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PRODUCT CHANGE NOTIFICATION (PCN)

Release Date: October 26th, 2018 Product Category: Express-IBE2 Models Affected: Express-IBE2 Series, Accessories and Semi-Custom Deriva�ves Purpose of No�fica�on: Product End of Lifecycle Status

Change of Lifecycle Status – End of Life Transi�on

In accordance with the Lifecycle Solu�onsSM program for ADLINK products, ADLINK announces that the product models listed in this no�fica�on and all its semi-custom deriva�ves are being transi�oned from Con�nued Availability to End of Life status. Affected by Intel’s Product Change No�fica�on (PCN, #116430-00) on August 18, 2018, Express-IBE2 Series, Accessories and Semi-Custom Deriva�ves will no longer be available for sale.

Material EOL:

Descrip�on: Intel® BD82QM77 Pla�orm Controller Hub . Manufacturer: Intel . Product Code: BD82QM77 (QM77)

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List of Affected Models:

Model Description Recommended Successor Product(s)

COM Express® Basic Size Type 2 Module with Intel® Express-IBE2-i7-3615QE Core™ i7-3615QE SV at 2.3 GHz

COM Express® Basic Size Type 2 Module with Intel® Express-IBE2-1020E Celeron® 1020E at 2.2GHz

COM Express® Basic Size Type 2 Module with Inte® Express-IBE2-1047UE Celeron® 1047UE 1.4 GHz

Express-IBE2-i7-3612QE COM Express® Basic Size Type 2 Module with Intel® Core™ i7-3612QE SV at 2.1 GHz Express-HL2 Series COM Express® Basic Size Type 2 Module with 4th Express-IBE2-i7-3555LE COM Express® Basic Size Type 2 Module with Intel® Generation Intel® Core™ i7/i5/i3 Processor (formerly Core™ i7-3555LE LV at 2.5 GHz codename: Haswell)

COM Express® Basic Size Type 2 Module with Intel® Express-IBE2-927UE Celeron® 927UE 1.5 GHz *Please refer to product datasheets enclosed at COM Express® Basic Size Type 2 Module with Intel® the end of this PCN Express-IBE2-i7-3517UE Core™ i7-3517UE ULV at 1.7 GHz

COM Express® Basic Size Type 2 Module with Intel® Express-IBE2-i5-3610ME Core™ i5-3610ME SV 2.7 GHz

COM Express® Basic Size Type 2 Module with Intel® Express-IBE2-i3-3120ME Core™ i3-3120ME SV at 2.4 GHz

COM Express® Basic Size Type 2 Module with Intel® Express-IBE2-i3-3217UE Core™ i3-3217UE ULV at 1.6 GHz

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Express-IBE2 Functional Diagram:

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Express-HL2 Functional Diagram:

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Key Dates:

Last �me buy date: July 19th, 2019 Last �me ship date: June 12th, 2020

ADLINK will accept orders for Express-IB product series un�l July 19th, 2019. Last �me ship date is June 12th, 2020. Orders for these products will be non-cancelable and non-returnable (NCNR) and dependent upon demand; these products may be subject to a minimum order quan�ty.

Customers of the Express-IBE2 product series are encouraged to migrate to Express-HL2 product series. Samples of the Express-HL2 are available immediately.

An important part of the Lifecycle Solu�ons program for ADLINK products is to provide customers with no�ce of any changes that might affect long-term product usage or availability. Except for circumstances requiring immediate changes, ADLINK normally provides a few months advance no�ce of changes that affect the form, fit, or func�on of the product. If you have any ques�ons or concerns about this no�ce, please contact your ADLINK sales representa�ve.

If you have technical ques�ons about this product no�fica�on, please contact your ADLINK Field Applica�ons Engineer directly. Otherwise, you can call ADLINK at 1-800-966-5200 or 408-360-0200. For online technical support, please visit our Ask an Expert page at h�p://askanexpert.adlinktech.com/AAE/Answers.aspx and click the tab labeled “Ask a Ques�on”.

