COUNCIL presents APEX" Electronics Assembly Process exhibition conference
PROCEEDINGS OF THE TECHNICAL PROGRAM
MARCH 14-16,2000 LONG BEACH CONVENTION CENTER, LONG BEACH, CALIFORNIA
UB/TIB Hannover 89 121 598 721 TABLE OF CONTENTS
Session P-AD1: Developments in Wafer Scale Packaging Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
Wafer Level Packaging (WLP) & Beyond, Associated Trends in Multi-Chip Package Integration P-AD1 / 1 Lee Smith, Amkor Technology
Important Considerations for Packaging ICs at Wafer Level P-AD1 / 2 Joseph Fjelstad, Pacific Consultants Belgacem Haba, Ph.D., Tessera, Inc.
A Unique Solution to Wafer-Level Back-End Processing P-AD1 / 3 John Novitsky, FormFactor Inc. Chuck Miller, FormFactor Inc.
Session P-AD2: CSP Reliability Considerations Chair: Martin Goetz, Alpine Microsystems
Wafer Level Packaging: Advantages, Applications and Reliability P-AD2 /1 Peter Elenius, Flip Chip Technologies
When to Underfill Chip Scale Packages, A Review of Design Considerations for Portable Electronic P-AD2 / 2 Applications Steven J. Adamson, Asymtek Horatio Quinones, Asymtek
Impact of CSP Assembly Underfill on Reliability P-AD2 / 3 Reza Ghaffarian, California Institute of Technology
Reliability Considerations for the Transition to Chip-Size Packaging P-AD2 / 4 Ian R. Harvey, Ph.D., Bourns Electronics David Turner, Bourns Electronics Chris Herbert, Bourns Electronics Jim Ortowski, Bourns Electronics
Session P-AD3: Laser Soldering Techniques Chair: Marc Chason, Motorola Inc.
Using Laser Technology for Selective Soldering and Rework P-AD3 /1 Erick Russell, ViTechnology
Laser Micro Soldering and Welding: Future-Oriented Joining Methods? P-AD3 / 2 Marc Fleckenstein, University of Erlangen-Nuremberg Michael Schmidt, University of Erlangen-Nuremberg Manfred Geiger, University of Erlangen-Nuremberg
Soldering with Diode Lasers P-AD3 / 3 ARahn, PhD., Rahn-Tec Consultant's Ync'.
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Session P-AD4: Integrating Passive Components Chair: Jan Danvir, Motorola Advanced Technology Center
Embedded Resistors in HDI Applications P-AD4 /1 Bruce Mahler, Ohmega Technologies, Inc.
Integrated Passives Packaging for Wireless Applications P-AD4 / 2 Elizabeth Logan, Intarsia Corporation James Young, Intarsia Corporation
Integral Passives Development: The State of the Art P-AD4 / 3 Simon Ang, University of Arkansas Fred Barlow, University of Arkansas William Brown, University of Arkansas Aicha Elshabini, University of Arkansas James Parkerson, University of Arkansas Len Schaper, University of Arkansas Richard Ulrich, University of Arkansas
Session P-APl: BGA and CSP Technology Chair: Glenn Dody, Dody Consulting
Launching Process Technology Worldwide P-APl / 1 Kim Hyland, Solectron Corporation Harjinder Ladhar, Solectron Corporation
Measurement and Analysis of BGA Defects with Advanced X-Ray Inspection Systems P-APl / 2 Richard Amtower, Ph.D., CR Technology
An Investigation Of The Effects Of Printed Wiring Board Surface Finish and Conformal Coating For Ball P-APl / 3 Grid Array Assembly Dave Hillman, Rockwell Collins Nicole Cavanah, Rockwell Collins Jaimie Reinig, Rockwell Collins Laura Keehner, Rockwell Collins Eddie Hofer, Rockwell Collins
Optimized PBGA Construction for Board Level Assembly and Reliability P-APl / 4 Janet Sickler, Analog Devices Inc. James Bray, Analog Devices Inc. Macs Dayanghirang, ASAT Inc.
