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Conference at a Glance SUNDAY, June 21, 2009 16:00 - 20:00 REGISTRATION 17:00 - 19:00 BELLY-UP TO THE BAR WELCOME RECEPTION MONDAY, June 22, 2009 08:00 - 08:15 OPENING OF TRANSDUCERS 2009 08:15 - 08:25 WELCOME TO DENVER 08:25 - 08:30 TRANSDUCERS 2011 ANNOUNCEMENT 08:30 - 08:45 TECHNICAL PROGRAM INTRODUCTION 08:45 - 09:25 Plenary I - Kensall D. Wise, University of Michigan, USA 09:25 - 10:05 Plenary II - Masayoshi Esashi, Tohoku University, JAPAN 10:05 - 10:35 BREAK & EXHIBIT INSPECTION 10:35 - 11:15 Plenary III - Nico F. de Rooij, Ecole Polytechnique Fédérale de Lausanne, SWITZERLAND 11:15 - 11:35 OUTSTANDING PAPER AWARDS CEREMONY 11:35 - 13:00 LUNCH ON OWN & EXHIBIT INSPECTION
13:00 - 16:00 M3P POSTER SESSION I - see floor plans starting on page 29 Actuators
POSTER BioSensors & BioMicrosystems SECTION 1 Chemical Microsensors & Microsystems Materials, Fabrication & Packaging Technologies Mechanical/Physical Sensors & Systems Medical Microsystems POSTER Microfluidics SECTION 2 Nanoscale Materials & Fabrication Technology, Devices & Systems Optical MEMS
POSTER Power MEMS SECTION 3 RF MEMS, Resonators & Oscillators 15:30 - 16:00 BREAK & EXHIBIT INSPECTION Plaza Ballroom B Plaza Ballroom C Plaza Ballroom E Plaza Ballroom F M4B - Chemical M4C - Cell M4F - Inertial 16:00 - 17:45 Microsensors & Manipulation & M4E - Power MEMS Sensors Microsystems I Analysis I 17:45 ADJOURN FOR THE DAY 18:30 - 22:00 EVENING RECEPTION AT THE MUSEUM OF NATURE & SCIENCE TUESDAY, June 23, 2009 Plaza Ballroom B Plaza Ballroom C Plaza Ballroom E Plaza Ballroom F T1C - Optical T1B - MEMS T1E - Materials & T1F - Biomimetic 08:00 - 09:30 Detection Resonators I Processes Systems Techniques 09:30 - 10:00 BREAK & EXHIBIT INSPECTION
T2C - Droplet & T2E - Packaging & T2F - Magnetic 10:00 - 11:45 T2B - RF MEMS Bubble Devices Assembly Devices
11:45 - 13:00 LUNCH ON OWN & EXHIBIT INSPECTION
13:00 - 16:00 T3P POSTER SESSION II - see floor plans starting on page 29 Actuators
POSTER BioSensors & BioMicrosystems SECTION 1 Chemical Microsensors & Microsystems Materials, Fabrication & Packaging Technologies
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TUESDAY, June 23, 2009 continued 13:00 - 16:00 T3P POSTER SESSION II (continued) Mechanical/Physical Sensors & Systems Medical Microsystems POSTER Microfluidics SECTION 2 Nanoscale Materials & Fabrication Technology, Devices & Systems Optical MEMS
POSTER Power MEMS SECTION 3 RF MEMS, Resonators & Oscillators 15:30 - 16:00 BREAK & EXHIBIT INSPECTION Plaza Ballroom B Plaza Ballroom C Plaza Ballroom E Plaza Ballroom F
T4B - Medical T4F - Flow & 16:00 - 17:45 T4C - NEMS T4E - Actuators I Microsystems I Acoustic Devices
17:45 ADJOURN FOR THE DAY WEDNESDAY, June 24, 2009 Plaza Ballroom B Plaza Ballroom C Plaza Ballroom E Plaza Ballroom F W1C - Optical W1B - Micro & W1E - 3D W1F - Mass & 08:00 - 09:30 Actuation Nanofluidics Technologies Tip-Based Sensors Technologies 09:30 - 10:00 BREAK & EXHIBIT INSPECTION W2B - Chemical W2C - Biochemical W2F - Physical 10:00 - 11:45 Microsensors & W2E - Metal MEMS & Humidity Sensors Sensors Microsystems II 11:45 - 13:00 LUNCH ON OWN & EXHIBIT INSPECTION
13:00 - 15:00 W3P POSTER SESSION III - see floor plans starting on page 29 Actuators
POSTER BioSensors & BioMicrosystems SECTION 1 Chemical Microsensors & Microsystems Materials, Fabrication & Packaging Technologies Mechanical/Physical Sensors & Systems Medical Microsystems POSTER Microfluidics SECTION 2 Nanoscale Materials & Fabrication Technology, Devices & Systems Optical MEMS
POSTER Power MEMS SECTION 3 RF MEMS, Resonators & Oscillators 15:00 ADJOURN FOR THE DAY 15:30 - 23:00 CHUCKWAGON BBQ AND RODEO BANQUET THURSDAY, June 25, 2009 Plaza Ballroom B Plaza Ballroom C Plaza Ballroom E Plaza Ballroom F
Th1B - Th1E - Robotic Th1F - Optical 08:00 - 09:30 Dielectrophoresis & Th1C - Nanosystems Separation Techniques Sensors MEMS I 09:30 - 10:00 BREAK & EXHIBIT INSPECTION
Th2B - Medical Th2C - Nanoscale Th2F - Optical 10:00 - 11:45 Th2E - Micropumps Microsystems II Devices MEMS II
11:45 - 13:00 LUNCH ON OWN & EXHIBIT INSPECTION Th3C - Cell Th3B - MEMS Th3F - Thermal 13:00 - 14:45 Manipulation & Th3E - Actuators II Resonators II Devices Analysis II 14:45 CONFERENCE ADJOURNS
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Table of Contents Conference at a Glance ...... 1 Welcome ...... 4 General Information ...... 5 Social Events ...... 7 Conference Organizers and Committee Members ...... 8 Conference Sponsors ...... 12 Patrons ...... 12 Exhibitors ...... 15 Hotel Floor Plan ...... 25 Exhibitor Booths Floor Plan ...... 26 Conference Exhibitor Raffle ...... 26 Meeting Space Floor Plan ...... 27-28 Poster Floor Plan Section 1 ...... 29 Poster Floor Plan Section 2 ...... 30 Poster Floor Plan Section 3 ...... 31 Technical Program Information ...... 32 Technical Program: Monday ...... 33 Monday - Posters ...... 33 Tuesday ...... 49 Tuesday - Posters ...... 53 Wednesday ...... 69 Wednesday - Posters ...... 73 Thursday ...... 82
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WELCOME!
Welcome to Transducers’09, the 15th International Conference on Solid-State Sensors, Actuators, and Microsystems. For more than 40 years, pioneers in this field have been exploring new frontiers and unchartered territories, and discovering new fields and ideas. It is only fitting that Transducers’09 comes to Denver, Colorado, the America’s old West, the frontier land, where the first pioneers chartered their own paths and made their own many discoveries.
