Micro-Thermal Analysis: Techniques and Applications
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Thermal Analysis
TECHNIQUE NOTE Thermal Analysis The scientists at EAG are experts in using thermal analysis techniques for materials characterization as well as for designing custom studies. This application note details TGA (Thermogravimetric Analysis), TG-EGA (Thermogravimetric Analysis with Evolved Gas Analysis), DSC (Differential Scanning Calorimetry), TMA (Thermomechanical Analysis) and DMA (Dynamic Mechanical Analysis). These techniques have played key roles in detailed materials identifications, failure analysis and deformulation (reverse engineering) investigations. THERMOGRAVIMETRIC ANALYSIS (TGA) DESCRIPTION • Vaporization, sublimation TGA measures changes in sample weight in a controlled thermal • Deformulation/failure analysis environment as a function of temperature or time. The changes in • Loss on drying sample weight (mass) can be a result of alterations in chemical or • Residue/filler content physical properties. • Decomposition kinetics TGA is useful for investigating the thermal stability of solids and liquids. A sensitive microbalance measures the change in mass of STRENGTHS the sample as it is heated or held isothermally in a furnace. The • Small sample size purge gas surrounding the sample can be either chemically inert • Analysis of solids and liquids with minimal sample preparation or reactive. TGA instruments can be programmed to switch gases during the test to provide a wide range of information in a single • Quantitative analysis of multiple mass loss thermal events experiment. from physical and chemical changes of materials • Separation and analysis of multiple overlapping mass loss COMMON APPLICATIONS events • Thermal stability/degradation studies LIMITATION • Investigating mass losses resulting from physical and chemical changes • Evolved products are identified only when the TGA is connected to an evolved gas analyzer (e.g. TGA/MS or TGA/ • Quantitation of volatiles/moisture FTIR) • Screening additives COPYRIGHT © 2017 EAG, INC. -
Methods for Topography Artifacts Compensation in Scanning Thermal Microscopy
Ultramicroscopy 155 (2015) 55–61 Contents lists available at ScienceDirect Ultramicroscopy journal homepage: www.elsevier.com/locate/ultramic Methods for topography artifacts compensation in scanning thermal microscopy Jan Martinek a,c,n, Petr Klapetek a,b, Anna Charvátová Campbell a a Czech Metrology Institute, Okružní 31, 638 00 Brno, Czech Republic b CEITEC, BUT, Technická 3058/10, 616 00 Brno, Czech Republic c Department of Physics, Faculty of Civil Engineering, BUT, Žižkova 17, Brno 602 00, Czech Republic article info abstract Article history: Thermal conductivity contrast images in scanning thermal microscopy (SThM) are often distorted by Received 10 July 2014 artifacts related to local sample topography. This is pronounced on samples with sharp topographic Received in revised form features, on rough samples and while using larger probes, for example, Wollaston wire-based probes. The 8 April 2015 topography artifacts can be so high that they can even obscure local thermal conductivity variations Accepted 15 April 2015 influencing the measured signal. Three methods for numerically estimating and compensating for to- Available online 25 April 2015 pographic artifacts are compared in this paper: a simple approach based on local sample geometry at the Keywords: probe apex vicinity, a neural network analysis and 3D finite element modeling of the probe–sample Scanning thermal microscopy interaction. A local topography and an estimated probe shape are used as source data for the calculation Artifacts in all these techniques; the result is a map of false conductivity contrast signals generated only by sample Neural networks topography. This map can be then used to remove the topography artifacts from measured data or to estimate the uncertainty of conductivity measurements using SThM. -
Conceptual Approach to Thermal Analysis and Its Main Applications
