2018 IEEE 68th Electronic Components and Technology

Conference (ECTC 2018)

San Diego, California, USA

29 May - 1 June 2018

Pages 1-618

IEEE Catalog Number: CFP18ECT-POD ISBN: 978-1-5386-5000-4

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2018 IEEE 68th Electronic Components and Technology Conference ECTC 2018

Table of Contents

Welcome Message from the General Chair and Program Chair lv Executive Committee lvii Program Committee lviii

Session 1: Flexible Electronics, Substrate for High Frequency Applications

In-Situ Stress Determination of Electroless Cu on PCB-Relevant Substrates 1 Tobias Bernhard (Atotech Deutschland GmbH), Ralf Brüning (Mount Allison University), Tanu Sharma (Mount Allison University), Delilah Brown (Mount Allison University), Laurence Gregoriades (Atotech Deutschland GmbH), Edith Steinhäeuser (Atotech Deutschland GmbH), Stefan Kempa (Atotech Deutschland GmbH), Frank Brüning (Atotech Deutschland GmbH), and Edward Alexandre Luy (Mount Allison University) Stretchable, Printable and Electrically Conductive Composites for Wearable RF Antennas 9 Bo Song (Georgia Institute of Technology), Fan Wu (Georgia Institute of Technology), Kyoung-sik Moon (Georgia Institute of Technology), Ryan Bahr (Georgia Institute of Technology), Manos Tentzeris (Georgia Institute of Technology), and CP Wong (Georgia Institute of Technology) A Study on the Anchoring Polymer Layer(APL) Solder Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Flex-on-Flex (FOF) Assembly Using an Ultrasonic Bonding Method 15 Dal-Jin Yoon (Korea Advanced Institute of Science and Technology), Sang Hoon Lee (Korea Advanced Institute of Science and Technology), and Kyung-Wook Paik (Korea Advanced Institute of Science and Technology) Development of Novel BT Laminate Material for Low-Loss and High Speed Transmission 21 Masahiko Shigaki (Mitsubishi Gas Chemical Company), Mika Suzuki (Mitsubishi Gas Chemical Company), Takashi Kobayashi (Mitsubishi Gas Chemical Company), Kentarou Takano (Mitsubishi Gas Chemical Company), Takaki Tsuchida (Mitsubishi Gas Chemical Company), Sotaro Hiramatsu (Mitsubishi Gas Chemical Company), Yoshitaka Ueno (Mitsubishi Gas Chemical Company), Tsuyoshi Kida (Mitsubishi Gas Chemical Company), Shu Yoshida (Mitsubishi Gas Chemical Company), and Toyoji Oshima (Mitsubishi Gas Chemical Company)

W Organic Substrate Material with Low Transmission Loss and Effective in Suppressing Package Warpage for 5G Application 28 Shunsuke Tonouchi (Hitachi Chemical Co. Ltd.), Etsuo Mizushima (Hitachi Chemical Co. Ltd.), Tomio Fukuda (Hitachi Chemical Co. Ltd.), Tomokazu Shimada (Hitachi Chemical Co. Ltd.), Yukio Nakamura (Hitachi Chemical Co. Ltd.), and Toshiyuki Iijima (Hitachi Chemical Co. Ltd.) Porous Epoxy Film for Low Dielectric Constant Chip Substrates and Boards 33 Jisu Jiang (Georgia Institute of Technology), Oluwadamilola Phillips (Georgia Institute of Technology), Landon Keller (Georgia Institute of Technology), and Paul A. Kohl (Georgia Institute of Technology) Development of Multi-layered Build-Up Insulation Dry-Film Material for Ultra-Low Transmission Loss Wirings for High-Speed Semi-Conductor Packaging 40 Zhong Guan (Taiyo Ink Mfg. Co. Ltd.), Arata Endo (Taiyo Ink Mfg. Co. Ltd.), and Tadahiko Hanada (Taiyo Ink Mfg. Co. Ltd.)

Session 2: Advances in Wafer and Panel Level Fan-Out Packaging

A Novel Submicron Polymer Re-Distribution Layer Technology for Advanced InFO Packaging 45 Han-Ping Pu (Taiwan Semiconductor Manufacturing Company Ltd.), H. J. Kuo (Taiwan Semiconductor Manufacturing Company Ltd.), C. S. Liu (Taiwan Semiconductor Manufacturing Company Ltd.), and Douglas C. H. Yu (Taiwan Semiconductor Manufacturing Company Ltd.) Fan-Out Panel Level Package with Fine Pitch Pattern 52 Jinyoung Kim (Samsung Electro-Mechanics Co. Ltd.), Ikjun Choi (Samsung Electro-Mechanics Co. Ltd.), JunHyeong Park (Samsung Electro-Mechanics Co. Ltd.), Jae-Ean Lee (Samsung Electro-Mechanics Co. Ltd.), TaeSung Jeong (Samsung Electro-Mechanics Co. Ltd.), Jungsoo Byun (Samsung Electro-Mechanics Co. Ltd.), YoungGwan Ko (Samsung Electro-Mechanics Co. Ltd.), Kangheon Hur (Samsung Electro-Mechanics Co. Ltd.), Dae-Woo Kim (Samsung Electronics Ltd.), and Kyung Suk Oh (Samsung Electronics Ltd.) Ultra Fine RDL Structure Fabrication Using Alternative Patterning and Bottom-Up Plating Processes 58 Richard Hollman (TEL Advanced Packaging), Ognian Dimov (Fujifilm Electronic Materials), Sanjay Malik (Fujifilm Electronic Materials), Habib Hichri (SUSS Microtec Photonic Systems Inc), and Markus Arendt (SUSS Microtec Photonic Systems Inc) Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications 64 Kyoung-Lim Suk (Samsung Electronics Ltd.), Seok Hyun Lee (Samsung Electronics Ltd.), Jong Youn Kim (Samsung Electronics Ltd.), Seok Won Lee (Samsung Electronics Ltd.), Hak Jin Kim (Samsung Electronics Ltd.), Su Chang Lee (Samsung Electronics Ltd.), Pyung Wan Kim (Samsung Electronics Ltd.), Jung Soo Byun (Samsung Electro-Mechanics Co. Ltd.), Dae-Woo Kim (Samsung Electronics Ltd.), and Dan Oh (Samsung Electronics Ltd.)

WJ Panel Level Packaging - A View Along the Process Chain 70 Tanja Braun (Fraunhofer IZM), K.-F. Becker (Fraunhofer IZM), O. Hoelck (Fraunhofer IZM), R. Kahle (Fraunhofer IZM), M. Wöhrmann (Fraunhofer IZM), L. Boettcher (Fraunhofer IZM), M. Töpper (Fraunhofer IZM), L. Stobbe (Fraunhofer IZM), H. Zedel (Fraunhofer IZM), R. Aschenbrenner (Fraunhofer IZM), S. Voges (Technical University Berlin), M. Schneider-Ramelow (Technical University Berlin), and K.-D. Lang (Technical University Berlin) Patterning High Resolution Features Through the Integration of an Advanced Lithography System with a Novel Nozzleless Spray Coating Technology 79 Jack Mach (Rudolph Technologies), Corey Shay (Rudolph Technologies), Stuart Erickson (Ultrasonic Systems Inc.), and Gary Smith (Sumitomo Chemical Advanced Technologies) Extreme Thinned-Wafer Bonding Using Low Temperature Curable Polyimide for Advanced Wafer Level Integrations 86 Julien Bertheau (Imec), Fumihiro Inoue (Imec), Alain Phommahaxay (Imec), lan Peng (Imec), Serena Iacovo (Imec), Nouredine Rassoul (Imec), Erik Sleeckx (Imec), Kenneth Rebibs (Imec), Andy Miller (Imec), Gerald Beyer (Imec), Eric Beyne (Imec), and Atsushi Nakamura (Fujifilm)

Session 3: 3D Design, Assembly and Additive Manufacturing

Novel Failure Analysis Techniques for 1.8 μm Pitch Wafer-to-Wafer Bonding 92 Christian Schmidt (ZEISS), Lorenz Lechner (ZEISS), Ingrid De Wolf (IMEC and also KU Leuven), Soon-Wook Kim (IMEC), and Eric Beyne (IMEC) Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks 97 Mark Schultz (IBM TJ Watson Research), Cyril Cabral Jr. (IBM TJ Watson Research), Cornelia Tsang (Raytheon), Joana Maria (IBM TJ Watson Research Center), Paul Andry (IBM TJ Watson Research), Qianwen Chen (IBM TJ Watson Research), and Timothy Chainer (IBM TJ Watson Research) Assembly Process Development of Ultra Large Scale 3D Stacking with Transmission Circuits Via TSVs 103 Shunichi Kikuchi (Fujitsu Limited), Hidehiko Kira (Fujitsu Limited), Makoto Suwada (Fujitsu Limited), Tatsumi Nakada (Fujitsu Limited), Naoaki Nakamura (Fujitsu Advanced Technologies Limited), Norio Kainuma (Fujitsu Advanced Technologies Limited), Kazuhiro Kanai (Fujitsu Advanced Technologies Limited), and Takumi Masuyama (Fujitsu Advanced Technologies Limited) The Principles of "Smart" Encapsulation: Using Additive Printing Technology for the Realization of Intelligent Application-Specific Packages for IoT, 5G, and Automotive Radar Applications 111 Bijan Tehrani (Georgia Institute of Technology), Ryan Bahr (Georgia Institute of Technology), Daniel Revier (Texas Instruments), Benjamin Cook (Texas Instruments), and Manos Tentzeris (Georgia Institute of Technology) A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process 118 Baptiste Goubault (CEA-LETI), Gabrielle Aspar (CEA-LETI), Jean-Charles Souriau (CEA-LETI), Laetitia Castagne (CEA-LETI), SimonGilles Simon (CEA-LETI), Lea Di Cioccio (CEA-LETI), and Yves Bréchet (CEA)

WJJ A Design Study of 3D Printed Reduced Height Waveguide Structures 125 Vincens Gjokaj (Michigan State University) and Premjeet Chahal (Michigan State University) Self-Powered, Inkjet Printed Electrochromic Films on Flexible and Stretchable Substrate for Wearable Electronics Applications 131 Ebraheem Ali Azhar (Arizona State University), Terry Alford (Arizona State University), and Hongbin Yu (Arizona State University)

Session 4: Automotive and Harsh Environment Reliability

Novel Corrosion Prevention Treatments for Cu Wire Bonded Device to Improve Bonding Reliability 139 Muthappan Asokan (University of North Texas), Josh Caperton (University of North Texas), Zach Thompson (University of North Texas), Oliver Chyan (University of North Texas), Mahmud Chowdhury (Texas Instruments Inc.), Shawn O'Connor (Texas Instruments Inc.), and Luu Nguyen (Texas Instruments Inc.) A Monte Carlo Approach to Predicting Failure Across Multiple Temperature and Humidity Field Environments 144 Jonathon Tucker (Microsoft Corporation), Ramji Dhakal (Microsoft Corporation), George Thiel (Microsoft Corporation), and Virendra Jadhav (Microsoft Corporation) Improve Interconnect Reliability of BGA Substrate with Stacked Vias by Reducing Carbon Inclusion in the Interface Between Via and Land Pad 150 Kejun Zeng (Texas Instruments Incorporated) and Jaimal Williamson (Texas Instruments) Understanding Underfill Degradation in Reliability Testing Conditions for ADAS Package Development 157 Ziyin Lin (Intel), Vijay Subramanian (Intel), Pramod Malatkar (Intel), and Nisha Ananthakrishnan (Intel) Quantification and Modeling of Microstructural Evolution in Lead Free Solders During Long Term Isothermal Aging 162 Sudan Ahmed (Auburn University), Jing Wu (Auburn University), Nianjun Fu (Auburn University), Jeffrey C. Suhling (Auburn University), and Pradeep Lall (Auburn University) Reliability Enhancement of Automotive Electronic Modules Using Various Glues 172 Dongji Xie (Nvidia Corp.), Zhongming Wu (Nvidia Corp.), Joe Hai (Nvidia Corp.), and Manthos Economou (Nvidia Corp.) High-Temperature And Moisture-Ageing Reliability of High-Density Power Packages For Electric Vehicles 179 Shreya Dwarakanath (Georgia Institute of Technology), P. Markondeya Raj (Georgia Institute of Technology), Vanessa Smet (Georgia Institute of Technology), Venky Sundaram (Georgia Institute of Technology), Mark D Losego (Georgia Institute of Technology), and Rao Tummala (Georgia Institute of Technology)

WJJJ Session 5: Antenna-in-Package for RF and mm-Wave Systems

Small Shielded Bluetooth Module Equipped with Slot Antenna on the Surface 185 Keiju Yamada (Toshiba Corporation), Makoto Sano (Toshiba Corporation), Makoto Higaki (Toshiba Corporation), and Akihiko Happoya (Toshiba Corporation) A 77GHz Antenna-in-Package with Low-Cost Solution for Automotive Radar Applications 191 Cheng-Yu Ho (Advanced Semiconductor Engineering Inc.), Sheng-Chi Hsieh (Advanced Semiconductor Engineering Inc.), Ming-Fong Jhong (Advanced Semiconductor Engineering Inc.), Chen-Chao Wang (Advanced Semiconductor Engineering Inc.), and and Chun-Yen Ting (Advanced Semiconductor Engineering Inc.) An Enhanced 64-Element Dual-Polarization Antenna Array Package for W-Band Communication and Imaging Applications 197 Xiaoxiong Gu (IBM T. J. Watson Research Center), Duixian Liu (IBM T. J. Watson Research Center), Chris Baks (IBM T. J. Watson Research Center), Jean-Olivier Plouchart (IBM T. J. Watson Research Center), Wooram Lee (IBM T. J. Watson Research Center), and Alberto Valdes-Garcia (IBM T. J. Watson Research Center) InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration 202 Chuei-Tang Wang (Taiwan Semiconductor Manufacturing Company), Tzu-Chun Tang (Taiwan Semiconductor Manufacturing Company), Chun-Wen Lin (Taiwan Semiconductor Manufacturing Company), Che-Wei Hsu (Taiwan Semiconductor Manufacturing Company), Jeng-Shien Hsieh (Taiwan Semiconductor Manufacturing Company), Chung-Hao Tsai (Taiwan Semiconductor Manufacturing Company), Kai-Chiang Wu (Taiwan Semiconductor Manufacturing Company), Han-Ping Pu (Taiwan Semiconductor Manufacturing Company), and Douglas Yu (Taiwan Semiconductor Manufacturing Company) Mm-Wave Antenna in Package (AiP) Design Applied to 5th Generation (5G) Cellular User Equipment Using Unbalanced Substrate 208 Ying-Wei Lu (Siliconware Precision Industries Co. Ltd.), Bo-Siang Fang (Siliconware Precision Industries Co. Ltd.), Hsuan-Hao Mi (Siliconware Precision Industries Co. Ltd.), and Kuan-Ta Chen (Siliconware Precision Industries Co. Ltd.) Novel 3D-/Inkjet-Printed Flexible On-package Antennas, Packaging Structures, and Modules for Broadband 5G Applications 214 Tong-Hong Lin (Georgia Institute of Technology), Ryan Bahr (Georgia Institute of Technology), Manos Tentzeris (Georgia Institute of Technology), Raj Pulugurtha (Georgia Institute of Technology), Venky Sundaram (Georgia Institute of Technology), and Rao Tummala (Georgia Institute of Technology)

JY A Compact 27 GHz Antenna-in-Package (AiP) with RF Transmitter and Passive Phased Antenna Array 221 Mei Xue (National Center for Advanced Packaging), Mei Xue (Institute of Microelectronics of Chinese Academy of Sciences), Mei Xue (University of Chinese Academy of Sciences), Liqiang Cao (National Center for Advanced Packaging), Liqiang Cao (Institute of Microelectronics of Chinese Academy of Sciences), Qidong Wang (National Center for Advanced Packaging), Qidong Wang (Institute of Microelectronics of Chinese Academy of Sciences), Delong Qiu (National Center for Advanced Packaging), Delong Qiu (Institute of Microelectronics of Chinese Academy of Sciences), Jun Li (National Center for Advanced Packaging), and Jun Li (Institute of Microelectronics of Chinese Academy of Sciences)

Session 6: Warpage and Moisture Characterization

A Novel Finite Element Technique for Moisture Diffusion Modeling Using ANSYS 227 Cagan Diyaroglu (University of Arizona), Selda Oterkus (University of Strathclyde), and Erkan Oterkus (University of Strathclyde) Adaptive Curvature Flexure Test to Assess Flexible Electronic Systems 236 Rui Chen (Georgia Institute of Technology), Justin Chow (Georgia Institute of Technology), Christine Taylor (Georgia Institute of Technology), Jeffrey Meth (DuPont Electronics & Imaging), and Suresh Sitaraman (Georgia Institute of Technology) Parametric Optimization and Yield Probability Prediction of Package Warpage 243 Shenghua Huang (Western Digital), Zhongli Ji (Western Digital), Yangming Liu (Western Digital), Ning Ye (Western Digital), and Hem Takiar (Western Digital) An Integrated Warpage Prediction Model Based on Chemical Shrinkage and Viscoelasticity for Molded Underfill 249 Shu-Shen Yeh (TSMC), Po-Yao Lin (TSMC), Kuang-Chun Lee (TSMC), Jin-Hua Wang (TSMC), Wen-Yi Lin (TSMC), Ming-Chih Yew (TSMC), Po-Chen Lai (TSMC), Chia-Kuei Hsu (TSMC), Che-Chia Yang (TSMC), and Shin-Puu Jeng (TSMC) Trend Plots for Different Mold-Thick Selection on Warpage Design of MUF FCCSP with 4L ETS 255 Chih-Sung Chen (Siliconware Precision Industries Co. Ltd.), Nicholas Kao (Siliconware Precision Industries Co. Ltd.), and Don Son Jiang (Siliconware Precision Industries Co. Ltd.) Numerical/Experimental Hybrid Approach to Predict Warpage of Thin Advanced Substrates 267 Byung Kim (University of Maryland) and Bongtae Han (University of Maryland) Warpage and Thermal Stress under Thermal Cycling Test in SiC and Si Power Device Structures Using Direct Chip-Bonding with Ag Sintered Layer on Cu Plate 273 Masaki Kanemoto (Keio University), Masaaki Aoki (Keio University), Akihiro Mochizuki (MacDermid Performance Solutions Japan), Yoshio Murakami (MacDermid Performance Solutions Japan), Mutsuharu Tsunoda (MacDermid Performance Solutions Japan), and Nobuhiko Nakano (Keio University)

Y

Session 7: Low Temperature Metallic Interconnection Technologies

Laser Sintering of Dip-Based All-Copper Interconnects 279 Luca Del Carro (IBM Research – Zurich ; ETH Zürich), Martin Kossatz (Pac Tech - Packaging Technologies GmbH), Lucas Schnackenberg (Pac Tech - Packaging Technologies GmbH), Matthias Fettke (Pac Tech - Packaging Technologies GmbH), Ian Clark (Intrinsiq Materials Ltd.), and Thomas Brunschwiler (IBM Research – Zurich) Low Temperature Fine-Pitch Wafer-Level Cu-Cu Bonding Using Nanoparticles Fabricated by PVD 287 Zijian Wu (Tsinghua University), Qian Wang (Tsinghua University), Changming Song (Tsinghua University), and Jian Cai (Tsinghua University) Transient Liquid Phase Bonding Using AgSn-Alloys for Stress Reduced Sensor Mounting 293 Markus Feißt (University of Freiburg), Jun Yu (University of Freiburg), and Jüergen Wilde (University of Freiburg) Demonstration of Patternable All-Cu Compliant Interconnections with Enhanced Manufacturability in Chip-to-Substrate Applications 301 Kashyap Mohan (Georgia Institute of Technology), Ninad Shahane (Georgia Institute of Technology), Ramon Sosa (Georgia Institute of Technology), Sadia Khan (Texas Instrument Inc.), P. Markondeya Raj (Georgia Institute of Technology), Antonia Antoniou (Georgia Institute of Technology), Vanessa Smet (Georgia Institute of Technology), and Rao Tummala (Georgia Institute of Technology) Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process 308 Sean Yang (National Taiwan University), Han-Tang Hung (National Taiwan University), Hiroshi Nishikawa (Osaka University), and C. Robert Kao (National Taiwan University) Scaling Package Interconnects Below 20μm Pitch with Hybrid Bonding 314 Guilian Gao (Xperi Corporation), Laura Mirkarimi (Xperi Corporation), Gill Fountain (Xperi Corporation), Liang Wang (Xperi Corporation), Cyprian Uzoh (Xperi Corporation), Thomas Workman (Xperi Corporation), Gabe Guevara (Xperi Corporation), Chandrasekhar Mandalapu (Xperi Corporation), Bongsub Lee (Xperi Corporation), and Rajesh Katkar (Xperi Corporation) Micro-Silver Sinter Paste Developed for Pressure Sintering on Bare Cu Surfaces under Air or Inert Atmosphere 323 Ly May Chew (Heraeus Deutschland GmbH & Co. KG), Wolfgang Schmitt (Heraeus Deutschland GmbH & Co. KG), Christian Schwarzer (Heraeus Deutschland GmbH & Co. KG), and Jens Nachreiner (Heraeus Deutschland GmbH & Co. KG)

YJ Session 8: Fan-Out Packaging-Applications and Architectures

Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application 331 Zihao Chen (Institute of Microelectronics - A*STAR), Lim Teck Guan (Institute of Microelectronics - A*STAR), David Soon Wee Ho (Institute of Microelectronics - A*STAR), and Surya Bhattacharya (Institute of Microelectronics - A*STAR) 3D Heterogeneous Integration with Multiple Stacking Fan-Out Package 337 Feng-Cheng Hsu (TSMC), Jackson Lin (TSMC), Shuo-Mao Chen (TSMC), Po-Yao Lin (TSMC), Jerry Fang (TSMC), Jin-Hua Wang (TSMC), and Shin-Puu Jeng (TSMC) Study of Advanced Fan-Out Packages for Mobile Applications 343 Taejoo Hwang (Samsung Electronics Co. Ltd.), Dan Oh (Samsung Electronics Co. Ltd.), Eunseok Song (Samsung Electronics Co. Ltd.), Kilsoo Kim (Samsung Electronics Co. Ltd.), Jaechoon Kim (Samsung Electronics Co. Ltd.), and Seokwon Lee (Samsung Electronics Co. Ltd.) An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications 349 Yu-Min Lin (Industrial Technology Research Institute), Sheng-Tsai Wu (Industrial Technology Research Institute), Wen-Wei Shen (Industrial Technology Research Institute), Shin-Yi Huang (Industrial Technology Research Institute), Tzu-Ying Kuo (Industrial Technology Research Institute), Ang-Ying Lin (Industrial Technology Research Institute), Tao-Chih Chang (Industrial Technology Research Institute), Hsiang-Hung Chang (Industrial Technology Research Institute), Shu-Man Lee (Industrial Technology Research Institute), Chia-Hsin Lee (Brewer Science Taiwan/Brewer Science Inc.), Jay Su (Brewer Science Taiwan/Brewer Science Inc.), Xiao Liu (Brewer Science Taiwan/Brewer Science Inc.), Qi Wu (Brewer Science Taiwan/Brewer Science Inc.), and Kuan-Neng Chen (National Chiao Tung University)

YJJ Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration 355 Cheng-Ta Ko (Unimicron Technology Corporation), Henry Yang (Unimicron Technology Corporation), John Lau (ASM Pacific Technology Ltd.), Ming Li (ASM Pacific Technology Ltd.), Margie Li (ASM Pacific Technology Ltd.), Curry Lin (Unimicron Technology Corporation), JW Lin (Unimicron Technology Corporation), Tony Chen (Jiangyin Changdian Advanced Packaging Co. Ltd.), Iris Xu (Jiangyin Changdian Advanced Packaging Co. Ltd.), Chieh-Lin Chang (Dow Chemical Company), Jhih-Yuan Pan (Dow Chemical Company), Hsing-Hui Wu (Dow Chemical Company), Qing Xiang Yong (Huawei Technologies Co. Ltd), Nelson Fan (ASM Pacific Technology Ltd.), Eric Kuah (ASM Pacific Technology Ltd.), Zhang Li (Jiangyin Changdian Advanced Packaging Co. Ltd.), Kim Hwee Tan (Jiangyin Changdian Advanced Packaging Co. Ltd.), Y. M. Cheung (ASM Pacific Technology Ltd.), Eric Ng Ng (ASM Pacific Technology Ltd.), Wu Kai (ASM Pacific Technology Ltd.), Ji Hao (ASM Pacific Technology Ltd.), Rozalia Beica (Dow Chemical Company), Marc Lin (Dow Chemical Company), YH Chen (Unimicron Technology Corporation), Zhong Cheng (Huawei Technologies Co. Ltd.), Koh Sau Wee (Huawei Technologies Co. Ltd.), Jiang Ran (Huawei Technologies Co. Ltd.), Cao Xi (Huawei Technologies Co. Ltd.), Sze Pei Lim (Indium Corporation), NC Lee (Indium Corporation), Mian Tao (Hong Kong University of Science and Technology), Jeffery Lo (Hong Kong University of Science and Technology), and Ricky Lee (Hong Kong University of Science and Technology) Design and Fabrication of Feasible 3D Optoelectronics Integration Based on Embedded IC Fanout Technology 364 Fengman Liu (System Packaging and Integration Research Center), Xueping Guo (System Packaging and Integration Research Center), Qian She (National Center for Advanced Packaging), Fengze Hou (System Packaging and Integration Research Center), Haiyun Xue (System Packaging and Integration Research Center), Yu Sun (System Packaging and Integration Research Center), Huimin He (System Packaging and Integration Research Center), Zhaoyao Yu (System Packaging and Integration Research Center), Wenqi Zhang (System Packaging and Integration Research Center), and Liqiang Cao (System Packaging and Integration Research Center) A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-μm Pitch 370 Arnita Podpod (IMEC), John Slabbekoorn (IMEC), Alain Phommahaxay (IMEC), Fabrice Duval (IMEC), Abdellah Salahouelhadj (IMEC), Mario Gonzalez (IMEC), Kenneth Rebibis (IMEC), Andy Miller (IMEC), Gerald Beyer (IMEC), and Eric Beyne (IMEC)

Session 9: Flip Chip Manufacturing Challenges

Low-Temperature Assembly of Surface-Mount Device on Flexible Substrate Using Additive Printing Process 379 Christine Taylor (Georgia Institute of Technology), Xuanke He (Georgia Institute of Technology), Vanessa Smet (Georgia Institute of Technology), Manos Tentzeris (Georgia Institute of Technology), and Suresh Sitaraman (Georgia Institute of Technology)

YJJJ Evaluation of Chip-Last Fan-Out Panel Level Packaging with G2.5 LCD Facility Using FlexUPTM and Mechanical De-bonding Technologies 386 Wei-Yuan Cheng (Industrial Technology Research Institute), Chen-Tsai Yang (Industrial Technology Research Institute), Jie-Mo Lin (Industrial Technology Research Institute), Wei-Han Chen (Industrial Technology Research Institute), Tai-Jui Wang (Industrial Technology Research Institute), and Yuh-Zheng Lee (Industrial Technology Research Institute) Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH Over 2000 392 Kohei Seyama (Shinkawa Ltd.), Shoji Wada (Shinkawa Ltd.), Yuji Eguchi (Shinkawa Ltd.), Tomonori Nakamura (Shinkawa Ltd.), Doug Day (Shinkawa USA Inc), and Shigetoshi Sugawa (Tohoku University) Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-Level Hybrid Bonding in 3D Integration 401 Cheng-Hsien Lu (National Chiao Tung University), Yi-Tung Kho (National Chiao Tung University), Yu-Tao Yang (National Chiao Tung University), Yu-Pei Chen (Taiflex Scientific Corporation), Chiao-Pei Chen (Taiflex Scientific Corporation), Tsung-Tai Hung (Taiflex Scientific Corporation), Chiu-Feng Chen (Taiflex Scientific Corporation), and Kuan-Neng Chen (National Chiao Tung University) Advances in Memory Die Stacking 407 Andreas Marte (Kulicke & Soffa Switzerland Management GmbH), Urban Ernst (Kulicke & Soffa Switzerland Management GmbH), Horst Clauberg (Kulicke & Soffa Industries Inc.), Daniel Buergi (Kulicke & Soffa Industries Inc.), Bob Chylak (Kulicke & Soffa Industries Inc.), Jie Wu (Kulicke & Soffa Pte Ltd), Oranna Yauw (Kulicke & Soffa Pte Ltd), Ulf Friederichs (CADFEM (Suisse) AG), and Ulrich Barthold (CADFEM GmbH) Plasma Treatment for Fluxless Flip-Chip Chip-Joining Process 419 Maxime Godard (Université de Sherbrooke), Dominique Drouin (Université de Sherbrooke), Maxime Darnon (Université de Sherbrooke), Serge Martel (IBM Canada Ltd.), and Clément Fortin (IBM Canada Ltd.) Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability 425 Luke Wentlent (Universal Instruments Corp), Mohammed Genanu (Binghamton University), and Thaer Alghoul (Binghamton University)

Session 10: Innovative Design, Modeling and Predictions for Reliability

Die Attach Delamination Analysis and Modeling Between Temperature Cycling and Thermal Shock for Exposed Pad Lead Frame Devices 434 Madison Koziol (Texas Instruments Inc.), Yutaka Suzuki (Texas Instruments Inc.), Siva Gurrum (Texas Instruments Inc.), and Muhammad Khan (Texas Instruments Inc.) A Comparison Study of Cu Dissolution Mechanism and Kinetics in Solder Joints under Electromigration and Extended Reflow 440 Deepak Goyal (Intel Corporation), Pilin Liu (Intel Corporation), and Alan Overson (Intel Corporation)

YJW Anand Parameters for Modeling Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature 448 Pradeep Lall (Auburn University), Vikas Yadav (Auburn University), Jeff Suhling (Auburn University), and David Locker (US Army AMRDEC) Innovative Design of Crackstop Wall for 14nm Technology Node and Beyond 460 Mohamed Rabie (GLOBALFOUNDRIES Inc.), Nicholas A. Polomoff (GLOBALFOUNDRIES Inc.), Md Khaled Hassan (GLOBALFOUNDRIES Inc.), Victoria L. Calero-DdelC (GLOBALFOUNDRIES Inc.), Danielle Degraw (GLOBALFOUNDRIES Inc.), Michael Hecker (GLOBALFOUNDRIES Inc.), Michael Thiele (GLOBALFOUNDRIES Inc.), and El Mehdi Bazizi (GLOBALFOUNDRIES Inc.) Back-end-of-Line (BEOL) Mechanical Integrity Evaluation: A Mixed-Mode Double Cantilever Beam Test for Crackstop Strength Assessment 467 Max Cioban (IBM), Tuhin Sinha (IBM), and Thomas M. Shaw (IBM) Study of the Long Term Reliability of 3D IC under Near-Application Conditions 476 Omar Ahmed (University of Central Florida), Golareh Jalilvand (University of Central Florida), Jessica Dieguez (University of Central Florida), Peng Su (Juniper Networks), and Tengfei Jiang (University of Central Florida) The Expermental and Numerical Study of Electromigration in 2.5D Packaging 483 Jiefeng Xu (State University of New York at Binghamton), Yuling Niu (State University of New York at Binghamton), Stephen R. Cain (State University of New York at Binghamton), Scott McCann (Xilinx Inc.), Ho Hyung Lee (Xilinx Inc.), Gamal Refai-Ahmed (Xilinx Inc.), and S.B. Park (State University of New York at Binghamton)

Session 11: Emerging Packaging Technologies for 5G and Advanced Computing

Modeling and Design of a 3D Interconnect Based Circuit Cell Formed with 3D SiP Techniques Mimicking Brain Neurons for Neuromorphic Computing Applications 490 Min Miao (Beijing Information Science and Technology University), Liyuan Wang (Beijing Information Science and Technology University), Tianfang Chen (Beijing Information Science and Technology University), Lei Sun (Peking University), Xiaoyang Duan (Beijing Information Science and Technology), Jincan Zhang (Beijing Information Science and Technology University), Na Li (Beijing Information Science and Technology University), Runiu Fang (Peking University), Xin Sun (Peking University), Huan Liu (Peking University), and Yufeng Jin (Peking University) Surface Mount Electroosmotic Pump for Integrated Microfluidic Printed Circuit Boards 498 Sarkis Babikian (University of California), Makoto Jinsenji (OM Sangyo Co. Ltd.), Mark Bachman (Integra Devices Inc.), and G.P. Li (University of California - Irvine)

YW Cryogenic Qubit Integration for Quantum Computing 504 Rabindra Das (MIT Lincoln Laboratory), Jonilyn Yoder (MIT Lincoln Laboratory), Danna Rosenberg (MIT Lincoln Laboratory), David Kim (MIT Lincoln Laboratory), Donna-Ruth Yost (MIT Lincoln Laboratory), Justin Mallek (MIT Lincoln Laboratory), David Hover (MIT Lincoln Laboratory), Vladimir Bolkhovsky (MIT Lincoln Laboratory), Andrew Kerman (MIT Lincoln Laboratory), and William Oliver (MIT Lincoln Laboratory) A Novel Structure for Backside Protection Against Physical Attacks on Secure Chips or SiP 515 Stephan Borel (CEA-Leti), L. Duperrex (CEA-Leti), E. Deschaseaux (CEA-Leti), J. Charbonnier (CEA-Leti), J. Cledière (CEA-Leti), R. Wacquez (CEA-Leti), J. Fournier (CEA-Leti), J.-C. Souriau (CEA-Leti), G. Simon (CEA-Leti), and A. Merle (CEA-Leti) Supply-Chain Security Enhancement by Chaotic Wireless Chip-Package-Board Interactive PUF 521 Masanori Takahashi (Kobe University), Makoto Nagata (Kobe University), and Noriyuki Miura (Kobe University) Interconnect Technology Development for 180GHz Wireless mm-Wave System-in-Foil Transceivers 527 Krzysztof Nieweglowski (Technische Universität Dresden), Patrick Seiler (Technische Universität Dresden), David Fritsche (Technische Universität Dresden), Sebastian Lüngen (Technische Universität Dresden), Dirk Plettemeier (Technische Universität Dresden), Corrado Carta (Technische Universität Dresden), Frank Ellinger (Technische Universität Dresden), and Karlheinz Bock (Technische Universität Dresden) Long Range LiDAR Characterisation for Obstacle Detection for use by the Visually Impaired and Blind 533 Rosemary O'Keeffe (Tyndall National Institute), Salvatore Gnecchi (SenL), Steve Buckley (SensL), Cian O'Murchu (Tyndall National Institute), Alan Mathewson (Tyndall National Institute), Suzanne Lesecq (CEA LETI), and Julie Foucault (CEA LETI)

Session 12: Sintering Pastes, Transient Liquid Phase and Direct Bonding

Pressure-Less Sintering on Large Dies Using Infrared Radiation and Optimized Silver Sinter Paste 539 Wolfgang Schmitt (Heraeus Deutschland GmbH & Co. KG), Ly May Chew (Heraeus Deutschland GmbH & Co. KG), and Robert Miller (Hochschule Aschaffenburg) Direct Bonding Silver to Aluminum Using Eutectic Reaction in Air 545 Shao-Wei Fu (University of California - Irvine) and Chin C. Lee (University of California - Irvine) Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding 551 Junghyun Cho (Binghamton University - State University of New York), Fei Dong (Binghamton University - State University of New York), Liang Yin (GE Global Research), and David Shaddock (GE Global Research) Nano-Cu Sintering Paste for High Power Devices Die Attach Applications 557 Jinjin Zhao (Indium Corporation), Min Yao (Indium Corporation), and Ning-Cheng Lee (Indium Corporation)

YWJ Transient Liquid Phase Sintering Using Copper-Solder-Resin Composite for High-Temperature Power Modules 564 Hiroaki Tatsumi (Mitsubishi Electric Corporation), Adrian Lis (Osaka University), Takeshi Monodane (Mitsubishi Electric Corporation), Hiroshi Yamaguchi (Mitsubishi Electric Corporation), Yoshihiro Kashiba (Osaka University), and Akio Hirose (Osaka University) Detection of Liquefaction by DSC for Cu-Sn TLP Bonding 568 Sylvain Lemettre (ULIS/C2N), Pierre Alphonse (CIRIMAT), Nathalie Isac (C2N), Sana Hammami (C2N), Seonho Seok (C2N), Johan Moulin (C2N), and Alain Bosseboeuf (C2N) High Performance Metal-Based Nanocomposite Thermal Interface Materials Toward Enhanced Cooling Efficiency in Electronic Applications 574 Nirup Nagabandi (Incendium Technologies LLC), Cengiz Yegin (Incendium Technologies LLC), and Mustafa Akbulut (Texas A - M University)

Session 13: Fan-Out and Interposer Interconnections

Chip Stackable, Ultra-thin, High-Flexibility 3D FOWLP (3D SWIFT® Technology) for Hetero-Integrated Advanced 3D WL-SiP 580 WonMyoung Ki (Amkor Technology Korea Inc.), WonGeoL Lee (Amkor Technology Korea Inc.), InSu MoK (Amkor Technology Korea Inc.), IlBok Lee (Amkor Technology Korea Inc.), WonChul Do (Amkor Technology Korea Inc.), Moh Kolbehdari (Amkor Technology - USA), Alex Copia (Amkor Technology - USA), Suresh Jayaraman (Amkor Technology - USA), Curtis Zwenger (Amkor Technology - USA), and KangWook Lee (Amkor Technology Korea Inc.) High Performance, High Density RDL for Advanced Packaging 587 C. H. Yu (Taiwan Semiconductor Manufacturing Company Ltd.), L. J. Yen (Taiwan Semiconductor Manufacturing Company Ltd.), C. Y. Hsieh (Taiwan Semiconductor Manufacturing Company Ltd.), J. S. Hsieh (Taiwan Semiconductor Manufacturing Company Ltd.), Victor C. Y. Chang (Taiwan Semiconductor Manufacturing Company Ltd.), C. H. Hsieh (Taiwan Semiconductor Manufacturing Company Ltd.), C. S. Liu (Taiwan Semiconductor Manufacturing Company Ltd.), C. T. Wang (Taiwan Semiconductor Manufacturing Company Ltd.), KC Yee (Taiwan Semiconductor Manufacturing Company Ltd.), and Doug C. H. Yu (Taiwan Semiconductor Manufacturing Company Ltd.) Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers 594 John Lau (ASM), Ming Li (ASM), Yang Lei (ASM), Margie Li (ASM), Iris Xu (Jiangyin Changdian Advanced Packaging Co. Ltd.), Tony Chen (Jiangyin Changdian Advanced Packaging Co. Ltd.), Sandy Chen (DISCO Hi-Tec China Co. Ltd.), Qing Xiang Yong (Huawei Technologies Co. Ltd.), Kumar Janardhanan (ASM), Wu Kai (ASM), Nelson Fan (ASM), Eric Kuah (ASM), Zhang Li (Jiangyin Changdian Advanced Packaging Co. Ltd.), Kim Hwee Tan (Jiangyin Changdian Advanced Packaging Co. Ltd.), Winsons Bao (DISCO Hi-Tec China Co. Ltd.), Sze Pei Lim (Indium Corporation), Rozalia Beica (Dow Chemical Company), CT Ko (Unimicron Technology Corporation), and Cao Xi (Huawei Technologies Co. Ltd.)

YWJJ Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process 601 Wei_chung Chen (Advanced Semiconductor Engineering), Chiu-Wen Lee (Advanced Semiconductor Engineering), Hung-Chun Kuo (Advanced Semiconductor Engineering), Min-Hua Chung (Advanced Semiconductor Engineering), Chaung-Chi Wang (Advanced Semiconductor Engineering), Shang-Kun Huang (Advanced Semiconductor Engineering), Yen-Sen Liao (Advanced Semiconductor Engineering), Chen-Chao Wang (Advanced Semiconductor Engineering), and David Tarng (Advanced Semiconductor Engineering) Micro Bump System for 2nd Generation Silicon Interposer with GPU and High Bandwidth Memory (HBM) Concurrent Integration 607 Jaesik Lee (NVIDIA Corporation), Chun Yang Lee (NVIDIA Corporation), Chongho Kim (NVIDIA Corporation), and Shantanu Kalchuri (NVIDIA Corporation) Low Cost Panel-Based 1-2 Micron RDL Technologies with Lower Resistance than Si BEOL for Large Packages 613 Fuhan Liu (Georgia Institute of Technology), Hirokazu Ito (JSR Corporation), Rui Zhang (Georgia Institute of Technology), Bartlet H DeProspo (Georgia Institute of Technology), Fabian Benthaus (Georgia Institute of Technology), Hisanori Akimaru (JSR Corporation), Kouichi Hasegawa (JSR Corporation), Venky Sundaram (Georgia Institute of Technology), and Rao R Tummala (Georgia Institute of Technology) Advanced Anodic Aluminum Oxide Interposer Fabrication and 3D Embedded Inductors 619 Hsiang-Yu Chan (University of California - Irvine), Mark Bachman (Integra Devices LLC), and Guann Pyng Li (University of California - Irvine)

Session 14: Advanced Substrates and Flip Chip Applications

2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages 625 Siddharth Ravichandran (Georgia Institute of Technology), Shuhei Yamada (Murata Manufacturing Co. Ltd), Giback Park (Applied Materials Inc.), Han-Wen Chen (Applied Materials Inc.), Tailong Shi (Georgia Institute of Technology), Chintan Buch (Georgia Institute of Technology), Fuhan Liu (Georgia Institute of Technology), Vanessa Smet (Georgia Institute of Technology), Venky Sundaram (Georgia Institute of Technology), and Rao Tummala (Georgia Institute of Technology) Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D) 631 Chen-Yu Huang (Siliconware Precision Industries Co. Ltd.), Yuan-Hung Hsu (Siliconware Precision Industries Co. Ltd.), Ying-Ju Lu (Siliconware Precision Industries Co. Ltd.), Kuo-Hua Yu (Siliconware Precision Industries Co. Ltd.), Wen-Shan Tsai (Siliconware Precision Industries Co. Ltd.), Chang-Fu Lin (Siliconware Precision Industries Co. Ltd.), and C. Key Chung (Siliconware Precision Industries Co. Ltd.)

YWJJJ A Novel Application of Chemical Mechanical Polishing for Panel Level Organic and Glass Substrate 638 Shyh-Lian Cheng (Unimicron Technology Corp.), Wei-Chun Chen (Unimicron Technology Corp.), Puru Bruce Lin (Unimicron Technology Corp.), Cheng-Ta Ko (Unimicron Technology Corp.), and Yu-Hua Chen (Unimicron Technology Corp.) Various Chip Attach Evaluations in a Fine Bump Pitch and Substrate Flip Chip Package 643 ChiYuan Chen (MediaTek Inc. ), Ian Hsu (MediaTek Inc. ), Stanley Lin (MediaTek Inc. ), KeonTaek Kang (STATS ChipPAC Pte. Ltd.), and Ming-Che Hsieh (STATS ChipPAC Pte. Ltd.) The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 μm Fine-Pitch Cu-Pillar/SnAg Micro Bump Interconnection 649 SeYong Lee (KAIST), HanMin Lee (KAIST), JongHo Park (KAIST), SangMyung Shin (KAIST), WooJeong Kim (Doosan Corporation Electro-Materials BG), TaeJin Choi (Doosan Corporation Electro-Materials BG), and Kyung-Wook Paik (KAIST) Chip-Package Interaction Challenges for Large Die Applications 656 Zhuo-Jie Wu (GLOBALFOUNDRIES), Charles Carey (GLOBALFOUNDRIES), Samantha Donavan (GLOBALFOUNDRIES), Doug Hunt (GLOBALFOUNDRIES), Patrick Justison (GLOBALFOUNDRIES), Theo Anemikos (GLOBALFOUNDRIES), John Cincotta (GLOBALFOUNDRIES), Hugues Gagnon (IBM), Oswaldo Chacon (IBM), Robert Martel (IBM), and Thomas Wassick (IBM) Injection of Molten Solder (IMS) Technology for Solder Bumping on Wafers, Ceramic/Organic/Flexible Substrates, and Si Via Filling from Fine Pitch to Large Pitch 663 Jae-Woong Nah (IBM T. J. Watson Research Center), Li-Wen Hung (IBM T. J. Watson Research Center), Paul Andry (IBM T. J. Watson Research Center), and John Knickerbocker (IBM T. J. Watson Research Center)

Session 15: Warpage Control in Assembly Processes

Reduce the Wafer Warpage Introduced by Cu in RDL Through Adjusting the Cooling Temperatures 669 Gong Cheng (Chinese Academy of Sciences), Gaowei Xu (Chinese Academy of Sciences), Wei Gai (Chinese Academy of Sciences), and Le Luo (Chinese Academy of Sciences) Ultra-Thin 50 um Fan-Out Wafer Level Package: Development of an Innovative Assembly and De-bonding Concept 675 Markus Woehrmann (Fraunhofer IZM), Tanja Braun (Fraunhofer IZM), Michael Toepper (Fraunhofer IZM), and Klaus-Dieter Land (Technische Universitaet Berlin) Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management 682 Jisun Hong (Samsung Electronics), Kyoungsei Choi (Samsung Electronics), Dan Oh (Samsung Electronics), SB Park (The State University of New York at Binghamton), Shuai Shao (The State University of New York at Binghamton), Huayan Wang (The State University of New York at Binghamton), Yuling Niu (The State University of New York at Binghamton), and Van Lai Pham (The State University of New York at Binghamton)

YJY Stacking Yield Prediction of Package-on-Package Considering the Statistical Distributions of Top/Bottom Package Warpages and Solder Ball Heights 693 Hsiu-Ping Wei (University of Maryland) and Bongtae Han (University of Maryland) Warpage Control During Mass Reflow Flip Chip Assembly Using Temporary Adhesive Bonding 703 Normand-Pierre Goodhue (Université de Sherbrooke), David Danovitch (Université de Sherbrooke), Jeff Moussodji Moussodji (Université de Sherbrooke), Benoit Papineau (IBM Canada Ltd), and Eric Duchesne (IBM Canada Ltd) Fabrication and Characterization of Epoxy Molding Films (EMFs) for Wafer-Level and Panel-Level Fan Out Packages 712 JongHo Park (Korea Advanced Institute of Science and Technology), HanMin Lee (Korea Advanced Institute of Science and Technology), SeYoung Lee (Korea Advanced Institute of Science and Technology), Youjin Kyung (LG Chem R&D Center), Jung Hak Kim (LG Chem R&D Center), Kwangjoo Lee (LG Chem R&D Center), and Kyung-Wook Paik (Korea Advanced Institute of Science and Technology) Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components Through the Correlation with Scattering in Material Properties 718 Qiming Zhang (The Hong Kong University of Science & Technology), Jeffery C. C. Lo (The Hong Kong University of Science & Technology), S. W. Ricky Lee (The Hong Kong University of Science & Technology), and Wei Xu (Huawei Technologies Co.)

Session 16: Advances in Interconnect Reliability and Techniques

Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh Environment 724 Pradeep Lall (Auburn University), Shantanu Deshpande (Auburn University), and Luu Nguyen (Texas Instruments) Study of Interface Micro-Voids Between Sputter Cu & Plating Cu: The Role of Photoresist 735 Y. B. Ou (Taiwan Semiconductor Manufacturing Company Ltd.), T. L. Yang (Taiwan Semiconductor Manufacturing Company Ltd.), W. C. Wu (Taiwan Semiconductor Manufacturing Company Ltd.), B. T. Chen (Taiwan Semiconductor Manufacturing Company Ltd.), K. Y. Lee (Taiwan Semiconductor Manufacturing Company Ltd.), H. L. Huang (Taiwan Semiconductor Manufacturing Company Ltd.), C. S. Liu (Taiwan Semiconductor Manufacturing Company Ltd.), Ponder Pang (Taiwan Semiconductor Manufacturing Company Ltd.), Edward Chen (Taiwan Semiconductor Manufacturing Company Ltd.), K. C. Liu (Taiwan Semiconductor Manufacturing Company Ltd.), Marvin Liao (Taiwan Semiconductor Manufacturing Company Ltd.), and Harry Ku (Taiwan Semiconductor Manufacturing Company Ltd.) Prediction of Statistical Distribution of Vibration-Induced Solder Fatigue Failure Considering Intrinsic Variations of Mechanical Properties of Anisotropic Sn-Rich Solder Alloys 741 Hsiu-Ping Wei (University of Maryland), Yu-Hsiang Yang (University of Maryland), Bulong Wu (University of Maryland), and Bongtae Han (University of Maryland)

YY Experimental Strain Energy Density Dissipated in SAC305 Solder Joints During Different Thermal Cycling Conditions Using Strain Gages Measurements 748 Jean-Baptiste Libot (Safran Electronics & Defense), F. Dulondel (Safran Electronics & Defense), P. Milesi (Safran Electronics & Defense), J. Alexis (University of Toulouse), L. Arnaud (University of Toulouse), and O. Dalverny (University of Toulouse) Understanding the Impact of PCB Changes in the Latest Published JEDEC Board Level Drop Test Method 756 Varun Thukral (NXP Semiconductor), J.J.M. Zaal (NXP Semiconductor), R. Roucou (NXP Semiconductor), J. Jalink (NXP Semiconductor), and R.T.H.. Rongen (NXP Semiconductor) Non-destructive Inspection of Flip-Chip BGA Solder Ball Defects Using Two Laser Beam Probe Ultrasonic Inspection Technique 764 Vishnu V. B. Reddy (Georgia Institute of Technology), I. Charles Ume (Georgia Institute of Technology), Aaron Mebane (Georgia Institute of Technology), Chidinma Imediegwu (Georgia Institute of Technology), Kola Akinade (Cisco Systems), Amiya R. Chaudhuri (Cisco Systems), Bryan Rogers (Cisco Systems), Mark Hill (Cisco Systems), Cherif Guirguis (Cisco Systems), and Tae-Kyu Lee (Portland State University) Enhanced Design and Reliability Analysis of Copper Post Wafer Level Package 771 Kuei Hsiao Kuo (Siliconware Precision Industries Co. Ltd.), Austin Chen (Siliconware Precision Industries Co. Ltd.), Yen Neng Wang (Siliconware Precision Industries Co. Ltd.), Jiunn Jie Wang (Siliconware Precision Industries Co. Ltd.), Jovi Chang (Siliconware Precision Industries Co. Ltd.), Feng Lung Chien (Siliconware Precision Industries Co. Ltd.), and Rick Lee (Siliconware Precision Industries Co. Ltd.)

Session 17: Technology Advances in Nano, Biochemical, Thermal and Flexible Applications

Development of Integrated Thermistor Sensor and Heating Electrode for Renal Denervation Procedure 777 Ruiqi Lim (Institute of Microelectronics), Ming-Yuan Cheng (Institute of Microelectronics), Weiguo Chen (Institute of Microelectronics), David Sze Wai Choong (Institute of Microelectronics), Jae Hyung Park (Handok Kalos Medical Inc.), Jung Soo Oh (Handok Kalos Medical Inc.), Sebastian Seung Woo Song (Handok Kalos Medical Inc.), Eul Joon Park (Handok Kalos Medical Inc.), and Yuandong Gu (Institute of Microelectronics) Nanomembrane Hybrid Electronics for Wireless Detection of Sourness and Saltiness Toward an Artificial Taste System 783 Yongkuk Lee (Georgia Institute of Technology), Musa Mahmood (Georgia Institute of Technology), Yun Soung Kim (Georgia Institute of Technology), Saswat Mishra (Georgia Institute of Technology), and Woon-Hong Yeo (Georgia Institute of Technology)

YYJ Cost-Efficient Formation of Flexible Pressure Sensor with Micropillar Arrays by Metal-Assisted Chemical Etching for Wearable Electronic Skin 790 Yougen Hu (Chinese Academy of Sciences), Xinyu Zhang (Chinese Academy of Sciences), Pengli Zhu (Chinese Academy of Sciences), Tao Zhao (Chinese Academy of Sciences), Yuan Zhang (Chinese Academy of Sciences), Rong Sun (Chinese Academy of Sciences), and Ching-Ping Wong (The Chinese University of Hong Kong) A Harmonic RF Phase-Shifter Based Wireless pH Sensor 796 Saikat Mondal (Michigan State University), Deepak Kumar (Michigan State University), Saranraj Karuppuswami (Michigan State University), and Premjeet Chahal (Michigan State University) Integration of Chip-Scale SERF Atomic Magnetometers for Magnetoencephalography Measurement 802 Guoliang Li (Southeast University), Jintang Shang (Southeast University), Yu Ji (Southeast University), Lin Lu (Southeast University), and Zhihua Pan (Southeast University) Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength 808 Steffen Bickel (Technische Universität Dresden), Robert Hoehne (Technische Universität Dresden), Iuliana Panchenko (Technische Universität Dresden), Joerg Meyer (Technische Universität Dresden), Iuliana Panchenko (Fraunhofer Institute for Reliability and Microintegration IZM), and M. Juergen Wolf (Fraunhofer Institute for Reliability and Microintegration IZM) Study of Wearables with Embedded Electronics Through Experiments and Simulations 814 Justin H. Chow (Georgia Institute of Technology), Suresh K. Sitaraman (Georgia Institute of Technology), Christopher May (Georgia Institute of Technology), and Joseph May (Georgia Institute of Technology)

Session 18: Silicon Photonics

Backside Optical I/O Module for Si Photonics Integrated with Electrical ICs Using Fan-Out Wafer Level Packaging Technology 822 Hiroshi Uemura (Photonics Electronics Technology Research Association), Kaori Warabi (Photonics Electronics Technology Research Association), Kazuya Ohira (Photonics Electronics Technology Research Association), Yoichiro Kurita (Photonics Electronics Technology Research Association), Haruhiko Yoshida (Photonics Electronics Technology Research Association), Hideto Furuyama (Photonics Electronics Technology Research Association), Yoshiaki Sugizaki (Toshiba Corporation), and Hideki Shibata (Toshiba Corporation) Single-Mode Optical Coupling Technology Using Movable Micro-Mirror Array and Surface-Emitting DFB Laser Array for High-Density 3-D Integration 828 Takanori Suzuki (Oclaro Japan), Koichiro Adachi (Oclaro Japan), Yasunobu Matsuoka (Oclaro Japan), and Shigehisa Tanaka (Oclaro Japan) 3D System-on-Packaging Using Through Silicon Via on SOI for High-Speed Optcal Interconnections with Silicon Photonics Devices for Application of 400 Gbps and Beyond 834 Do-Won Kim (Institute of Microelectronics), Hong Yu Li (Institute of Microelectronics), Ka Fai Chang (Institute of Microelectronics), Woon Leng Loh (Institute of Microelectronics), Ser Choong Chong (Institute of Microelectronics), Hong Cai (Institute of Microelectronics), and Bhattacharya Surya (Institute of Microelectronics)

YYJJ Broadband, Polarization-Insensitive Lensed Edge Couplers for Silicon Photonics 841 Bradley Snyder (imec), Guy Lepage (imec), Sadhishkumar Balakrishnan (imec), Peter Verheyen (imec), Marianna Pantouvaki (imec), Philippe Absil (imec), and Joris Van Campenhout (imec) 400 Gbps 2-Dimensional Optical Receiver Assembled on Wet Etched Silicon Interposer 848 Chenhui Li (Eindhoven University of Technology), Ripalta Stabile (Eindhoven University of Technology), Finn Kraemer (Mellanox Technologies Ltd.), Teng Li (Eindhoven University of Technology), and Oded Raz (Eindhoven University of Technology) EOCB-Platform for Integrated Photonic Chips Direct-on-Board Assembly within Tb/s Applications 854 Tobias Lamprecht (vario-optics AG), Felix Betschon (vario-optics AG), Joris Lambrecht (IDLab - Ghent University-imec), Hannes Ramon (IDLab - Ghent University-imec), Xin Yin (IDLab - Ghent University-imec), Alex Bruderer (Varioprint AG), and Romeo Premerlani (Varioprint AG) Integrated Multi-wavelength Laser Source for Sensing 859 Gabriel Paré-Olivier (TeraXion), Simon Ayotte (TeraXion), François Costin (TeraXion), André Babin (TeraXion), Michel Morin (TeraXion), Benoît Filion (TeraXion), Keven Bédard (TeraXion), Bilodeau Ghislain (TeraXion), Émile Girard-Deschênes (TeraXion), Philippe Chrétien (TeraXion), Louis-Philippe Perron (TeraXion), Charles-André Davidson (TeraXion), Dominique D'amato (TeraXion), Mathieu Laplante (TeraXion), and Jocelyn Blanchet-Létourneau (TeraXion)

Session 19: Interconnect Reliability

Characterization of Material Damage and Microstructural Evolution Occurring in Lead Free Solders Subjected to Cyclic Loading 865 Md Mahmudur Chowdhury (Auburn University), Mohd Aminul Hoque (Auburn University), Nianjun Fu (Auburn University), Jeffrey C. Suhling (Auburn University), Sa'd Hamasha (Auburn University), and Pradeep Lall (Auburn University) Effects of Au and Pd in Pad Surface Finish on Electro-Migration of Flip Chip Interconnection Between Cu-Pillar and Sn-Bi Solder Alloy System 875 Kei Murayama (Shinko Electric Industries Co. Ltd.), Mitsuhiro Aizawa (Shinko Electric Industries Co. Ltd.), and Kiyoshi Oi (Shinko Electric Industries Co. Ltd.) The Stress State of BGA Solder Joints Influenced by the Grain Orientations of Neighboring Joints 882 Andreas Lövberg (Swerea IVF AB) and Per-Erik Tegehall (Swerea IVF AB) Microstructure Evolution of Cu/In/Cu Joints After Solid-Liquid Interdiffusion 890 Yu Shan Chiu (National Taiwan University) and C. Robert Kao (National Taiwan University)

YYJJJ Isothermal Fatigue of Interconnections in Flexible Hybrid Electronics Based Human Performance Monitors 896 Rajesh Sharma Sivasubramony (Binghamton University), Nardeeka Adams (Binghamton University), Mohammed Alhendi (Binghamton University), Gurvinder Singh Khinda (Binghamton University), Maan Z Kokash (Binghamton University), Jack P Lombardi (Binghamton University), Arun Raj (Binghamton University), Sanoop Thekkut (Binghamton University), Darshana L Weerawarne (Binghamton University), Manu Yadav (Binghamton University), Ashwin Varkey Zachariah (Binghamton University), Nancy C Stoffel (GE Global Research), David M Shaddock (GE Global Research), Liang Yin (GE Global Research), Mark D Poliks (Binghamton University), and Peter Borgesen (Binghamton University) Board Level Reliability Investigation of FO-WLP Package 904 Stephen Hou (Taiwan Semiconductor Manufacturing Company Ltd.), K. H. Tsai (Taiwan Semiconductor Manufacturing Company Ltd.), M.F. Wu (Taiwan Semiconductor Manufacturing Company Ltd.), M.F. Ku (Taiwan Semiconductor Manufacturing Company Ltd.), P.H. Tsao (Taiwan Semiconductor Manufacturing Company Ltd.), and L. H. Chu (Taiwan Semiconductor Manufacturing Company Ltd.) Multi-Axis Loading Impact on Thermo-Mechanical Stress-Induced Damage on WLCSP and Components With Via-in Pad Plated Over (VIPPO) Board Design Configuration 911 Mohamed Sheikh (Portland State University), Andy Hsiao (Portland State University), Weidong Xie (Cisco Systems Inc), Steven Perng (Cisco Systems Inc), Edward Ibe (Zymet), Karl Loh (Zymet), and Tae-Kyu Lee (Portland State University)

Session 20: MEMS, Sensor, IoT and Flex

Development of a High Resolution Magnetic Field Position Sensor System Based on a Through Silicon Via First Integration Concept 916 Kai Zoschke (Fraunhofer IZM), Hermann Oppermann (Fraunhofer IZM), Johannes Paul (Sensitec GmbH), Heiko Knoll (Sensitec GmbH), Franz-Josef Braun (Sensitec GmbH), Monika Saumer (University of Applied Sciences Kaiserslautern), Martin Theis (University of Applied Sciences Kaiserslautern), Peter Frank (Sandvik Tooling Supply Schmalkalden), Andreas Lenkl (Märzhäuser Wetzlar GmbH), and Fabian Klose (Märzhäuser Wetzlar GmbH) High Dielectric Constant Molding Compounds for Fingerprint Sensor Packages 926 Tom Tang (Siliconware Precision Industries Co. Ltd), Kelly Chen (Siliconware Precision Industries Co. Ltd), Kevin Tsai (Siliconware Precision Industries Co. Ltd), Max Lu (Siliconware Precision Industries Co. Ltd), Jensen Tsai (Siliconware Precision Industries Co. Ltd), and Yu-Po Wang (Siliconware Precision Industries Co. Ltd) Concept for Using MID Technology for Advanced Packaging 932 Ing. Wurz (Institute of Micro Production Technology), Marc Christopher Wurz (Institute of Micro Production Technology), Sebastian Bengsch (Institute of Micro Production Technology), Bernd Roesener (LPKF Laser & Electronics AG), and Sebastian Beringer (Institute of Micro Production Technology)

YYJW Chipless RFID with Fully Inkjet Printed Tags: A Practical Case Study for Low Cost Smart Packaging Applications 940 Jarrid Wittkopf (HP Inc.), Ning Ge (HP Inc.), Robert Ionescu (HP Inc.), Wagston Staehler (HP Inc.), Doug Pederson (HP Inc.), and Helen Holder (HP Inc.) Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor 948 Thaer M. Alghoul (Binghamton University), Manu Yadav (Binghamton University), Sanoop Thekkut (Binghamton University), Rajesh S. Sivasubramony (Binghamton University), Christopher M. Greene (Binghamton University), Mark D. Poliks (Binghamton University), Peter Borgesen (Binghamton University), Luke Wentlent (Universal Instruments), Michael Meilunas (Universal Instruments), Nancy Stoffel (GE Global Research), David M. Shaddock (GE Global Research), and Liang Yin (GE Global Research) Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications 954 Bongsub Lee (Xperi), Rajesh Katkar (Xperi), Guilian Gao (Xperi), Gill Fountain (Xperi), Sangil Lee (Xperi), Liang Wang (Xperi), Chandrasekhar Mandalapu (Xperi), Cyprian Uzoh (Xperi), Laura Mirkarimi (Xperi), Bob Sykes (Xyztec), Max Litjens (Xyztec), Yuling Niu (State University of New York at Binghamton), Shuai Shao (State University of New York at Binghamton), Jing Wang (State University of New York at Binghamton), and Seungbae Park (State University of New York at Binghamton) Study on an Improved Wafer Level Fabrication Process to Achieve Size Uniformity for Micro Glass Shell Resonators 962 Zhaoxi Su (Southeast University), Jintang Shang (Southeast University), Bin Luo (Southeast University), and Ching-Ping Wong (The Chinese University of Hong Kong)

Session 21: Materials and Process Trends for Fan-Out Wafer Level Packaging

Warpage Control of Liquid Molding Compound for Fan-Out Wafer Level Packaging 967 Yosuke Oi (Nagase ChemteX Corporation), Yasuhito Fujii (Nagase ChemteX Corporation), Takashi Hiraoka (Nagase ChemteX Corporation), Yukio Yada (Nagase ChemteX Corporation), and Katsushi Kan (Nagase ChemteX Corporation) Warpage Analysis with Newly Molding Material of Fan-Out Panel Level Packaging and the Board Level Reliability Test Results 973 Kazuhiro Kikuchi (Lintec corporation), Yuusuke Nedzu (Lintec corporation), and Takashi Sugino (Lintec corporation) The Impact of Thermal Shrinkage of Glass Carriers on Achieving Fine Pitch Wiring Through Fan-Out WLP/PLP Process 979 Shuhei Nomura (AGC Asahi Glass) and Kazutaka Hayashi (AGC Asahi Glass)

YYW Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up 985 Alain Phommahaxay (imec), Arnita Podpod (imec), John Slabbekoorn (imec), Erik Sleeckx (imec), Gerald Beyer (imec), Eric Beyne (imec), Alice Guerrero (Brewer Science), Dongshun Bai (Brewer Science), and Kim Arnold (Brewer Science) Novel Microwave Process for RDL Photosensitive Dielectric Polymer Curing on FOWLP Reconstructed Wafer 993 Kazunori Yamamoto (Institute of Microelectronics), Chun-Mei Wang (Institute of Microelectronics), Xiang-Yu Wang (Institute of Microelectronics), Tuck-Foong Koh (Applied Materials Singapore), and Felix Deng (Applied Materials Singapore) Fabrication of Fine Via and Line / Space in Low CTE Film For Panel Fan-out Using a Dry Etching Technology 1000 Yasuhiro Morikawa (ULVAC, Inc.), Muneyuki Sato (ULVAC, Inc.), Takahide Murayama (ULVAC, Inc.), and Tetsushi Fujinaga (ULVAC, Inc.) Reliability Studies of Excimer Laser-Ablated Microvias Below 5 Micron Diameter in Dry Film Polymer Dielectrics for Next Generation, Panel-Scale 2.5D Interposer RDL 1005 Chandrasekharan Nair (Georgia Institute of Technology), Bartlet DeProspo (Georgia Institute of Technology), Habib Hichri (SUSS MicroTec AG), Markus Arendt (SUSS MicroTec AG), Fuhan Liu (Georgia Institute of Technology), Venky Sundaram (Georgia Institute of Technology), and Rao Tummala (Georgia Institute of Technology)

Session 22: Thermal Mechanical Modeling and Characterization

Seal Rings Toughness Characterization by Numerical and Experimental Approaches 1010 Idir Raid (STMicroelectronics & Université Grenoble Alpes), Sébastien Gallois-Garreignot (STMicroelectronics), Rafael Estevez (Université Grenoble Alpes), and Vincent Coutellier (STMicroelectronics) Reliability Life Assessment of WLCSP Using Different Creep Models 1017 V. Ramachandran (National Tsing Hua University), K. C. Wu (National Tsing Hua University), C. C. Lee (National Tsing Hua University), and K. N. Chiang (National Tsing Hua University) On the Uniqueness and Sensitivity of Nanoindentation Testing for Determining Elastic and Plastic Material Properties of Electroplating Copper Filled in Through-Silicon-Via (TSV) 1023 Mahmoud El Barbary (Lamar University), Liangbiao Chen (On Semiconductor), Yong Liu (On Semiconductor), Fei Qin (Beijing University of Technology), and Xuejun Fan (Lamar University) Co-design for Extreme Large Package Solution with Embedded Fine Pitch Interposer (EFI) Technology 1030 Fa Xing Che (Institute of Microelectronics - A*STAR), David Ho (Institute of Microelectronics - A*STAR), and T.C. Chai (Institute of Microelectronics - A*STAR)

YYWJ Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages 1039 Wei Wang (Qualcomm Technologies Inc. ), Dingyou Zhang (Qualcomm Technologies Inc. ), Yangyang Sun (Qualcomm Technologies Inc. ), David Rae (Qualcomm Technologies Inc. ), Lily Zhao (Qualcomm Technologies Inc. ), Jiantao Zheng (Qualcomm Technologies Inc. ), Mark Schwarz (Qualcomm Technologies Inc. ), Milind Shah (Qualcomm Technologies Inc. ), and Ahmer Syed (Qualcomm Technologies Inc.) A Study of Organic Chip Carrier Fatigue Cracking 1044 Shidong Li (IBM), Sushumna Iruvanti (IBM), Kamal Sikka (IBM), and Rui Wang (IBM) Developments for Highly Reliable Electronics - Experiments on Combined Thermal and Vibration Loading 1050 Meier Karsten (Technische Universität Dresden - Electronics Packging Laboratory), Roellig Mike (Fraunhofer Institute for Ceramic Technologies and Systems), and Bock Karlheinz (Technische Universität Dresden - Electronics Packaging Laboratory)

Session 23: RF and THz Module Components

Package Co-design of a Fully Integrated Multimode 76-81GHz 45nm RFCMOS FMCW Automotive Radar Transceiver 1054 Minhong Mi (TI), Meysam Moallem (TI), Jie Chen (TI), Ming Li (TI), and Rajen Murugan (TI) Embedded Active Elements in 3D Printed Structures for the Design of RF Circuits 1062 Mohd Ifwat Mohd Ghazali (Michigan State Univeristy), Saranraj Karuppuswami (Michigan State University), Saikat Mondal (Michigan State University), and Premjeet Chahal (Michigan State University) Miniaturized High-Performance Filters for 5G Small-Cell Applications 1068 Muhammad Ali (Georgia Institute of Technology), Fuhan Liu (Georgia Institute of Technology), Atom Watanabe (Georgia Institute of Technology), P. Markondeya Raj (Georgia Institute of Technology), Venkatesh Sundaram (Georgia Institute of Technology), Manos M. Tentzeris (Georgia Institute of Technology), and Rao. R. Tummala (Georgia Institute of Technology) 3D-IPD with High Aspect Ratio Cu Pillar Inductor 1076 Cheng-Yuan Kung (Advanced Semiconductor Engineering Inc.), Chien-Hua Chen (Advanced Semiconductor Engineering Inc.), Teck Chong Lee (Advanced Semiconductor Engineering Inc.), Hung-Yi Lin (Advanced Semiconductor Engineering Inc.), Shiuan-Yu Lin (Advanced Semiconductor Engineering Inc.), Yu-Chang Hsieh (Advanced Semiconductor Engineering Inc.), Pao-Nan Lee (Advanced Semiconductor Engineering Inc.), and Chen-Chao Wang (Advanced Semiconductor Engineering Inc.) Ultra-Compact, High-Performance, 3D-IPD Integrated Using Conformal 3D Interconnects 1082 Ayad Ghannam (3DiS Technologies S.A.S), Alessandro Magnani (3DiS Technologies S.A.S), David Bourrier (3DiS Technologies S.A.S; LAAS-CNRS and University of Toulouse), and Thierry Parra (3DiS Technologies S.A.S; LAAS-CNRS and University of Toulouse)

YYWJJ Glass in Electronic Packaging and Integration: High Q Inductances for 2.35 GHz Impedance Matching in 0.05 mm Thin Glass Substrates 1089 Wu Zihan (PRC Georgia Tech), Sukhadha Viswanathan (PRC Georgia Tech), Matthias Jotz (SCHOTT AG), Holger Maune (TU Darmstadt), Matthias Jost (TU Darmstadt), P. Markondeya Raj (PRC Georgia Tech), Venkatesh Sundaram (PRC Georgia Tech), and Rao Tummala (PRC Georgia Tech) Through Glass Via (TGV) Based Band Pass Filter for 5G Communications 1097 Renuka Bowrothu (University of Florida), Yong-Kyu Yoon (University of Florida), and Jay Zhang (Corning Incorporated)

Session 24: Optical Module Integration

Direct Fabrication for Polymer Optical Waveguide in PMT Ferrule Using the Mosquito Method 1103 Takaaki Ishigure (Keio University), Hikaru Masuda (Keio University), Kumi Date (Keio University), Chinami Marushima (Keio University), and Tadayuki Enomoto (Keio University) Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions 1109 Alexander Janta-Polczynski (IBM), Elaine Cyr (IBM), Richard Langlois (IBM), Paul Fortier (IBM), Yoichi Taira (IBM), Nicolas Boyer (IBM), and Tymon Barwicz (IBM) Low Reflectance and Reflowable Thermoplastic Optical Lens Without AR Coating 1118 Sho Yakabe (Sumitomo Electric Industries), Takuro Watanabe (Sumitomo Electric Industries), Takayuki Shimazu (Sumitomo Electric Industries), Ryohei Hokari (National Institute of Advanced Industrial Science and Technology), Kazuma Kurihara (National Institute of Advanced Industrial Science and Technology), and Shouhei Okabe (Sumitomo Electric Fine Polymer) Wide-Range 2D InP Chip-to-Fiber Alignment Through Bimorph Piezoelectric Actuators 1124 Simone Cardarelli (Technical University of Eindhoven), Nicola Calabretta (Technical University of Eindhoven), Ripalta Stabile (Technical University of Eindhoven), Kevin Williams (Technical University of Eindhoven), Xiao Luo (VTEC Lasers & Sensors), and Jan Mink (VTEC Lasers & Sensors) Co-integration of High-Bandwidth Photonic and Electronic RDL on 2.5D Glass Interposers Using Low Optical Absorption Photoimageable Dielectric Polymer 1130 Rui Zhang (Georgia Institute of Technology), Fuhan Liu (Georgia Institute of Technology), Michael Gallagher (DowDuPont Specialty Products Division), Ed Anzures (DowDuPont Specialty Products Division), Venky Sundaram (Georgia Institute of Technology), and Rao Tummala (Georgia Institute of Technology) Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems 1136 Gunnar Böttger (Fraunhofer Institute for Reliability and Microintegration IZM), Henning Schröder (Fraunhofer Institute for Reliability and Microintegration IZM), Martin Schneider-Ramelow (Technische Universität Berlin), and Klaus-Dieter Lang (Technische Universität Berlin)

YYWJJJ Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling 1140 Nivesh Mangal (imec and Ghent University), Jeroen Missinne (imec and Ghent University), Joris Van Campenhout (imec), Geert Van Steenberge (imec and Ghent University), and Brad Snyder (imec)

Session 25: Fabrication and Characterization of TSV

Low-Cost and Self-Formed Vertical Nanowires with Aspect Ratio >100x in Deep Si-Trenches for Future 3D-LSI/IC Applications 1146 M. Murugesan (Tohoku University), T. Fukushima J.C. Bea (Tohoku University), H. Hashimoto (Tohoku University), and M. Koyanagi (Tohoku University) First Demonstration of Silicon-Like >250 I/O Per mm Per Layer Multilayer RDL on Glass Panel Interposers by Embedded Photo-Trench and Fly Cut Planarization 1152 Bartlet DeProspo (Georgia Institute of Technology), Fuhan Liu (Georgia Institute of Technology), Chandrasekharan Nair (Georgia Institute of Technology), Atsushi Kubo (Tokyo Ohka Kogyo Corporation), Frank Wei (Disco Corporation), Ye Chen (Disco Corporation), Venkatesh Sundaram (Georgia Institute of Technology), and Rao R. Tummala (Georgia Institute of Technology) Dielectric Quality of 3D Capacitor Embedded in Through-Silicon Via (TSV) 1158 Ye Lin (Nanyang Technological University) and Chuan Seng Tan (Nanyang Technological University) Experimental Assessment and Analysis of the Influence of Radiation on Through-Silicon Vias 1164 Qinghua Zeng (Peking University), Jing Chen (Peking University), and Yufeng Jin (Shenzhen Graduate School) Co-deposition of Nano-Size SiC Particles in Micro-Via 1170 Houya Wu Wu (Central South University), Yan Wang (Central South University), Fuliang Wang (Central South University), Zhuo Chen (Central South University), Hu He (Central South University), Liancheng Wang (Central South University), and Wenhui Zhu (Central South University) A Study of Crystal Orientation of Solder TSVs 1176 Yuki Ohra (Denso Corporation), Yuki Inagaki (Denso Corporation), Atsushi Mizutani (Denso Corporation), and Kazushi Asami (Denso Corporation) Characterization of Optical End-Point Detection for Via Reveal Processing 1181 Anne Jourdain (IMEC), Nina Tutunjyan (IMEC), Joeri DeVos (IMEC), Stefano Sardo (IMEC), Daniele Piumi (IMEC), Andy Miller (IMEC), Eric Beyne (IMEC), Edward Walsby (SPTS Technologies), Huma Ashraf (SPTS Technologies), Dave Thomas (SPTS Technologies), and Nouredine Rassoul (IMEC)

YYJY Session 26: Wafer Level Packaging Fan-In and Fan-Out Key Developments

Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI) 1188 Zhaohui Chen (Institute of Microelectronics - A*STAR), Boon Long Lau (Institute of Microelectronics - A*STAR), Zhipeng Ding (Institute of Microelectronics - A*STAR), Eva Leong Ching Wai (Institute of Microelectronics - A*STAR), Beibei Han (Institute of Microelectronics - A*STAR), Lin Bu (Institute of Microelectronics - A*STAR), Hyun-Kee Chang (Institute of Microelectronics - A*STAR), and Tai Chong Chai (Institute of Microelectronics - A*STAR) Fan Out Package: Performance and Scalability Perspective 1194 Jong Heon Kim (nepes Corporation), Young Tae Kwon (nepes Corporation), Yong Ho Kwon (nepes Corporation), Yong Woon Yeo (nepes Corporation), Young Mo Lee (nepes Corporation), Yoon Mook Park (nepes Corporation), Eung Ju Lee (nepes Corporation), Jun Kyu Lee (nepes Corporation), Nam Chul Kim (nepes Corporation), Sangdon Lee (Giparang Inc.), Seongwook Choi (Giparang Inc.), Yoonyoung Bae (Giparang Inc.), and Young June Park (Seoul National University) Board Level Reliability Enhancement of WLCSP with Large Chip Size 1200 Pei-Haw Tsao (TSMC), T. H. Lu (TSMC), T. M. Chen (TSMC), K. C. Chang (TSMC), C. M. Kuo (TSMC), M. J. Lii (TSMC), and L. H. Chu (TSMC) Controlling Underfill Lateral Flow to Improve Component Density in Heterogeneously Integrated Packaging Systems 1206 Christophe Faucher-Courchesne (Université de Sherbrooke), David Danovitch (Université de Sherbrooke), Lise Brault (IBM Canada Ltd), Marie-Claude Paquet (IBM Canada Ltd), and Eric Turcotte (IBM Canada Ltd) Dual-Carrier Process Using Mechanical and Laser Release Technologies for Advanced Wafer-Level Packaging 1214 Michelle Fowler (Brewer Science Inc.), John P. Massey (Brewer Science Inc.), Ramachandran K. Trichur (Brewer Science Inc.), and Matthew Koch (Brewer Science Inc.) Optimization of Electrodeposited Copper for Sub 5 μm L/S Redistribution Layer Lines by Plating Additives 1220 Ralf Schmidt (Atotech Deutschland GmbH), T. Beck (Atotech Deutschland GmbH), R. Rooney (University of Illinois), and A. Gewirth (University of Illinois) UBM/RDL Deposition by PVD for FOWLP in High Volume Production 1226 Chris Jones (SPTS Technologies Ltd), Steve Burgess (SPTS Technologies Ltd), Tony Wilby (SPTS Technologies Ltd), and Paul Densley (SPTS Technologies Ltd)

Session 27: Automotive and Power Electronics

Embedded Components for High Temperature Automotive Applications 1233 Wolfgang Grübl (Continental), Stephanie Gross (Continental), and Bernhard Schuch (Continental)

YYY New Failure Mechanism in High Temperature Resin Materials 1238 Michael Guyenot (Robert Bosch GmbH CR/APJ3), D. Maas (Robert Bosch GmbH CR/APJ3), R. Ratchev (Robert Bosch GmbH CR/APJ3), A. Khoshamouz (Schweizer Electronic AG), T. Gottwald (Schweizer Electronic AG), and S. Kreuer (Isola GmbH) Next Generation of Automotive Radar with Leading-Edge Advances in SiGe Devices and Glass Panel Embedding (GPE) 1245 Tailong Shi (Georgia Institute of Technology), Yunyi Gong (Georgia Institute of Technology), Siddharth Ravichandran (Georgia Institute of Technology), Venky Sundaram (Georgia Institute of Technology), John D. Cressler (Georgia Institute of Technology), and Rao Tummala (Georgia Institute of Technology) Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics 1251 Kremena Vladimirova (Univ. Grenoble Alpes), Julie Widiez (Univ. Grenoble Alpes), Bastien Letowski (Univ. Grenoble Alpes), Pierre Perreau (Univ. Grenoble Alpes), Gregory Enyedi (Univ. Grenoble Alpes), Perceval Coudrain (Univ. Grenoble Alpes), Nicolas Rouger (Univ. Grenoble Alpes), and Jean-Christophe Crebier (Univ. Grenoble Alpes) Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density 1258 Bianca Boettge (Fraunhofer Institute for Microstructure of Materials and Systems IMWS), F. Naumann (Fraunhofer Institute for Microstructure of Materials and Systems IMWS), S. Behrendt (FuE-Zentrum Fachhochschule Kiel GmbH), M. G. Scheibel (Heraeus Deutschland GmbH & Co. KG), S. Kaessner (Robert Bosch GmbH and University of Tuebingen), S. Klengel (Fraunhofer Institute for Microstructure of Materials and Systems IMWS), M. Petzold (Fraunhofer Institute for Microstructure of Materials and Systems IMWS), K. G. Nickel (University of Tuebingen), G. Hejtmann (Robert Bosch GmbH), A. Z. Miric (Heraeus Deutschland GmbH & Co. KG), and R. Eisele (FuE-Zentrum Fachhochschule Kiel GmbH) Mechanism of Ultrasonic-Assisted Sintering of Cu@Ag NPs Paste in air for High-Temperature Power Device Packaging 1270 Hongjun Ji (Harbin Institute of Technology at Shenzhen) and Mingyu Li (Harbin Institute of Technology at Shenzhen) Design Consideration of a 3D Stacked Power Supply on Chip 1276 Kota Ono (Kyushu Institute of Technology), Kengo Hiura (Kyushu Institute of Technology), and Satoshi Matsumoto (Kyushu Institute of Technology)

Session 28: High-Speed and High-Bandwidth Packaging

Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon-Interconnect Fabric 1283 SivaChandra Jangam (University of California - Los Angeles), Adeel Ahmed Bajwa (University of California - Los Angeles; Kulicke & Soffa Industries Inc.), Kannan K Thankkappan (University of California - Los Angeles), Premsagar Kittur (University of California - Los Angeles), and Subramanian Srikantes Iyer (University of California - Los Angeles)

YYYJ High Bandwidth Memory Interface on Organic Substrate: Challenges to Electrical Design 1289 Vadim Heyfitch (Xilinx Inc.), Shen Dong (Xilinx Inc.), Nanju Na (Xilinx Inc.), Hong Shi (Xilinx Inc.), Jaspreet Gandhi (Xilinx Inc.), Jane Xi (Xilinx Inc.), and Susan Wu (Xilinx Inc.) Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages 1295 Se-Ho You (Samsung Electronics Corporation), Seonghwan Jeon (Samsung Electronics Corporation), Dan (Kyung Suk) Oh (Samsung Electronics Corporation), Kilsoo Kim (Samsung Electronics Corporation), Jaechoon Kim (Samsung Electronics Corporation), Seung-Yong Cha (Samsung Electronics Corporation), and GyoungBum Kim (Samsung Electronics Corporation) FCBGA Fundamental Technology Realizing 56 Gbps PAM-4 System with 50 cm Electric Transmission 1302 Kazuyuki Nakagawa (Renesas Electronics Corporation), Norio Chujo (Hitachi Ltd.), Masayoshi Yagyu (Hitachi Ltd.), Yutaka Uematsu (Hitachi Ltd.), Keita Tsuchiya (Renesas Electronics Corporation), Shinji Katayama (Renesas Electronics Corporation), Yoshiaki Sato (Renesas Electronics Corporation), Hiroyuki Uchida (Renesas Electronics Corporation), and Shinji Baba (Renesas Electronics Corporation) De-sensitization Design and Analysis for Highly Integrated RFSoC and DRAM Stacked-Die Design 1310 Sheng-Mou Lin (MediaTek Inc.), Chih-Chun Hsu (MediaTek Inc.), Yi-An Hsu (MediaTek Inc.), Fu-Yi Han (MediaTek Inc.), Duen-Yi Ho (MediaTek Inc.), Wen-Zhou Wu (MediaTek Inc.), and Charles Nan-Cheng Chen (MediaTek Inc.) Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications 1318 Timothy Clingenpeel (University of Florida), Seahee Hwangbo (University of Florida), Nicolas Garraud (University of Florida), David Arnold (University of Florida), and Yong-Kyu Yoon (University of Florida) Comparative Study on Electrical Performance of eWLB, M-Series and Fan-Out Chip Last 1324 Chih-Yi Huang (Advanced Semiconductor Engineering Inc.), Tsun-Lung Hsieh (Advanced Semiconductor Engineering Inc.), Po-Chih Pan (Advanced Semiconductor Engineering Inc.), Ming-Fong Jhong (Advanced Semiconductor Engineering Inc.), Chen-Chao Wang (Advanced Semiconductor Engineering Inc.), and Sheng-Chi Hsieh (Advanced Semiconductor Engineering Inc.)

Session 29: Modeling of Power Electronics

Prognostication of Damage in Automotive Underhood Electronics Subjected to Temperature and Vibration 1330 Pradeep Lall (Auburn University), Tony Thomas (Auburn University), and Jeff Suhling (Auburn University) Interface Fracture Toughness Characterization in Electronic Packages Using the Crack Surface Displacement Extrapolation Method 1342 Przemyslaw Gromala (Robert Bosch GmbH), Mateus Jeronimo (Robert Bosch GmbH), Alexandru Prisacaru (Robert Bosch GmbH), Marcus Schulz (AMIC GmbH), and Jüergen Keller (AMIC GmbH)

YYYJJ Simulation for Enhancing Automotive Power Module DBC Reliability During Assembly Process 1349 Yong Liu (ON Semiconductor) and Qiuxiao Qian (ON Semiconductor) A Methodology to Integrate Thermo-Mechanical Reliability Predictions into Co-design of Flip-Chip-On-Lead Devices 1359 Siva Gurrum (Texas Instruments Inc.), Manu Prakuzhy (Texas Instruments Inc.), Guangxu Li (Texas Instruments Inc.), Hung-Yun Lin (Texas Instruments Inc.), Saumya Gandhi (Texas Instruments Inc.), J. Carlos Arroyo (Texas Instruments Inc.), Frank Mortan (Texas Instruments Inc.), and Amit Nangia (Texas Instruments Inc.) High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology 1365 Fengze Hou (National Center for Advanced Packaging), Xueping Guo (National Center for Advanced Packaging), Qidong Wang (National Center for Advanced Packaging), Wenbo Wang (Delft University of Technology), Tingyu Lin (National Center for Advanced Packaging), Liqiang Cao (Institute of Microelectronics of Chinese Academy of Sciences), G. Q. Zhang (Delft University of Technology), and J. A. Ferreira (Delft University of Technology) Mars 2020 Rover Laser Power Supply Thermomechanical Analysis 1371 Juan Cepeda-Rizo (NASA / Californian Institute of Technology) and David Tuman (NASA / Californian Institute of Technology) Mechanical Modelling of High Power Lateral IGBT for LED Driver Applications 1375 Pushparajah Rajaguru (University of Greenwich), Chris Bailey (University of Greenwich), Hua Lu (University of Greenwich), Alberto Castellazzi (University of Nottingham), Mattia Antonini (University of Nottingham), Vasantha Pathirana (University of Cambridge), Nishad Udugampola (University of Cambridge), Florin Udrea (University of Cambridge), Paul Mitchelson (Imperial College), and Samer Aldhaher (Imperial College)

Session 30: Emerging Materials and Technologies

On-chip Solid-State CMOS Compatible Micro-Supercapacitors 1382 Rickard Andersson (Smoltek AB), Amin M. Saleem (Smoltek AB), Vincent Desmaris (Smoltek AB), Bo Song (Georgia Institute of Technology), and Ching Ping Wong (Georgia Institute of Technology) Fabrication of High Capacitance Density Capacitor Using Spray Coated Ba0.6Sr0.4TiO3 Thin Films 1389 Emmanuel Tetsi (Université de Bordeaux; Université de Sherbrooke), Isabelle Bord Majek (Université de Bordeaux), Gilles Philippot (Université de Bordeaux), Cyril Aymonier (Université de Bordeaux), Roxan Lemire (IBM Canada Ltd.; Centre de Collaboration MiQro Innovation), Jean Audet (IBM Canada Ltd.; Centre de Collaboration MiQro Innovation), Laurent Bechou (Université de Bordeaux; Université de Sherbrooke), and Dominique Drouin (Université de Sherbrooke) Structuring Methods of Polymers for low Cost Sensor Manufacturing 1396 Sebastian Bengsch (Leibniz University Hanover), Marc Christopher Wurz (Leibniz University Hanover), Maximilian Aue (Leibniz University Hanover), and Sascha de Wall (Leibniz University Hanover)

YYYJJJ Solely Calcine Controlled Ferroelectricity and Resistivity of Barium Titanate Thin Films and Their Advanced Memory Applications 1402 Todd Schumann (University of Florida), Xiaochen Zhu (University of Florida), Jacob Neff (University of Florida), Arthur Hebard (University of Florida), Henry Zmuda (University of Florida), and Yong-Kyu Yoon (University of Florida) Electrochemical Analysis of Mechanically Flexible Magnesiumion Battery Electrodes in a Polymer Gel Perchlorate Electrolyte 1407 Todd Houghton (Arizona State University) and Hongbin Yu (Arizona State University) Demonstration of Hermetic Sealing on Ultra-Thin, Wafer-Integrated Aluminum-Polymer Capacitors for High-Voltage and High-Temperature Applications 1414 Robert Spurney (Georgia Institute of Technology), Himani Sharma (Georgia Institute of Technology), Markondeya Pulugurtha (Georgia Institute of Technology), Rao Tummala (Georgia Institute of Technology), Naomi Lollis (AVX Corporation), Mitch Weaver (AVX Corporation), Saumya Gandhi (Texas Instruments), and Matt Romig (Texas Instruments) Hydrothermal Exfoliation for Two-Dimension Boron Nitride Nanosheets 1421 Guang Yang (Chinese Academy of Sciences), Haixu Wang (Chinese Academy of Sciences), Ning Wang (Chinese Academy of Sciences), Rong Sun (Chinese Academy of Sciences), and Ching-Ping Wong (Chinese University of Hong Kong)

Session 31: Advanced Wirebond and Interconnect Technologies

Effects of Epoxy Molding Compound on Electrical Resistance Degradation of Pd-Coated Cu Wire Bonds in the 175 °C to 225 °C Range 1427 Michael David Hook (University of Waterloo), Michael Mayer (University of Waterloo), and Stevan Hunter (ON Semiconductor) Molecular Dynamics Simulation of Microwelds Formation and Breakage During Ultrasonic Copper Wire Bonding 1434 Yangyang Long (Leibniz Universität Hannover), Bo He (Leibniz Universität Hannover Hanover), Weizhe Cui (Leibniz Universität Hannover Hanover), Xiaoying Zhuang (Leibniz Universität Hannover Hanover), and Jens Twiefel (Leibniz Universität Hannover Hanover) Investigation for Highly Reliable Free Air Ball Formation for Silver Bonding Wire 1440 Noritoshi Araki (Nippon Micrometal Corporation), Yasutomo Ichiyama (Nippon Steel & Sumikin Technology), Ryo Oishi (Nippon Micrometal Corporation), and Takashi Yamada (Nippon Micrometal Corporation) Corrosion Mechanisms of Cu Wire Bonding on Al Pads 1446 Wentao Qin (On Semiconductor), Harold Anderson (On Semiconductor), Tom Anderson (On Semiconductor), George Chang (On Semiconductor), and Denise Barrientos (On Semiconductor)

YYYJW Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices 1455 Shubhada Sahasrabudhe (Intel Corporation), Scott Mokler (Intel Corporation), Mukul Renavikar (Intel Corporation), Sandeep Sane (Intel Corporation), Kevin Byrd (Intel Corporation), Eric Brigham (Intel Corporation), Owen Jin (Intel Corporation), Pubudu Goonetilleke (Intel Corporation), Nilesh Badwe (Intel Corporation), and Satish Parupalli (Intel Corporation) Advances in Wire Bonding Technology to Overcome Resonance Conditions 1465 Aashish Shah (Kulicke and Soffa Industries Inc. ), Gary Schulze (Kulicke and Soffa Industries Inc. ), Jon Brunner (Kulicke and Soffa Industries Inc. ), Ivy Qin (Kulicke and Soffa Industries Inc. ), Bob Chylak (Kulicke and Soffa Industries Inc. ), and Nelson Wong (Kulicke and Soffa Industries Pte. Ltd.) 3-D Antenna-in-Package Design with Metallic Coating Technique 1472 Chih-Chun Hsu (MediaTek Inc.), Sheng-Mou Lin (MediaTek Inc.), Ying-Chih Chen (MediaTek Inc.), Wen-Zhou Wu (MediaTek Inc.), Che-Ya Chou (MediaTek Inc.), Charles Nan-Cheng Chen (MediaTek Inc.), Gavin Gao (Advanced Semiconductor Engineering Inc.), and Chen-Chao Wang (Advanced Semiconductor Engineering Inc.)

Session 32: Heterogeneous Integration

Void-Free Copper Pillar Hybrid Wafer Bonding Using a BCB Based Polymer Adhesive and Chemical Mechanical Polishing 1479 Michael Gallagher (DowDuPont Specialty Products Division), Julia Kozhukh (DowDuPont Specialty Products Division), Matthew VanHanehem (DowDuPont Specialty Products Division), Ed Anzures (DowDuPont Specialty Products Division), Rosemary Bell (DowDuPont Specialty Products Division), and Masaki Kondo (DowDuPont Specialty Products Division) Heterogeneous Integration Challenges Within Wafer Level Fan-Out SiP for Wearables and IoT 1485 Alberto Martins (Amkor Technology Portugal), Marcio Pinheiro (Amkor Technology Portugal), Ana Filipa Ferreira (Amkor Technology Portugal), Rodrigo Almeida (Amkor Technology Portugal), Filipe Matos (Amkor Technology Portugal), Joana Oliveira (Amkor Technology Portugal), Rui Pedro Silva (Amkor Technology Portugal), Hugo Santos (INESC TECH), Manual Monteiro (Fraunhofer Portugal), and Hugo Gamboa (Fraunhofer Portugal) Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration 1493 Shuying Ma (Huatian Technology (Kunshan) Electronics Co. Ltd.), Jiao Wang (Huatian Technology (Kunshan) Electronics Co. Ltd.), Fengxia Zheng (Huatian Technology (Kunshan) Electronics Co. Ltd.), Zhiyi Xiao (Huatian Technology (Kunshan) Electronics Co. Ltd.), Teng Wang (Huatian Technology (Kunshan) Electronics Co. Ltd.), and Daquan Yu (Huatian Technology (Kunshan) Electronics Co. Ltd.)

YYYW "Hole-in-One TSV", a New Via Last Concept for High Density 3D-SOC Interconnects 1499 Joeri De Vos (imec), Stefaan Van Huylenbroeck (imec), Anne Jourdain (imec), Nancy Heylen (imec), Lan Peng (imec), Geraldine Jamieson (imec), Nina Tutunjyan (imec), Stefano Sardo (imec), Andy Miller (imec), and Eric Beyne (imec) Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 μm) and Reliable Flexible Cu-Based Interconnects 1505 Amir Hanna (UCLA), Arsalan Alam (UCLA), Takafumi Fukushima (UCLA), Steven Moran (UCLA), William Whitehead (UCLA), Siva Chandra Jangam (UCLA), Saptadeep Pal (UCLA), Goutham Ezhilarasu (UCLA), Randall Irwin (UCLA), Adeel Bajwa (UCLA), and Subramanian Iyer (UCLA) Heterogeneous Multi-die Stitching: Technology Demonstration and Design Considerations 1512 Paul Jo (Georgia Institute of Technology), Md Obaidul Hossen (Georgia Institute of Technology), Xuchen Zhang (Georgia Institute of Technology), Yang Zhang (Georgia Institute of Technology), and Muhannad Bakir (Georgia Institute of Technology) Heterogeneous Integration Technology Demonstrations for Future Healthcare, IoT, and AI Computing Solutions 1519 John Knickerbocker (IBM), R. Budd (IBM), B. Dang (IBM), Q. Chen (IBM), E. Colgan (IBM), L.W. Hung (IBM), S. Kumar (IBM), K. W. Lee (IBM), M. Lu (IBM), J.W. Nah (IBM), R. Narayanan (IBM), K. Sakuma (IBM), V. Siu (IBM), and B. Wen (IBM)

Session 33: Next Generation Materials and Processes for Through Vias and 3D Interconnects

Extreme Thinning of Si Wafers for Via-Last and Multi-wafer Stacking Applications 1523 Anne Jourdain (imec), Joeri De Vos (imec), Nouredine Rassoul (imec), Houman Zahedmanesh (imec), Andy Miller (imec), Gerald Beyer (imec), Eric Beyne (imec), Edward Walsby (SPTS Technologies), Jash Patel (SPTS Technologies), Oliver Ansell (SPTS Technologies), Huma Ashraf (SPTS Technologies), Dave Thomas (SPTS Technologies), Shifang Li (KLA-Tencor), Timothy Chang (KLA-Tencor), Stephen Hiebert (KLA-Tencor), Moritz Stoerring (KLA-Tencor), and Andrew Cross (KLA-Tencor) Development of a Polyimide/SiC-Whisker/Nano-Particles Composite with High Thermal Conductivity and Low Coefficient of Thermal Expansion as Dielectric Layer for Interposer Application 1531 Yunna Sun (Shanghai Jiao Tong University), Jiangbo Luo (Shanghai Jiao Tong University), Zhuoqing Yang (Shanghai Jiao Tong University), Yan Wang (Shanghai Jiao Tong University), Guifu Ding (Shanghai Jiao Tong University), and Zhenqian Wang (Clemson University) An Advanced Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and Ultra-Fine Line/Space in 2.5D Interposers and Fan-Out Packages 1537 Daichi OKamoto (Taiyo Ink Mfg. Co. Ltd.), Yoko Shibasaki (Taiyo Ink Mfg. Co. Ltd.), Daisuke Shibata (Taiyo Ink Mfg. Co. Ltd.), Tadahiko Hanada (Taiyo Ink Mfg. Co. Ltd.), Fuhan Liu (Georgia Institute of Technology 3D Systems Packaging Research Center), Venky Sundaram (Georgia Institute of Technology 3D Systems Packaging Research Center), and Rao R Tummala (Georgia Institute of Technology 3D Systems Packaging Research Center)

YYYWJ Highly Productive Solder Interconnect Formation by Bump Stabbing for 3D-TSV Die Stacking 1543 Shizu Fukuzumi (Hitachi Chemical Co. Ltd), Hitoshi Onozeki (Hitachi Chemical Co. Ltd), Naoya Suzuki (Hitachi Chemical Co. Ltd), and Toshihisa Nonaka (Hitachi Chemical Co. Ltd) Reliability Studies of 5 μm Diameter Photo Vias with Daisy Chain Resistance Using Dry Film Photosensitive Dielectric Material 1550 Atsushi Kubo (Tokyo Ohka Kogyo Co. Ltd), Chandrasekharan Nair (Georgia Institute of Technology), Bartlet DeProspo (Georgia Institute of Technology), Fuhan Liu (Georgia Institute of Technology), Tomoyuki Ando (Tokyo Ohka Kogyo Co. Ltd), Venky Sundaram (Georgia Institute of Technology), and Rao Tummala (Georgia Institute of Technology) Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications 1555 Asisa Kumar Panigrahi (KLEF Hyderabad Campus), Hemanth Kumar C (Indian Institute of Technology Hyderabad), Satish Bonam (Indian Institute of Technology Hyderabad), Brince Paul K (Indian Institute of Technology Hyderabad), Tamal Ghosh (Indian Institute of Technology Hyderabad), Nirupam Paul (Indian Institute of Technology Hyderabad), Siva Rama Krishna Vanjari (Indian Institute of Technology Hyderabad), and Shiv Govind Singh (Indian Institute of Technology Hyderabad) Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate 1561 Kwang-Seong Choi (ETRI), Wagno Alves Braganca Junior (ETRI), leeseul Jeong (ETRI), Keon-Soo Jang (ETRI), Seok Hwan Moon (ETRI), Hyun-Cheol Bae (ETRI), Yong-Sung Eom (ETRI), Min Kyo Cho (Beyond! Technology Innovator), and Seung Il Chang (Beyond! Technology Innovator)

Session 34: Fan-Out Wafer Level Package Reliability

Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers 1568 John Lau (ASM), Ming Li (ASM), Lei Yang (ASM), Margie Li (ASM), Qing Xiang Yong (Huawei Technologies Co. Ltd.), Zhong Cheng (Huawei Technologies Co. Ltd.), Tony Chen (Jiangyin Changdian Advanced Packaging Co. Ltd.), Iris Xu (Jiangyin Changdian Advanced Packaging Co. Ltd.), Nelson Fan (ASM), Eric Kuah (ASM), Zhang Li (Jiangyin Changdian Advanced Packaging Co. Ltd.), Kim Hwee Tan (Jiangyin Changdian Advanced Packaging Co. Ltd.), Y. M. Cheung (ASM), Eric Ng (ASM), Penny Lo (ASM), Wu Kai (ASM), Ji Hao (ASM), Rozalia Beica (Dow Chemical Company), Koh Sau Wee (Huawei Technologies Co. Ltd.), Jiang Ran (Huawei Technologies Co. Ltd.), Cao Xi (Huawei Technologies Co. Ltd.), Sze Pei Lim (Indium Corporation), NC Lee (Indium Corporation), Cheng-Ta Ko (Unimicron Technology Corporation), Henry Yang (Unimicron Technology Corporation), YH Chen (Unimicron Technology Corporation), Mian Tao (Hong Kong University of Science and Technology), Jeffery Lo (Hong Kong University of Science and Technology), and Ricky Lee (Hong Kong University of Science and Technology) Passivation Materials for a Reliable Fine Pitch RDL 1577 Moreau Stéphane (CEA), Nacima Allouti (CEA), Céline Ribière (CEA), Jean Charbonnier (CEA), David Bouchu (CEA), Jean-Philippe Michel (CEA), Nicolas Buffet (CEA), and Pascal Chausse (CEA)

YYYWJJ Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method 1587 Van-Lai Pham (Binghamton University), Yuling Niu (Binghamton University), Jing Wang (Binghamton University), Huayang Wang (Binghamton University), Charandeep Singh (Binghamton University), Seungbae Park (Binghamton University), Cheng Zhong (Huawei Technologies Co. Ltd. ), Sau Wee Koh (Huawei Technologies Co. Ltd. ), Jifan Wang (Huawei Technologies Co. Ltd. ), and Shuai Shao (Binghamton University) Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications 1594 Cheng Chen (Institute of Microelectronics of Chinese Academy of Sciences), Teng Wang (Huatian Technology (Kunshan) Electronics Co. Ltd.), Daquan Yu (Huatian Technology (Kunshan) Electronics Co. Ltd.), Shuying Ma (Huatian Technology (Kunshan) Electronics Co. Ltd.), Kai Zhu (Huatian Technology (Xi'an) Electronics Co. Ltd.), Zhiyi Xiao (Huatian Technology (Kunshan) Electronics Co. Ltd.), and Lixi Wan (Institute of Microelectronics of Chinese Academy of Sciences) Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages 1601 Chia-Kuei Hsu (Taiwan Semiconductor Manufacturing Company ), Po-Yao Lin (Taiwan Semiconductor Manufacturing Company ), Wen-Yi Lin (Taiwan Semiconductor Manufacturing Company ), Ming-Chih Yew (Taiwan Semiconductor Manufacturing Company ), Shu-Shen Yeh (Taiwan Semiconductor Manufacturing Company ), Kuang-Chun Lee (Taiwan Semiconductor Manufacturing Company ), Jin-Hua Wang (Taiwan Semiconductor Manufacturing Company ), Po-Chen Lai (Taiwan Semiconductor Manufacturing Company ), Che-Chia Yang (Taiwan Semiconductor Manufacturing Company ), and Shin-Puu Jeng (Taiwan Semiconductor Manufacturing Company) Effects of Underfill on Thermo-Mechanical Behavior of Fan-out Wafer Level Package Used in PoP: An Experimental Study by Advancements of Real-Time Moiré Interferometry 1609 Bulong Wu Wu (University of Maryland) and Bongtae Han (University of Maryland) Reliability Study of Large Fan-Out BGA Solution on FinFET Process 1617 C.K. Yu (MediaTek Inc.), W.S. Chiang (MediaTek Inc.), P.S. Huang (MediaTek Inc.), M.Z. Lin (MediaTek Inc.), Y.H. Fang (MediaTek Inc.), M.J. Lin (MediaTek Inc.), Cooper Peng (MediaTek Inc.), Benson Lin (MediaTek Inc.), and Michael Huang (MediaTek Inc.)

Session 35: Multiphysics and Solder Joint Reliability

Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion Subjected to Highly-Accelerated Stress Test 1622 Pradeep Lall (Auburn University), Yihua Luo (Auburn University), and Luu Nguyen (Texas Instruments)

YYYWJJJ Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package 1633 Aurore Quelennec (Université de Sherbrooke), Yosri Ayadi (Université de Sherbrooke), Quentin Vandier (Université de Sherbrooke), Éric Duchesne (IBM Canada Ltd), Hélène Frémont (Université de Bordeaux), and Dominique Drouin (Université de Sherbrooke) Improving Solder Joint Reliability for PoP Packages in Current Mobile Ecosystem 1639 Karthikeyan Dhandapani (Qualcomm Technologies Inc.), Jiantao Zheng (Qualcomm Technologies Inc.), Brian Roggeman (Qualcomm Technologies Inc.), and Marcus Hsu (Qualcomm Technologies Inc.) Experimental Investigation of Temperature and Mean Stress Effects on High Cycle Fatigue Behavior of SnAgCu-Solder Alloy 1645 Youssef Maniar (Robert Bosch GmbH), Georg Konstantin (Robert Bosch GmbH), Alexander Kabakchiev (Robert Bosch GmbH), Peter Binkele (University of Stuttgart), and Siegfried Schmauder (University of Stuttgart) Water Effects in Polymers Through Molecular Dynamics 1653 Nancy Iwamoto (Honeywell) Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling 1662 Shuai Shao (The State University of New York at Binghamton), Yuling Niu (The State University of New York at Binghamton), Jing Wang (The State University of New York at Binghamton), Ruiyang Liu (The State University of New York at Binghamton), Seungbae Park (The State University of New York at Binghamton), Hohyung Lee (Xilinx), Gamal Refai-Ahmed (Xilinx), and Laurene Yip (Xilinx) Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-Out Chip Last Packages 1670 Meng-Kai Shih (Advanced Semiconductor Engineering Inc.), Ryan Chen (Advanced Semiconductor Engineering Inc.), PeterBS Chen (Advanced Semiconductor Engineering Inc.), Ying-Chih Lee (Advanced Semiconductor Engineering Inc.), KarenYU Chen (Advanced Semiconductor Engineering Inc.), Ian Hu (Advanced Semiconductor Engineering Inc.), Tang-Yuan Chen (Advanced Semiconductor Engineering Inc.), Lung Tsai (Advanced Semiconductor Engineering Inc.), Eatice Chen (Advanced Semiconductor Engineering Inc.), Eddie Tsai (Advanced Semiconductor Engineering Inc.), David Tarng (Advanced Semiconductor Engineering Inc.), and CP Hung (Advanced Semiconductor Engineering Inc.)

Session 36: Power Delivery Solutions for Components and Systems

Analog Power Filtering: Modeling, Measuring & Analog PI 1677 Matthew S. Doyle Mr. (IBM), Layne A. Berge Mr. (IBM), and Kyle B. Schoneck Mr. (IBM) Improved Staggered Through Silicon Via Inductors for RF and Power Applications 1686 Xiao Sun (imec), Geert Van der Plas (imec), and Eric Beyne (imec)

YYYJY Realization of High Electrical Performance On-chip Thick Copper Inductor Package by Via Interface Process Improvement for Metal Contact 1692 T. L. Yang (TSMC), S. B. Yang (TSMC), W. L. Huang (TSMC), C. C. Chen (TSMC), C. C. Kuo (TSMC), G. C. Huang (TSMC), K. Y. Wu (TSMC), T. C. Chang (TSMC), C.C. Hsu (TSMC), C. L. Chang (TSMC), H. L. Huang (TSMC), Edward Chen (TSMC), K. C. Liu (TSMC), Marvin Liao (TSMC), Alex Kalnitsky (TSMC), and Harry Ku (TSMC) An Approach for PDN Simplification of a Mobile Processor 1700 Sungwook Moon (Samsung Electronics Co. Ltd.), Seungki Nam (Samsung Electronics Co. Ltd.), Jungil Son (Samsung Electronics Co. Ltd.), and Sunha Lee Sunha Lee (Samsung Electronics Co. Ltd.) Design Optimization and Accurate Extraction of On-die Decoupling Capacitors for High-Performance Applications 1706 Xiaoping Liu (Intel Corporation), Jihong Ren (Intel Corporation), Wendem Beyene (Intel Corporation), Simon Ku (Intel Corporation), Chin Hong Heah (Intel Corporation), and Sherman Hsu (Intel Corporation) Signal and Power Integrity Analysis of InFO Interconnect for Networking Application 1714 Po-Hao Chang (MediaTek Inc.), Chia-Yuan Hsieh (MediaTek Inc.), Chun-Wei Chang (MediaTek Inc.), Chih-Lun Chuang (MediaTek Inc.), and Chen-Feng Chiang (MediaTek Inc.) A System-in-Package Based Energy Harvesting for IoT Devices with Integrated Voltage Regulators and Embedded Inductors 1720 Edward Lee (Georgia Institute of Technology), Mohammad Faisal Amir (Georgia Institute of Technology), Sridhar Sivapurapu (Georgia Institute of Technology), Colin Pardue (Georgia Institute of Technology), Hakki Mert Torun (Georgia Institute of Technology), Mohamed Bellaredj (Georgia Institute of Technology), Madhavan Swaminathan (Georgia Institute of Technology), and Saibal Mukhopadhyay (Georgia Institute of Technology)

Session 37: Interactive Presentations 1

Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression Bonding 1726 Hemanth Kumar Cheemalamarri (IITH), Asisa Kumar panigrahi (KL University Hyderabad), Satish Bonam (Indian Institute of Technology Hyderabad), Nirupam Paul (Indian Institute of Technology Hyderabad), Siva Rama Krishna Vanjari (Indian Institute of Technology Hyderabad), and Shiv Govind Singh (Indian Institute of Technology Hyderabad) Reliability Test of Organic Substrate Processed by Newly Desmear Method "PhotodesmearTM" 1732 Shinichi Endo (Ushio Inc.), Tomoyuki Habu (Ushio Inc.), Yasushi Muto (Ushio Inc.), and Shintaro Yabu (Ushio America Inc.) Highly-Conductive Stretchable Electrically Conductive Composites by Halogenation Treatment and Its Application in Stretchable Electronics 1738 Peng Zheng (Fudan University), Haoyue Zhuo (Fudan University), Yuxiao Zou (Fudan University), Wei Guo (Huazhong University of Science and Technology), Hao Wu (Huazhong University of Science and Technology), and Zhuo Li (Fudan University)

YM Electroplating Enhanced Silver Nanowire Networks for Transparent Heaters 1745 Shang Wang (Harbin Institute of Technology) and Yanhong Tian (Harbin Institute of Technology) Low Transmission Loss Film Material for High-Speed High-Frequency Devices 1751 Takao Tanigawa (Hitachi Chemical Co. Ltd.), Etsuo Mizushima (Hitachi Chemical Co. Ltd.), Mami Shimada (Hitachi Chemical Co. Ltd.), Kohji Morita (Hitachi Chemical Co. Ltd.), Minoru Kakitani (Hitachi Chemical Co. Ltd.), and Shin Takanezawa (Hitachi Chemical Co. Ltd.) Wet-Spun Graphene Sheets as Flexible Heat Spreaders for Efficient Thermal Management 1756 Guang Yang (Fudan University), Yuze Yan (Fudan University), Zhuo Li (Fudan University), Chaowei Li (Suzhou Institute of Nano-tech and Nano-bionics Chinese Academy of Sciences), and Yagang Yao (Suzhou Institute of Nano-tech and Nano-bionics Chinese Academy of Sciences) Aging Characteristics of Green Mold Compound for Use in Encapsulation of Microelectronic Devices 1762 Subramani Manoharan (University of Maryland), Chandradip Patel (Schlumberger Technology Corporation), Steven Dunford (Schlumberger Technology Corporation), Carlos Morillo (University of Maryland), and Patrick McCluskey (University of Maryland) Effective Stress Relief Without Jeopardizing Reliability in Overmolded Packages with Stress Buffers 1768 A. Mavinkurve (NXP Semiconductors), Jeroen Zaal (NXP Semiconductors), Yukai Liang (NXP Semiconductors), Sean Xu (NXP Semiconductors), Antoine Storez (NXP Semiconductors), Yuan Guo (NXP Semiconductors), Seng Teng (NXP Semiconductors), and Sheila Chopin (NXP Semiconductors) High Temperature Mechanical Behavior of SAC and SAC+X Lead Free Solders 1775 Mohammad S. Alam (Auburn University), KM Rafidh Hassan (Auburn University), Jeffrey C. Suhling (Auburn University), and Pradeep Lall (Auburn University) Flexible Wearable Biometric Band and Smartphone Application for Prevention of Sudden Causes of Death 1784 Pradeep Lall (Auburn University), Hao Zhang (Auburn University), and Rahul Lall (Stanford University) Backward Compatible Connectors for Next Generation PCIe Electrical I/O 1792 Lei Shan (IBM Corporation), Daniel Freidman (IBM Corporation), Craig Kennedy (Amphenol Corporation), Warren Persak (Amphenol Corporation), and Kevin Lau (Amphenol Corporation) PCB Pin Area Wire Modeling Based on Representative Layer 2D Misregistration 1799 Zhaoqing Chen (IBM Corporation) Compact Low Power Avionics for the Europa Lander Concept and Other Missions to Ocean Worlds 1807 Gary S. Bolotin (Jet Propulsion Laboratory - California Institue of Technology), Douglas J. Sheldon (Jet Propulsion Laboratory - California Institue of Technology), Malcolm L. Lias (Jet Propulsion Laboratory - California Institue of Technology), Christopher B. Stell (Jet Propulsion Laboratory - California Institue of Technology), Jong-ook Suh (Jet Propulsion Laboratory - California Institue of Technology), and Donald J. Hunter (Jet Propulsion Laboratory - California Institue of Technology)

YMJ Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level Packaging 1818 Chia-Hsin Lee (Brewer Science; National Chiao Tung University), Jay Su (Brewer Science), Xiao Liu (Brewer Science), Qi Wu (Brewer Science), Jim-Wein Lin (Unimicron Technology Corp.), Puru Lin (Unimicron Technology Corp.), Cheng-Ta Ko (Unimicron Technology Corp.), Yu-Hua Chen (Unimicron Technology Corp.), Wen-Wei Shen (Industrial Technology Research Institute), Tzu-Ying Kou (Industrial Technology Research Institute), Shin-Yi Huang (Industrial Technology Research Institute), Yu-Min Lin (Industrial Technology Research Institute), Kuan-Neng Chen (Industrial Technology Research Institute), and Ang-Ying Lin (Industrial Technology Research Institute) Thermally Conductive Underfill and Its Viscoelastic Properties Using Hexagonal Boron Nitride Nanofiller N/A S. A. Razgaleh (North Carolina A&T State University) and Shyam Aravamudhan (North Carolina A&T State University) Self-Assembly Technologies for FlexTrate™ 1830 Takafumi Fukushima (Tohoku University), Yuki Susumago (Tohoku University), Hisashi Kino (Tohoku University), Tetsu Tanaka (Tohoku University), Arsalan Alam (UCLA), Amir Hanna (UCLA), and Subramanian Iyer (UCLA) High Performance EMI Shielding Materials and Spraying Process Parameters for High Frequency FCBGA Application 1836 Kisu Joo (Ntrium Incorporation), Kyu Jae Lee (Ntrium Incorporation), Jung Woo Hwang (Ntrium Incorporation), Jin-Ho Yoon (Ntrium Incorporation), Yoon-Hyun Kim (Ntrium Incorporation), Joo-Wook Park (Ntrium Incorporation), Myung Jin Yim (Ntrium Incorporation), and Se Young Jeong (Ntrium Incorporation) Physical Aging of Epoxy Molding Compound and Its Influences on the Warpage of Reconstituted Wafer 1842 Tz-Cheng Chiu (National Cheng Kung University), Wei-Jie Yin (ASE Group Kaohsiung), En-Yu Yeh (National Cheng Kung University), Yu-Ting Yang (ASE Group Chung-Li), Dao-Long Chen (ASE Group Kaohsiung), and Yi-Hsiu Tseng (ASE Group Chung-Li) High Thermal Conductive Semi-Sintering Die Attach Paste 1850 Wei Yao (Henkel Electronic Materials LLC.), Rajasekhar Peddi (Henkel Electronic Materials LLC.), Kily Wu (Henkel Electronic Materials LLC.), Robin Fu (Henkel Electronic Materials LLC.), and Hoseung Yoo (Henkel Electronic Materials LLC.) Non-destructive Assessment of the Porosity in Silver (Ag) Sinter Joints Using Acoustic Waves 1857 Sebastian Brand (Fraunhofer Institute for Microstructure of Materials and Systems), Bianca Böttge (Fraunhofer Institute for Microstructure of Materials and Systems), Michael Kögel (Fraunhofer Institute for Microstructure of Materials and Systems), Falk Naumann (Fraunhofer Institute for Microstructure of Materials and Systems), Jurrian Zijl (BESI Netherlands), Sebastiaan Kersjes (BESI Netherlands), Thomas Behrens (Infineon Technologies AG), and Frank Altmann (Fraunhofer Institute for Microstructure of Materials and Systems)

YMJJ Reliability Study and Finite Element Modeling of a Wearable Sensor Patch (WSP) to Monitor ECG Signals 1865 Mark Poliks (Binghamton University), Varun Soman (Binghamton University), James Turner (Binghamton University), Mark Schadt (i3 Electronics Inc.), Michael Shay (i3 Electronics Inc.), and Frank Egitto (i3 Electronics Inc.)

Session 38: Interactive Presentations 2

Fabrication and Characteristics of Spin-on Dielectric for Multi-level Interconnect in WLP 1873 Changmin Song (Seoul National University of Science and Technology), Sungdong Kim (Seoul National University of Science and Technology), and Sarah Kim (Seoul National University of Science and Technology) High Density TSV-Free Interposer (TFI) Packaging with Submicron Cu Damascene RDLs for Integration of CPU/GPU and HBM 1879 Masaya Kawano (Institute of Microelectronics), Chum-Mei Wang (Institute of Microelectronics), Hong-Yu Li (Institute of Microelectronics), Mian-Zhi Ding (Institute of Microelectronics), Sharon Pei-Siang Lim (Institute of Microelectronics), Teck-Guan Lim (Institute of Microelectronics), Zi-Hao Chen (Institute of Microelectronics), and Fa-Xing Che (Institute of Microelectronics) Dynamic Warpage Analysis of QFP Packages During Soldering Reflow Process and Thermal Cycle 1887 Marco Rovitto (STMicroelectronics), Arianna Morelli (STMicroelectronics), Carlo Passagrilli (STMicroelectronics), and Claudio Maria Villa (STMicroelectronics) Improvement of Mechanical Properties of Zn-Added Sn58Bi Alloy by Zn Segregation on the Sn-Bi Phase Boundaries During Thermal Aging 1893 Shiqi Zhou (Osaka University), Omid Mokhtari (Osaka University), and Hiroshi Nishikawa (Osaka University) Low Dielectric Properties Encapsulation for High Frequency Devices 1900 Naoki Kanagawa (Panasonic corporation), Daisuke Sasaki (Panasonic Corporation), and Shigeru Yamatsu (Panasonic Corporation) Controlling Die Warpage by Applying Under Bump Metallurgy for Fan-Out Package Process Applications 1906 Hwan-Pil Park (Hanyang University), Young-Ho Kim (Hanyang University), Young-Moon Jang (Seoul National University of Science and Technology), and Sung-Hoon Choa (Seoul National University of Science and Technology) Influence of Metallization and Size on the Conductive Properties of Metal-Coated Polymer Particles in Anisotropic Conductive Adhesive 1914 Molly Bazilchuk (Conpart AS), Helge Kristiansen (Conpart AS), and Jianying He (Norwegian Institute of Science and Technology) Demonstration of a Heterogeneously Integrated System-on-Wafer (SoW) Assembly 1920 Adeel Ahmad Bajwa (University of California Los Angeles), SivaChandra Jangam (University of California Los Angeles), Saptadeep Pal (University of California Los Angeles), Boris Vaisband (University of California Los Angeles), Randall Irwin (University of California Los Angeles), Mark Goorsky (University of California Los Angeles), and Subramanian S. Iyer (University of California Los Angeles)

YMJJJ Novel Temporary Adhesive Materials for RDL-First Fan-Out Wafer-Level Packaging 1925 Hong Zhang (Brewer Science Inc.), Xiao Liu (Brewer Science Inc.), Shawna Rickard (Brewer Science Inc.), Rama Puligadda (Brewer Science Inc.), and Tony Flaim (Brewer Science Inc.) The Reliability and the Effect of NCA Trapping in Thermo-Compression Flip-Chip Solder Joints Fabricated Using Sn-Ag Solder Capped 40 μm Pitch Cu Pillar Bumps and Low Temperature Curable Non-Conductive Adhesive (NCA) 1931 Hwan-Pil Park (Hanyang University), Seongchul Kim (Hanyang University), Taeyoung Lee (Hanyang University), Sehoon Yoo (Korea Institue Industrial Technology), Young-Ho Kim (Hanyang University), and Jae-Yong Park Park (Hanyang University) Performance of Fine and Ultra-Fine Lead-Free Powders for Solder Paste Applications 1936 Amir H. Nobari (5N Plus Inc.), Sylvain St-Laurent (5N Plus Inc.), Yannig Thomas (National Research Council Canada), Arslane Bouchemit (École Polytechnique de Montréal), and Gilles L’Espérance (École Polytechnique de Montréal) Laser-Based Full Cut Dicing Evaluations for Thin Si Wafers 1945 Jeroen van Borkulo (ASM Pacific Technology) and Richard van der Stam (ASM Pacific Technology) Thermal Design and Characterization of High Power SiC Inverter with Low Profile and Enhanced Thermal Performance 1950 Gongyue Tang (Institute of Microelectronics - A*STAR ), Tai Chong Chai (Institute of Microelectronics - A*STAR ), and Xiaowu Zhang (Institute of Microelectronics - A*STAR) Challenges of Large Body FCBGA on Board Level Assembly and Reliability 1956 Fletcher (Cheng Piao) Tung (Siliconware Precision Industries Co. Ltd.), Chung (Hsiang Chun) Chen (Siliconware Precision Industries Co. Ltd.), Max (Chin Yu) Lu (Siliconware Precision Industries Co. Ltd.), Jensen Tsai (Siliconware Precision Industries Co. Ltd.), and Yu-Po Wang (Siliconware Precision Industries Co. Ltd.) Optimization of Via Bottom Cleaning for Bumpless Interconnects and Wafer-on-Wafer (WOW) Integration 1962 Y. S. Kim (Tokyo Institute of Technology), S. Kodama (Tokyo Institute of Technology), Y. Mizushima (Tokyo Institute of Technology), N. Araki (Tokyo Institute of Technology), C. Hsiao (Industrial Technology Research Institute), H. Chang (Industrial Technology Research Institute), C. Lin (Industrial Technology Research Institute), and T. Ohba (Industrial Technology Research Institute) Design, Fabrication and Characterization of TSV Interposer Integrated 3D Capacitor for SIP Applications 1968 Jiwei Li (Xiamen University), Shenglin Ma (Xiamen University), Huan Liu (Peking University), Yong Guan (Peking University), Jing Chen (Peking University Shenzhen Graduate School Peking University Shenzhen), Yufeng Jin (Peking University), Wei Wang (Peking University), Liulin Hu (Chengdu Ganide Technology Co. Ltd.), and Shuwei He (Chengdu Ganide Technology Co. Ltd.)

YMJW High-Speed Precision Handling Technology of Micro-Chip for Fan-Out Wafer Level Packaging (FOWLP) Application 1975 Qianwen Chen (IBM), Li-wen Hung (IBM), Evan Colgan (IBM), Bo Wen (IBM), Bing Dang (IBM), Russell Budd (IBM), Jae-woong Nah (IBM), and John Knickerbocker (IBM) A Novel Inorganic Substrate by Three Dimensionally Stacked Glass Core Technology 1981 Toshiki Iwai (Fujitsu Laboratories Ltd.), Taiji Sakai (Fujitsu Laboratories Ltd.), Daisuke Mizutani (Fujitsu Laboratories Ltd.), Seiki Sakuyama (Fujitsu Laboratories Ltd.), Kenji Iida (Fujitsu Interconnect Technologies Ltd.), Takayuki Inaba (Fujitsu Interconnect Technologies Ltd.), Hidehiko Fujisaki (Fujitsu Interconnect Technologies Ltd.), and Yoshinori Miyazawa (Fujitsu Interconnect Technologies Ltd.) High Reliability Sintered Silver-Indium Bonding with Anti-Oxidation Property for High Temperature Applications 1987 Chun An Yang (National Taiwan University), C. Robert Kao (National Taiwan University), Hiroshi Nishikawa (Osaka University), and Chin C. Lee (University of California - Irvine) RF Characterization, Analysis and Miniaturization Impact of RDL Interconnects 1994 Hélène Jacquinot (CEA-LETI), Alexis Farcy (STMicroelectronics), Thierry Lacrevaz (IMEP-LAHC), Kévin Morot (ST-Microelectronics), Bernard Flechet (IMEP-LAHC), Roselyne Ségaud (CEA-LETI), Rémi Velard (STMicroelectronics), Lucile Arnaud (CEA-LETI), Jean-Charles Barbe (CEA-LETI), and Lucile Cheramy (CEA-LETI) Integration of the SERF Magnetometer and the Mz Magnetometer Using Micro-Fabricated Alkali Vapor Cell 2001 Jin Zhang (Southeast University), Jintang Shang (Southeast University), Guoliang Li (Southeast University), Lin Lu (Southeast University), Zhihua Pan (Southeast University), Yu Ji (Southeast University), and Ching-Ping Wong (The Chinese University of Hong Kong) Integrated Copper Heat Spreaders in Glass Panel Embedded Packages with Near-Zero Thermal Interface Resistance 2007 Nithin Nedumthakady (Georgia Institute of Technology), Bartlet DeProspo (Georgia Institute of Technology), P. Markondeya Raj (Georgia Institute of Technology), Venky Sundaram Sundaram (Georgia Institute of Technology), Rao Tummala (Georgia Institute of Technology), Kyle Byers (Kansas City National Security Campus), Sean Garrison (Kansas City National Security Campus), Chris Gibson (Sandia National Labs), and Michael Elsbury (Sandia National Labs) Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond Contacts 2013 Robert Klengel (Fraunhofer Instiute for Microstructure of Materials and Systems IMWS), Falk Naumann (Fraunhofer Institute for Microstructure of Materials and Systems IMWS), Sebastian Tismer (Fraunhofer Institute for Microstructure of Materials and Systems IMWS), and Sandy Klengel (Fraunhofer Institute for Microstructure of Materials and Systems IMWS)

YMW Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions 2020 Atom Watanabe (Georgia Institute of Technology), Tong-Hong Lin (Georgia Institute of Technology), P. Markondeya Raj (Georgia Institute of Technology), Venky Sundaram (Georgia Institute of Technology), Manos M. Tentzeris (Georgia Institute of Technology), Rao R. Tummala (Georgia Institute of Technology), and Tomonori Ogawa (Asahi Glass Company) Effect of Surface Finish and High Bi Solder Alloy on Component Reliability in Thermal Cycling 2026 Sa'd Hamasha (Auburn University), Francy Akkara (Auburn University), Mohammed Abueed (Auburn University), Mumen Rababah (Auburn University), Cong Zhao (Auburn University), Sianan Su (Auburn University), Jeffery Suhling (Auburn University), and John Evans (Auburn University) Electromigration Behavior and Mechanical Properties of the Whole Preferred Orientation Intermetallic Compound Interconnects for 3D Packaging 2035 M.L. Huang (Dalian University of Technology), L. Zou (Dalian University of Technology), and S.Q. Yin (Dalian University of Technology)

Session 39: Interactive Presentations 3

3D Stacking Process with Thermo-Sonic Bonding Using Non-conductive Film 2043 Shigeru Yamatsu (Panasonic Corporation), Kazuki Watanabe (Panasonic Corporation), Naoki Kanagawa (Panasonic Corporation), Takatoshi Ishikawa (Panasonic Smart Factory Solutions Co.), and Teppei Kojio (Panasonic Smart Factory Solutions Co.) 2D Magnetic Inductors for DC-DC Converters on Glass Interposer 2049 Vincent Lafage (Université de Sherbrooke), Yann Beilliard (Université de Sherbrooke), Arvind Sridhar (IBM Zurich), Thomas Brunschwiler (IBM Zurich), and Dominique Drouin (Université de Sherbrooke) Modeling and Characterization of a Hermetic Ceramic Package and Its Performance Impact on a 1.5-7V Input, 3-A, Radiation-Hardened Ultra-Low Dropout (LDO) Regulator 2055 Javier Valle (TI), Li Ming (TI), Rajen Murugan (TI), Jeff Holloway (TI), and Leon Stiborek (TI) Electrical Characterization of a High Speed HBM Interface for a Low Cost Interposer 2062 Michael Dittrich (Fraunhofer IIS/EAS), Andy Heinig (Fraunhofer IIS/EAS), and Fabian Hopsch (Fraunhofer IIS/EAS) Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D System-in-Packaging (SiP) Using Compact Through Glass Via (TGV)-Integrated Antennas 2068 Seahee Hwangbo (University of Florida), Yong-Kyu Yoon (University of Florida), and Aric B. Shorey (Corning Incorporated) Reliability of Sintered and Soldered High Power Chip Size Packages and Flip Chip LEDs 2074 Alexander Hanss (Technische Hochschule Ingolstadt), Maximilian Schmid (Technische Hochschule Ingolstadt), Sri Krishna Bhogaraju (Technische Hochschule Ingolstadt), Fosca Conti (University of Padova), and Gordon Elger (Technische Hochschule Ingolstadt)

YMWJ Comparison of Package-on-Package Technologies Utilizing Flip Chip and Fan-Out Wafer Level Packaging 2083 Amy Lujan (SavanSys Solutions LLC) Fork Type Structure of Silicon Waveguide for Optical Efficiency Optimization 2089 Warren Wang (Corporate R&D/ Optical communication SiP Technology), OnionZY Yang (Corporate R&D/ Optical communication SiP Technology), Shian Tu (Corporate R&D/ Optical communication SiP Technology), Meiju Lu (Corporate R&D/ Optical communication SiP Technology), Jihan Chen (Corporate R&D/ Optical communication SiP Technology), and Vincent Lin (Corporate R&D/ Optical communication SiP Technology) Effect of Improved Optimization of DFE Equalization on Crosstalk and Jitter in High Speed Links with Multi-level Signal 2095 Nana Dikhaminjia (Ilia State University), J. He (Ilia State University), H. Deng (Ilia State University), M. Tsiklauri (Ilia State University), J. Drewniak (Ilia State University), A. Chada (Dell Enterprise Product Group), and B. Mutnury (Dell Enterprise Product Group) Copper Transparent Antennas on Flexible Glass by Subtractive and Semi-Additive Fabrication for Automotive Applications 2101 Jack Lombardi (Binghamton University), Robert Malay (Binghamton University), James Schaffner (HRL Laboratories), Hyok Jae Song (HRL Laboratories), Ming-Huang Huang (Corning Research and Development Corporation), Scott Pollard (Corning Research and Development Corporation), Mark Poliks (Binghamton University), and Timothy Talty (General Motors) Correlated Model for Wafer Warpage Prediction of Arbitrarily Patterned Films 2110 Gregory Ostrowicki (Texas Instruments), Siva Gurrum (Texas Instruments), and Amit Nangia (Texas Instruments) Thermomechanical Properties of Fan-Out Wafer Level Package with Various Chip and Mold Thickness 2115 Haksan Jeong (Sungkyunkwan University), Woo-Ram Myung (Sungkyunkwan University), Kwang-Ho Jung (Sungkyunkwan University), and Seung-Boo Jung (Sungkyunkwan University) Design of a Compact Broadband Butler Matrix and Its Application in Organic Beam-Former at the 5 GHz Band 2121 Chung-Yi Hsu (National Sun Yat-Sen University), Chia-Ling Chiang (National Sun Yat-Sen University), Lih-Tyng Hwang (National Sun Yat-Sen University), and Fa-Shian Chang (Cheng Shiu University) Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods 2128 Shui-Bao Liang (South China University of Technology), Chang-Bo Ke (South China University of Technology), Cheng Wei (South China University of Technology), Min-Bo Zhou (South China University of Technology), and Xin-Ping Zhang (South China University of Technology) Electrical Design for the Development of FOWLP for HBM Integration 2136 Teck Guan Lim (Institute of Microelectronics - A*STAR) and David HO Soon Wee (Institute of Microelectronics - A*STAR)

YMWJJ Accurate Electrical Modeling of Through Silicon Via with Minority Carrier Redistribution Effect 2143 Huan Liu (Peking University), Runiu Fang (Peking University), Xin Sun (Peking University), Min Miao (Beijing Information Science and Technology University), and Yufeng Jin (Peking University Shenzhen Graduate School) Thermal and Electrical Characterization of TSV Interposer Embedded with Microchannel for 2.5D Integration of GaN RF Devices 2150 Han Cai (Xiamen University), Shenglin Ma (Xiamen University), Wei Wang (Peking University), Yufeng Jin (Peking University), Jing Chen (Peking University), Jian Zhang (Southwest China Research Institute of Electronic Equipment), Weiwei Xiang (Southwest China Research Institute of Electronic), Liulin Hu (Chengdu Ganide Technology Co.), and Shuwei He (Chengdu Ganide Technology Co.) Alternative Deposition Solution for Cost Reduction of TSV Integration 2157 Julien Vitiello (KOBUS) and Fabien Piallat (KOBUS) Evaluation of Mechanical Stress Induced During IC Packaging 2162 Vladimir Cherman (IMEC), Melina Lofrano (IMEC), Mario Gonzalez (IMEC), Francisco Cadacio Jr. (IMEC), Kenneth June Rebibis (IMEC), Eric Beyne (IMEC), Akihito Takano (Shinko Electric Industries Co.), and Mitsutoshi Higashi (Shinko Electric Industries Co.) Wireless EAS Sensor Tags for Volatile Profiling in Food Packages 2168 Saranraj Karuppuswami (Michigan State University), Mohd Ifwat Mohd Ghazali (Michigan State University), Saikat Mondal (Michigan State University), and Premjeet Chahal (Michigan State University) High Throughput and Improved Edge Straightness for Memory Applications Using Stealth Dicing 2174 Natsuki Suzuki (Tokyo Institute of Technology), Takayuki Ohba (Tokyo Institute of Technology), Yuta Kondo (Hamamatsu Photonics K.K.), Takeshi Sakamoto (Hamamatsu Photonics K.K.), Naoki Uchiyama (Hamamatsu Photonics K.K.), and Kazuhiro Atsumi (Hamamatsu Photonics K.K.) Thick 3D Printed RF Components: Transmission Lines and Bandpass Filters 2180 Kyoung Youl Park (Agency for Defense Development), Mohd Ifwat Mohd Ghazali (Michigan State University), Nophadon Wiwatcharagoses (King Mongkut’s University of Technology North Bangkok), and Premjeet Chahal (Michigan State University) Introduction of a New Metric for the Solder Joint Reliability Assessment of BGA Packages on System Level 2186 Fabian Schempp (Automotive Electronics), Marc Dressler (Automotive Electronics), Daniel Kraetschmer (Automotive Electronics), Friederike Loerke (Automotive Electronics), and Juergen Wilde (University of Freiburg - IMTEK) Compact Optical Coherent Receiver for Avionics Applications 2192 Simon Ayotte (TeraXion), Ghislain Bilodeau (TeraXion), Jocelyn Blanchet-Létourneau (TeraXion), Michel Morin (TeraXion), Pascal Deladurantaye (TeraXion), François Costin (TeraXion), André Babin (TeraXion), Louis-Philippe Perron (TeraXion), Guillaume Brochu (TeraXion), Charles-André Davidson (TeraXion), Dominique D'amato (TeraXion), Émile Girard-Deschênes (TeraXion), Philippe Chrétien (TeraXion), Mathieu Laplante (TeraXion), Mathieu Drolet (TeraXion), and Gabriel Paré-Olivier (TeraXion)

YMWJJJ Parylene as a Dielectric Material for Electronic Applications in Space 2199 Franz Selbmann (TU Bergakademie Freiberg & Fraunhofer ENAS Chemnitz), Mario Baum (TU Bergakademie Freiberg & Fraunhofer ENAS Chemnitz), Maik Wiemer (Fraunhofer ENAS Chemnitz), Yvonne Joseph (TU Bergakademie Freiberg), and Thomas Otto (TU Chemnitz & Fraunhofer ENAS Chemnitz)

Session 40: Interactive Presentations 4

Practical Design Method to Reduce Crosstalk for Silicon Wafer Integrated Fan-Out Technology (SWIFT®) Packages 2205 HoJeong Lim (Amkor Technology Inc.), JeongKyu Yang (Amkor Technology Inc.), and Ruben Fuentes (Amkor Technology Inc.) Fully Inkjet-Printed Three-Dimensional Bandpass Filter on Liquid Crystal Polymer Substrate 2212 Hsuan-Ling Kao (Chang Gung University) and Cheng-Lin Cho (National Tsing Hua University) A Dynamic Bending Method for PoP Package Board Level Reliability Validation 2217 Jeffrey Lee (iST-Integrated Service Technology Inc.), Cheng-Chih Chen (iST-Integrated Service Technology Inc.), Lane Brown (Motorola Lenovo), Esme Mehretu (Motorola Lenovo), Thomas Obrien (Motorola Lenovo), and Feng Lu (Motorola Lenovo) Eliminating Harmful Intermetallic Compound Phase in Silver Wire Bonding by Alloying Silver with Indium 2224 Jiaqi Wu (University of California - Irvine) and Chin C. Lee (University of California - Irvine) Cyanate Ester/Epoxy Co-Curing System with Thermal Stabilizers for High Temperature Stability 2231 Fan Wu (Georgia Institute of Technology), Bo Song (Georgia Institute of Technology), Kyoung-Sik Moon (Georgia Institute of Technology), and CP Wong (Georgia Institute of Technology) Demonstration of 28GHz Band Pass Filter Toward 5G Using Ultra Low Loss and High Accuracy Through Quartz Vias 2237 Yoichiro Sato (Asahi Glass Co.) and Nobutaka Kidera (Asahi Glass Co.) Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power Electronics 2242 Shanshan Xu (University of Colorado Boulder), Ryan Lewis (University of Colorado Boulder), Rongfu Wen (University of Colorado Boulder), Ronggui Yang (University of Colorado Boulder), Yung-Cheng (Y.C.) Lee (University of Colorado Boulder), Woochan Kim (Texas Instruments Inc), and Luu Nguyen (Texas Instruments Inc) 3D Integration of Physics System Using Foldable Packaging for MEMS Atomic Clocks N/A Jongcheol Park (National NanoFab Center), Tae Hyun Kim (National NanoFab Center), Hee Yeoun Kim (National NanoFab Center), Gil Sun Roh (National NanoFab Center), Gapseop Sim (National NanoFab Center), Hae Cheol Hwang (National NanoFab Center), Jin Won Ko (National NanoFab Center), Hyun Gue Hong (Korea Research Institute of Standards and Science), and Taeg Yong Kwon (Korea Research Institute of Standards and Science)

YMJY Die Edge Crack Propagation Modeling for Risk Assessment of Advanced Technology Nodes 2254 Tingge Xu (GLOBALFOUNDRIES US Inc.), Zhuo-Jie Wu (GLOBALFOUNDRIES US Inc.), Haojun Zhang (GLOBALFOUNDRIES US Inc.), Carole Graas (GLOBALFOUNDRIES US Inc.), and Patrick Justison (GLOBALFOUNDRIES US Inc.) Development of a Through-Silicon Via (TSV) Process Module for Multi-project Wafer SiGe BiCMOS and Silicon Interposer 2261 Matthias Wietstruck (IHP), Steffen Marschmeyer (IHP), Philipp Kulse (IHP), Thomas Voß (IHP), Marco Lisker (IHP), Andreas Krüger (IHP), Dirk Wolansky (IHP), Mirko Fraschke (IHP), and Mehmet Kaynak (IHP) A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques 2269 Robert Klengel (Fraunhofer Institute for Microstructure of Materials and Systems IMWS), Sandy Klengel (Fraunhofer Institute for Microstructure of Materials and Systems IMWS), Georg Schusser (Fraunhofer Institute for Microstructure of Materials and Systems IMWS), and Michael Krause (Fraunhofer Institute for Microstructure of Materials and Systems IMWS) Effect of Interaction Between Multiple Defects on Z-Depth Estimate in Lock-in Thermography Applications 2274 Bharath Viswanath Ravi (Intel Corporation), Mayue Xie (Intel Corporation), and Deepak Goyal (Intel Corporation) Practical High Speed PCB Stackup Tool - Generation and Validation 2282 Wei Jiang (University of South Carolina), kevin Cai (Cisco Systems), Bidyut Sen (Cisco Systems), and Guoan Wang (University of South Carolina) A Volatile Molecular Sensor Using Terahertz Resonators on Porous Substrates 2289 Saranraj Karuppuswami (Michigan State University), Jennifer A. Byford (Michigan State University), and Premjeet Chahal (Michigan State University) Effects of the Adhesion Strength on the Bending Fatigue Behavior of Cu Pattern Laminated Fabrics Using B-Stage Non-Conductive Films (NCFs) 2295 Seung-Yoon Jung (Korea Advanced Institute of Science and Technology) and Kyung-Wook Paik (Korea Advanced Institute of Science and Technology) Process Development of 4-Die Stack Module Using Moldable Underfill 2301 Ser Choong Chong (Institute of Microelectronics), Hongyu Li (Institute of Microelectronics), Ling Xie (Institute of Microelectronics), Simon Boon Lim (Institute of Microelectronics), and Zhaohui Chen (Institute of Microelectronics) Integrated Fully Solid-State Capacitor Based on Carbon Nanofibers and Dielectrics 2307 Rickard Andersson (Smoltek AB), Amin Muhammad Saleem (Smoltek AB), and Vincent Desmaris (Smoltek AB) Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF (Chip-in-Flex) Packages at Humid Environment 2313 Ji-Hye Kim (KAIST), Tae-Ik Lee (KAIST), Taek-Soo Kim (KAIST), and Kyung-Wook Paik (KAIST)

M Warpage Simulation/ Experiments and Analysis of 12" Wafer Level Fan-Out Packaging Technology N/A Jia-Shen Lan (National Sun Yat-sen University), Shang Lee (Advanced Semiconductor Engineering Inc.), Chiyu Wang (Advanced Semiconductor Engineering Inc.), Brian Wu (Advanced Semiconductor Engineering Inc.), and Mei-Ling Wu (National Sun Yat-sen University) Design Considerations of a Matching Circuit for Low Power Wake-Up Receivers 2326 Jack Ou (California State University Northridge) Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications 2330 Ning-Cheng Lee (Indium Corporation), Jie Geng (Indium Corporation), Hongwen Zhang (Indium Corporation), and Francis Mutuku (Indium Corporation) Warpage and Reliability Challenges for Stacked Silicon Interconnect Technology in Large Packages 2339 Scott McCann (Xilinx Inc.), Ho Hyung Lee (Xilinx Inc.), Gamal Refai-Ahmed (Xilinx Inc.), Tom Lee (Xilinx Inc.), and Suresh Ramalingam (Xilinx Inc.) Effect of Shallow Cycling on Flexible Power-Source Survivability under Bending Loads and Operating Temperatures Representative of Stresses of Daily Motion 2345 Pradeep Lall (Auburn University), Amrit Abrol (Auburn University), Ben Leever (US AFRL), and Jason Marsh (NextFlex) Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder Joints 2353 Abdullah Fahim (Auburn University), Sudan Ahmed (Auburn University), Jeffrey C. Suhling (Auburn University), and Pradeep Lall (Auburn University) Fan-Out Wafer-Level Packaging for Heterogeneous Integration 2354 John Lau (ASM Pacific Technology Ltd), Ming Li (ASM Pacific Technology Ltd), Margie Li (ASM Pacific Technology Ltd), Tony Chen (Jiangyin Changdian Advanced Packaging Co. Ltd.), Iris Xu (Jiangyin Changdian Advanced Packaging Co. Ltd.), Qing Xiang Yong (Huawei Technologies Co. Ltd.), Zhong Cheng (Huawei Technologies Co. Ltd.), Nelson Fan (ASM Pacific Technology Ltd), Eric Kuah (ASM Pacific Technology Ltd), Zhang Li (Jiangyin Changdian Advanced Packaging Co. Ltd.), Kim Hwee Tan (Jiangyin Changdian Advanced Packaging Co. Ltd.), Y. M. Cheung (ASM Pacific Technology Ltd), Eric Ng (ASM Pacific Technology Ltd), Penny Lo (ASM Pacific Technology Ltd), Wu Kai (ASM Pacific Technology Ltd), Ji Hao (ASM Pacific Technology Ltd), Koh Sau Wee (Huawei Technologies Co. Ltd.), Jiang Ran (Huawei Technologies Co. Ltd.), Cao Xi (Huawei Technologies Co. Ltd.), Rozalia Beica (Dow Chemical Company), Sze Pei Lim (Indium Corporation), NC Lee (Indium Corporation), Cheng-Ta Ko (Unimicron Technology Corporation), Henry Yang (Unimicron Technology Corporation), YH Chen (Unimicron Technology Corporation), Mian Tao (Hong Kong University of Science and Technology), Jeffery Lo (Hong Kong University of Science and Technology), and Ricky Lee (Hong Kong University of Science and Technology)

Session 41: Student Interactive Presentation

Broad-Band Dielectric Probes for On-Wafer Characterization of Terahertz Devices 2361 Jennifer A. Byford (Michigan State University) and Premjeet Chahal (Michigan State University)

MJ Machine Learning Driven Advanced Packaging and Miniaturization of IoT for Wireless Power Transfer Solutions 2368 Hakki Mert Torun (Georgia Tech), Colin Pardue (Georgia Tech), Mohamed L. F Belleradj (Georgia Tech), Anto K. Davis (Georgia Tech), and Madhavan Swaminathan (Georgia Tech) Application of Additive Manufacturing Technologies for Realization of Multilayer Microstrip Directional Filter 2376 Jakub Sorocki (AGH University of Science and Technology), Ilona Piekarz (AGH University of Science and Technology), Slawomir Gruszczynski (AGH University of Science and Technology), Krzysztof Wincza (AGH University of Science and Technology), and John Papapolymerou (Michigan State University) 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges 2383 Tiwei Wei (imec), Herman Oprins (imec), Vladimir Cherman (imec), Ingrid De Wolf (imec), Eric Beyne (imec), Shoufeng Yang (KU Leuven), and Martine Baelmans (KU Leuven) Design and Surface Modification of PET Substrates Using UV/Ozone Treatment for Roll-to-Roll Processed Solar Photovoltaic (PV) Module Packaging 2391 Jinho Hah (Georgia Institute of Technology), Bo Song (Georgia Institute of Technology), Kyoung-Sik Moon (Georgia Institute of Technology), Samuel Graham (Georgia Institute of Technology), and C. P. Wong (Georgia Institute of Technology) A Study on the High Frequency Performance of Solder ACFs Joints for Flex-on-Board Applications Using Coplanar Waveguide 2398 Shuye Zhang (Harbin Institute of Technology), Tiesong Lin (Harbin Institute of Technology), Peng He (Harbin Institute of Technology), Junyong Park (Korea Advanced Institute of Science and Technology), Gapyeol Park (Korea Advanced Institute of Science and Technology), Huijin Song (Korea Advanced Institute of Science and Technology), Joungho Kim (Korea Advanced Institute of Science and Technology), and Kyung-Wook Paik (Korea Advanced Institute of Science and Technology) Low-Temperature Cu-Cu Bonding by Anti-Oxidative Copper Nanoparticle Paste N/A Yun Mou (Huazhong University of Science and Technology), Yang Peng (Huazhong University of Science and Technology), Junjie Li (Huazhong University of Science and Technology), Hao Cheng (Huazhong University of Science and Technology), Xingxing Liu (Huazhong University of Science and Technology), and Mingxiang Chen (Huazhong University of Science and Technology) Deep Understanding the role of Cu in RDL to Warpage by Exploring the Warpage Evolution with Microstructural Changes 2410 Gong Cheng (Chinese Academy of Sciences), Gaowei Xu (Chinese Academy of Sciences), Wei Gai (Chinese Academy of Sciences), and Le Luo (Chinese Academy of Sciences) A 56 Gbps I/O Interface Design with Exact Power Source Simulation: Total I/O Circuit Design with over 28 GHz from Driver to Receiver Device Models 2416 Daisuke Ogawa (Meisei University), Daisuke Iguchi (2-1-1 Hodokubo), Yasutaka Wada (Meisei University), Kaoru Hashimoto (Meisei University), Yusuke Taira (Fuji Xerox Co. Ltd.), Nobutaka Hara (Fuji Xerox Co. Ltd.), and Kanji Otsuka (Meisei University)

MJJ Enhancements on Underfill Materials' Thermal Conductivity by Insulation Coating Layer Control of Conductive Particles 2425 Tae-Ryong Kim (Ntrium Incorporation), Kisu Joo (Ntrium Incorporation), Boo Taek Lim (National Nanofab Center), Sung-Soon Choi (Korea Electronics Technology Institute), Boung Ju Lee (National Nanofab Center), Euijoon Yoon (Seoul National University), Se Young Jeong (Ntrium Incorporation), and Myung Jin Yim (Intel Corporation) Fabrication of Fe-4.5wt.% Si Magnetic Cores for Power Electronic Converters by Selective Laser Melting N/A Wang-Yun Li (South China University of Technology), Jing Wang (Loughborough University), Guang Chen (Loughborough University), Daniel Engstrom (Loughborough University), Changqing Liu (Loughborough University), Xin-Ping Zhang (South China University of Technology), Adam Walker (University of Nottingham), Gaurang Vakil (University of Nottingham), and Andrew Forsyth (University of Manchester) Accurate Core Alignment for Polymer Optical Waveguide in the Mosquito Method for High-Efficient Coupling 2438 Yoshie Morimoto (Keio University), Kumi Date (Keio University), and Takaaki Ishigure (Keio University) Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-Heating CVD for Thermal Applications 2444 Josef Hansson (Chalmers University of Technology), Majid Kabiri Samani (Chalmers University of Technology), Andreas Nylander (Chalmers University of Technology), Lilei Ye (SHT Smart High Tech AB), Nan Wang (Chalmers University of Technology), Torbjörn Nilsson (Chalmers University of Technology), and Johan Liu (Chalmers University of Technology) Size and Shape Effect in the Determination of the Fracture Strength of Silicon Nitride in MEMS Structures at High Temperatures 2451 Alex Axel Navarrete Gonzalez (University of Waterloo), Eric Brace (University of Waterloo), and Patricia Nieva (University of Waterloo) A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly 2458 HanMin Lee (Korea Advanced Institute of Science and Technology), SeYong Lee (Korea Advanced Institute of Science and Technology), JongHo Park (Korea Advanced Institute of Science and Technology), Chang-kyu Chung (Global Technology Center), Kyung-Woon Jang (Global Technology Center), Il Kim (Global Technology Center), SeongWoo Choi (Global Technology Center), and Kyung-Wook Paik (Korea Advanced Institute of Science and Technology) Suspended Microstrip Low-Pass Filter Realized Using FDM Type 3D Printing with Conductive Copper-Based Filament 2464 Ilona Piekarz (AGH University of Science and Technology), Jakub Sorocki (AGH University of Science and Technology), Krzysztof Wincza (AGH University of Science and Technology), Slawomir Gruszczynski (AGH University of Science and Technology), and John Papapolymerou (Michigan State University)

MJJJ Modeling and Design of 2.5D Package with Mitigated Warpage and Enhanced Thermo-Mechanical Reliability 2471 Jing Wang (State University of New York at Binghamton), Yuling Niu (State University of New York at Binghamton), Seungbae Park (State University of New York at Binghamton), and Alexander Yatskov (Juniper Networks) Piezoelectric Ceramics and Flexible Printed Circuits (FPCs) Interconnection Using Anisotropic Conductive Films (ACFs) for Ultrasound Transducers Assembly 2478 Jae-Hyeong Park (Korea Advanced Institute of Science and Technology) and Kyung-Wook Paik (Korea Advanced Institute of Science and Technology) Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF Applications 2486 Yunheng Sun (Peking University Shenzhen Graduate School), Han Cai (Xiamen University), Jiwei Li (Xiamen University), Shenglin Ma (Xiamen University), Yufeng Jin (Peking University Shenzhen Graduate School), Wei Wang (Peking University), Jing Chen (Peking University), Min Miao (Beijing Information Science and Technology University), Liulin Hu (Chengdu Ganide Technology Co.), and Shuwei He (Chengdu Ganide Technology Co.) A Novel Integration of Stereolithography and Inkjet Printing for Multichip Modules with High Frequency Packaging Applications 2492 Ryan Bahr (Georgia Institute of Technology), Bijan Teharani (Georgia Institute of Technology), Manos Tentzeris (Georgia Institute of Technology), and Kyle Byers (DOE’s Kansas City National Security Campus)

Author Index

MJW