The Transducers Conference series began in Boston in 1981, and the subsequent series of biennial Conferences were held in Delft, Philadelphia, Tokyo, Montreux, San Francisco, Yokohama, Stockholm, Chicago, Sendai, Munich, Seoul, and Lyon, rotating through Americas, Asia/Oceania, and Europe/Africa. The Transducers Conferences has been established as the premier forum for reporting the latest research, development, and commercialization results in microsensors, microactuators, MEMS and microsystems, and their applications in health care and medical devices, transportation and space, security and defense, and a variety of consumer products.
Transducers’09 will continue this tradition, and will present the latest in materials and microfabrication processes, innovative designs for physical, chemical and bio sensors and microactuators, RF MEMS, micro total analysis systems, interface electronics, energy scavenging, and wireless sensors. The Technical Program covers four days of presentations, including the plenary session which opens the Conference with three exciting and world famous speakers. Twelve invited speakers in different technical areas will open the first sessions on the subsequent three days. There are nearly 220 contributed oral papers in 40 sessions and over 380 poster papers in three sessions, making Transducers the largest meeting of its kind worldwide. The Digest of Technical Papers for Transducers’09 contains four-page versions of all oral and poster papers, and is provided in both printed and USB electronic versions. We thank the authors who submitted their latest work, which makes this meeting possible. We also express our thanks to the 96 members of the international Technical Program Committee, headed by Chairman Marty Schmidt, and Vice Chairs Long-Sheng Fan (Asia) and Göran Stemme (Europe), for their hard work in reviewing the more than 1,300 abstracts submitted, and for arranging the excellent Technical Program contained in this Digest.
In addition to the Technical Program, an exciting series of social events has been planned to allow attendees the opportunities for informal interactions. This begins with a Welcome Reception at the Sheraton Denver Downtown on Sunday Evening, June 21. A Monday Evening Reception will be held at the beautiful Denver Museum of Nature and Science. The Conference Banquet will be held on Wednesday Evening at the Flying W Ranch, a real working cowboy ranch located in Colorado Springs, and will provide attendees a unique western experience with a chuckwagon barbeque dinner and rodeo, and an evening of conversation and entertainment. Denver has a central downtown area with a convention complex, performing arts complex, and a wide variety of shops, department stores, restaurants, and nightspots. Also within easy walking distance are some of the city's top attractions. A mile-long pedestrian mall cuts through the heart of downtown Denver and is surrounded by a series of parks and plazas. The Greater Colorado Area is surrounded by many national parks and tourist and historic sites, perfect for a memorable vacation for attendees and their families before or after the Conference. Our thanks go to Local Arrangement Committee Chair Chip Spangler and Vice Chair Victor Bright for providing these excellent events.
Our appreciation also goes to Kurt Petersen and Joe Brown (Development, Exhibits), Roger Grace (Media), Dave Monk (Publicity and Promotion), Farrokh Ayazi (Short Courses), Mehran Mehregany (Outstanding Paper Awards), Oliver Brand (USA Student Travel Support), Joe Giachino (Finance), members of the Executive Committee, Katharine Cline and the entire staff at Preferred Meeting Management, Inc. for their many contributions. We thank the IEEE Electron Devices Society for sponsoring Transducers’09, as well as our Patrons and Exhibitors for the significant financial support they have provided.
Finally, we thank you for attending Transducers’09. We hope that you renew friendships and make new ones, and that you find the Conference professionally stimulating and personally enjoyable.
Khalil Najafi Martin Schmidt General Conference Chair Technical Program Chair
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General Information
CONFERENCE LOCATION All sessions will be held at the Sheraton Denver Downtown Hotel.
Sheraton Denver Downtown Hotel 1550 Court Place Denver, Colorado 80202 USA Phone: +1-303-893-3333 Fax: +1-303-626-2543 Web: www.sheratondenverhotel.com
DIALING CODES USA International Country Code: +1 ...... Denver’s Local Area Code: 303
MEETING ROOM LOCATIONS Plenary Sessions...... Grand Ballroom, Tower Building Parallel Oral Sessions ...... Plaza Ballroom B, C, F, E, Plaza Building Poster Sessions...... Concourse Level, Plaza Building Exhibitor Hall ...... Concourse Level, Plaza Building Registration (Sunday & Monday Morning)...... South Convention Lobby, Tower Building Registration (Monday Afternoon - Thursday) ...... Concourse Level, Plaza Building Please refer to the hotel floorplan on page 25.
REGISTRATION & INFORMATION DESK The Registration and Information Desk will be open during the following times:
Sunday, June 21st ...... 16:00 - 20:00 Monday, June 22nd ...... 07:00 - 18:00 Tuesday, June 23rd...... 07:30 - 18:00 Wednesday, June 24th...... 07:30 - 15:00 Thursday, June 25th ...... 07:30 - 15:00
NAME BADGES All attendees must wear their name badge at all times to gain admission to all sessions, exhibits, and social events.
CHIMES The chimes will ring five minutes before the end of each scheduled break. The sessions will begin on time, so please return to the sessions when you hear the chimes.
EVALUATION There is a Conference Evaluation Form in your packet. Your feedback is very important to the improvement and development of the Conference. Please return completed form to the Conference Registration Desk.
MESSAGE & JOB MARKET BOARD Please visit the Message and Job Market Board located in the exhibit hall at booth 49.
TECHNICAL DIGEST USB FLASH DRIVE One copy of the Technical Digest on a USB flash drive is included in your bag. Additional copies may be purchased at the Registration Desk. Purchase price of the Technical Digest will increase after the Conference. Be sure to order your additional copies during the Conference. Please note that there are a limited number of hard copy books to purchase.
USB Flash Drive - IEEE Member ...... $200.00 each USB Flash Drive - Non-Member ...... $250.00 each Hard Copy Book - IEEE Member ...... $200.00 each Hard Copy Book - Non-Member ...... $250.00 each Hard Copy Book & USB Flash Drive - IEEE Member ...... $300.00 each Hard Copy Book & USB Flash Drive - Non-Member ...... $350.00 each
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General Information continued
INTERNET SERVICE For those that have their computers with them, complimentary wireless Internet will be available in the following areas:
Every day (24 hours)...... Main Lobby of the Sheraton Denver Downtown Hotel Monday morning ...... South Convention Lobby, Tower Building Monday afternoon through Thursday ...... Internet Corral, Governor’s Square 15, Plaza Building Exhibit Hall, Concourse Level, Plaza Building
When in the Conference meeting space area, select “Sheraton Meeting Group” from the list of available networks. Once prompted, the login information is: username: transd password: transd *Please note that the codes are case sensitive.
The Internet Corral will have tables for you to sit and work. Please be considerate of others in the room and limit your time to 15 minutes if others are waiting.
For those that don’t have a computer with them, in the main lobby of the hotel you will find the Link@Sheraton, a complimentary connection destination, with wireless Internet access and features 8 computers and printers for hotel guests. Please limit your usage to 15 minutes.
CELL PHONES, PAGERS & WATCH ALARMS Out of courtesy to our speakers and other attendees, please turn off any cellular phones, pagers and watch alarms during sessions.
