RF Front-End Module Comparison 2020 - Volume 3 1 Table of Contents

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

RF Front-EndModule Comparison 2020 – Volume 3 Technical and cost overview of the latest Radio Frequency connectivity Front-End technologies, with deep analysis of Wifi 6.0 and Ultra-Wide Band architecture. SP20523 - RF report by Stéphane ELISABETH LABORATORY ANALYSIS done by Nicolas RADUFE October 2020 – Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 1 Table of Contents

Overview / Introduction 4 ✓ Die View And Dimensions o Executive Summary ✓ Die Delayering & Main Block IDs o Key Take Away ✓ Die Process o Reverse Costing Methodology o Hi1105V100 vs. Hi1103V110 Company Profile 11 o Mediatek – Front-End Analysis 89 o Apple, Samsung, Huawei, OnePlus, Google, LG Electronics, Oppo o HTC desire 19s vs. Oppo Reno3 5G o Smartphones Teardown: o MT6635 Analysis iPhone 11, Galaxy Note 10+, 8 5G, Pixel 4 XL, V60 ThinQ, Reno 3 5G o MT6635 vs. MT6631N o Physical Analysis Summary 37 Qualcomm – Front-End Analysis 105 o Samsung Galaxy M11 & OnePlus 7 pro 5G vs. OnePlus 8 5G – o Summary of the analyzed RF components Archi. Wifi 4.0 to 6.0 o Comparative Analysis: o Google Pixel 4XL vs. LG V60 ThinQ – Archi. Wifi 6.0 Module Module in Connectivity, Connectivity Area, Design Win, Main Supplier, o Murata 1VF & QCA6391 Analysis Function, OEMs main Supplier o QCA6391 vs. WCN2998 vs. WCN3615 Physical Comparison 47 o Broadcom – Front-End Analysis 128 o Area Distribution per Supplier & Function o Apple iPhone SE (2020) vs. Galaxy Note10+ vs. Apple iPhone 11 o Area Distribution per Supplier & Function for Wifi 6.0 Pro Max – Archi. Wifi 6.0 Module from Murata, USI and Samsung o SEMCO 4005C2, USI APPL339S00648, Murata 1VC & o Die Design Win in Number & Area BCM4378 Analysis o Die Distribution per Function o BCM4378 vs. BCM4377 o Die Distribution per Function for Wifi 6.0 o Apple UWB – Front-End Analysis 154 o Filter Distribution per Smartphone: Technology and Substrate o USI U1 and Antenna Analysis o PA/LNA/Switch Distribution per Smartphone: Technology and SoC Physical Comparison 177 Substrate SoC Manufacturing Process 180 o Material Substrate Distribution per Smartphone o Wafer Die Front-End Process & Fabrication Unit Cost Comparison 61 SoC Cost Analysis 184 o o Cost Distribution per Supplier & Function Summary of the cost analysis 185 o Yields Explanation & Hypotheses 187 o Cost Distribution per Supplier & Function for Wifi 6.0 o SoC Die 189 Market Analysis 65 ✓ SoC Die Front-End Cost o Wifi Evolution ✓ SoC Die Probe Test, Thinning & Dicing o Connectivity Market Ecosystem & Forecast ✓ SoC Die Wafer & Die Cost Physical Analysis 71 ✓ SoC Component Cost o HiSilicon – Front-End Analysis 72 Selling price 193 o Huawei Mate 20 X (5G) vs. Huawei P40 pro – Archi. Wifi 5.0 Feedbacks 197 vs. 6.0 SystemPlus Consulting services 199 o Hi1105V100 Analysis ✓ Package View & Dimensions ✓ Package Opening & Cross-Section ©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 2 Executive Summary