Trends in Assembly Processes for Miniaturized Consumer Electronics P-APl / 5 Caroline Beelen-Hendrikx, Philips Centre for Manufacturing Technology Martin Verguld, Philips Centre for Manufacturing Technology
Session P-AP2: DCA Design and Applications Chair: Kishor Desai, LSI Logic and Dan Baldwin, Georgia Institute of Technology
Flip Chip Processing for Miniaturized Telecommunications Applications P-AP2 /1 Kari Kulojarvi, Nokia Mobile Phones
Advances in Materials and Processes for Flip Chip Packaging _ P-AP2 / 2 Raj Master, Advanced Micro Devices, Inc. Mohammad Khan, Advanced Micro Devices, Inc. Maria Guardado, Advanced Micro Devices, Inc.
Process Characterization and the Effect of Process Defects on Flip Chip Reliability P-AP2 / 3 Brian J. Lewis, Siemens EAE
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Session P-AP3: Flip Chip Processes Chair: Ajit Trivedi, IBM Corp.
OSP Development for Flip Chip Ball Grid Array Package P-AP3 /1 Chao-Wen Chung, Ph.D., LSI LOGIC Corp. Anand Govind, LSI LOGIC Corp. Kumar Nagarajan, LSI LOGIC Corp.
Manufacturing of Flip Chip-on-Laminate P-AP3 / 2 Prasanna Kulkarni, Auburn University R. Wayne Johnson, Ph.D., Auburn University Erin Yaeger, Loctite Corporation Mark Konarski, Loctite Corporation Afranio Torres, Loctite Corporation Paul Krug, Loctite Corporation Larry Crane, Loctite Corporation
Low Cost Flip Chip Processes Utilizing No Flow Underfill Materials P-AP3 / 3 Ryan Thorpe, Kyocera America Paul N. Houston , Georgia Institute of Technology Daniel F. Baldwin, Ph.D., Georgia Institute of Technology
Failure Mode Analysis of Advanced Electronics Packaging P-AP3 / 4 PaulN. Houston, Georgia Institute of Technology Brian A. Smith, Georgia Institute of Technology Daniel F. Baldwin, PhD, Georgia Institute of Technology Brian J. Lewis, Siemens EAE
Session P-AP4: Materials & Reliability for Direct Chip Attach Applications Chair: Elizabeth Jacobs, Texas Instruments
Development of a Reliable High Thermal Performance Laminate Flip Chip BGA Package P-AP4 / 1 Kumar Nagarajan, LSI Logic Corporation Kishor Desai, LSI Logic Corporation My Nguyen, Ph.D., Honeywell
Flip Chip Reliability __ P-AP4 / 2 Peter Borgesen, Ph.D., Universal Instruments Corporation Daniel Blass, Universal Instruments Corporation K. Srihari, Ph.D., State University of New York
High Frequency Acoustic Micro Imaging for Process Monitoring and Quality Control In Flip Chip P-AP4 / 3 Underfill Assembly Janet E. Semmens, Sonoscan, Inc. Lawrence W. Kessler, Sonoscan, Inc.
Session P-AP5: Panel: Advances in Flip Chip Technology and Future Directions No Paper Chair: Dan Baldwin, Georgia Institute of Technology
Raj Master, Advanced Micro Devices Peter Elenius, Flip Chip Technologies Steven Corbett, Poly-flex Circuits Kari Kulojarvi, Nokia Mobile Phones Ltd. Larry Crane, Ph.D., Loctite
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Session P-AP6: Advanced Methodology for Cleaning HDI Assemblies Chair: Terry Munson, CSL Inc.
Cleaning Issues Related to Flip Chip, Ball Grid Array and Chip Scale Packages P-AP6 /1 Mike Bixenman, Kyzen Corporation Erik Miller, Kyzen Corporation
Cleaning RMA Flux Residues in a High Lead Wafer Bumping Process P-AP6 / 2 Mary Pat McCurdie, Agilent Technologies
Effects of Post-Reflow Cleaning Processes On the Performance of Flip-Chip Devices P-AP6 / 3 Michael Todd, Dexter Electronic Materials Mike Bixenman, Kyzen Corporation
Session P-AP7: Conformal Coating for Today's Assemblies Chair: William Kenyan, Ph.D. Global Centre for Process Change
Conformal Coating Process Controls: The Manufacturing Engineer's Aid P-AP7 /1 Michael A. Reighard, Nordson Electronics Systems Group Nicholas A. Barendt, Nordson Electronics Systems Group
Conformal Coatings and Harsh Environments P-AP7 / 2 David A. Douthit, D.A. Douthit Consulting
Conformal Coating: A Hybrid Process for Critical PCB Assemblies P-AP7 / 3 Khalid Saeed, Abbott Diagnostic Manufacturing, Inc.