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Product Change Notification

Change Notification #: 116430 - 00 Change Title: Select Intel® Platform Controller Hubs, PCN 116430-00, Product Discontinuance, End of Life Date of Publication: August 18, 2018

Key Characteristics of the Change: Product Discontinuance

Forecasted Key Milestones: Product Discontinuance Program Support Begins: August 18, 2018 Last Product Discontinuance Order Date: August 23, 2019 Orders for Discontinued Products Become Non-Cancelable: August 23, 2019 Last Product Discontinuance Shipment Date: February 21, 2020

Description of Change to the Customer: Intel will discontinue the manufacturing of select products listed in the "Products Affected/Intel Ordering Codes" table below and the products will become unavailable for additional orders after August 23, 2019.

Customer Impact of Change and Recommended Action: Please determine your remaining demand for the products listed in the "Products Affected/Intel Ordering Codes" table and place your "Last Product Discontinuance Order" in accordance with the "Key Milestones" listed above.

Functional Analysis Correlation Request (FA/CR) support for the products listed in the "Products Affected/Intel Ordering Codes" table will follow standard FA/CR support timelines.

Please contact your Intel Field Sales Representative with any questions, requests or concerns.

Products Affected / Intel Ordering Codes: Marketing Name Product Platform Spec MM# Code Code

Intel® BD82QM67 Platform Controller Hub BD82QM67 Mobile SLJ4M 914325 Intel® BD82HM65 Platform Controller Hub BD82HM65 Mobile SLJ4P 914377 Intel® BD82B65 Platform Controller Hub BD82B65 Desktop SLJ4A 914379 Intel® BD82H61 Platform Controller Hub BD82H61 Desktop SLJ4B 914380 Intel® BD82Q67 Platform Controller Hub BD82Q67 Desktop SLJ4D 914397 Intel® BD82C206 Platform Controller Hub BD82C206 Server SLJ4G 914417

Page 1 of PCN #116430 - 00 3 Intel® BD82QM77 Platform Controller Hub BD82QM77 Mobile SLJ8A 915663 Intel® BD82HM76 Platform Controller Hub BD82HM76 Mobile SLJ8E 915666 Intel® BD82Q77 Platform Controller Hub BD82Q77 Desktop SLJ83 915673 Intel® BD82B75 Platform Controller Hub BD82B75 Desktop SLJ85 915675 Intel® BD82C216 Platform Controller Hub BD82C216 Server SLJ8H 915680

PCN Revision History: Date of Revision: Revision Number: Reason: August 18, 2018 00 Originally Published PCN

Page 2 of PCN #116430 - 00 3

Product Change Notification 116430 - 00

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Should you have any issues with the timeline or content of this change, please contact the Intel Representative(s) for your geographic location listed below. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.

Americas Contact: [email protected] Asia Pacific/PRC Contact: [email protected] Europe Email: [email protected] Japan Email: [email protected]

Copyright © Intel Corporation 2018. Other names and brands may be claimed as the property of others.

3D XPoint, Axxia, Basis, Basis Peak, BlueMoon, BunnyPeople, Celeron, Centrino, Cilk, Curie, Flexpipe, Intel, the Intel logo, Intel Atom, Intel CoFluent, Intel Core, Intel. Experience What's Inside, the Intel. Experience What's Inside logo, Intel Inside, the Intel Inside logo, Intel Insider, Intel Joule, Intel RealSense, Intel SingleDriver, Intel SpeedStep, Intel Unite, Intel vPro, Intel Xeon Phi, Intel XScale, InTru, the InTru logo, the InTru Inside logo, InTru soundmark, Iris, Itanium, MCS, MMX, Optane, Ostro, Pali, Pentium, picoArray, Picochip, picoXcell, Puma, Quark, SMARTi, Soletta, Sound Mark, StarPro, Stay With It, the Engineering Stay With It logo, StreamSight, Tarari, The Journey Inside, Thunderbolt, the Thunderbolt logo, Transcede, True Key, Ultrabook, VTune, Xeon, X-GOLD, XMM, X-PMU and XPOSYS are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.

Microsoft, Windows, and the Windows logo are trademarks, or registered trademarks of Microsoft Corporation in the United States and/or other countries. Java is a registered trademark of Oracle and/or its affiliates. Bluetooth is a trademark owned by its proprietor and used by Intel Corporation under license. Intel Corporation uses the Palm OS* Ready mark under license from Palm, Inc. OpenCL and the OpenCL logo are trademarks of Apple Inc. used by permission by Khronos. Learn how to use Intel Trademarks and Brands correctly at http://www.intel.com/intel/legal/tmusage2.htm.

Page 3 of PCN #116430 - 00 3 Express-HL2 COM Express® Basic Size Type 2 Module with Intel® Core™ and Celeron® Processor

Features

® ® ● Intel i7/i5/i3 and Celeron 200XE series Processor with Mobile Intel® QM87 Express Chipset ● Up to 16GB Dual Channel DDR3L at 1600MHz ● Dual Channel LVDS and VGA supporting 2 independent displays ● Six PCIe x1, one PCIe x16 and 32-bit PCI-bus ● GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0 ® ● Supports Smart Embedded Management Agent (SEMA ) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option)

Specifications

● Core System ● Video CPU GPU Feature Support Intel® Core™ i7 Processors (Mobile) - 22nm Generation 7.5 graphics core architecture, supporting i7-4860EQ 2.4 GHz (3.2 GHz Turbo), 47W (4C/GT3) 2 independent and simultaneous display i7-4700EQ 2.4 GHz (3.4 GHz Turbo), 47W (4C/GT2) combinations of VGA and LVDS monitors i5-4400E 2.7 GHz (3.3 GHz Turbo), 37W (2C/GT2) Encode/transcode HD content i5-4402E 1.6 GHz (2.7 GHz Turbo), 25W (2C/GT2) i3-4100E 2.4 GHz (no Turbo) 3MB, 37W (2C/GT2) LVDS i3-4102E 1.6 GHz (no Turbo) 3MB, 25W (2C/GT2) Single/dual channel 18/24-bit LVDS from eDP (two lanes) Celeron® 2000E 2.2 GHz (no Turbo) 35W (2C/GT1) Celeron® 2002E 1.5 GHz (no Turbo) 25W (2C/GT1) VGA Supports : Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Analog VGA support with 300 MHz DAC Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® Analog monitor support up to QXGA (2048 x 1536) AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX Note: Availability of the features may vary between processor SKUs. ● Audio Memory Chipset Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 16GB in dual Intel® HD Audio integrated in SOC SODIMM socket Audio Codec Embedded BIOS Located on carrier Express-BASE6 (ALC886 standard supported) AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 9.0 support

L3 Cache ● Ethernet 6MB for i7-4650U, 3MB for i5-4400E, i5-4402E, i3-4100E and i3-4102E Intel® MAC/PHY: i217LM (Enterprise SKU) with AMT 9.0 support Interface: 10/100/1000 GbE connection Expansion Busses PCI Express x16 (Gen3) or PCI Express (2 x8 or 1 x8 with 2 x4) ● I/O Interfaces 6 PCI Express x1: Lanes 0/1/2/3/4/5 USB: 8x USB 2.0 (USB 0,1,2,3,4,5,6,7) 32-bit PCI bus rev 2.3 SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) LPC bus, SMBus (system) , I2C (user) PATA: One PATA IDE single device only SEMA Board Controller GPIO: 4 GPO and 4 GPI with interrupt Supports : Voltage/Current monitoring, Power sequence debug support, AT/ ATX mode control, Logistics and Forensic information, Flat Panel Control, ● Super I/O General Purpose I2C, Failsafe BIOS (dual BIOS ), Watchdog Timer and Fan Control On carrier if needed (standard support for W83627DHG-P) Debug Headers ● TPM 40-pin multipurpose flat cable connector Chipset: Atmel AT97SC3204 Use in combination with DB-40 debug module Type: TPM 1.2 Providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power Testpoints, Debug LEDs 60-pin XDP header for ICE debug of CPU/chipset

Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications ● Power ● Mechanical Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% Form Factor: PICMG COM.0: Rev 2.1 Type 2 Wide Input: ATX = 8.5~20 V / 5Vsb ±5% or AT = 8.5~20V Dimension: Basic size: 125 mm x 95 mm Management: ACPI 4.0 compliant, Smart Battery support Operating Temperature Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) Standard: 0°C to +60°C ECO mode: Supports deep S5 mode for power saving Extreme Rugged: -40°C to +85°C (build option) Humidity ● Operating Systems 5-90% RH operating, non-condensing Standard Support 5-95% RH storage (and operating with conformal coating) Windows 7/8 32/64-bit, Linux 32/64-bit Shock and Vibration Extended Support (BSP) IEC 60068-2-64 and IEC-60068-2-27 WES7/8, Linux, VxWorks, QNX MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

HALT Tested Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times. Functional Diagram

SODIMM 2 XDP 1333/1600 MHz 60-pin 1~16 GB DDR3L 4th Generation SODIMM 2 1333/1600 MHz Intel® Core™ 1~16 GB DDR3L i7/i5/i3 Processor

single / dual eDP - LVDS eDP 18/24 -bit LVDS RTD2136R/N 2 lane “Haswell” PCI Express x16 (GEN3) 2 x8 or 1x8 + 2x4 I I D M F D

CRT VGA

6x PCIe x1 (GEN2) B

(port 0~5) D C A GbE LAN PCIe x1 SATA SATA to PATA i217LM (port 7) port 2 PATA

4x SATA 3 (port 0/1/4/5) PCH PCIe to 8x USB v1.1/2.0 (port 0~3, 8~11) Mobile Intel® QM87 PCIe x1 PCI PCI (port 6) Express Chipset TI XIO2001 HDA Audio

TPM Atmel AT97SC3204

LPC bus SPI 0 4x GP0 GPIO BIOS 4x GPI PCA9535 SPI_CS0 SMbus SPI_CS1 SPI 1 GP I2C BIOS SEMA 2 DDC I C BMC SPI_CS# LM73 SPI Ordering Information Accessories

● Express-HL2-i3-4100E Heat Spreaders COM Express® Basic Size Type 2 Module with Intel® Core™ i3- 4100E at 2.4 GHz with GT2 level graphics ● HTS-HL-B Heatspreader for Express-HL2 with threaded standoffs for ● Express-HL2-i3-4102E bottom mounting COM Express® Basic Size Type 2 Module with Intel® Core™ i3- 4102E at 1.6 GHz with GT2 level graphics ● HTS-HL-BT ● Express-HL2-i5-4400E Heatspreader for Express-HL2 with through hole standoffs for COM Express® Basic Size Type 2 Module with Intel® Core™ i5- top mounting 4400E at 2.7 GHz with GT2 level graphics Passive Heatsinks ● Express-HL2-i5-4402E ® ® COM Express Basic Size Type 2 Module with Intel Core™ i5- ● THS-HL-BL 4402E at 1.6 GHz with GT2 level graphics Low profile heatsink for Express-HL2 with threaded standoffs ● Express-HL2-i7-4700EQ for bottom mounting ® ® COM Express Basic Size Type 2 Module with Intel Core™ i7- ● THSH-HL-BL 4700EQ at 2.4/1.7 GHz with GT2 level graphics Low profile heatsink for Express-HL2 with through hole ● Express-HL2-i7-4860EQ standoffs for top mounting COM Express® Basic Size Type 2 Module with Intel® Core™ i7- ● THSF-HL-BL 4860EQ at 2.18GHz with GT3 level graphics High profile heatsink for Express-HL2 with threaded standoffs ● Express-HL2-Celeron 2000E for bottom mounting COM Express® Basic Size Type 2 Module with Intel® Celeron® 2000E 2.2 GHz (no Turbo) 35W (2C/GT1) Active Heatsink ● Express-HL2-Celeron 2002E ● THSF-HL-BL-WT COM Express® Basic Size Type 2 Module with Intel® Celeron® 2002E 1.5 GHz (no Turbo) 25W (2C/GT1) High profile heatsink with Fan for Express-HL2 with threaded standoffs for bottom mounting

*Quad Core CPU at 47W cannot use above heatsinks

Starter Kit

● COM Express Type 2 Starter Kit Starter kit for Express-HL2 COM Express formfactor starter kit with Express-BASE board, power supply, and accessory kit

www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Jan. 19, 2017. ©2017 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice.