An Overview of Aurora, Argonne's Upcoming Exascale System

Total Page:16

File Type:pdf, Size:1020Kb

An Overview of Aurora, Argonne's Upcoming Exascale System An Overview of Aurora, Argonne’s Upcoming Exascale System Argonne Leadership Computing Facility and Computational Science Division ECP Annual Meeting, Houston, Feb. 3-7 Yasaman Ghadar, Tim Williams www.anl.gov Argonne staff that can help with your question Yasaman Ghadar Tim Williams Kevin Sudheer Application Porting Early Science Harms Chunduri EXXALT Project I/O Libraries Network WDMApp DAOS Performance SlingShot JaeHyuk Kwack Colleen Bertoni Thomas Performance Ray Loy Application Porting Applencourt Tools Tools Programming Application Porting OpenMP Debugger Models SYCL/DPC++ Kokkos E3SM-MMF GAMESS QMCPACK ExaWind Brian Homerding Kris Rowe James Osborn Programming Saumil Patel I/O Libraries LatticeQCD Models ExaSMR ExaSMR Raja/Kokkos EQSIM Victor Silvio Rizzi Servesh Anisimov ALPINE Programing Kevin Brown Muralidharan Models Network performance Performance NWChemEx Hardware Opt. InteGration ExaFEL 2 Outline q Hardware Architecture: (Yasaman Ghadar) q Node-level Hardware q Interconnect q I/O q Aurora’s Testbed q Software Stack: (Tim Williams) q Three pillars q Programming models q Tools and libraries q Development platforms q Support for ECP teams q Further details on Aurora can be discussed under NDA q If you are not covered by an Aurora NDA please talk to your ECP project PI 3 Aurora: A High-level View q Intel-Cray machine arriving at Argonne in 2021 q Sustained Performance > 1Exaflops q Intel Xeon processors and Intel Xe GPUs q 2 Xeons (Sapphire Rapids) q 6 GPUs (Ponte Vecchio [PVC]) q Greater than 10 PB of total memory q Cray Slingshot fabric and Shasta platform q Filesystem q Distributed Asynchronous Object Store (DAOS) q ≥ 230 PB of storage capacity q Bandwidth of > 25 TB/s q Lustre q 150 PB of storage capacity q Bandwidth of ~1TB/s 4 The Evolution of Intel GPUs Source: Intel 5 Intel GPUs q Recent integrated generations: q Gen9 – used in Skylake q Gen11 – used in Ice Lake qGen9: Double precision peak performance: 100-300 GF q Low by design due to power and space limits qUpcoming Xe GPU q Discrete Layout of Architecture components for an Intel Core i7 processor 6700K for desktop systems (91 W TDP, 122 mm) 6 Intel Discrete Graphics 1 (DG1): q Intel Xe DG1: Software Development Vehicle(SDV) Shown At CES 2020 q Xe DG1 GPU is part of the low power (LP) series and is not a high-end product. q Chip will be used in laptops with GPU integrated on to the motherboard q PCIe form factor is only for the SDV and not a product q The SDV is shipping worldwide to integrated software vendors (ISVs) to enable broad software optimization for the Xe architecture. https://newsroom.intel.com/image-archive/images-intel-dgi-sdv/?wapkw=DG1#gs.u0a8t8 7 Aurora Compute Node q2 Intel Xeon (Sapphire Rapids) processors q6 Xe Architecture based GPUs (Ponte Vecchio) q All to all connection q Low latency and high bandwidth q8 Slingshot Fabric endpoints qUnified Memory Architecture across CPUs and GPUs 8 Network Interconnect Cray Shasta System qSupport diversity of processors qScale-optimized cabinets for density, cooling, and high network bandwidth qStandard cabinets for flexibility qCray SW stack with improved modularity qUnified by a single, high-performance Optimized Rack Standard Rack interconnect Shasta Hardware Workshop, May 6, 2019, Cray User Meeting 10 Cray Slingshot Network qSlingshot is next generation scalable interconnect by Cray q 8th major generation qBuilds on Cray’s expertise in high performance network following q Gemini (Titan, Blue Waters) q Aries (Theta, Cori) q 5 hop dragonfly topology qSlingshot introduces: q Congestion management q Traffic classes q 3 hop dragonfly Cray Slingshot https://www.cray.com/products/computing/slingshot https://www.cray.com/resources/slingshot-interconnect-for-exascale-era 