Conformal Coatings for Assembled PCBs - Requirement Profiles and Processing P-AP7 / 4 Peter Heuser, Lackwerke Peters GmbH + Co KG
Session P-AP8: Board Assembly Issues with Chip Scale Packages Chair: Joe Fjelstad, Pacific Consultants, LLC
Process Development Strategies: Rapid Implementation of Chip-Scale Packaging Production P-AP8 /1 Jeff Kennedy, Manufacturers' Services Ltd A.H. Tan, Manufacturers' Services Ltd
Developing a Repeatable SMT Assembly Process for Chip Scale Packaging P-AP8 / 2 Vern Solberg, Tessera, Inc Joseph Fjelstad, Pacific Consultants
Assembly and Cleaning of CSPs for High, Low and Ultra-Low Volume Applications P-AP8 / 3 R. Ghaffarian, Ph.D., California Institute of Technology A. Mehta, California Institute of Technology C. Achong, Celestica O. Vogler, Celestica D. Phillips, Celestica A. Chen, Celestica J.K. Banner, Ph.D., California Institute of Technology S. Stegura, Raytheon Systems Company M. Mehrotra, Raytheon Systems Company M. Simeus, Raytheon Systems Company
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Session P-AP9: Reliability of Area Array Devices Chair: Jean-Paul Clech, Ph.D, EPS I
BGA Solder Joint Vibration Fatigue Damage P-AP9 /1 T. E. Wong, Raytheon Systems Company, Sensor and Electronic Systems F. W. Palmieri, Raytheon Systems Company, Sensor and Electronic Systems B. A. Reed, Raytheon Systems Company, Sensor and Electronic Systems H. M. Cohen, Raytheon Systems Company, Sensor and Electronic Systems
Optimization of Design and Process Parameters for CSP Solder Joint Reliability P-AP9 / 2 Shelgon Yee, Ph.D., Solectron Technical Center Horace Firth, Solectron Technology Inc. Charles Fieselman, Solectron Technology Inc. Douglas Greenfield, Solectron Technology Inc.
Solder Column Interposer for Single Chip Ceramic Packaging P-AP9 / 3 Raj N. Master, Advanced Micro Devices Thomas Dolbear, Advanced Micro Devices O. T. Ong, Advanced Micro Devices Ajit Dubey, Advanced Micro Devices H. Saiki, NTK Technical Ceramics K. Yamasaki, NTK Technical Ceramics
Session P-EM1: Smoothing the Manufacturing Process Chair: Jeff Kennedy, Manufacturers' Services, Ltd.
Flip Chip - Integrated In A Standard SMT Process P-EM1 / 1 Wilhelm Prinz von Hessen, Universal Instruments Corporation
Implementing SMT AOI in a Contract Manufacturing Environment P-EM1 / 2 Shane Downing, Celestica Corporation Mark Owning, MV Technology Ltd.
Implementing CSP Technology: A Controlled Approach to New Product Introduction P-EM1 / 3 Cameron E. Presley, K*Tec Electronics, Inc.
Qualifying and Maintaining Process Sensitive Manufacturing Equipment on the Production Floor _ ___ P-EM1 / 4 Michael O'Hanlon, DEK Screen Printers
Cycle Time Reduction In A Batch Mode P-EM1 / 5 Michael R. Bublitz, Benchmark Electronics - Winona Division Connie A. LeCleir, Benchmark Electronics - Winona Division
Session P-EM2: Panel: The Challenges of Bringing Products to Market: No Paper OEMs, EMS Providers and Suppliers Share Their Experiences Chair: Rodolfo Archbold, Manufacturers' Services Ltd.
Kim Hyland, Solectron Corp. Nick Brathwaite, Flextronics International Richard Kubin, Nortel Networks George Westby, Universal Instruments Corporation Ralph Kenton, Ralph Kenton & Associates
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Session P-EM3: Using Internet for Electronic Data Transfer Chair: Lisa Hamburg, Circuits Assembly Magazine
Expediting Product Data Transfer between OEM and EMS Provider P-EM3 / 1 Tomo Yoshikawa, Solectron Corporation Taka Shioya, Solectron Corporation
Best Practices in New Product Introduction: Software Tools for Data Transfer and Rapid Document __ P-EM3 / 2 Generation Mike Shivnan, Manufacturers' Services Tom Lyons, Manufacturers' Services
Remote Monitoring of the Reflow Process # ^ P-EM3/3 Miles Moreau, KIC Thermal Profiling
Session P-EM4: Ins & Outs of Supply Chain Management Chair: Angela Locascio, Ph.D, Motorola, Inc.
Customer-Centric Supply Chains P-EM4 /1 Sarah Saunders, Manugistics, Inc. Case History of Inventory Accuracy Management in an OEM Electronics Manufacturing Environment P-EM4 / 2 Kay Israelite, Motorola, Inc.
Beyond Manufacturing: Managing the EMS Supply Chain P-EM4 / 3 Brian Tracy, EFTC Corporation John Briant, EFTC Corporation
Session P-EM5: EMS Business Issues Chair: Greg Reed, Penn Well
Tools for Measuring Customer Satisfaction P-EM5 / 1 Douglas Andrea, Andrea Electronics Corporation Sezai Dogdu, Ph.D., Andrea Electronics Corporation Carolynne O'Grady, Andrea Electronics Corporation
A Field Survey Report on Outsourcing P-EM5 / 2 Randall Sherman, New Venture Research Corporation
Changes EMS Business Models for the New Millennium P-EM5 / 3 Mark Lyell, SMT Unlimited
Session P-EQl: Advances in Inspection Technology Chair: Ray Prasad, Ray Prasad Consultancy Group
An Improved Imaging System for Inspecting BGA, CSP, Flip Chip Components P-EQl / 1 Mark Cannon, ERSA Lottechnik GmbH
Benefits of AOI: A Case Study P-EQl / 2 Shane Fitzpatrick, Dovatron Ireland, B. V.
Advances in Image Technology: Statistical Appearance Modeling for PCB Inspection P-EQl / 3 Brook Jackson, CyberOptics
An Integrated Test And Inspection Strategy P-EQl / 4 David M. Mendez, Solectron Electronics
AOI Implementation - Obtaining the Best Return on Investment from the Process P-EQl / 5 Mark J. Norris, Vision Inspection Technology
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Session P-EQ2: Dispensing Equipment Chair: Ken Gilleo, Ph.D, Cookson Electronics Group
Practical Production Applications for Jetting Technology _ P-EQ2 / 1 Anthony F. Piracci, Asymtek
Ultra-High Speed Dispensing of Surface Mount Materials to Enhance Production Throughput P-EQ2 / 2 Chris Ijee, Speedline Technologies, Inc.
Flux Encapsulants - Dispense and Place P-EQ2 / 3 Jaques Coderre, Universal Instruments Corporation Karthik Vijayamadhavan, Binghamton University
Session P-EQ3: Rework Methods for High Density Assemblies Chair: Donald Spigarelli, Phase Four Solutions
Rework Process Development and Solder Joint Analysis for Fine Pitch Connectors P-EQ3/1 Paul P. E. Wang, Solectron Corporation
Rework of BGAs Used in Data Networking Applications P-EQ3 / 2 Changhong Lin, Nortel Networks Susan Hayes, Nortel Networks Rajat Srivastava, Nortel Networks KSrihari, Ph.D., State University of New York
Rework Process for MicroBGA and CSP Components P-EQ3 / 3 Thomas W. Dalrymple, IBM Microelectronics Cynthia Milkovich, IBM Microelectronics
Session P-EQ4: Trends in Placement Equipment Chair: John Yealland, Celestica, Inc.
Process Development for Chip-Size Package Mounting P-EQ4 / 1 Caroline Beelen-Hendrikx, Philips Centre for Manufacturing Technology Sjefvan Gastel, Philips Electronic Manufacturing Technology
Advances in SMT Automation: The 0201 Challenge for High Speed Placement Machines P-EQ4 / 2 Gene Dunn, Panosonic Factory Automation
Mass Reflow Assembly of 02\01 Components P-EQ4 / 3 James H. Adriance , Universal Instruments Corporation Jeffrey D. Schake, DEK Screen Printers
A Placement Tool Characterization: Innovations and Obstacles with Advanced Assembly Equipment _ P-EQ4 / 4 Brian J. Lewis, Siemens EAE Alan R. Reinnagel, Hover-Davis, inc. Andrew D. Dugenske, Georgia Institute of Technology
Low Cost Smart Tag/RFID Assembly Using Flexible Flip Chip Shooters P-EQ4 / 5 Gunter Schiebel, Siemens AG
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Session P-EQ5: Selective Soldering Chair: Bill Barthel, Plexus
Using Softbeam Technique as a Selective Soldering Method in High Volume Production P-EQ5 / 1 Lother Baer, Kiekert AC
Selective Soldering Options and Decisions P-EQ5 / 2 Peter Bagshaw, Seho UK Ltd
Pin In Paste - Another Process Alternative #- P-EQ5/3 Michael K. Garn, Abbott Laboratories Diagnostics Division
Session P-EQ6: Developments in Wave & Refiow Soldering Chair: Phil Zarrow, ITM Inc.