CAMERAS & VIDEO RECORDERS Cameras and video tape recorders are strictly prohibited in the sessions, poster presentations and the exhibit area.
SMOKING The Sheraton Denver Downtown Hotel is a smoke-free facility.
TIPPING STANDARDS 15% is standard for meals. For porters and bellman, $1.00 per bag, and $1.00 per night for housekeeping.
SHIPPING SERVICE Shipping Service is available by visiting the hotel Business Center located in the Plaza Building, Lobby Level. The Business Center hours are Monday -Thursday, 07:00 - 21:00.
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Social Events
Sunday Belly-Up to the Bar Welcome Reception Sunday, June 21, 17:00 - 19:00
Please join us for the Transducers Welcome Reception at the Sheraton Denver Downtown Hotel. Enjoy visiting with other attendees while sampling beer from local breweries from around the Colorado area.
This event is included in the registration fee. Additional tickets may be purchased for guests at the on-site registration desk.
Evening Reception at the Denver Museum of Nature & Science Monday, June 22, 2009, 18:30 - 22:00
Please join us for an evening at the Denver Museum of Nature & Science. You will get an opportunity to socialize with other attendees and guests while enjoying many of the museum's exhibitions including Egyptian Mummies, North American Indian Cultures, and a prehistoric exhibition from dinosaurs to inhabitants of today's Earth in Prehistoric Journey.
Continuous shuttle transportation will depart the hotel from the main lobby of the Sheraton beginning at 18:30. The last shuttle will leave the Museum at 22:00.
This event is included in the registration fee. Additional tickets may be purchased for guests at the on-site registration desk.
Chuckwagon BBQ & Rodeo Banquet Wednesday, June 24, 2009, 15:30 - 23:00
Please join us for the Chuckwagon BBQ & Rodeo Banquet at the Flying W Ranch in Colorado Springs! You will board the buses from the Sheraton Denver Downtown Hotel for the 90 minute trip to Colorado Springs to enjoy what the Flying W Ranch has to offer.
The Flying W Ranch is an actual working mountain cattle ranch located in the foothills of Colorado Springs, Colorado. They have been specializing in authentic western food and western style entertainment since 1953.
Experience the old west the way the cowboys did through mind-spinning, gut-busting rodeo action. The rodeo originated in 1864, when cowboys were rough and wooly and would do anything to make a buck. Now a traditional sport, the cowboys you will see tonight are true rodeo cowboys, competing against one another for the opportunity to compete at the National Finals Rodeo in Las Vegas Nevada this coming fall.
The Chuckwagon Supper at the Flying W Ranch, will give you a chance to catch a glimpse of the Old West, a meal typical of one that might have been served on a cattle drive of years past, cowboys singing and an atmosphere that will beckon you to escape for a while and enjoy an evening long to be remembered.
You will experience picturesque natural surroundings, an authentic Western Village and a mighty tasty Chuckwagon Supper. When the Flying W Wranglers top the evening off with their outstanding Western Stage Show we truly will have an unsurpassed evening in Colorado.
Busses will depart the hotel from the main lobby of the Sheraton at 15:30 and will return from the Ranch at 21:00.
Banquet ticket...... $95.00 Tickets can be purchased at the on-site registration desk until 12:00 on Monday, June 22nd.
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Conference Organizers and Committee Members GENERAL CONFERENCE CHAIR Khalil Najafi...... University of Michigan, USA
TECHNICAL PROGRAM CHAIR Martin Schmidt...... Massachusetts Institute of Technology, USA
TECHNICAL PROGRAM VICE CHAIRS Long-Sheng Fan...... National Tsinghua University, TAIWAN Göran Stemme...... Royal Institute of Technology, SWEDEN
FINANCE CHAIR Joseph Giachino ...... University of Michigan, USA
LOCAL ARRANGEMENTS COMMITTEE Chair Leland "Chip" Spangler ...... Aspen Technologies, USA Vice Chair Victor M. Bright ...... University of Colorado, Boulder, USA
Kristina Lamers ...... axept, USA Steven Martin ...... Avago Technologies, USA Siavash Pourkamali...... University of Denver, USA
SHORT COURSE COMMITTEE Chair Farrokh Ayazi...... Georgia Institute of Technology, USA Vice Chairs Masayoshi Esashi...... Tohoku University, JAPAN Oliver Paul ...... University of Freiburg - IMTEK, GERMANY
EXHIBITS and COMMERCIAL SUPPORT COMMITTEE Chair Kurt Petersen...... Consultant, USA Vice Chair Joe Brown ...... Consultant, USA Media Chair Roger Grace ...... Consultant, USA
Jean-Christophe Eloy...... Yole Développement, FRANCE Susumu Kaminaga...... Sumitomo Precision Products Co., Ltd., JAPAN Sean Neylon ...... Colibrys, USA Charles Yang...... Taiwan Semiconductor Mfg. Co. (TSMC), TAIWAN
PROMOTION and PUBLICITY COMMITTEE Chair Dave Monk...... Freescale Semiconductor, USA
Vice Chair Gary O'Brien ...... Robert Bosch GmbH, USA Jérémie Bouchaud...... isuppli, GERMANY Yoshitake Ito ...... OMRON, JAPAN K. Sooriakumar ...... MEMS Technology Bhd, SINGAPORE CONFERENCE MANAGEMENT Preferred Meeting Management ...... USA
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Conference Organizers and Committee Members continued OUTSTANDING PAPER AWARDS COMMITTEE Chair Mehran Mehregany...... Case Western Reserve university, USA Vice Chairs Shuichi Shoji ...... Waseda University, JAPAN Göran Stemme...... Royal Institute of Technology, SWEDEN
USA STUDENT TRAVEL SUPPORT CHAIR Oliver Brand...... Georgia Institute of Technology, USA
EXECUTIVE PROGRAM COMMITTEE Chong Ahn...... University of Cincinnati, USA Karl Böhringer...... University of Washington, USA Siebe Bouwstra ...... MEMS TC, THE NETHERLANDS Jong-Uk Bu...... SenPlus, REPUBLIC OF KOREA Young-Ho Cho...... KAIST, REPUBLIC OF KOREA Long-Sheng Fan...... National Tsinghua University, TAIWAN Weileun Fang ...... National Tsinghua University, TAIWAN Hiroyuki Fujita ...... University of Tokyo, JAPAN Christofer Hierold ...... ETH Zürich, SWITZERLAND Jack Judy ...... University of California at Los Angeles, USA Jörg Kutter...... Technical University of Denmark, DENMARK Laurie Locascio...... National Institute of Standards and Technology (NIST), USA Joan R. Morante...... Univeristy of Barecelona, SPAIN Clark T.-C Nguyen...... University of California, Berkeley, USA Lina Sarro...... Delft University of Technology, THE NETHERLANDS Martin Schmidt...... Massachusetts Institute of Technology, USA Helmut Seidel...... University of Saarland, GERMANY Shuichi Shoji ...... Waseda University, JAPAN Olav Solgaard...... Stanford University, USA Göran Stemme ...... Royal Institute of Technology (KTH), SWEDEN Harrie A.C. Tilmans ...... IMEC, BELGIUM Kimberly L. Turner...... University of California, Santa Barbara, USA Man Wong...... Hong Kong University of Science & Technology, HONG KONG Shanhong Xia ...... Chinese Academy of Sciences, CHINA
