Nexus 6P Fingerprint Scanner Assembly

Electronic Costing & Technology Experts

21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] www.systemplus.fr

December 2015 – Version 1 – Written by Elena Barbarini

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Return to TOC

Glossary 4. Sensor Manufacturing Process 69 1. Overview / Introduction 4 – Sensor Die Front-End Process & Fabrication Unit – Executive Summary – LGA Packaging Process & Fabrication unit – Reverse Costing Methodology – Sensor Die Front-End Process & Fabrication Unit 2. Company Profile 9 – Final Test & Packaging Fabrication unit – Fingerprint Cards – Synthesis of the main parts 3. Physical Analysis 13 5. Cost Analysis 78 – Synthesis of the Physical Analysis – Synthesis of the cost analysis – Nexus 6P Fingerprint Scanner disassembly 15 – Yields Explanation & Hypotheses – Fingerprint Scanner Removal – Sensor die 83 – Sensor Die Front-End Cost – Fingerprint Scanner Assembly 19 – Sensor Die Probe Test, Thinning & Dicing – Fingerprint Scanner Views – Sensor Die Wafer Cost – Fingerprint Scanner Croos-Section – Sensor Die Cost – Fingerprint Scanner Patents – LGA Packaged Component 89 – Sensor Die 33 – Sensor Die View & Dimensions – LGA Packaging Cost – Sensor Die Capacitors – Back End: Final Test – Sensor Die Edge Contact – Component Cost – Sensor Delayering & main Blocs – ASIC Component 94 – Sensor Die Process – ASIC Die Front-End Cost – Sensor Die Cross-Section – Sensor Die Probe Test, Thinning & Dicing – Sensor Die Process Characteristic – ASIC Component Cost – ASIC Die 52 – Complete Module Fingerprint 99 – ASIC Die View & Dimensions – Assembled Components Cost – ASIC Delayering & main Blocs – Synthesis of the assembling – ASIC Die Process – Fingerprint Component Cost – ASIC Die Cross-Section 6. Huawei’s vs Samsung’s vs Apple’s fingerprint sensor 104 – ASIC Die Process Characteristic 4. Nexus 6P’s vs Ascend Mate 7’s fingerprint sensor 65 Contact © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 2 Nexus 6P Fingerprint Scanner Return to TOC

• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Nexus 6P Fingerprint Scanner Assembly.

• The Nexus 6P is a smartphone designed and manufactured by Huawei. Likely the Ascend Mate 7, the Chinese company integrates again a fingerprint of Fingerprint Card on the back of the device but introduces significant modifications in term of resolution and packaging.

• Located on the back side of the smartphone, the fingerprint sensor of the Nexus 6P has dimensions of 11.6 x 11.6mm. It is assembled on a square LGA package and is protected by metal support.

• The sensor has a resolution of 15,600 pixels with a pixel density of 508ppi. It uses a capacitive touch technology to takes an image of the fingerprint from the subepidermal layers of the skin.

• The sensor die is manufactured with CMOS 65nm technology and is connected by mean of wire bonding to the rigid PCB.

• The components also includes an ASIC die manufactued using a 0.5µm CMOS process and connected to the flex PCB.

• This report includes comparisons with Ascend Mate 7 fingerprint sensor and with the latest Samsung’s and Apple’s fingerprints buttons. © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 3 Nexus 6P Fingerprint Scanner Return to TOC

Packaging Connector plastic ring metallic support Flex PCB

Connector Protective elastomer

Nexus 6P fingerprint scanner Assembly – front view

Fingerprint sensor ASIC surface

ASIC metallic support

Al ring

• Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

• Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

• These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: • Consulting and Specific Analysis – North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc. Email: [email protected] – Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: [email protected] – RoW: Jean-Christophe Eloy, President & CEO, Yole Développement Email: [email protected] • Report business – North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc. Email: [email protected] – Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected] – Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: [email protected] – Korea: Hailey Yang, Business Development Manager, Korean Office Email: [email protected] – Taiwan/China: Mavis Wang, Business Development Manager, Chinese Office Email: [email protected] • Financial services – Jean-Christophe Eloy, CEO & President Email: [email protected]