Using Simulated Membrane Technology in Inert Wave Soldering to Reduce Costs P-EQ6 /1 Jason Smith, Lexmark Electronics Andy C. Mackie, Ph.D., Praxair, Inc. Bill Boudinot, Praxair, Inc.
Robust Refiow Profile Design P-EQ6 / 2 Bob Rooks, KByte Reptron Inc.
Cooling Parameters in Refiow Soldering P-EQ6 / 3 W. James Hall, Vitronics Sollec Corporation
Integrated Profiling for the Refiow Process P-EQ6 / 4 Kristen Brown, BTU international
Session P-MTl: Underfill Materials Chair: Alec Babiarz, Asymtek
"No Flow" Underfill Reliability is Here - Finally! P-MTl /1 Michael A. Previti, Cookson Semiconductor Packaging Materials
Evaluations of No-Flow Fluxing Underfills with BGA, CSP and Flip Chip on Board Assemblies P-MTl / 2 Doug Katze, Emerson and Cuming Tony DeBarros, Emerson and Cuming Pericles Kondos, Universal Instruments
Refiow Encapsulant for Flip Chip Applications P-MTl / 3 Torey J. Tomaso, Kester Solder Hui Wang, Kester Solder
Wafer -Level Flux-Underfill: Underflip! P-MTl / 4 Ken Gilleo, Ph.D., Cookson Electronics
On the Effects of Underfill Properties on Flip Chip Plastic Ball Grid Array (FC-PBGA) Reliability __ P-MTl / 5 Peter J. Brofman , IBM Microelectronics Division Michael Gaynes, IBM Microelectronics Division Aleksander Zubelewicz, IBM Microelectronics Division Son Tran, IBM Microelectronics Division
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Session P-MT2: Eliminating Lead from Electronics: Lead-free Alloys Chair: Paul Vianco, Ph.D, Sandia National Laboratories
Worldwide Usage of Lead-free Solder Alloys for SMT P-MT2 /1 Peter Biocca, Multicore Solders, Inc.
Assessment of Lead-Free Solders for SMT P-MT2/2 Klaus Feldman, Institute for Manufacturing Automation and Production Systems, University of Erlangen Marcus Reichenberger, Institute for Manufacturing Automation and Production Systems, University of Erlangen
Solderability of Lead-Free Alloys P-MT2 / 3 Christopher Hunt, National Physical Laboratory Deborah Lea, National Physical Laboratory
Session P-MT3: Processing with Lead-Free Solders Chair: R. Wayne Johnson, Ph.D, Auburn University
Challenges and Solutions for Lead-Free Soldering of Large PCB Assembly P-MT3 /1 Kenichiro Suetsugu, Ph.D., Matsushita Electric Industrial Company, Ltd. Takeo Okumura, Matsushita Electric Industrial Company, Ltd. Thomas J. Baggio, Panasonic Factory Automation
Lead-Free - After the Shouting Is Over? P-MT3 / 2 Alan Rae, Cookson Electronics
Circuit Board Assembly with Lead-Free Solders P-MT3 / 3 Paul T. Vianco, Sandia National Laboratories Cynthia L. Hernandez, Sandia National Laboratories Jerome A. Rejent, Sandia National Laboratories
Compatibility of Lead-Free Solders with Refiow Process P-MT3 / 4 Benlih Huang, Ph.D., Indium Corporation of America Ning-Cheng Lee, Ph.D., Indium Corporation of America
Session P-SM1: Evaluating Processes Chair: Karen Walters, BTU International
Usage Of Process Capability Coefficients In SMT-Manufacturing: Theory And Practical Experiences P-SM1 / 1 Wilfried Sauer, Dresden University of Technology Mathias Keil, Cybertron mbH Heinz Wohlrabe, Dresden University of Technology
The Use for Process Metrics to Predict Quality Performance P-SM1 / 2 Brian Coll, Manufacturers' Services Ltd
Systematic Procedures for the Process Evaluation of Solder Pastes P-SM1 / 3 Balakrishnan Goplan, State University of New York K. Srihari, Ph.D., State University of New York James H. Adriance, Universal Instruments Corporation
