pads and mechanical lockout features are located y24 from the FP, and symmetrically about the about symmetrically and FP, the from y24 located are features lockout mechanical and pads info The Figure17 Bottom of FOSB View Page 76 jn l jn Document Document 4760Number: info Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and NOTE 4: NOTE byx29,y26, the volumedefined y27, be z37as within placed andshownFiguresmust in z38 25.23 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This RFID Tag Placement Volume Placement Tag RFID SEMI provides E144 specifications the elements for required of tags. RFID Figure19 Figure18 — Volume where the RFID tag tag RFID the where Volume — FOSB Detail & Cross-Section F―SensorPad Hole Side of View Page RFID TagRFID 77 P can be can lacement lacement jn l jn placed. The entire RFID tag, if present, if tag, RFID entire The placed. V olume Document Document 4760Number: info 19 Doc. 4760 info Doc. 4760 and and Date: 2009/08/13Date: 20

. DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and and shownFigure in and within be must door FOSB of surface an of placed. be can code 2D a where shell, 25.24 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This area defined by by defined area 2D 2D C ode ode

P lacement lacement 22 x70 . , , x71 Figure20 A rea , , y70

— and and One optional area on the door and another optional area on top of the the of top on area optional another and door the on area optional One FOSB the lateral boundaries defined defined boundaries lateral the The 2D code on top of of top on code 2D The y71 Rear View of View Rear

as defined in Table in defined as Page RFID TagRFID 78 the the 1 and shown in Figure Figure in shown and FOSB by by P lacement lacement jn l jn x72

shell must be within the the within be must shell , , x73 , , V z70 Document Document 4760Number: info olume and and 21 . The 2D code on the the on code 2D The . z71 Doc. 4760 info Doc. 4760

as defined in Table Table in defined as Date: 2009/08/13Date: lateral boundaries lateral DRAFT  FOSB front SEMI 1  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and characters in The total. characters per case alphanumeric” upper of the surface on employed 25.25 would l 25.24.1 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This       Character 1–2 Character C C C C C haracter haracter haracter haracter haracter 2D 2D ikely conflict withother for purposes. reserved conflict spaces ikely The C ode

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intended to be used for automat for used be to intended Data Matrix Matrix Data Figure21 Serial n Serial c with laser marking. Each data matrix includes information designated as “primary information designated matrix includes data Each marking. laser with ode Figure22 ; B ; as o x Shell (B) orx Shell Door umber byeachFOSB defined maker n 2D 2D ECC200 ECC200 umber