Overview / Introduction o Executive Summary Each year System Plus opens hundreds of Front-End Modules (FEMs) and components to provide an overview of the Radio o Reverse Costing Methodology Frequency (RF) FEM market in selected flagship smartphones. Gathering the information into one report offers an o Glossary opportunity to keep track of the evolution of this technology market. Company Profile & Supply Chain This year, System Plus Consulting offers different volumes on technical and cost comparisons of smartphone RFFEMs. Every report will focus on a specific subject, either a player’s evolution, a specific technology or a comparison of flagship devices. Physical Analysis Summary This third volume provides insights into technology and cost data for FEMs and several components found in 14 latest Physical Comparison smartphones made by companies from Apple to Xiaomi. It features a comprehensive overview of the connectivity architecture on the market, comparing Wifi ac/5.0 to Wifi ax/6.0. As the architecture is centered on the Systems-on-Chips Cost Comparison (SoCs), that’s what we’ve done a detailed analysis with cross-section and technology analysis on. Different choices of architecture are revealed between Mediatek, Broadcom, Qualcomm, and Huawei. Additionally, the analysis provides insight Market Analysis into Apple’s Ultra Wide Band (UWB) technology from the antenna to the SoC.

Physical Analysis With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed, from the output of the transceiver to the antenna. Packaging, sizes and technologies are studied to provide a large panel of SoC Physical Comparison technical and economical choices and an overview of the market.

Manufacturing Process Flow Moreover, the report includes an overview of other flagship smartphones released by the end of 2019 and provides a statistical analysis for most connectivity modules. It also tries to explain the smartphone makers’ choices and supplier Cost Analysis tendencies. Analyses of FE modules for LTE and 5G modules are not included in this report.

Selling Price Analysis Note: Feedbacks Discrete filters and duplexer has been integrated in this report. Related Reports Wifi, Bluetooth and UWB Module analysed are included in this report. About System Plus RF Front-End Module for LTE/5G connectivity are not included in this report.

Overview / Introduction RF Front-End Module Comparison 2020 – Vol. 1 RF Front-End Module Comparison 2020 – Vol. 2 o Executive Summary o Reverse Costing Methodology Study on smartphones on Q3 2019 Study on Huawei smartphones o Glossary

Company Profile & Supply Chain

Physical Analysis Summary

Physical Comparison

Cost Comparison

Market Analysis The report includes the study of at least twenty FEM and several The report includes the study of at least eighty FEM and several components found in three smartphones: Apple iPhone 11 Pro, components found in ten smartphones: Mate and P series from Physical Analysis Samsung Galaxy Note10+ and OnePlus 7 Pro 5G. Also, it comes 2015 to 2019. Also, it came along with a database including SoC Physical Comparison along with a database including information on 485 components information on 483 components in 13 smartphones. in 17 smartphones. Manufacturing Process Flow Smartphone List Serie Generation Version # of Components Smartphone List 11 Pro 26 Serie Generation Version Addon # of Components Cost Analysis Apple iPhone 11 - 20 30 Pro 5G 60 11 Pro Max 27 20 X 5G 45 Selling Price Analysis Note 10 Plus 19 Note 10 - 33 20 - - 22 Samsung Galaxy Huawei Mate 10 Lite - 34 Feedbacks A80 - 22 Fold - 24 10 - - 28 Xcover 4 S 21 9 - - 40 Related Reports OnePlus OnePlus 7 Pro 5G 33 8 - - 42 Meizu - 16 S 22 30 Pro - 41 About System Plus Xiaomi Black Shark 2 - 41 30 - - 31 Asus ROG Phone II - 33 20 Pro - 37 Motorola One Vision - - 28 Huawei P 10 - - 45 Huawei Mate 20 X (5G) 45 Oppo Reno - 5G 24 9 - - 30 Royole FlexPai - - 31 9 Lite - 28 LG Electronics V50 ThinQ 5G 36 Total 483 Total 485 ©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 4 Executive Summary