TECHNICALTECHNICAL PROGRAM PROGRAM COMMITTEE COMMITTEE Tayfun Akin ...... Middle East Technical University, TURKEY David Arnold...... University of Florida, USA Rashid Bashir...... University of Illinois, Urbana-Champaign, USA Anja Boisen...... Technical University of Denmark, DENMARK Jürgen Brugger ...... Ecole Polytechnique Fédérale de Lausanne ...... (EPFL), SWITZERLAND Lionel Buchaillot ...... University of Lille, FRANCE Rob Candler...... Bosch LLC, USA Pei-Zen Chang ...... National Taiwan University, TAIWAN Karen Cheung...... University of British Columbia, CANADA Michel Despont...... IBM Research Laboratory, SWITZERLAND Jens Ducree...... Dublin City University, IRELAND David Elata...... Technion- Israel Institute of Technology, ISRAEL Masayoshi Esashi...... Tohoku University, JAPAN Gary Fedder ...... Carnegie Mellon University, USA Alissa Fitzgerald ...... A.M. Fitzgerald & Associates, LLC, USA Sami Franssila...... Helsinki University of Technology, FINLAND Luc Frechette ...... Université de Sherbrooke, CANADA Paddy French...... Delft University of Technology, NETHERLANDS Han Gardeniers ...... University of Twente, NETHERLANDS Udo-Martin Gómez...... Robert Bosch GmbH, GERMANY
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Conference Organizers and Committee Members continued
TECHNICAL PROGRAM COMMITTEE (continued) Yael Hanein...... Tel Aviv University, ISRAEL Yi-Long Hao...... Peking University, CHINA Gilbert Hawkins ...... Eastman Kodak Company, USA Storrs Hoen ...... Agilent, USA David Horsley...... University of California, Davis, USA Michael Huff...... MEMS Exchange, USA Qing-An Huang...... Southeast University, CHINA Mike Judy ...... Analog Devices, USA CJ Kim...... University of California, Los Angeles, USA Yongkweon Kim...... Seoul National University, KOREA Satoshi Konishi...... Ritsumeikan University, JAPAN Chee W. Kwok ...... University of New South Wales, AUSTRALIA Abraham Lee ...... University of California, Irvine, USA Gwo-Bin Lee ...... National Cheng Kung University, TAIWAN Luke Lee ...... University of California, Berkeley, USA Yikuen Lee...... Hong Kong University of Science and Technology, HONG KONG Xinxin Li ...... Chinese Academy of Sciences, CHINA Michel Maharbiz...... University of California, Berkeley, USA Ellis Meng ...... University of Southern California, USA Jianmin Miao ...... Nanyang Technological University, SINGAPORE Wilfried Mokwa...... RWTH Aachen, GERMANY Hiroaki Nakanishi...... Shimadzu Corporation, JAPAN Hyo-Jin Nam...... LG Electronics, KOREA Fredrik Nikolajeff ...... Uppsala University, SWEDEN Joachim Oberhammer ...... Royal Institute of Technology, SWEDEN Yongsoo Oh ...... Samsung Electro-Mechanics Corporation, KOREA Wouter Olthuis ...... Universite of Twente, NETHERLANDS Takahito Ono ...... Tohoku University, JAPAN Je-Kyun Park...... Korea Advanced Institute of Science and Technology, KOREA Sumitha Pennathur...... University of California, Santa Barbara, USA Beth Pruitt...... Stanford University, USA Robert Puers...... Katholieke Universiteit Leuven, BELGIUM Kazuo Sato ...... Nagoya University, JAPAN Kazuaki Sawada ...... Toyohashi University of Technology, JAPAN Uwe Schnakenberg...... RWTH Aachen, GERMANY Mark Shannon...... University of Illinois, Urbana-Champaign, USA Isao Shimoyama...... University of Tokyo, JAPAN Andrei Shkel ...... University of California, Irvine, USA Joe Simonson...... Sandia National Laboratories, USA Yuji Suzuki...... University of Tokyo, JAPAN Richard Syms ...... Imperial College London, UK Osamu Tabata...... Kyoto University, JAPAN Joseph Talghader...... University of Minnesota, USA Hiroshi Toshiyoshi...... University of Tokyo, JAPAN Michiel Vellekoop...... Vienna University of Technology, AUSTRIA Sabeth Verpoorte...... University of Groningen, NETHERLANDS Joel Voldman...... Massachusetts Institute of Technology, USA Eric Yeatman...... Imperial College London, UK Jun-Bo Yoon ...... Korea Advanced Institute of Science and Technology, KOREA Hans Zappe ...... University of Freiburg, GERMANY Roland Zengerle ...... University of Freiburg-IMTEK, GERMANY Zhaoying Zhou...... Tsinghua University, CHINA
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Conference Organizers and Committee Members continued INTERNATIONAL STEERING COMMITTEE Chair Khalil Najafi...... University of Michigan, USA Vice Chair Gilles Delapierre...... CEA-LETI, Grenoble, FRANCE
Asian Members Kukjin Chun ...... Seoul National University, KOREA Makoto Ishida ...... Toyohashi University of Technology, JAPAN Duk-Dong Lee...... Kyungpook National University, KOREA Masanori Okuyama...... Osaka University, JAPAN Shuichi Shoji ...... Waseda University, JAPAN Susumu Sugiyama ...... Ritsumeikan University, JAPAN Ching-Yi Wu...... Kenly Precision Industry Co, TAIWAN Shanhong Xia...... Institute of Electronics, Beijing, CHINA
European Members Christopher Hierold ...... ETH Zurich, SWITZERLAND Hannu Kattelus...... VTT, FINLAND Juan R. Morante ...... University of Barcelona, SPAIN Stéphane Renard...... Tronics Microsystems, FRANCE Helmut Seidel...... University of Saarland, Saarbrucken, GERMANY Göran Stemme ...... Royal Institute of Technology, Stockholm, SWEDEN Richard Syms...... Imperial College of London, UK Albert van den Berg...... University of Twente, THE NETHERLANDS
American Members Mark Allen ...... Georgia Institute of Technology, USA Roger T. Howe...... Stanford University, USA Thomas Kenny...... Stanford University, USA Mehran Mehregany ...... Case Western Reserve University, USA Kurt Petersen...... Consultant, USA Martin A. Schmidt...... Massachusetts Institute of Technology, USA Leland 'Chip' Spangler...... Aspen Technologies, USA