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Session P-SM2: Evaluating and Improving Electronic Manufacturing Productivity Chair: Chuck Richardson, SCI Systems
Real Time Costing as a Tool to Improve Profitability P-SM2 / 1 Ronald C. Lasky, Ph.D., PE, Cookson Performance Solutions
A Practical Guide to Process Assessments as a Continuous Process Improvement Tool P-SM2 / 2 Joe Belmonte, Cookson Performance Solutions
Tools for Optimizing Manufacturing Efficiency in a Low Margin Environment P-SM2/3 Mike Slenson, Manufacturers' Services Ltd
Operational Performance Metrics and Assessment _ P-SM2/4 Leon F. McGinnis.Ph.D., Georgia Institute of Technology
Session P-SM3: Automating Odd Form Assembly Chair: Bill Mahoney, GPAX International Corp.
Application and Automation of Straddle Mount Connectors P-SM3/1 John G. Ricci, Universal Insterments Corp. Sarah Marshall, Celestica Inc. Jeffrey Stanton, AMP Inc.
Developments in Odd-Form Assembly P-SM3 / 2 Joseph Morris, PMJ Automec Oyj.
Feeding Challenges and Solutions for Odd-Form Parts _ P-SM3 / 3 Gregory W. Holcomb, CHAD Industries
Session P-SM4: Reducing Manufacturing Defects Chair: Kathleen Murray, Cookson Performance Solutions
Analyzing Lead-Free Soldering Defects in Wave Soldering Using Taguchi Methods P-SM4 /1 Gerjan Diepstraten, Vitronics Soltec
Using Failure-Mode Effect Analysis (FMEA) to Reduce Defects P-SM4 / 2 Paul Wheeler, Manufacturers' Services Ltd.
Implementing Statistical Process Control and Automated Optical Inspection in Electronic Manufacturing P-SM4 / 3 George T. Ayoub, Ph.D., Machine Vision Products, Inc.
Automating Component Selection and Trackability P-SM4 / 4 Brian Philips, Panasonic Factory Automation
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Session P-SMS: Advances in Screen Printing Technology: Controlling the Process Chair: Richard Clouthier, AMTX
Developments in Advanced Stencil Technology P-SM5 / 1 Richard Cloutier, AMTX
Solder Paste Characteristics that Influence Production Yields P-SM5 / 2 David Torp, Kester Solder/Litton
High Speed Stencil Printing of Solder Paste: A DOE Screening Experiment P-SM5 / 3 S. Manian Ramkumar, Ph.D., Rochester Institute of Technology (RIT) Jason Lemery, Rochester Institute of Technology (RIT)
3D Inspection for the Measurement of Solder Paste Deposits P-SM5/4 Jeffrey Rupert, GSI Lumonics Inc. Doreen Tan, GSI Lumonics Inc. Pat Pilon, GSI Lumonics Inc.
Comparison of Volume and Height Control Between 45 and 60 Degree Metal Squeegee Blades and Direct P-SM5 / 5 Imaging Jay B. Hinerman, DEK USA, Inc.
PCB Surface Planarity for Solder Paste Deposition P-SM5 / 6 George Trinite, Sanmina Corporation
Session F-FO2: Japan's "JISSO" Technology Roadmap for Packaging and Hand-held Applications Chair: Richard Boulanger, Universal Instruments Corp.
The Requirement for A Semiconductor Device and Package or Electronic Products F-FO2 / 2 Kuniaki Takahashi, Toshiba Corp. Digital Media Equipment & Services Company
Session F-FO3: New IPC Standards Chair: Mel Parrish, EMPF/ACI
IPC-9850 Surface Mount Equipment Performance Characterization F-FO3 / 4 Craig Ramsey, Quad Systems Corp. Barry Groman, Motorola David Farrell, Universal Instruments
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