11 Dragonfly Topology qSeveral groups are connected together using all to all links. qOptical cables are used for the long links between groups. qLow-cost electrical links are used to connect the NICs in each node to their local router and the routers in a group AllAll-to-all to All … Switch Switch Switch Switch Switch Switch Switch Switch Switch Switch Switch Switch … … … … Nodes Nodes Nodes Nodes Nodes Nodes Nodes Nodes Nodes Nodes Nodes Nodes GroupGroup 00 GroupGroup 1 1 GroupGroup 2 2 GroupGroup Z n https://www.cray.com/sites/default/files/resources/CrayXCNetwork.pdf 12 High Bandwidth Switch: Rosetta q Multi-level congestion management q To minimize the impact of congested applications on others q Very low average and tail latency qQuality of Service (QoS) – Traffic Classes q Class: Collection of buffers, queues and bandwidth q Intended to provide isolation between applications via traffic shaping q Aggressive adaptive routing q Expected to be more effective for 3-hop dragonfly due to closer congestion information Rosetta Switch q High performance multicast and reductions 25.6 Tb/s per switch, from 64 - 200 Gbs ports (25GB/s per direction) 13 Congestion Management with Slingshot q GPCNeT benchmark suite was utilized 14 GPCNeT (Global Performance and Congestion Network Tests) qA new benchmark developed by Cray in collaboration with Argonne and NERSC qPublicly available at https://github.com/netbench/GPCNET qGoals: q Proxy for real-world application communication patterns q Measure network performance under load q Look at both mean and tail latency q Look at interference between workloads q What is the Congestion management? q How well the system performs under congestion 15 Congestion Management with Slingshot q GPCNeT benchmark suit was utilized q Tail latency was measured at: q congested q isolated https://dl.acm.org/doi/pdf/10.1145/3295500.3356215 16 Congestion Management with Slingshot q GPCNeT benchmark suit was utilized qTail latency was measured at: q congested q isolated qBenchmark was run over the full machine for multiple runs qCongestion impact: q Latency congested/Latency isolated https://dl.acm.org/doi/pdf/10.1145/3295500.3356215 17 Congestion Management with Slingshot q GPCNeT benchmark suit was utilized Aries Network 10000 InfiniBand CI(99% Tail Latency) q Tail latency was measured at: CI(99% All Reduce) q congested q isolated 1000 q Benchmark was run over the full machine for multiple runs qCongestion impact: 100 q Latency congested/Latency isolated q Aries congestion impact is in order 10 of 1000x q InfiniBand has reduced congestion impact (20-1000x) scale) (log Impact Congestion 1 q Slingshot testbed (Malbec) has Crystal Theta Edison Osprey Summit Sierra Malbec minimal congestion impact https://dl.acm.org/doi/pdf/10.1145/3295500.3356215 18 Slingshot Quality of Service Classes § Highly tunable QoS classes Traffic type 1 § Supports multiple, overlaid virtual Traffic type 2 networks … Traffic type 3 § Jobs can use multiple traffic classes Bandwidth sharing without QoS § Provides performance isolation for different types of traffic Traffic class 1 Traffic class 2 Traffic class 3 Bandwidth sharing with QoS 19 I/O Distributed Asynchronous Object Store (DAOS) qOpen source storage solution qOffers high performance in bandwidth and IO operations q ≥ 230 PB capacity q ≥ 25 TB/s q Using DAOS is critical to achieving good I/O performance on Aurora qProvides compatibility with existing I/O models such as POSIX, MPI-IO and HDF5 qProvides a flexible storage API that enables new I/O paradigms DAOS (Distributed Asynchronous Object Storage) for Applications; Thursday 8:30-10:00AM 21 User Environment q User see single storage namespace which is in Lustre Compatibility with legacy systems q Links point to DAOS containers within the /project directory q DAOS aware software interpret these links and access the DAOS containers qData resides in a single place (Lustre or DAOS) q Explicit data movement, no auto-migration qSuggested storage locations q Source and binaries in Lustre q Bulk data in DAOS DAOS (Distributed Asynchronous Object Storage) for Applications; Thursday 8:30-10:00AM 22 Summary of Aurora Hardware Features qIntel/Cray machine arriving at Argonne in 2021 with sustained performance > 1 Exaflops qAurora node architecture q2 Intel Xeon (Sapphire Rapids) processors q6 Xe Architecture based GPUs (Ponte Vecchio) q8 Slingshot Fabric endpoints qUnified Memory Architecture across CPUs and GPUs qCray Sling Shot Network and Shasta platform q Highly tunable congestion management, traffic classes qI/O q DAOS (≥ 230 PB capacity and ≥ 25 TB/s) q Lustre (150 PB of storage and ~ 1TB/s) 23 Aurora Testbed Aurora Testbed qJLSE provides testbeds for Aurora – available today q 20 Nodes of Intel Xeons with Gen9 Iris Pro integrated GPU q Intel’s Aurora SDK that already includes many of the compilers, libraries, tools, and programming models planned for Aurora. [NDA required] q OpenMP q DPC++/SYCL q OpenCL q Intel VTune and Advisor q If you’d like to develop your application on the integrated Gen9 GPU, request access by sending email Joint Laboratory for System Evaluation to [email protected]. (JLSE) https://jlse.anl.gov q Note your home institution needs a CNDA agreement with Intel. 25 Intel Gen9 Integrated Graphics qCPUs and GPUs are integrated on same chip: q GPU and CPU same memory q GPU, cores, and memory are connected by an internal ring interconnect q Shared Last Level Cache IDf-2015 release of “The Compute Architecture of Intel Processor Graphics Gen9” – Stephen Junkins 26 Intel Gen9 Hierarchy q GPU architectures have hardware hierarchies q Built out of smaller scalable units, each level shares a set of resources Slice Sub-Slice Execution Unit (EU) 27 Intel Gen9 Building Blocks: EU EU: Execution Unit q These are compute processors that executes
Recommended publications
  • Petaflops for the People
    PETAFLOPS SPOTLIGHT: NERSC housands of researchers have used facilities of the Advanced T Scientific Computing Research (ASCR) program and its EXTREME-WEATHER Department of Energy (DOE) computing predecessors over the past four decades. Their studies of hurricanes, earthquakes, NUMBER-CRUNCHING green-energy technologies and many other basic and applied Certain problems lend themselves to solution by science problems have, in turn, benefited millions of people. computers. Take hurricanes, for instance: They’re They owe it mainly to the capacity provided by the National too big, too dangerous and perhaps too expensive Energy Research Scientific Computing Center (NERSC), the Oak to understand fully without a supercomputer. Ridge Leadership Computing Facility (OLCF) and the Argonne Leadership Computing Facility (ALCF). Using decades of global climate data in a grid comprised of 25-kilometer squares, researchers in These ASCR installations have helped train the advanced Berkeley Lab’s Computational Research Division scientific workforce of the future. Postdoctoral scientists, captured the formation of hurricanes and typhoons graduate students and early-career researchers have worked and the extreme waves that they generate. Those there, learning to configure the world’s most sophisticated same models, when run at resolutions of about supercomputers for their own various and wide-ranging projects. 100 kilometers, missed the tropical cyclones and Cutting-edge supercomputing, once the purview of a small resulting waves, up to 30 meters high. group of experts, has trickled down to the benefit of thousands of investigators in the broader scientific community. Their findings, published inGeophysical Research Letters, demonstrated the importance of running Today, NERSC, at Lawrence Berkeley National Laboratory; climate models at higher resolution.
    [Show full text]
  • Fact Sheet: the Next Generation of Computing Has Arrived
    News Fact Sheet The Next Generation of Computing Has Arrived: Performance to Power Amazing Experiences The new 5th Generation Intel® Core™ processor family is Intel’s latest wave of 14nm processors, delivering improved system and graphics performance, more natural and immersive user experiences, and enabling longer battery life compared to previous generations. The release of the 5th Generation Intel Core technology includes 14 new processors for consumers and businesses, including 10 new 15W processors with Intel® HD Graphics and four new 28W products with Intel® Iris™ Graphics. The 5th Generation Intel Core processor is purpose-built for the next generation of compute devices offering a thinner, lighter and more efficient experience across diverse form factors, including traditional notebooks, 2 in 1s, Ultrabooks™, Chromebooks, all-in-one desktop PCs and mini PCs. With the 5th Generation Intel Core processor availability, the “Broadwell” microarchitecture is expected to be the fastest mobile transition in company history to offer consumers a broad selection and availability of devices. Intel also started shipping its next generation 14nm processor for tablets, codenamed “Cherry Trail”, to device manufacturers. The new system on a chip (SoC) offers 64-bit computing, improved graphics with Intel® Generation 8-LP graphics, great performance and battery life for mainstream tablets. The platform offers world-class modem capabilities with LTE-Advanced on Intel® XMM™ 726x platform, which supports Cat-6 speeds and carrier aggregation. Customers will introduce new products based on this platform starting in the first half of this year. Key benefits of the 5th Generation Intel Core family and the next-generation 14nm processor for tablets include: Powerful Performance.
    [Show full text]
  • Intel® Architecture Instruction Set Extensions and Future Features Programming Reference
    Intel® Architecture Instruction Set Extensions and Future Features Programming Reference 319433-037 MAY 2019 Intel technologies features and benefits depend on system configuration and may require enabled hardware, software, or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifica- tions. Current characterized errata are available on request. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Intel does not guarantee the availability of these interfaces in any future product. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1- 800-548-4725, or by visiting http://www.intel.com/design/literature.htm. Intel, the Intel logo, Intel Deep Learning Boost, Intel DL Boost, Intel Atom, Intel Core, Intel SpeedStep, MMX, Pentium, VTune, and Xeon are trademarks of Intel Corporation in the U.S.
    [Show full text]
  • GPU Developments 2018
    GPU Developments 2018 2018 GPU Developments 2018 © Copyright Jon Peddie Research 2019. All rights reserved. Reproduction in whole or in part is prohibited without written permission from Jon Peddie Research. This report is the property of Jon Peddie Research (JPR) and made available to a restricted number of clients only upon these terms and conditions. Agreement not to copy or disclose. This report and all future reports or other materials provided by JPR pursuant to this subscription (collectively, “Reports”) are protected by: (i) federal copyright, pursuant to the Copyright Act of 1976; and (ii) the nondisclosure provisions set forth immediately following. License, exclusive use, and agreement not to disclose. Reports are the trade secret property exclusively of JPR and are made available to a restricted number of clients, for their exclusive use and only upon the following terms and conditions. JPR grants site-wide license to read and utilize the information in the Reports, exclusively to the initial subscriber to the Reports, its subsidiaries, divisions, and employees (collectively, “Subscriber”). The Reports shall, at all times, be treated by Subscriber as proprietary and confidential documents, for internal use only. Subscriber agrees that it will not reproduce for or share any of the material in the Reports (“Material”) with any entity or individual other than Subscriber (“Shared Third Party”) (collectively, “Share” or “Sharing”), without the advance written permission of JPR. Subscriber shall be liable for any breach of this agreement and shall be subject to cancellation of its subscription to Reports. Without limiting this liability, Subscriber shall be liable for any damages suffered by JPR as a result of any Sharing of any Material, without advance written permission of JPR.
    [Show full text]
  • 1 Intel CEO Remarks Pat Gelsinger Q2'21 Earnings Webcast July 22
    Intel CEO Remarks Pat Gelsinger Q2’21 Earnings Webcast July 22, 2021 Good afternoon, everyone. Thanks for joining our second-quarter earnings call. It’s a thrilling time for both the semiconductor industry and for Intel. We're seeing unprecedented demand as the digitization of everything is accelerated by the superpowers of AI, pervasive connectivity, cloud-to-edge infrastructure and increasingly ubiquitous compute. Our depth and breadth of software, silicon and platforms, and packaging and process, combined with our at-scale manufacturing, uniquely positions Intel to capitalize on this vast growth opportunity. Our Q2 results, which exceeded our top and bottom line expectations, reflect the strength of the industry, the demand for our products, as well as the superb execution of our factory network. As I’ve said before, we are only in the early innings of what is likely to be a decade of sustained growth across the industry. Our momentum is building as once again we beat expectations and raise our full-year revenue and EPS guidance. Since laying out our IDM 2.0 strategy in March, we feel increasingly confident that we're moving the company forward toward our goal of delivering leadership products in every category in which we compete. While we have work to do, we are making strides to renew our execution machine: 7nm is progressing very well. We’ve launched new innovative products, established Intel Foundry Services, and made operational and organizational changes to lay the foundation needed to win in the next phase of our company’s great history. Here at Intel, we’re proud of our past, pragmatic about the work ahead, but, most importantly, confident in our future.
    [Show full text]
  • Future-ALCF-Systems-Parker.Pdf
    Future ALCF Systems Argonne Leadership Computing Facility 2021 Computational Performance Workshop, May 4-6 Scott Parker www.anl.gov Aurora Aurora: A High-level View q Intel-HPE machine arriving at Argonne in 2022 q Sustained Performance ≥ 1Exaflops DP q Compute Nodes q 2 Intel Xeons (Sapphire Rapids) q 6 Intel Xe GPUs (Ponte Vecchio [PVC]) q Node Performance > 130 TFlops q System q HPE Cray XE Platform q Greater than 10 PB of total memory q HPE Slingshot network q Fliesystem q Distributed Asynchronous Object Store (DAOS) q ≥ 230 PB of storage capacity; ≥ 25 TB/s q Lustre q 150PB of storage capacity; ~1 TB/s 3 The Evolution of Intel GPUs 4 The Evolution of Intel GPUs 5 XE Execution Unit qThe EU executes instructions q Register file q Multiple issue ports q Vector pipelines q Float Point q Integer q Extended Math q FP 64 (optional) q Matrix Extension (XMX) (optional) q Thread control q Branch q Send (memory) 6 XE Subslice qA sub-slice contains: q 16 EUs q Thread dispatch q Instruction cache q L1, texture cache, and shared local memory q Load/Store q Fixed Function (optional) q 3D Sampler q Media Sampler q Ray Tracing 7 XE 3D/Compute Slice qA slice contains q Variable number of subslices q 3D Fixed Function (optional) q Geometry q Raster 8 High Level Xe Architecture qXe GPU is composed of q 3D/Compute Slice q Media Slice q Memory Fabric / Cache 9 Aurora Compute Node • 6 Xe Architecture based GPUs PVC PVC (Ponte Vecchio) • All to all connection PVC PVC • Low latency and high bandwidth PVC PVC • 2 Intel Xeon (Sapphire Rapids) processors Slingshot
    [Show full text]
  • Hardware Developments V E-CAM Deliverable 7.9 Deliverable Type: Report Delivered in July, 2020
    Hardware developments V E-CAM Deliverable 7.9 Deliverable Type: Report Delivered in July, 2020 E-CAM The European Centre of Excellence for Software, Training and Consultancy in Simulation and Modelling Funded by the European Union under grant agreement 676531 E-CAM Deliverable 7.9 Page ii Project and Deliverable Information Project Title E-CAM: An e-infrastructure for software, training and discussion in simulation and modelling Project Ref. Grant Agreement 676531 Project Website https://www.e-cam2020.eu EC Project Officer Juan Pelegrín Deliverable ID D7.9 Deliverable Nature Report Dissemination Level Public Contractual Date of Delivery Project Month 54(31st March, 2020) Actual Date of Delivery 6th July, 2020 Description of Deliverable Update on "Hardware Developments IV" (Deliverable 7.7) which covers: - Report on hardware developments that will affect the scientific areas of inter- est to E-CAM and detailed feedback to the project software developers (STFC); - discussion of project software needs with hardware and software vendors, completion of survey of what is already available for particular hardware plat- forms (FR-IDF); and, - detailed output from direct face-to-face session between the project end- users, developers and hardware vendors (ICHEC). Document Control Information Title: Hardware developments V ID: D7.9 Version: As of July, 2020 Document Status: Accepted by WP leader Available at: https://www.e-cam2020.eu/deliverables Document history: Internal Project Management Link Review Review Status: Reviewed Written by: Alan Ó Cais(JSC) Contributors: Christopher Werner (ICHEC), Simon Wong (ICHEC), Padraig Ó Conbhuí Authorship (ICHEC), Alan Ó Cais (JSC), Jony Castagna (STFC), Godehard Sutmann (JSC) Reviewed by: Luke Drury (NUID UCD) and Jony Castagna (STFC) Approved by: Godehard Sutmann (JSC) Document Keywords Keywords: E-CAM, HPC, Hardware, CECAM, Materials 6th July, 2020 Disclaimer:This deliverable has been prepared by the responsible Work Package of the Project in accordance with the Consortium Agreement and the Grant Agreement.
    [Show full text]
  • Marc and Mentat Release Guide
    Marc and Mentat Release Guide Marc® and Mentat® 2020 Release Guide Corporate Europe, Middle East, Africa MSC Software Corporation MSC Software GmbH 4675 MacArthur Court, Suite 900 Am Moosfeld 13 Newport Beach, CA 92660 81829 Munich, Germany Telephone: (714) 540-8900 Telephone: (49) 89 431 98 70 Toll Free Number: 1 855 672 7638 Email: [email protected] Email: [email protected] Japan Asia-Pacific MSC Software Japan Ltd. MSC Software (S) Pte. Ltd. Shinjuku First West 8F 100 Beach Road 23-7 Nishi Shinjuku #16-05 Shaw Tower 1-Chome, Shinjuku-Ku Singapore 189702 Tokyo 160-0023, JAPAN Telephone: 65-6272-0082 Telephone: (81) (3)-6911-1200 Email: [email protected] Email: [email protected] Worldwide Web www.mscsoftware.com Support http://www.mscsoftware.com/Contents/Services/Technical-Support/Contact-Technical-Support.aspx Disclaimer User Documentation: Copyright 2020 MSC Software Corporation. All Rights Reserved. This document, and the software described in it, are furnished under license and may be used or copied only in accordance with the terms of such license. Any reproduction or distribution of this document, in whole or in part, without the prior written authorization of MSC Software Corporation is strictly prohibited. MSC Software Corporation reserves the right to make changes in specifications and other information contained in this document without prior notice. The concepts, methods, and examples presented in this document are for illustrative and educational purposes only and are not intended to be exhaustive or to apply to any particular engineering problem or design. THIS DOCUMENT IS PROVIDED ON AN “AS-IS” BASIS AND ALL EXPRESS AND IMPLIED CONDITIONS, REPRESENTATIONS AND WARRANTIES, INCLUDING ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE DISCLAIMED, EXCEPT TO THE EXTENT THAT SUCH DISCLAIMERS ARE HELD TO BE LEGALLY INVALID.
    [Show full text]
  • Motherboards, Processors, and Memory
    220-1001 COPYRIGHTED MATERIAL c01.indd 03/23/2019 Page 1 Chapter Motherboards, Processors, and Memory THE FOLLOWING COMPTIA A+ 220-1001 OBJECTIVES ARE COVERED IN THIS CHAPTER: ✓ 3.3 Given a scenario, install RAM types. ■ RAM types ■ SODIMM ■ DDR2 ■ DDR3 ■ DDR4 ■ Single channel ■ Dual channel ■ Triple channel ■ Error correcting ■ Parity vs. non-parity ✓ 3.5 Given a scenario, install and configure motherboards, CPUs, and add-on cards. ■ Motherboard form factor ■ ATX ■ mATX ■ ITX ■ mITX ■ Motherboard connectors types ■ PCI ■ PCIe ■ Riser card ■ Socket types c01.indd 03/23/2019 Page 3 ■ SATA ■ IDE ■ Front panel connector ■ Internal USB connector ■ BIOS/UEFI settings ■ Boot options ■ Firmware upgrades ■ Security settings ■ Interface configurations ■ Security ■ Passwords ■ Drive encryption ■ TPM ■ LoJack ■ Secure boot ■ CMOS battery ■ CPU features ■ Single-core ■ Multicore ■ Virtual technology ■ Hyperthreading ■ Speeds ■ Overclocking ■ Integrated GPU ■ Compatibility ■ AMD ■ Intel ■ Cooling mechanism ■ Fans ■ Heat sink ■ Liquid ■ Thermal paste c01.indd 03/23/2019 Page 4 A personal computer (PC) is a computing device made up of many distinct electronic components that all function together in order to accomplish some useful task, such as adding up the numbers in a spreadsheet or helping you to write a letter. Note that this defi nition describes a computer as having many distinct parts that work together. Most PCs today are modular. That is, they have components that can be removed and replaced with another component of the same function but with different specifi cations in order to improve performance. Each component has a specifi c function. Much of the computing industry today is focused on smaller devices, such as laptops, tablets, and smartphones.
    [Show full text]
  • Intel 2019 Year Book
    YEARBOOK 2019 POWERING THE FUTURE Our 2019 yearbook invites you to look back and reflect on a memorable year for Intel. TABLE OF CONTENTS 2019 kicked off with the announcement of our new p4 New CEO. Evolving culture. Expanded ambitions. chief executive, Bob Swan. It was followed by a stream of notable news: product announcements, technology p6 More data. More storage. More processing. breakthroughs, new customers and partnerships, p10 Innovation for the PC user experience and important moves to evolve Intel’s culture as the company entered its sixth decade. p12 Self-driving cars hit the road p2 p16 AI unlocks the power of data It’s a privilege to tell the Intel story in all its complexity and humanity. Looking through these pages, the p18 Helping customers push boundaries breadth and depth of what we’ve achieved in 12 p22 More supply to meet strong demand months is substantial, as is the strong foundation we’ve built for even greater impact in the future. p26 Next-gen hardware and software to unlock it p28 Tech’s future: Inventing and investing I hope you enjoy this colorful look at what’s possible when more than 100,000 individuals from every p32 Reinforcing the nature of Moore’s Law corner of the globe unite to change the world – p34 Building for the smarter future through technologies that make a positive difference to our customers, to society, and to people’s lives. — Claire Dixon, Chief Communications Officer NEW CEO. EVOLVING CULTURE. EXPANDED AMBITIONS. 2019 was an important year in Intel’s transformation, with a new chief executive officer, ambitious business priorities, an aspirational culture evolution, and a farewell to Focal.
    [Show full text]
  • Intel® Architecture Instruction Set Extensions and Future Features Programming Reference
    Intel® Architecture Instruction Set Extensions and Future Features Programming Reference 319433-041 OCTOBER 2020 Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Your costs and results may vary. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All product plans and roadmaps are subject to change without notice. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. Code names are used by Intel to identify products, technologies, or services that are in development and not publicly available. These are not “commercial” names and not intended to function as trademarks. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be ob- tained by calling 1-800-548-4725, or by visiting http://www.intel.com/design/literature.htm. Copyright © 2020, Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.
    [Show full text]
  • EARNINGS Presentation Disclosures
    Q2 2020 EARNINGS Presentation Disclosures This presentation contains non-GAAP financial measures. Earnings per share (EPS), gross margin, and operating margin are presented on a non- GAAP basis unless otherwise indicated, and this presentation also includes a non-GAAP free cash flow (FCF) measure. The Appendix provides a reconciliation of these measures to the most directly comparable GAAP financial measure. The non-GAAP financial measures disclosed by Intel should not be considered a substitute for, or superior to, the financial measures prepared in accordance with GAAP. Please refer to “Explanation of Non-GAAP Measures” in Intel's quarterly earnings release for a detailed explanation of the adjustments made to the comparable GAAP measures, the ways management uses the non-GAAP measures, and the reasons why management believes the non-GAAP measures provide investors with useful supplemental information. Statements in this presentation that refer to business outlook, future plans, and expectations are forward-looking statements that involve a number of risks and uncertainties. Words such as "anticipate," "expect," "intend," "goals," "plans," "believe," "seek," "estimate," "continue,“ “committed,” “on-track,” ”positioned,” “launching,” "may," "will," “would,” "should," “could,” and variations of such words and similar expressions are intended to identify such forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, uncertain events or assumptions, including statements relating to total addressable market (TAM) or market opportunity, future products and technology and the expected availability and benefits of such products and technology, including our 10nm and 7nm process technologies, products, and product designs, and anticipated trends in our businesses or the markets relevant to them, also identify forward-looking statements.
    [Show full text]