Ex-Officios Masayoshi Esashi...... Tohoku University, JAPAN Hiroyuki Fujita ...... University of Tokyo, JAPAN G. Benjamin Hocker ...... USA Ingemar Lundström...... Linköping University, SWEDEN Toyosaka Moriizumi ...... Tokyo Institute of Technology, JAPAN Richard Muller...... University of California at Berkeley, USA Ernst Obermeier ...... Technical University of Berlin, GERMANY Robert Puers...... Katholieke Universiteit Leuven, BELGIUM Stephen Senturia...... Polychromix, USA Byung-Ki Sohn ...... Kyungpook National University, KOREA Kensall Wise ...... University of Michigan, USA
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Conference Sponsors
Patrons We gratefully acknowledge, at the time of printing this program, the financial contributors to the Conference:
DIAMOND
Freescale Semiconductor, Inc. 2100 E. Elliot Road Tempe, AZ 85284 USA phone: 1-480-413-8053 fax: 1-480-413-8838 www.freescale.com
SAPPHIRE
Coventor 4000 Centregreen Way, Suite 190 Cary, NC 27513 USA phone: 1-919-854-7500 fax: 1-919-854-7501 www.coventor.com
Michigan Center for Wireless Integrated MicroSystems 1301 Beal Avenue, 2214 EECS Ann Arbor, MI 48109 USA phone: 1-734-615-3096 fax: 1-734-647-2342 www.wimserc.org, www.LNF.umich.edu
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Patrons continued
MONDAY MORNING BREAK
Tegal Corporation 2201 S. McDowell Blvd. Petaluma, CA 94954 USA phone: 1-707-765-5608 fax: 1-707-773-3015 www.tegal.com
TUESDAY MORNING BREAK
Berkeley Sensor & Actuator Center University of California, Berkeley 497 Cory Hall #1774 Berkeley, CA 94720 USA phone: 1-510-643-6690 fax: 1-510-643-6637 bsac.berkeley.edu
MEDIA - PLATINUM PLUS
Euro Asia Semiconductor Hannay House, 39 Clarendon Road Watford Herts, WD17 1JA UK phone: +44-1923-690200 Small Times fax: +44-1923-690201 98 Spit Brook Road - LL1 www.euroasiasemiconductor.com Nashua, NH 03062 USA phone: 1-603-891-9141 fax: 1-978-891-0597 www.smalltimes.com
MEDIA - GOLD
Micronews 45 rue Ste Genevieve Lyon, 69006 FRANCE IOP Publishing, Inc. phone: +33-47-283-0189 150 S. Independence Mall W., Suite 929 fax: +33-47-283-0183 Philadelphia, PA 19106 USA www.i-micronews.com phone: 1-215-627-0880 fax: 1-215-627-0879 http://publishing.iop.org
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Patrons continued
MEDIA - SILVER
ECN Magazine 100 Enterprise Drive, Suite 600 Rockaway, NJ 07866 USA phone: 1-973-920-7038 fax: 1-973-607-5531 www.ecnmag.com
MEDIA - BRONZE
NASA Tech Briefs MEMS Investor Journal, Inc. 1466 Broadway, Suite 910 Desktop Engineering 14681 Talbot Street New York, NY 10036 USA 1283 Main Street Oak Park, MI 48237 USA phone: 1-212-490-3999 Dublin, NH 03444 USA phone: 1-734-277-3599 fax: 1-212-986-7864 phone: 1-603-563-1631 fax: 1-734-239-7409 www.techbriefsmediagroup.com fax: 1-603-563-8192 www.memsinvestorjournal.com www.deskeng.com
ASSOCIATION
MEPTEC MEMS Industry Group P.O. Box 222 1620 Murray Avenue Medicine Park, OK 73557 USA Pittsburgh, PA 15217 phone: 1-650-714-1570 phone: 1-412-390-1644 fax: 1-866-424-0130 fax: 1-412-381-7714 www.meptec.org www.memsindustrygroup.org
mstnews VDI/VDE-IT GmbH, Steinplatz 1 Berlin, D-10623 GERMANY phone: +49 30 310078-167 North America Taiwanese fax: +49 30 310078-223 Engineers' Association NEXUS Association www.mstnews.de P.O. Box 2792 www.nexus-mems.com Sunnyvale, CA 94087 USA phone: 1-650-814-3888 www.natea.org
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Exhibitors Exhibits are located on the Concourse Level, Plaza Building. Please refer to the floor plan on page 26.
EXHIBIT HOURS: Monday, June 22nd...... 12:00 - 18:00 Tuesday, June 23rd ...... 07:30 - 18:00 Wednesday, June 24th...... 07:30 - 15:15 Thursday, June 25th...... 07:30 - 15:00
ALLVIA...... 40 657 N. Pastoria Avenue Sunnyvale, CA 94085 USA phone: 1-408-212-3200 fax: 1-408-720-3340 www.allvia.com
Aspen Technologies ...... 13 5050 List Drive, Suite C Colorado Springs, CO 80919 USA phone: 1-719-592-9100 fax: 1-719-592-9126 www.aspentechnologies.com
Aspen Technologies is a microelectronic manufacturing company specializing in advanced packaging technologies for complex integrated circuits and MEMS devices. Aspen enables its customers to rapidly bring new products to market through world-class assembly technologies (wirebond, Flip Chip, et al), innovative engineering, and scalable manufacturing solutions. The engineering and manufacturing capabilities at Aspen provide a direct path from development through to production, including device qualification support and supply chain management. Quick-turn engineering prototypes can be assembled as quickly as same-day to support development or design verification needs.
Boschman Technologies BV...... 29 Stenograaf 3 Ex Duiven, 6921 THE NETHERLANDS phone: +31-26-319-4900 fax: +31-26-319-4999 www.boschman.nl
Boschman manufactures Unistar auto molding systems for encapsulation of semiconductors and sensors. The patented FAM (Film Assist Mold) technology provides low cost solutions to keep exposed contacts and chip surfaces clean. Our services consist of: - Strip, device and package design support with focus on reliable moldability. - Low cost sample molding in our test system, to provide test and customer samples. Various production solutions to address customer specific requirements. Various special package samples will be on exhibition, together with technical personnel to discuss your projects.
Conferences...... 57
Stop by to learn more about future Conferences in your field. Keep in touch with the colleagues that you meet at Transducers and come see them in places like New Zealand, The Netherlands and Mexico!
Coventor...... 2 & Plaza Court 2 4000 Centregreen Way, Suite 190 Cary, NC 27513 USA phone: 1-919-854-7500 fax: 1-919-854-7501 www.coventor.com
Coventor, Inc. is the leading worldwide provider of 3-D simulation, analysis and design automation software for the development of micro- and nano-scale devices and systems. The CoventorWare MEMS software suite is the industry software standard in MEMS product development, with an extensive customer base spanning from the top 10 MEMS manufacturing companies to small laboratories around the world. SEMulator3D emulates Silicon processing in software, allowing you to fabricate your device in a virtual 3D environment. Reduces your process development/integration costs by finding problems in a virtual 3D environment before fabrication. Enhances communication in the fab with highly detailed, interactive 3D models. At the 2009 Transducers conference in Denver, Coventor will be introducing the next generation MEMS + IC design software. If you have not done so already, please contact us and arrange to see what's next.