Prospect. Vol. 15, No. 2, Julio-Diciembre de 2017, 117-125 Conceptual approach to thermal analysis and its main applications Aproximación conceptual al análisis térmico y sus principales aplicaciones Alejandra María Zambrano Arévalo1*, Grey Cecilia Castellar Ortega2, William Andrés Vallejo Lozada3, Ismael Enrique Piñeres Ariza4, María Mercedes Cely Bautista5, Jesús Sigifredo Valencia Ríos6 1*M.Sc. Chemical Sciences, Full Professor, Universidad de la Costa. Barranquilla-Colombia. 2M.Sc. Chemical Sciences, Full Professor, Universidad Autónoma del Caribe. Barranquilla-Colombia. 3Ph.D. Chemical Sciences, Full Professor, Universidad del Atlántico. Barranquilla-Colombia. 4M.Sc. Physical Sciences, Occasional Full Professor, Universidad del Atlántico. Barranquilla-Colombia. 5Ph.D. Engineering, Full Professsor, Universidad Autónoma del Caribe. Barranquilla-Colombia. 6Ph. D. Universidad Nacional de Colombia, Vicerrector Universidad Nacional de Colombia (Sede Palmira). Palmira-Colombia. E-mail: [email protected] Recibido 12/04/2017 Cite this article as: A. Zambrano, G.Castellar, W.Vallejo, I.Piñeres, M.M. Aceptado 28/05/2017 Cely, J.Valencia, Aproximación conceptual al análisis térmico y sus principales aplicaciones, “Conceptual approach to thermal analysis and its main applications”. Prospectiva, Vol 15, N° 2, 117-125, 2017. ABSTRACT This work shows to the reader a general description about the techniques of classic thermal analysis as known as Differential Scanning Calorimetry (DSC), Differential Thermal Analysis (DTA) and Thermal Gravimetric Analysis. These techniques are very used in science and material technologies (metals, metals alloys, ceramics, glass, polymer, plastic and composites) with the purpose of characterizing precursors, following and control of process, adjustment of operation conditions, thermal treatment and verifying of quality parameters. Key words: Physical chemistry; Calorimetry; Thermochemistry; Thermal analysis. -
Fabrication of Hot-Wire Probes and Electronics for Constant Temperature Anemometers
Latin American Applied Research 40:233-239(2010) FABRICATION OF HOT-WIRE PROBES AND ELECTRONICS FOR CONSTANT TEMPERATURE ANEMOMETERS O.D. OSORIO †, N. SILIN ‡ and J. CONVERTI § † Instituto Balseiro, S. C. de Bariloche, 8400, Argentina, e-mail: [email protected] ‡ Investigador CONICET, Instituto Balseiro, S. C. de Bariloche, 8400, Argentina, e-mail: [email protected] r § Instituto Balseiro, S. C. de Bariloche, 8400, Argentina, e-mail: [email protected] r Abstract −−−−−− The purpose of this paper is to discuss rior removal of the silver by chemical etching. the construction of constant temperature hot wire Electronics were built following the design of Its- anemometers. Different options are analyzed for the weire and Helland (1983) but including modifications to fabrication of sensors and electronics. A practical avoid the use of components not readily available, like and simple method is developed to manufacture the variable inductors and delay lines. probe and associated electronics. The fabricated sen- Frequency response was measured as suggested by sor has a diameter of 2 µm and approximately 500 Freymuth (1977) and Fingerson (1994). Measurements µm in length. The associated electronics are designed of a turbulent flow field were performed simultaneously to keep the sensor working at a constant tempera- with the present electronics and a commercial unit ture and allow the indirect measurement of speed. (TSI1051). The two measurements were equivalent for The design is simple, inexpensive and highly flexible frequencies up to approximately 50 kHz. regarding its use and modifications. The dynamic II. PROBE CONSTRUCTION tests performed and the comparison with a commer- Hot-wire probes are built with a thin wire of 0.5 to 20 cial model shows a satisfactory performance. -
Beam Sterilization with Gamma Radiation Sterilization
FABAD J. Pharm. Sci., 34, 43–53, 2009 REVIEW ARTICLE Sterilization Methods and the Comparison of E-Beam Sterilization with Gamma Radiation Sterilization Mine SİLİNDİR*, A. Yekta ÖZER*° Sterilization Methods and the Comparison of E-Beam Sterilizasyon Metodları ve E-Demeti ile Sterilizasyonun Sterilization with Gamma Radiation Sterilization Gama Radyasyonu ile Karşılaştırılması Summary Özet Sterilization is used in a varity of industry field and a strictly Sterilizasyon endüstrinin pek çok alanında kullanılmakta- required process for some products used in sterile regions dır ve medikal cihazlar ve parenteral ilaçlar gibi direk vü- of the body like some medical devices and parenteral drugs. cudun steril bölgelerine uygulanan bazı