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B on ox D fab fab oor S hell equipment Document Document 4760Number: info capacity of of capacity load ports load Doc. 4760 info Doc. 4760 25 Date: 2009/08/13Date: alphanumerical , since readers since , DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and Note: All linear dimensions are indimensions angular all dimensions degrees. mm, arein linear Note: All are Table 1 reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This r36 r32 r31 r30 r29 r28 r23 r21 r18 r15 r13 r12 r10 r7 r6 f234 f230 f002 f001 (d7) (d4) d (d2) θ6 θ5 θ4 θ3 θ1 3 Symbol Used 450FOSB None 10 11 6, 16 7,12 ¶ ¶ ¶ ¶ 5 4 14 3 13,15 14 14 16 9 3 4 4 3 4 4 4,5 17 11 ,14 8.4.13 8.4.14 8.17.2.2 8.17.2.1 13 Figure Dimensions Dimensions ≥ ≤ 227 +1/-0 ≤ ≥ ≥ ≤ ≤ ≥ ≥ (10 (10.6) ±0.5 51 (17) ±0.5 45 degrees ±0.5 45 degrees ±0.5 45 degrees 30.0 ±2 degrees degrees±6 45 ≤ ≥ ≥ ≤ ≥ ≥ ≥ ≥ ≥ Value Specified 3 19 21 23 15 15 226 314 30 245 3 1.7 Nm N 141 N 175 6 20 30 14 10 r12 .6 87 N 87 ) + + 1 (x43 & (x43 x42), CL x45,C ( feature flange Automation centering ( feature flange Automation centering FP automation of flange to surfacePerpendicular Side (BP FP) Vertical & HP (BP FP) Vertical & Blend radius Blend radius Blend radius Blend radius Blend x44 x38,z31 key latch pads Lock-Out of Center Info, placement and Origin N/A Origin x Origin x26, y29 Origin Door Key Latch feature applied hold Force to down direction at point,in Applied any any =0, =0, , CL , & Datum From Measured y14 L Page x63,y54 x63,y54 x45 80 , , CL ) ) jn l jn Diameter of for Pin Diameter slot Door of pin Diameter door opening atDiameter top depression of atDiameter bottom depression of of retainer Side forklift feature notches surfaces automationSide of flange feature of flange Edge automation centering of feature Incline hold-down of surfaces grooveskinematic coupling from Angle vertical the of planar Corners of frame sealof area Corners frame edge door Inner of seal area edge door Outer of seal area sealof area Corners frame of sense Boundary door area reservedArea for pads vacuum Clearance of areaExtent pad of extractionRadius wafer volume direction in horizontal misalignment any in: CorrectableLead 450 FOSB of pick-upRadius wafer volume of set-downRadius wafer volume limit carrierOuter of in featureSpace hold-down boundary EE Rear of exclusion area to carrierForce close door latch(each key) required operateTorque to latches function theintended of carrier a without on negative impact the door and during opening closing that Force carrier withstand must that feature the must carrier withstand. that anyForce the one down hold Document Document 4760Number: info Feature Measured To Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: . DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This x48 x47 (x45) (x44) (x43) x42 x38 x35 x34 x33 x32 x31 x30 x29 x28 x27 x26 x25 x24 x23 x22 x21 x20 x17 x16 x15 x14 x13 x12 x11 x10 x9 x4 x3 x2 (x1) r41 r40 r37 Symbol Used 14 14 20 16 17 17 17 17 17 17 17 17 13,15 13,15 13,15 7,12 7,12 7,12 3 17 17 9 14 3,13 1, ¶ ¶ 7 4 4 4 4,5 5 5 4,5 13,15 9 14 14 8.3 8.3 3,9 Figure 210 ±0.5 210 ±0.5 50 25±1 ±0.5 50 ±1 145 ±1 115 ±1 85 ±1 55 ±1 55 ≥ ±1 141 ≤ ≤ ≤ ≥ ≤ ≥ ≥ ≤ ±1 193 ≤ ±1 150 ±0.5 300 ≤ (≤5 maximum2mm 1mm ≥ ≥ ≤ (220) (142) (220) ≥ ≥ 14 ≤ ±0.5 250 ±1 12 Value Specified 30 160 220 2 2 3.0 260.0 210 250 50 135 243.5 268.8 2 2 66.8 10 ±0.5 132 67.6 83.8 29