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Exhibitors continued DALSA Semiconductor ...... 52 18 boul.de l'Aeroport Bromont, QB J2L 1S7 CANADA phone: 1-450-534-2321 fax: 1-450-534-2168 www.dalsa.com
As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs. What sets us apart? Without a doubt it is our vast and unique wafer fabrication repertoire, the mastery of which we have earned through decades of research, innovation, and process development. This unparalleled technology portfolio enables us to bring our customers' breakthrough designs from conception to reality for true competitive advantage.
e2v ...... 53 520 White Plains Road, Suite 450 Tarrytown, NY 10591 USA phone: 1-914-592-6050 fax: 1-914-592-5148 www.e2v.com
e2v offers 20 years expertise in Mixed Signal ASICs & ASSPs engineering, design, test and production for demanding sensor signal conditioning. The ambitious roadmap of solutions for tomorrow‚s sensor conditioning, processing, and interfacing will be exhibited on the booth, along with demonstrators of high-precision sensor applications, like for instance 0.1° accelerator-based tilt or 0.1° High Temperature Magneto-resistive angle sensing.
FEMTO Science Inc...... 38 323-1, Banwol-Dong Whaseong-Si, Gyeonggi-Do, 445-330 KOREA phone: +82-31-203-7066 fax: +82-31-204-7063 www.femtoscience.co.kr
Vacuum & Atmospheric plasma system (Surface modification, Cleaning, Etching...) Laser micro machining systems (Patterning, via holing...) We make plasma work. We make laser work. Research is your business, Instrumentation is our JOB!!!
Freescale Semiconductor, Inc...... 3 & Plaza Court 3 2100 E. Elliot Road Tempe, AZ 85284 USA phone: 1-480-413-8053 fax: 1-480-413-8838 www.freescale.com
Freescale Semiconductor is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. Freescale is a leading high-volume sensor provider with an extensive portfolio of acceleration, pressure and proximity sensors. Freescale has offered MEMS (Micro-Electro-Mechanical-Systems)-based sensors for more than 25 years. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations around the world. For more information, visit www.freescale.com/ sensors.
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Exhibitors continued Georgia Tech Center for MEMS and Microsystems Technology ...... 31 85 Fifth Street, NW, Room 447 Atlanta, GA 30308 USA phone: 1-404-894-9496 fax: 1-404-385-6650 www.mems.gatech.edu
Georgia Tech Center for MEMS and Microsystems Technologies (CMMT) is an interdisciplinary center for research and development dedicated to microelectromechanical devices and systems. Research expertise of the center includes silicon and non-silicon micro- and nano-fabrication technologies, microsensor and microactuator design, resonator design, interface IC design, and integrated micro/nanosystem development. CMMT offers research opportunities in a wide range of MEMS-related topics ranging from inertial sensors to biochemical sensors, from biomedical microdevices to RF microsystems, and from power-MEMS to power-efficient integrated microsystems. CMMT has the capability of technology transfer, as highlighted by recent start-up companies CardioMEMS and Qualtre. CMMT researchers have access to state-of-the-art microfabrication facilities at Georgia Tech's Nanotechnology Research Center (NRC).
Georgia Tech Nanotechnology Research Center...... 30 791 Atlantic Drive Atlanta, GA 30332 USA phone: 1-404-894-0479 fax: 1-404-894-5028 www.nrc.gatech.edu
Georgia Tech's Nanotechnology Research Center (NRC) is a research enabler, providing state-of-the-art equipment resources, staff expertise, training, and teaming environments to support fabrication and characterization on the micro and nano scale. The NRC is supported by the National Science Foundation as the southeast node in the National Nanotechnology Infrastructure Network (NNIN) and operates as an open, hands-on user facility. The Georgia Tech NRC provides a unique resource to academic, industry, and government researchers (more than 500 users in 2008) to develop new microelectronic, optical, and MEMS devices and to evaluate unique nano-materials and surfaces with an emphasis on applications in bioengineering and biomedicine.
Heidelberg Instruments ...... 7 2807 Oregon Court, Unit E2 Torrance, CA 90503 USA phone: 1-310-212-5071 fax: 1-310-212-5254 www.himt.de
Heidelberg Instruments is today a global leader in design, development and manufacturing of complex laser based maskless lithography systems. These systems are critical to fabrication of advanced photomasks and direct write solutions in the areas of Micro Total Analysis Systems, Sensors, MEMS, Integrated Optics and other micro and nano based applications.
IEEE Sensors Council ...... 46 445 Hoes Lane Piscataway, NJ 08854 USA phone: 1-732-562-3910 fax: 1-732-981-1138 www.ewh.ieee.org/tc/sensors
The IEEE Sensors Council publishes the IEEE Sensors Journal, the premier refereed journal in the field of sensors, and sponsors the annual IEEE SENSORS conference. According to the Annual ISI Citation Index, the IEEE publishes 18 of the top 20 journals in its field. Free samples of the Sensors Journal will be available at the booth. About 2 million scientists, engineers and students have access to the IEEE Sensors Journal via their institutions' subscription to IEEE's on-line publications. IEEE Xplore provides users with web access to more than 1.7 million articles (visit www.ieeexplore.ieee.org). For further information, please visit www.ieee.org/sensors, and, to join the IEEE, www.ieee.org/join.
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Exhibitors continued iMINT Center - University of Colorado...... 45 427 UCB Boulder, CO 80309 USA phone: 1-303-492-5808 fax: 1-303-492-7990 www.imintcenter.org
iMINT researchers conduct research to establish science and technology to facilitate the successful integration of nanowire/nanotube/graphene-enabled microsystems with repeatable, predictable, and reliable performance. A few examples of the research projects are: 1) GaN nanowire-based resonator with Q>10,000 (10X higher than Q’s of other nanowires); 2) defect free GaN nanowires grown on silicon for high efficiency LED and MESFET; 3) MEMS-based universal testing platform to characterize RF performance (> 40GHz) of nanowire/nanotube/graphene under loadings; 4) graphene demonstrated as the strongest material ever measured and use of graphene as mechanical resonators; 5) growth, fabrication and characterization of chemically modified graphene; 6) atomic layer deposition/molecular layer deposition for a moisture barrier coating with the highest mechanical toughness; 7) nano-scaled hermetic sealing of polymer packages; and 8) thermal ground plane with effective thermal conductivity 100X higher than copper’s.
The Institution of Engineering and Technology...... 15 Michael Faraday House, Six Hills Way Stevenage, SG1 2AY UK phone: +44-1438-7655-20 fax: +44-1438-7673-17 www.theiet.org
The Institution of Engineering and Technology (IET) is Europe’s leading organisation of engineering and technology professionals with over 150,000 members in 127 countries. It provides a range of leading publications and information services in the areas of engineering and technology, including the world-renowned journal, Electronics Letters, and the recently-launched online journal Micro & Nano Letters. See us at Booth 15 for free copies of our journals and to find out more about our products and services.
IntelliSense...... 50 600 W. Cummings Place, Suite 2000 Woburn, MA 01801 USA phone: 1-781-933-8098 fax: 1-781-933-8099 http://intellisense.com
IntelliSense ignited the MEMS industry in the early 1990s with its IntelliSuite family of innovative CAD tools -- and is now the leading innovator and supplier of design and development solutions for the MEMS professional. After more than a decade in continuous development, IntelliSuite now boasts the widest range of features available in a MEMS tool and remains unsurpassed in its simulation capabilities, robustness and ease of use. With users in more than 30 countries, including all of the top 5 MEMS manufacturers, research organizations and MEMS universities, IntelliSuite is the industry standard software for MEMS. As a fabless MEMS company, IntelliSense also offers custom design, consulting and market research services to universities, blue-chip companies and start-ups worldwide.
IOP Publishing, Inc...... 8 150 S. Independence Mall W., Suite 929 Philadelphia, PA 19106 USA phone: 1-215-627-0880 fax: 1-215-627-0879 http://publishing.iop.org
IOP Publishing is a leading international scientific publisher. IOP publishes a range of journals, community websites and magazines including Journal of Micromechanics and Microengineering. More than 50 journals reflect the growth and interdisciplinary nature of scientific research and application. Publishing research work with IOP Publishing is quick and easy, allowing authors to submit without delay, to monitor progress and to keep research archived safely. Furthermore, advice on all aspects of publishing, including authorship of journal articles and subscription information, is readily available. For a complete list of IOP journals, see our website.
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Exhibitors continued Labtec Sales ...... 28 7160 Eagle Ridge Drive Gilroy, CA 95020 USA phone: 1-408-847-5657 fax: 1-408-847-5659 www.labtec-sales.com
Labtec Sales provide a wide range of products for the MEMs industry these include: Intelligent Micro Pat- terning - Maskless Patterning System; AGS Plasma Systems - RIE, ICP and PECVD Systems; SSI - Rapid Thermal Processing Systems; AMS - Micro and Nano Trimming Systems; Seren IPS - RF Generators and Matching Networks; Denton Vacuum - Evaporation and Sputtering Systems.
memsstar® ...... 42 Starlaw Park, Starlaw Road Livingston EH54 8SF UK phone: +44 (0) 1506409160 fax: +44 (0) 1506464300 www.memsstar.com
memsstar® is a global leader in the provision of technology and systems to the MEMS (Micro Electrical Mechanical Systems) and integrated semiconductor markets. memsstar® uses vapour phase single wafer processing for the release etch and surface modification process steps as required in most MEMS devices. With unique CCFT process control technology and an extensive range of chemistries, users get a wide process window and integrated process controls which far exceed other currently available systems and methods. memsstar® systems deliver fast throughput, small footprint, low consumption and emissions, scalable platforms, process controls and high repeatability at a low entry level cost. System configurations can be matched to suit any situation from R&D to high throughput production. Additional information about the company can be found at www.memsstar.com
MEMStaff Inc...... 44 209 Willow Ave., Suite #1 Somerville, MA 02144 USA phone: 1-866-863-8731 fax: 1-617-996-9265 www.memstaff.com
MEMStaff is a staffing company specializing in the MEMS, Microfluidics, Microsystem Technology (MST), or Micromachining fields. MEMStaff places highly qualified employees at companies looking to hire the best people. MEMStaff is built upon more than fifty years of combined MEMS experience in a broad range of disciplines. This experience allows us to understand, in detail, the kind of job you're looking for and the kind of employee you need.
Michigan Center for Wireless Integrated MicroSystems...... 1 & Plaza Court 1 1301 Beal Avenue, 2214 EECS Ann Arbor, MI 48109 USA phone: 1-734-615-3096 fax: 1-734-647-2342 www.wimserc.org, www.LNF.umich.edu
The Michigan Center for Wireless Integrated MicroSystems offers the opportunity for research and the capability to translate the research into product. The Center is anchored by the WIMS ERC which has merged micropower circuits, wireless interfaces, MEMS, nanotechnology, and advanced packaging to create microsystems. The NNIN is an integrated network of user facilities that provides efficient access to nanotechnology infrastructure to researchers across the country and abroad. The LNF is a 12,500 square foot state-of -the- art class 10/100/1000 and 10,000 cleanroom facility available to government, industry and universities. Equipment and processes are available for research on silicon integrated circuits, MEMS, III-V compound devices, organic devices and nanoimprint technology. The Michigan Center for Wireless Integrated MicroSystems offers the opportunity to go from an idea to a functioning system.
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Exhibitors continued Micralyne Inc...... 35 1911 94 Street Edmonton, AB T6N 1E6 CANADA phone: 1-780-431-4400 fax: 1-780-431-4422 www.micralyne.com
Micralyne is a full-service developer and OEM manufacturer of MEMS-based components. We translate MEMS product designs into the processes needed to manufacture products repeatedly and reliably. With 20 years of development experience, our customers can fully benefit from our expert staff, state-of-the-art equipment base, and our ISO-9001 – registered facilities including Class 10 clean rooms. Micralyne offers a full-breadth of MEMS capabilities that include the core competencies of micromachining (bulk and surface micromachining; wet and dry etch), thin film processing (metallization and lithography; especially with metals such as gold that are not compatible with CMOS processing facilities), wafer bonding, dicing, wire bonding, assembly and characterization/testing.
Micronarc...... 54-55 FSRM, Ruelle DuPeyrou 4 Neuchâtel, CH-2001 SWITZERLAND phone: +41-32-720-0900 fax: +41-32-720-0990 www.micronarc.ch
Micronarc is the dedicated micro-nanotech cluster and communication platform created by the governments of the seven cantons that constitute Western Switzerland (Bern, Fribourg, Vaud, Neuchâtel, Geneva, Valais and the Jura). Its primarily role is the development and promotion of the regional scientific, industrial and economic base in the sectors of micro and nanotechnology, as well as its educational structures, R&D facilities, technology transfer and inward investment. To achieve its objectives, Micronarc manages and operates its internet portal www.micronarc.ch, organises grouped booths at industry trade shows and scientific conferences; organises professional and public events locally; provides information and networking possibilities and acts as a facilitator in establishing business relations.
Micronews...... 18 45 rue Ste Genevieve Lyon, 69006 FRANCE phone: +33-47-283-0189 fax: +33-47-283-0183 www.i-micronews.com
Micronews is the industry journal produced and published by Yole Développement. Distributed by email to over 23,000 readers around the globe this monthly journal, and its website www.i-micronews.com, have become the leading information source for MEMS industry news. With content developed by the team of analysts at Yole, Micronews offers greater insight than other publications in the field. Further, drawing from the body of work at Yole, topics covered by Micronews extend beyond MEMS and include: Microfluidics, LED, Power Electronics as well as quarterly supplements on Photovoltaic and Advanced Packaging. In each issue of Micronews you will find the latest news and information on applications, markets, industrial companies, R&D institutes and investors worldwide.
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Exhibitors continued OAI...... 48 685 River Oaks Parkway San Jose, CA 95134 USA phone: 1-408-232-0600 fax: 1-408-433-9904 www.oainet.com
OAI designs and manufactures equipment for MEMS, Nanotechnology and Microfluidics. Products include: front & backside mask aligners, UV lightsources, Nano Imprint System (NIL), and Wafer Bonders for both R&D through production. Also available are modules and materials for Microfluidic Device prototypes or production. Recently added to the OAI product line are HF vapor etchers for dry release, IR Microscope for Inspection, and chip to chip bonders. OAI maintains sales, engineering and service support worldwide.