Overview / Introduction Smartphone List RF Front-End Module Comparison 2020 – Vol. 3 Serie Generation Version Addon # of Components o Executive Summary 11 - - 5 o Reverse Costing Methodology Wifi & Connectivity 11 Pro - 4 Apple iPhone o Glossary 11 Pro Max 3 SE (2020) - - 3 Asus Rog Phone II - - 8 Company Profile & Supply Chain Google Pixel 4 XL - 6 HTC Desire 19s - - 4 Physical Analysis Summary 20 X 5G 8 Mate 30 Pro 5G 9 Huawei Xs - - 8 Physical Comparison P 40 Pro - 10 LG V60 ThinQ - - 8 Edge + - - 7 Cost Comparison Moto G8 Plus - 5 Motorola Hyper - - 6 One Market Analysis Macro - - 4 The report includes the study of several FEMs and components Razr 2019 - - 5 7 Pro - 5G 9 found in 14 smartphones: From Apple to Xiaomi. Also, it came OnePlus Physical Analysis 8 - - 5G 10 along with a database including information on 281 components Find X2 - - 10 3 - 5G 6 in 44 smartphones. Oppo SoC Physical Comparison Reno 3 Pro 5G 6 Ace - - 7 Manufacturing Process Flow A10 s - 4 A50 - - 7 A51 - - 6 Cost Analysis Fold - - 5 M11 - - 4 M31 - - 7 Samsung Galaxy Selling Price Analysis Note10 - - 7 Note10 + - 8 Feedbacks S20 Ultra 5G 8 S20 + 5G 8 Xcover 4S - 5 Related Reports Z Flip - - 5 Sharp Aquos R - 5G 5 Nex 3s - - 8 About System Plus Vivo Nex S - - 5 X30 Pro - - 7 Mi 10 Pro 5G 8 Mi Note 10 - 5 Xiaomi K30 - 5G 6 Redmi Note 8 Pro 5 ZTE Nubia Red Magic - 5G 7 Total 281 ©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 5 Samsung Smartphone Teardown – Samsung Galaxy Note 10 plus

Overview / Introduction RF Components Manufacturer Type Area Quantity RF Board Cost (Marking) (mm²) Proportion Company Profile & Supply Chain o Apple & iPhone 11 Teardown 4005C2 SEMCO Wifi FEM 76.97 1 XX% $ XX o Huawei & P40 Pro Teardown BCM4775 Broadcom GPS SoC 9.83 1 XX% $ XX o Samsung & Galaxy Note 10+ Teardown B8920 (8PR) Epcos (TDK) SAW Diplexer 3.00 1 XX% $ XX o OnePlus & 8 5G Teardown B8893 (8NX) Epcos (TDK) BAW Filter 0.99 2 XX% $ XX o Google & Pixel 4 XL Teardown yEx Wisol SAW Filter 0.99 1 XX% $ XX o LG & V60 ThinQ Teardown 7Hx Wisolm SAW Filter 0.99 1 XX% $ XX o Oppo & Reno 3 5G Teardown BGA855N6 Infineon LNA 0.78 1 XX% $ XX Physical Analysis Summary Sx Infineon LNA 0.99 1 XX% $ XX Total 94.54 9 XX% $ XX Physical Comparison Connectivity Board Area : Cost Comparison 346 mm² Market Analysis

Physical Analysis

SoC Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks Related Reports About System Plus

Overview / Introduction Manufacturer Model Packaging Manufacturer IC Main IC Function Wifi Norme MIMO BT Rev. Hi1103V110 WLCSP - - Wifi, BT, GPS a/b/g/n/ac - 5.0 Company Profile & Supply Chain HiSilicon Hi1105V100 WLCSP - - Wifi, BT, GPS a/b/g/n/ac/ax 2x2 5.1 MT6631N WLCSP - - Wifi, BT, GPS, FM a/b/g/n/ac - 5.0 Physical Analysis Summary Mediatek o Summary of the analyzed RF MT6635 WLCSP - - Wifi, BT, GPS, FM a/b/g/n/ac/ax 2x2 5.0 components 1RH Double Side Molding Broadcom BCM4377 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0 o Comparative Analysis 1TR MCM Qualcomm WCN3990 Wifi, BT, FM a/b/g/n/ac 2x2 5.0 Murata 1VF Double Side Molding Qualcomm QCA6390 Wifi, BT a/b/g/n/ac/ax 2x2 5.1 Physical Comparison 1VC MCM Broadcom BCM4378 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0 QCA6391 FCBGA - - Wifi, BT a/b/g/n/ac/ax 2x2 5.1 Cost Comparison WCN3615 WLCSP - - Wifi, BT b/g/n - 4.2 WCN3950 WLCSP - - Wifi, BT, FM a/b/g/n/ac 2x2 5.0 Market Analysis Qualcomm WCN3980 WLCSP - - Wifi, BT, FM a/b/g/n/ac 2x2 5.0 Physical Analysis WCN3990 WLCSP - - Wifi, BT, FM a/b/g/n/ac 2x2 5.0 WCN3998 WLCSP - - Wifi, BT, FM a/b/g/n/ac 2x2 5.0 SoC Physical Comparison S5N5C12 WLCSP - - Wifi, BT, FM a/b/g/n/ac - 4.2 Samsung S5N5C20 WLCSP - - Wif, BT, FM a/b/g/n/ac - 5.0 Manufacturing Process Flow 4005C2 MCM Double Sided Broadcom BCM4377 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0 APPL339S00648 MCM Broadcom BCM4378 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0 USI Cost Analysis U1 MCM Apple (Est.) TMKA75 UWB - - - • The components using Wifi 6 and UWB will be opened, and the die pictures will be presented in this report. Selling Price Analysis