ürünler için ge- Although there are many kinds of sterilization methods rekli bir işlemdir. Ürünlerin fizikokimyasal özelliklerine according to physicochemical properties of the substances, bağlı olarak pek çok farklı sterilizasyon metodu bulunma- the use of radiation in sterilization has many advantages sına rağmen, radyasyonun sterilizasyon amacıyla kullanı- depending on its substantially less toxicity. The use of mı daha az toksik etkisine bağlı olarak pek çok avantaja sa- radiation in industrial field showed 10-15% increase per every hiptir. Radyasyonun endüstriyel alanda kullanımı her yıl year of the previous years and by 1994 more than 180 gamma bir öncekine oranla %10-15 artış göstermiştir ve 1994’ten irradiation institutions have functioned in 50 countries. As bu yana 50 ülkede 180’den fazla gama ışınlama -
(12) United States Patent (10) Patent No.: US 8,177,422 B2 Kjoller Et Al
US008177422B2 (12) United States Patent (10) Patent No.: US 8,177,422 B2 Kjoller et al. (45) Date of Patent: May 15, 2012 (54) TRANSITION TEMPERATURE (56) References Cited MICROSCOPY U.S. PATENT DOCUMENTS (75) Inventors: Kevin Kjoller, Santa Barbara, CA (US); 6,185.992 B1* 2/2001 Daniels et al. ................ 25O?307 Khoren Sahagian, Burbank, CA (US); 6,200,022 B1* 3/2001 Hammiche et al. ............. 374/46 Doug Gotthard, Carpinteria, CA (US); gig3. R : S383 Airectalammiche et al. .............. (92.i Althy E" E. EcA 6,805,839 B2 * 10/2004 Cunningham et al. ... 422/82. 12 (US); Craig Prater, Santa Barbara, 7,448,798 B1 * 1 1/2008 Wang ..................... ... 374f183 (US); Roshan Shetty, Westlake Village, 2002/O126732 A1* 9, 2002 Shakouri et al. .............. 374,130 CA (US); Michael Reading, Norwich 2002/0196834 A1* 12/2002 Zaldivar et al. ................. 374,22 (GB) 2004/0026007 A1 2/2004 Hubert et al. ................... 156,64 2004/0202226 A1* 10, 2004 Gianchandani et al. ...... 374,185 2005/0105097 A1* 5/2005 Fang-Yen et al. ... 356,497 (73) Assignee: Anasys Instruments, Santa Barbara, CA 2006/0243034 A1 ck 11, 2006 Chand et al. T3/104 (US) 2007/0263696 A1* 11/2007 Kjoller et al. 374/31 2009 OO32706 A1* 2, 2009 Prater et al. 25O?307 (*) Notice: Subject to any disclaimer, the term of this 2009/0229020 A1* 9, 2009 Adams et al. ................... 850/33 patent is extended or adjusted under 35 SR A. 1939 CC. C. al . 3. U.S.C. 154(b) by 474 days. 2011/0078834 A1* 3/2011 King ................................ -
Thermal Analysis Methods
Modern Methods in Heterogeneous Catalysis Research Thermal analysis methods Rolf Jentoft 03.11.06 Outline • Definition and overview • Thermal Gravimetric analysis • Evolved gas analysis (calibration) • Differential Thermal Analysis/DSC • Kinetics introduction • Data analysis examples Definition Thermal analysis: the measurement of some physical parameter of a system as a function of temperature. Usually measured as a dynamic function of temperature. Types of thermal analysis – TG (Thermogravimetric) analysis: weight – DTA (Differential Thermal Analysis): temperature – DSC (Differential Scanning Calorimetry): temperature – DIL (Dilatometry): length – TMA (Thermo Mechanical Analysis): length (with strain) – DMA (Dynamic-Mechanical Analysis): length (dynamic) – DEA (Dielectric Analysis): conductivity – Thermo Microscopy: image –...– Combined methods Thermogravimetric Developed by Honda in 1915 Oven Oven heated at controlled rate Sample Temperature and Weight are recorded Balance Types of thermal analysis – TG (Thermogravimetric) analysis: weight – DTA (Differential Thermal Analysis): temperature – DSC (Differential Scanning Calorimetry): temperature – DIL (Dilatometry): length – TMA (Thermo Mechanical Analysis): length (with strain) – DMA (Dynamic-Mechanical Analysis): length (dynamic) – DEA (Dielectric Analysis): conductivity – Thermo Microscopy: image – Combined methods DTA/DSC First introduced by Le Chatelier in 1887, perfected by Roberts-Austen 1899 Sample Reference Oven heated at controlled rate Temperature and temperature difference -
Pv-3 Globar Sensing Element
Lawrence Berkeley National Laboratory Recent Work Title VAPOR-LIQUID EQUILIBRIA IN THE SYSTEM HYDROGEN-NITROGEN Permalink https://escholarship.org/uc/item/836767dh Author Maimoni, Arturo. Publication Date 1955-09-01 eScholarship.org Powered by the California Digital Library University of California UCRL 3/3 I \ UNIVERSITY OF CALIFORNIA TWO-WEEK LOAN COPY This is a library Circulating Copy which may be borrowed for two weeks. For a personal retention copy, call Tech. Info. Diuision, Ext. 5545 BERKELEY. CALIFORNIA DISCLAIMER This document was prepared as an account of work sponsored by the United States Government. While this document is believed to contain correct information, neither the United States Government nor any agency thereof, nor the Regents of the University of California, nor any of their employees, makes any warranty, express or implied, or assumes any legal responsibility for the accuracy, completeness, or usefulness of any information, apparatus, product, or process disclosed, or represents that its use would not infringe privately owned rights. Reference herein to any specific commercial product, process, or service by its trade name, trademark, manufacturer, or otherwise, does not necessarily constitute or imply its endorsement, recommendation, or favoring by the United States Government or any agency thereof, or the Regents of the University of California. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof or the Regents of the University of California. UCRL-3131 UNIVERSITY OF CALIFORNIA I Radiation Laboratory Berkeley,. California Contract No. W -7405 -eng-48 . VAPOR-LIQUID EQUILIBRIA IN THE SYSTEM HYDROGEN -NITROGEN Arturo M.a.imoni (The sis) September 1, 1955 .·• Printed for the U. -
Advances in Scanning Thermal Microscopy Measurements for Thin Films
Chapter 1 Advances in Scanning Thermal Microscopy Measurements for Thin Films Liliana Vera-Londono, Olga Caballero-Calero, Jaime Andrés Pérez-Taborda and Marisol Martín-González Additional information is available at the end of the chapter http://dx.doi.org/10.5772/intechopen.79961 Abstract One of the main challenges nowadays concerning nanostructured materials is the under- standing of the heat transfer mechanisms, which are of the utmost relevance for many specific applications. There are different methods to characterize thermal conductivity at the nanoscale and in films, but in most cases, metrology, good resolution, fast time acquisition, and sample preparation are the issues. In this chapter, we will discuss one of the most fascinating techniques used for thermal characterization, the scanning thermal microscopy (SThM), which can provide simultaneously topographic and thermal infor- mation of the samples under study with nanometer resolution and with virtually no sample preparation needed. This method is based on using a nanothermometer, which can also be used as heater element, integrated into an atomic force microscope (AFM) cantilever. The chapter will start with a historical introduction of the technique, followed by the different kinds of probes and operation modes that can be used. Then, some of the equations and heating models used to extract the thermal conductivity from these mea- surements will be briefly discussed. Finally, different examples of actual measurements performed on films will be shown. Most of these results deal with thermoelectric thin films, where the thermal conductivity characterization is one of the most important parameters to optimize their performance for real applications. Keywords: scanning thermal microscopy, thermal probes, thermoelectric thin films, thermal conductivity, local temperature measurements © 2018 The Author(s). -
Differential Scanning Calorimetry Beginner's Guide
FREQUENTLY ASKED Differential Scanning QUESTIONS Calorimetry (DSC) DSC 4000 DSC 8000 DSC 8500 with Autosampler DSC 6000 with Autosampler PerkinElmer's DSC Family A Beginner's Guide This booklet provides an introduction to the concepts of Differential Scanning Calorimetry (DSC). It is written for the materials scientist unfamiliar with DSC. The differential scanning calorimeter (DSC) is a fundamental tool in thermal analysis. It can be used in many industries – from pharmaceuticals to polymers and from nanomaterials to food products. The information these instruments generate is used to understand amorphous and crystalline behavior, poly- morph and eutectic transitions, curing and degree of cure, and many other material properties used to design, manufacture and test products. DSCs are manufactured in several variations, but PerkinElmer is the only company to make both single and double-furnace styles. We’ve manufactured thermal analysis instrumentation since 1960, and no one understands the applications of DSC like we do. In the following pages, we answer common questions about what a DSC is, how the instruments work, and what they tell you. Table of Contents 20 Common Questions about DSC What is DSC? ................................................................................................3 What is the difference between a heat flow and a heat flux DSC? ...................3 How does the difference affect me? ..............................................................3 Why do curves point in different directions? ...................................................4 -
THERMAL ANALYSIS New Castle, DE USA
THERMAL ANALYSIS New Castle, DE USA Lindon, UT USA Hüllhorst, Germany Shanghai, China Beijing, China Tokyo, Japan Seoul, South Korea Taipei, Taiwan Bangalore, India Sydney, Australia Guangzhou, China Eschborn, Germany Wetzlar, Germany Brussels, Belgium Etten-Leur, Netherlands Paris, France Elstree, United Kingdom Barcelona, Spain Milano, Italy Warsaw, Poland Prague, Czech Republic Sollentuna, Sweden Copenhagen, Denmark Chicago, IL USA São Paulo, Brazil Mexico City, Mexico Montreal, Canada Thermal Analysis Thermal Analysis is important to a wide variety of industries, including polymers, composites, pharmaceuticals, foods, petroleum, inorganic and organic chemicals, and many others. These instruments typically measure heat flow, weight loss, dimension change, or mechanical properties as a function of temperature. Properties characterized include melting, crystallization, glass transitions, cross-linking, oxidation, decomposition, volatilization, coefficient of thermal expansion, and modulus. These experiments allow the user to examine end-use performance, composition, processing, stability, and molecular structure and mobility. All TA Instruments thermal analysis instruments are manufactured to exacting standards and with the latest technology and processes for the most accurate, reliable, and reproducible data available. Multiple models are available based on needs; suitable for high sensitivity R&D as well as high throughput quality assurance. Available automation allows for maximum unattended laboratory productivity in all test environments. -
High-Frequency Voltage Measurements
REPORT CRPL-8-2 ISSUED APRIL 14, 1948 tiona! Bureau of Standards Library, N. W. Bldg. Mm/ , c 1Q/iq U. S. DEPARTMENT OF COMMERCE NOV 1 b 1949 NATIONAL BUREAU OF STANDARDS CENTRAL RADIO PROPAGATION LABORATORY WASHINGTON, D. C. HIGH - FREQUENCY VOLTAGE MEASUREMENTS BY M. C. SELBY Report No, NATIONAL BUREAU OF STANDARDS CRPL-8-2. CENTRAL RADIO PROPAGATION LABORATORY WASHINGTON 25, D. C. HIGH-FREQUENCY VOLTAGE MEASUREMENTS By M, C. Selby Preface This report on r-f measurements contains material written for inclusion in a Handbook of Physical Measurements to be published by the National Bureau of Stand¬ ards . The objectives ares (l) to present an up-to-date conspectus of fundamental techniques used in scientific research, laboratory and commercial measurements as well as their relative merits, (2) to cover all principles and methods that have met with any degree of success but not necessarily to compile all available material in encyclopedical form, (3) to meet the need of the professional worker and graduate student somewhat more comprehensively than the presently available handbooks do, A considerable amount of the material presented is based on work done at this Bureau, Bibliography is omitted because the references given leading in turn to further references and bibliography are considered adequate. Recognition and thanks are due to the authors listed in the references for their kind permission to quote some of these data and reproduce some drawings and curves, as well as to the N. B. S, editorial readers for valuable suggestions and cooperation. Contents Preface List of figures Introductory note 1, Accurate high-precision methods based on d-c measurements (a) Power measurements (b) Current meter and resistance (c) Cathode-ray beam deflection (d) Electrostatic voltmeter 2, Accurate moderate precision methods (a) Vacuum tube voltmeter (b) Non-thermionic rectifiers 3, Pulse-peak voltage measurement (a) Cathode-ray deflection (b) Diode peak voltmeters (o've r) 4.