OKMETIC ...... 39 Piitie 2 Vantaa, 01510 FINLAND phone: +358-9-50-2800 fax: +358-9-50-2802-00 www.okmetic.com
Okmetic is the world´s leading supplier of silicon wafers for high-performance MEMS sensor manufacturing. With the widest product selection on the market, we offer silicon solutions for the rapidly growing MEMS market. Our selection for surface and bulk micromachining, encapsulation and MEMS-IC-integration designs includes double side polished (DSP), single side polished (SSP), epitaxial and bonded silicon on insulator (SOI) wafers with products like C-SOI and G-SOI in 100-200 mm. Also a wide range of services and further developed solutions are included into our product range.
Oriental System Technology Inc...... 47 2F, N25, Industry E. Road, 9th Hsinchu Science Park Hsinchu, 30075 TAIWAN phone: +886-3-5785177 fax: +886-3-5787070 www.orisystech.com
Oriental System Technology, Inc. is a MEMS manufacturing company based in the heart of Taiwan's Silicon Valley, the Hsinchu Science-Based Park. OST provides customers the service of MEMS device packages, such as TO-metal can types for IR, NDIR, pressure, vacuum and flow sensors. OST also provides backend MEMS processes for customers, such as: front-side and backside surface micromachining; through-wafer via using selective porous silicon etching and etc. The company also provides the total solution of low-cost process integration for customer's mass production.
Polytec, Inc...... 21 1342 Bell Avenue, Suite 3-A Tustin, CA 92780 USA phone: 1-949-769-2626 fax: 1-949-769-2622 www.polytec.com
Polytec will introduce a new ultra high frequency laser Doppler vibrometer for measuring the vibration of transducers up to 600MHz. The system is compatible with probe stations and offers sub-µm spatial resolution. It includes software for time and frequency domain acquisition and analysis. Polytec will also demonstrate its renowned MSA-500 system combining stroboscopic-video-based in-plane motion analysis and laser-Doppler-vibrometer-based out-of-plane vibration measurement with optical surface metrology imaging.
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Exhibitors continued Primaxx Inc...... 36 7377 William Avenue, Suite 800 Allentown, PA 18106 USA phone: 1-610-336-0314 fax: 1-610-336-0455 www.primaxxinc.com
Primaxx is the world leader in stiction-free, reduced pressure MEMS dry etch release, where etching of sacrificial silicon oxide takes place in the gas phase. Although there are many potential MEMS applications that benefit from stiction-free release using the Primaxx process, it is practically a requirement for high yield processing of inertial sensors, mirror arrays and micro-actuators. With an in-house Process Engineering knowledge base second to none, the Primaxx second generation product line meets wide ranging process needs from R&D to low, mid and high volume production. Headquartered in Allentown, Pennsylvania, Primaxx maintains sales and support centers in the United States, Europe and Asia through its worldwide distribution relationship with parent company Sumitomo Precision Products Co Ltd (SPP) of Japan and affiliate Surface Technology Systems PLC (STS), another SPP subsidiary.
SAES Getters USA, Inc...... 12 1122 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 USA phone: 1-719-576-3200 fax: 1-719-576-5025 www.saesgetters.com
The SAES Getters Group is the world leader in providing getters for scientific and industrial applications where stringent vacuum conditions or ultra-high purity gases are required. SAES Getters provides integrated thin film getter products specifically designed to improve and maintain stable vacuum conditions in hermetically sealed MEMS. At Transducers 2009, SAES will showcase the Page film product line consisting in PageLid for single device encapsulations and PageWafer for wafer level packaging.
Silex Microsystems ...... 37 9 Hamilton Place, Suite 300 Boston, MA 02108 USA phone: 1-617-933-2972 fax: 1-617-357-5599 www.silexmicrosystems.com
Silex Microsystems is a world-leading MEMS foundry that brings advanced process technologies and manufacturing capacity to a wide range of high-tech companies. Currently Silex operates two state-of-the-art MEMS fabs with 6" and 8" wafer size respectively. We serve customers in a wide range of application areas, such as automotive, medical, consumer electronics and more. Among the sensors manufactured are: pressure sensors, accelerometers, gyros, drug delivery devices, biochips, switches, etc. Silex is also well recognized for its world leading through wafer via (Sil-ViaT) and bonding processes that enables wafer level packaging of MEMS and CMOS.
Small Times...... 9 98 Spit Brook Road - LL1 Nashua, NH 03062 USA phone: 1-603-891-9141 fax: 1-978-891-0597 www.smalltimes.com
Small Times eMagazine is owned by Pennwell Corporation and is published every two months. Small Times contains technical and review articles, news & analysis, and product information. We also publish an annual Small Times Buyers Guide. Each issue is delivered to over 40,000 "e-subscribers" who are influential business decision makers in MEMS, micro, and nanotechnology. We are a global emagazine with strong brand recognition.
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Exhibitors continued SoftMEMS LLC ...... 27 2301 Nobili Avenue Santa Clara, CA 95051 USA phone: 1-510-847-4170 www.softmems.com
SoftMEMS sells powerful, easy-to-use MEMS CAD tools. Functionalities encompass mixed MEMS/IC schematic capture, modeling, simulation, optimization, statistical analysis, mask layout, DRC, 3D model generation, and process emulation.
Springer Business and Media...... 41 233 Spring Street New York, NY 10013 USA phone: 1-781-681-0541 www.springer.com/engineering
Springer is pleased to be an exhibitor at Transducers 2009 and present our latest titles in the MEMs Reference Shelf including Photonic Microsystems, Micro and Nanotechnology Applied to Optical Devices and Systems by Olav Solgaard and MEMS Vibratory Gyroscopes · Structural Approaches to Improve Robustness by Cenk Acar and Andrei Shkel. For information on becoming a Springer author, please contact Steven Elliot , Senior Editor Engineering via e-mail at [email protected]
Surface Technology Systems, PLC...... 22 Imperial Park Newport, NP10 BUJ UK phone: +44-1633-652-400 fax: +44-1633-652-405 www.stsystems.co.uk
Established in 1984, Surface Technology Systems plc (STS), a wholly owned subsidiary of Sumitomo Precision Products Co., Ltd (SPP), manufactures cassette-to-cassette cluster and single/batch loadlocked plasma etch and deposition systems that can be configured with ICP, RIE, XeF2 and PECVD sources. Their wafer processing technologies include the market-leading ASE® deep silicon etch process for MEMS micromachining, dielectric etch and deposition for Optical Waveguides, and compound semiconductor etch processes. STS and SPP have a worldwide distribution and service network of sales offices, service engineers and agents, to offer local sales, spares and service support throughout Asia, Europe and North America.
Tango Systems, Inc...... 51 2363 Bering Drive San Jose, CA 95131 USA phone: 1-408-526-2330 fax: 1-408-526-2336 www.tangosystemsinc.com
Tegal Corporation...... 32 2201 S. McDowell Blvd. