Qualcomm 3D Sonic Sensor Fingerprint Ultrasonic Fingerprint Sensor SP19465 - MEMS Report by Stéphane ELISABETH LAB

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Qualcomm 3D Sonic Sensor Fingerprint Ultrasonic Fingerprint Sensor SP19465 - MEMS report by Stéphane ELISABETH LAB. Analysis by Veronique LE TROADEC July 2019 – Sample

Overview / Introduction 4 Comparison with Qualcomm Sense ID 80 o Executive Summary o Comparison with LeEco Le Max Fingerprint: o Reverse Costing Methodology Integration, Structure, Die, Process Company Profile 8 Manufacturing Process 87 o Qualcomm o Global Overview o Samsung Galaxy S10 Plus Teardown o Ultrasonic Sensor Die Front-End Process & Fabrication Unit Market Analysis 18 o Sensor Front-End Process Flow o MEMS & Sensors Market Forecast o ASIC Front-End Process Flow & Fabrication Unit Physical Analysis 21 Cost Analysis 97 o Summary of the cost analysis 98 o Summary of the Physical Analysis 22 o Yields Explanation & Hypotheses 100 o Module Extraction 23 o Ultrasonic Sensor die 102  Display Integration  Sensor Front-End Cost  AMOLED Display Interaction  Sensor Die Probe Test & Dicing  Display Cross-Section  Sensor Die Panel & Die Cost o Module Assembly 32 o ASIC Component 105  Module Views & Disassembly  ASIC Front-End Cost  Module Cross-Section  ASIC Die Probe Test, Bumping & Dicing o Sensor Die 42  ASIC Wafer & Die Cost  Sensor Die View & Dimensions o Module Cost 109  Sensor Overview & main Blocs Cost Comparison with Synaptics FS9500 114  Sensor Die Cross-Section o Comparison with Vivo X21UD Fingerprint:  Sensor Die Process Characteristic Integration, Sensor and ASIC, Cost o ASIC Component 58 Selling price 118  Package View & Dimensions Feedbacks 122  ASIC Die View & Dimensions SystemPlus Consulting services 124  ASIC Delayering & main Blocs  ASIC Die Process  ASIC Die Cross-Section  ASIC Die Process Characteristic ©2019 by System Plus Consulting | SP19465 – Qualcomm 3D Sonic Sensor 2 Executive Summary

Overview / Introduction o Executive Summary o Reverse Costing Methodology • This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price o Glossary of the Qualcomm 3D Sonic Sensor.

Company Profile & Supply Chain

Market Analysis • Either with the Exynos or the Qualcomm Chipset, the Samsung Galaxy S10 series is the first to feature the Ultrasonic Fingerprint Sensor directly under display. The sensor is located on the front of the device directly glued on the OLED material. Physical Analysis

Physical Comparison • This report focusses on analyzing the ultrasonic sensor and its integration with the display. The sensor is manufactured using Manufacturing Process Flow LTPS (Low-Temperature Polycrystalline Silicon) technology on glass substrate. Using ferroelectric polymer, the sensor generated and process ultrasonic waves on the substrate. The component includes also acoustic horn structure in order to Cost Analysis focalize the ultrasonic waves.

Cost Comparison

Selling Price Analysis • Since the last version of the device, Qualcomm managed to realize several changes at the TFT level reusing some mask layers. Also, the QBIC (Qualcomm Biometric Integrated Circuit) has evolved in term of circuit and power handling. Related Reports

About System Plus • This complete analysis of the Ultrasonic Fingerprint Module includes analyses of the Sensor die and the ASIC, along with a cost analysis and price estimation for the module. It also includes a physical and technical comparison with the previous version of the sensor in the LeEco LeMax Pro.

Overview / Introduction Dimensions Company Profile & Supply Chain o Height: 162.6 mm o Qualcomm o Width: 77.1 mm o Fingerprint Technology o Thickness: 7.9 mm o Samsung Galaxy S10 Teardown

Market Analysis Weight o 198 g Physical Analysis

Physical Comparison

Manufacturing Process Flow • By using the Ultrasonic Cost Analysis fingerprint sensor, Samsung can Cost Comparison provide an almost full front display. Selling Price Analysis

Related Reports Fingerprint About System Plus Sensor

Overview / Introduction

Company Profile & Supply Chain o Qualcomm o Fingerprint Technology o Samsung Galaxy S10 Teardown

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis o MEMS & Sensor Forecast

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Module Extraction Copper Layer o Module Assembly Polymer #1 Layer o Views & Dimensions o Cross-Section o Sensor Die o Views & Dimensions o Overview o Die Process Sensor Die Flex PCB o Die Cross-section o ASIC Component o Views & Dimensions o Delayering o Die Process Adhesive o Die Cross-section

Physical Comparison

Manufacturing Process Flow

Selling Price Analysis

Related Reports

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Module Extraction o Module Assembly o Views & Dimensions o Cross-Section o Sensor Die o Views & Dimensions o Overview o Die Process o Die Cross-section o ASIC Component Qualcomm 3D Sonic Sensor Assembly o Views & Dimensions ©2019 by System Plus Consulting o Delayering o Die Process o Die Cross-section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Module Extraction o Module Assembly o Views & Dimensions o Cross-Section o Sensor Die o Views & Dimensions o Overview o Die Process o Die Cross-section o ASIC Component o Views & Dimensions o Delayering o Die Process o Die Cross-section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Module Extraction o Module Assembly o Views & Dimensions o Cross-Section o Sensor Die o Views & Dimensions o Overview o Die Process o Die Cross-section o ASIC Component o Views & Dimensions o Delayering o Die Process o Die Cross-section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Module Extraction o Module Assembly o Views & Dimensions o Cross-Section o Sensor Die o Views & Dimensions o Overview o Die Process o Die Cross-section o ASIC Component o Views & Dimensions o Delayering o Die Process o Die Cross-section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Module Extraction o Module Assembly o Views & Dimensions o Cross-Section o Sensor Die o Views & Dimensions o Overview o Die Process o Die Cross-section o ASIC Component o Views & Dimensions o Delayering o Die Process o Die Cross-section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain nd st Physical Analysis 2 Gen. 1 Gen. Fingerprint Sensor Physical Comparison o Integration o Module o Module Cross-Section o Sensor Die o Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

• The sensor was first integrated under a metal cover back in 2016.

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow o Sensor Die Front-End Process o Sensor Fabrication Unit o Sensor Die Process Flow o ASIC Die Front-End Process o ASIC Fabrication Unit

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow o Sensor Die Front-End Process o Sensor Fabrication Unit o Sensor Die Process Flow o ASIC Die Front-End Process o ASIC Fabrication Unit

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o Sensor Die Cost o ASIC Component Cost o Complete Module Cost

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o Sensor Die Cost o ASIC Component Cost o Complete Module Cost

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o Sensor Die Cost o ASIC Component Cost o Complete Module Cost

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison o Optical vs. Ultrasonic Module o Integration o Sensor o Cost

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis o Definition of Prices o Manufacturer Financials o Complete Module Price

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT Physical Analysis MEMS & SENSORS MEMS & SENSORS • Physical Comparison • Synaptics’ Under-Display Fingerprint Scanner Inside the VIVO X21 Status of the MEMS Industry 2019 UD Smartphone • Consumer Biometrics: Market and Technologies Trends 2018 Manufacturing Process Flow • FPC’s FPC1268 in the Huawei Mate 9 Pro and Huawei P10 series • Next-Generation Human Machine Interaction in Displays 2019 • Qualcomm® Snapdragon Sense™ ID 3D Fingerprint Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis Physical Comparison Custom Analyses Manufacturing Process Flow (>130 analyses per year)

Cost Analysis Cost Comparison Reports Selling Price Analysis (>60 reports per year) Related Reports

About System Plus o Company services o Contact Costing Tools

Trainings

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison FRANKFURT/MAIN Europe Sales Office

Manufacturing Process Flow NANTES LYON KOREA Headquarter YOLE HQ YOLE Cost Analysis TOKYO PHOENIX YOLE KK YOLE Inc. Cost Comparison GREATER CHINA YOLE Selling Price Analysis

Related Reports

About System Plus o Company services o Contact Headquarters Europe Sales Office America Sales Office Asia Sales Office 22 bd Benoni Goullin Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA 44200 Nantes Frankfurt am Main Phoenix, AZ Tokyo FRANCE GERMANY WESTERN US JAPAN +33 2 40 18 09 16 +49 151 23 54 41 82 T : +1 310 600 8267 T : +81 804 371 4887 [email protected] [email protected] [email protected] [email protected]

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