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Overview / Introduction Module in Connectivity Area proportion Company Profile & Supply Chain

Physical Analysis Summary Galaxy Note10+ XX,XXX mm²

o Summary of the analyzed RF Samsung components

o Comparative Analysis Reno 3 5G XX,XXX mm² Oppo Physical Comparison 8 5G XX,XXX mm²

Cost Comparison OnePlus Sum of Total Module Area Market Analysis

P40 Pro XX,XXX mm² Sum of Blank Space & Discrete Huawei Physical Analysis iPhone SE (2020) XX,XXX mm²

SoC Physical Comparison Apple Manufacturing Process Flow iPhone 11 Pro Max XX,XXX mm² Cost Analysis 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% Selling Price Analysis Percentage of module in connectivty area

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Overview / Introduction Component Distribution per Funtion Smartphone List Serie Generation Version Addon # of Components 2% 11 - - 5 0% Company Profile & Supply Chain 11 Pro - 4 281 Apple iPhone 4% 11 Pro Max 3 Components SE (2020) - - 3 8% Physical Analysis Summary Asus Rog Phone II - - 8 o Google Pixel 4 XL - 6 Summary of the analyzed RF Filter HTC Desire 19s - - 4 8% components 20 X 5G 8 LNA Mate 30 Pro 5G 9 FEM o Comparative Analysis Huawei 46% Xs - - 8 SoC P 40 Pro - 10 Switch LG V60 ThinQ - - 8 Physical Comparison LNA/Switch Edge + - - 7 14% Multiplexer Moto G8 Plus - 5 Motorola Hyper - - 6 RFIC Cost Comparison One Macro - - 4 Razr 2019 - - 5 7 Pro - 5G 9 Market Analysis OnePlus 8 - - 5G 10 18% Find X2 - - 10 3 - 5G 6 Oppo Physical Analysis Reno 3 Pro 5G 6 Ace - - 7 A10 s - 4 Share in implemented function SoC Physical Comparison A50 - - 7 ©2020 by System Plus Consulting A51 - - 6 Fold - - 5 Component Distribution per Supplier Manufacturing Process Flow M11 - - 4 M31 - - 7 1% 1% 1%1% 0% Samsung Galaxy 0% 281 MURATA Note10 - - 7 2% 1% 1% Cost Analysis Note10 + - 8 Components QUALCOMM S20 Ultra 5G 8 2% NXP S20 + 5G 8 QORVO Selling Price Analysis Xcover 4S - 5 3% SKYWORKS Z Flip - - 5 26% UNIDENTIFIED Sharp Aquos R - 5G 5 6% WISOL Feedbacks Nex 3s - - 8 Vivo Nex S - - 5 TAIYO YUDEN INFINEON TECHNOLOGIES X30 Pro - - 7 6% Related Reports Mi 10 Pro 5G 8 SAMSUNG Mi Note 10 - 5 Xiaomi MEDIATEK K30 - 5G 6 Redmi USI Note 8 Pro 5 7% HISILICON About System Plus ZTE Nubia Red Magic - 5G 7 MAXSCEND Total 281 17% AWINIC 10% BROADCOM 44 Smartphones; From 2019 to 2020; 281 Components WILLSEMI 14% TST Share in design win ©2020 by System Plus Consulting ©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 9 Filter Distribution

Overview / Introduction Filter substrate Area Company Profile & Supply Chain

Physical Analysis Summary

Physical Comparison o Area Distribution per Supplier & Function 30% o Die Design Win in Number & Area o Die Distribution per Function LT/LN o Filter Distribution Sapphire o PA/LNA/Switch Distribution Filter Distribution per technology o Material Substrate Distribution Silicon

3% Cost Comparison 4% 3% 67% Market Analysis 10%

Physical Analysis

SoC Physical Comparison 13% Filter BAW FBAR Filter BAW SMR Filter die substrate distribution Filter IPD - Manufacturing Process Flow ©2020 by System Plus Consulting Filter SAW - Cost Analysis Filter SAW IHP

Selling Price Analysis 70% Feedbacks Related Reports About System Plus

Overview / Introduction

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Physical Comparison o Area Distribution per Supplier & Function o Die Design Win in Number & Area o Die Distribution per Function o Filter Distribution o PA/LNA/Switch Distribution o Material Substrate Distribution

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Overview / Introduction

Company Profile & Supply Chain Manufacturer Model Packaging Manufacturer IC Main IC Function Wifi Norme MIMO BT Rev. Cost Hi1103V110 WLCSP - - Wifi, BT, GPS a/b/g/n/ac - 5.0 $XX Physical Analysis Summary HiSilicon Hi1105V100 WLCSP - - Wifi, BT, GPS a/b/g/n/ac/ax 2x2 5.1 $XX Physical Comparison Manufacturer Model Type Series Module Cost Comparison Cost Hi1103V110 RFIC Mate 20 X (5G); Mate 30 Pro 5G; Mate Xs $XX HiSilicon Market Analysis Hi1105V100 RFIC P40 Pro $XX

Physical Analysis o HiSilicon – Front-End Analysis Mate 20 X (5G) Mate Xs o Mediatek – Front-End Analysis o Qualcomm – Front-End Analysis Manufacturer Model Type Quantity Module Cost Manufacturer Model Type Quantity Module Cost o Broadcom – Front-End Analysis HiSilicon Hi1103V110 RFIC 1 $XX HiSilicon Hi1103V110 RFIC 1 $XX o Apple UWB – Front-End Analysis NXP BGF8458 LNA/Switch 2 $XX NXP BGF8458 LNA/Switch 2 $XX NXP BGS8324 LNA/Switch 2 $XX NXP BGS8324 LNA/Switch 2 $XX SoC Physical Comparison Triquint A7C BAW Filter 2 $XX Murata SADEN2G45MC0F0A SAW Filter 2 $XX Epcos B8857 (8MS) BAW Filter 2 $XX Manufacturing Process Flow Solution Cost: $XX Solution Cost: $XX Cost Analysis

Selling Price Analysis Mate 30 Pro 5G P40 Pro

Feedbacks Manufacturer Model Type Quantity Module Cost Manufacturer Model Type Quantity Module Cost HiSilicon Hi1103V110 RFIC 1 $XX HiSilicon Hi1105V100 RFIC 1 $XX Related Reports NXP BGF8458 LNA/Switch 2 $XX NXP 102# FEM 2 $XX NXP BGS8324 LNA/Switch 2 $XX NXP BGS8324 LNA/Switch 2 $XX About System Plus Murata SADEN2G45MC0F0A SAW Filter 1 $XX Taiyo Yuden 166# BAW Filter 1 $XX Epcos B8921 (8PS) SAW Filter 1 $XX Murata SADEN2G45MC0F0A SAW Filter 1 $XX Solution Cost: $XX Solution Cost: $XX

Overview / Introduction

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Cost Comparison

Market Analysis

Physical Analysis o HiSilicon – Front-End Analysis o Mediatek – Front-End Analysis o Qualcomm – Front-End Analysis o Broadcom – Front-End Analysis o Apple UWB – Front-End Analysis

SoC Physical Comparison

Manufacturing Process Flow

Cost Analysis Oppo Reno3 5G

Selling Price Analysis Manufacturer Model Type Quantity Module Cost Mediatek MT6635 RFIC 1 $XX Feedbacks Murata SAFQA2G45MA0G0A IHP SAW Filter 2 $XX

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Overview / Introduction • Package Type : XX XX BGA • Package Type : XX XX BGA Company Profile & Supply Chain • Dimensions : XX mm² x XX mm • Dimensions : XX mm² x XX mm (XX x XX x XX mm) (XX x XX x XX mm) Physical Analysis Summary • Pin Pitch : XX mm • Pin Pitch : XX mm

Physical Comparison • Marking : • Marking : 1VF QCA6391 Cost Comparison 002 JE004F96 Market Analysis

Physical Analysis o HiSilicon – Front-End Analysis XX mm XX mm o Mediatek – Front-End Analysis o Qualcomm – Front-End Analysis o Broadcom – Front-End Analysis o Apple UWB – Front-End Analysis

SoC Physical Comparison

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XX mm XX XX mm XX Cost Analysis

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Feedbacks Package Top View – Optical View Package Bottom View – Optical View ©2020 by System Plus Consulting ©2020 by System Plus Consulting Related Reports Package Top View – Optical View Package Bottom View – Optical View

Overview / Introduction

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Physical Analysis o HiSilicon – Front-End Analysis Package Molding o Mediatek – Front-End Analysis o Qualcomm – Front-End Analysis o Broadcom – Front-End Analysis Copper Notch o Apple UWB – Front-End Analysis Silicon Substrate XX µm SoC Physical Comparison

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Selling Price Analysis XX µm 8-Layer PCB Substrate Feedbacks

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Physical Analysis XX o HiSilicon – Front-End Analysis o Mediatek – Front-End Analysis o Qualcomm – Front-End Analysis o Broadcom – Front-End Analysis o Apple UWB – Front-End Analysis XX SoC Physical Comparison

Manufacturing Process Flow XX Cost Analysis

Selling Price Analysis XX Feedbacks XX Related Reports

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Die Delayering – Optical View ©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 ©2020 by System Plus Consulting 18 Broadcom BCM4377 vs. BCM4378 – Die View & Dimensions

Overview / Introduction Norme Die Size RF/LF Ratio Company Profile & Supply Chain BCM4377 ax XX mm² XX % Physical Analysis Summary BCM4378 ax XX mm² XX % Physical Comparison TSMC XX nm TSMC XX nm Cost Comparison

Market Analysis

Physical Analysis o HiSilicon – Front-End Analysis o Mediatek – Front-End Analysis o Qualcomm – Front-End Analysis o Broadcom – Front-End Analysis o Apple UWB – Front-End Analysis

SoC Physical Comparison

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Selling Price Analysis

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Physical Analysis o HiSilicon – Front-End Analysis o Mediatek – Front-End Analysis o Qualcomm – Front-End Analysis o Broadcom – Front-End Analysis o Apple UWB – Front-End Analysis

SoC Physical Comparison

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Cost Analysis

Selling Price Analysis

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Physical Analysis o HiSilicon – Front-End Analysis o Mediatek – Front-End Analysis o Qualcomm – Front-End Analysis o Broadcom – Front-End Analysis o Apple UWB – Front-End Analysis

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Company Profile & Supply Chain • Die substrate thickness: Solder Ball XX µm Physical Analysis Summary UBM Physical Comparison RDL Polyimide Cost Comparison Metal Layers Market Analysis

Physical Analysis o HiSilicon – Front-End Analysis o Mediatek – Front-End Analysis o Qualcomm – Front-End Analysis o Broadcom – Front-End Analysis o Apple UWB – Front-End Analysis

SoC Physical Comparison Silicon Die Manufacturing Process Flow XX µm Cost Analysis

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Physical Analysis Summary REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT Physical Comparison PACKAGING ADVANCED PACKAGING • 5G’s Impact on RF Front-End and Connectivity for Cellphones Cost Comparison • RF Front-End Module Comparison 2020 – Volume 2 • RF Front-End Module Comparison 2020 – Volume 1 2020 Market Analysis • SAW Filter Comparison 2020 • Skyworks’ FBAR-BAW Filter Technology in 2G/UHB PAMiD Physical Analysis SKY78221 • Qualcomm’s Second Generation 5G mmWave Chipset, SoC Physical Comparison from Modem to Antenna

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