maximum

BP BP BP BP BP BP BP side automation Right of flange BP n/a N N Origin Outer edge edge door Outer of seal area BP BP BP BP atCentered atCentered edge carrierOuter of BP side automation Right of flange of Edge flange side automation Right of flange side automation Right of flange BP BP BP BP BP BP BP BP BP BP BP BP BP ot applicableot applicableot Datum From Measured Page x43 x44 81 ,CL jn l jn Extent of waferExtent rear support structure extent waferInner of support surface area edge E Inner of edge frameInnerseal of area centerOuter ofsense placement pad Edge presenceOuter of sense area carrier Right Left edge carrierOuter of width carrierOverall of A A Side Inner edge edge door Inner of seal area edge door Outer of seal area door opening pin Left key Latch opening of for door r22 Center slot right pin of for pin Length slot door of keyWidth latch clearance of for Depth notch forklift of flangeSide automation neck Flange Automation Flange Automation chamfer Flange Automation Notch Flange Automation Notch of placement Side RFID volume of featureCenter hold-down of Pad ( Center info of Pad Center Info ( of Pad Center Info ( of padCenter lock-out (1 / right) left 2 of Center rear sense placement pad of Edge central sensepresence pad centerOuter ofsense placement pad edge sideInner of presence sense area side featureInner of forklift side top clampingInner of front feature feature side top clampingOuter of front ll required ll concave (radius)features concavell features (radius) Document Document 4760Number: info boundary EE area of exclusion side of flange automation Edge Edge automation of flange on Feature Measured To nd Doc. 4760 info Doc. 4760 Effector exclusionEffector N B A C Date: 2009/08/13Date: left / otch left / / left E D F right) right) right) DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This y22 y21 y19 y14 y12 y11 y10 y9 y8 y4 y3 y2 (y1) x73 x72 x71 x70 x66 x64 x63 x62 x61 x58 x57 x56 x50 x49 Symbol Used 7,12 8,13 14 8,13 1, 22 22 21 21 13,15 3 14 17 17 16 16 14 9 4 17 17 7,8,12 ７ 8 7,12 6 12 Figure ≤ shell or door box elsewhere on maximum 257.5 area Door at sense application vacuum for spacesreserved seal and door frame 2 ±0.5 300 ≤ (≤ 225 175 60 110 2 ≥ ±0.5 150 ±1 102 ±1 154 ≤ ≥ ±0.5 14 ≥ 200 151 ±1 151 ≥ ≥ > ±1 162 ≥ 3.00 ±0.25 ≥ Value Specified 57.0 76.0 2 25 1.0 502.5 180 2 81.8 21 229 30 228 200 211.25 45 0 area ,≤3.0 and 0 mm mm ±0.5at ±1 ) at and and BP BP BP BP BP flange Side automation Right of BP BP BP BP of flange Edge automation BP BP FP FP FP FP FP FP surface door Front of (y4) FP FP FP side automation Front of flange FP n/a BP Datum From Measured Page 82 jn l jn edge of edge 2D-code area indication on body of edge 2D-code area indication on body of edge 2D-code area indication on surfaceOuter of lift fork feature side frameOuter seal of area Notch Front centerInner ofsense placement pad centerInner ofsense placement pad side bottom clampInner of front side bottom clampOuter of front of depth notches wall carrierInner of reservedSpace for pads vacuum Outer centerOuter ofsense placement pad of presenceEdges side sense area neararea rear support wafer structure extent E Inner of of Center edge automation Front of flange of waferExtent rear support structure keyslatch for Space unobstructed of rotation surfaceInner of door betweenarea extent E Inner of Front FOSB side automationRear of flange of Rear carrier depth carrierOverall of door e door dge of indication dge 2D-code area on Document Document 4760Number: info Feature Measured To r12 and centerand of d3

x12 and Doc. 4760 info Doc. 4760 nd nd and r18 E E Date: 2009/08/13Date: ffector ffector x13 exclusion exclusion DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This z9 z8 z7 z6 z5 z2 (z1) y71 y70 Y y56 y55 y54 y53 y52 y50 y48 y47 y46 y45 y44 y43 y40 y39 y y y35 y34 y31 y30 y29 y28 y27 y26 y25 y24 y23 38 37 60 Symbol Used 21 7 8,14 8 14 17 17 17 15,16 15,16 13,15 13,15 13,15 13,15 6 6 16 14 16 16 14 8 14 14 19 19 17 17 17 8,9,14 1, 16 16 15 8 1, 21 8,9 8,9 Figure 170 ≥ ≤ ≤ ±0.5 150 ±1 48 ±1 125 ±1 95 ≤ 3.5 ±0.5 ≥ ≥ ≤ 3.5 ±0.5 ≥ ≥ ±0.5 75 ≤ ±0.5 60 ±0.5 90 ±0.5 14 ≥ ±0.5 90 ±1 12 ≤ ≥ ±1 194 ±1 120 ±1 74 ≥ 382.0 ±0.2 6 ±0.5 11 ≥ ≥ (≤4 210 Value Specified 1 120 196.25 23 120 1 12 17 00 5 2 12 12 144 19 230 225 21 04.0 3.5 0 33.5 5.75 ±1 ) Front Surface Surface Door Front of Surface Door Front of FP FP FP FP of flangeSide automation FP side automation Front of flange of Flange Edge Automation FP FP FP FP FP flange surface automationBottom of HP featurehold-down horizontal Lower surface inside HP of FrameTop Door of flangeTop automation n/a FP FP FP FP FP of flangeFront automation FP FP FP FP Surface FOSB Front of Frame FP FP FP Surface FOSB Front of Frame Datum From Measured Page 83 jn l jn Clearance Door for Pin Clearance Latchkeysfor of featureCenter hold-down side automation flangeFront of neck edgeRear of opening hold-down edge hold-down Front of opening of Depth notches of flangeBack door Flange Automation Flange Automation chamfer of placementRear RFIDvolume of placement Front RFID volume of Center rear sense placement pads of Out and Row Info pads Lock centerOuter ofsense placement pad Clearance use automation for of flange of Top carrier edge hold-own Lower of incline featuredown horizontal Lower surface hold- inside of front featureBottom upper clamp of depressionBottom centering all of Over height carrier body of indication Edge 2D-code area on body of edge 2D-code area indication on of Rear wafer retaining side automationRear of flange neck volume of Rear wafer exclusion mapping Notch centerInner ofsense placement pad centerInner ofsense placement pad Sense Placement Pad forklift for side bottom clampRear of front side bottom clampFront of front limit surfaceRear of for forklift side forklift Front of feature side Rear of side Front of Document Document 4760Number: info and center d3 of Feature Measured To Top Top Doc. 4760 info Doc. 4760 front clamping front front clampingfront N Date: 2009/08/13Date: otch ing DRAFT ing  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This z48 (z45) (z44) z43 z42 z38 z37 z36 z35 z34 z33 z32 z31 z30 z28 z27 z26 z25 z24 z23 z22 z21 z20 z19 z18 z17 z16 z15 z14 z13 z1 1 Symbol Used 15 3 4 4 4 4 3 3 8 8 18 18 11 10 15 15 8 1 10 8 8 9,14 8,9,18 16 3 3 3 3 20 20 15 0 , , 8 8 Figure

≤ ≤ ≤ ≥ 129 1 ≥ ≥ ≥ ≥ ≤ ±0.5 20 4.85 ±0. 0 ≥ ±1 163 ≥ 11.1 ≥ ≥ 43.6 7.5 ±0.5 ≤ ≥ ( (≤3 3 ≤ ≤ ≥ ≥ Value Specified 400.6 74 1 1 79.3 1 1 24.1 17 10 2 78.6 2 10 12 82.3 80.3 2 95.3 95.3 15 7.1 7.1 11.1 1 11 1 5 64.6 .0 ±0 ±0 5 ±1 )

) z49 above above z49 eachwafer nominal plane nominal Each wafer seating of featureTop forklift HP surface top Top of wafer slot plane nominal Each wafer seating seatingwafer plane surface each Top ofnominal of wafer top Height first slot HP flange surface automationTop of HP hold-down featurehold-down horizontal Lower surface inside n/a n/a HP HP HP HP of frameBottom door HP CL CL edge door Outer of seal area CL HP CL CL HP support of 25 Top wafer nominal HP HP planeseating Datum From Measured Page 84 jn l jn Top of extractionTop wafer and set- wafer plane actual Each nominal seating wafer of retainer Bottom forklift feature of featureTop forklift planeseating point topwaferAny above nominal pitch) (wafer nominal Adjacent wafer planes seating support surface nextBottom of higher wafer Clearance top first slot below of wafer nominal seatingBottom wafer plane surface automationBottom offlange specifiedotherwise FO down featuredown horizontal Upper surface hold- inside of flangeHeight door of opening Height door of flangeTop door of flangeBottom door of placement Top RFID volume of placement Bottom RFID volume of front featureTop lower clamp of featureBottom forklift of Inner edges areaframe seal edge door Outer of seal area edge Door Inner of seal area pads of spaceCenter reserved vacuum for door – Center CL the Horizontal Line of sealof area Bottom frame sealof area Top frame volume of mapping Bottom wafer exclusion volume of mapping Top wafer exclusion when activepads not of within Top space Lockout Info & of Surface placement pads sense volumesdown SB Document Document 4760Number: info bottom areas not surface Feature Measured To Doc. 4760 info Doc. 4760

Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT Informational (Blue) Ballot1000AInformational (Blue) Ballot Ballot1000AInformational (Blue) (Blue) Informational Phone:408.943.6900 Fax: 408.943.7943Phone:408.943.6900 Fax: CASan 95134-2127Jose, 3081 Zanker Road Equipment Semiconductor InternationalMaterials and (z45) (z44) (z1) (y1) (x1) Symbol Used user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other and change to sheets, subject are data standards These product herein. labels, mentioned equipment product or materials instructions, any respecting literature manufacturer’s relevant to refer to cautioned are Users user. the of responsibility the solely is standard(s) the of suitability the of determination The application. particular any NOTICE: in DerivationofReferenceDimensions Table 2 tolerance the of figure significant last the to down or up rounded be should tolerances practice. withaccordance good engineering specified with dimensions for values in Measured dimension the of figure significant last the to down or up rounded practice. withaccordance good engineering be should tolerance specified without dimensions for values Measured in parentheses are Reference dimensions are dimensions in all mm. otherwisenoted, * Unless reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other All activity. development) (document committee Standards International SEMI of scope the within reproduction without distribution and/or SEMIwritten the ofprior isprohibited.consent only part, in or whole in document, this distribute and/or reproduce to granted is Permission standard. adopted or official an as construed be to is page this on material No program. Standards International SEMI the of document draft a is This own suchresponsibility. infringement areentirely rights their the of risk of this in mentioned item any with connection in rights any copyrights, areexpressly such determination and standard that of of patent or Users this standard. advised asserted copyrights or rights position patent no any of takes validity (SEMI) the International respecting Materials and Equipment Semiconductor standard, this of publication By notice.without z71 z70 z50 z49 Symbol Used SEMI makes no warranties or representations as to the suitability of the standard(s) set forth herein for herein forth set standard(s) the of suitability the to as representations or warranties no makes SEMI 22 22 18 11 ( (3 40 (≤ (≤ 5 (≤ Value 400.7 64.6 Figure 502.5 67.6 4.0 ) ) ) ) ) 270 230 ±1 20 1.5 Value Specified

z42 + z43 z42 + z z8 y x Formula and are not requirements. areand not 34 + z34 34 + 2 + y42 + x22 + max + + z1 max 2 (≤ max (≤ 2 (≤ 1 (18 (38 ( 83.8 21.0 2.3 4 3.0 5 + + 2 5 HP HP HP plane nominal Each wafer seating + ≤ + 2 + + 1 + + 3 + 21 + Datum From Measured 57.5 82.3 79.7 83.8 Page .0 ) ) ) ) ) 85 jn l jn door of edge 2D-code area indication on door of edge 2D-code area indication on active of and padsHeight info lockout when slots) between center (To the volume extraction of extractionBottom wafer volume. Document Document 4760Number: info Feature Measured To Doc. 4760 info Doc. 4760 Date: 2009/08/13Date: DRAFT  SEMI  INFORMATIONAL BALLOT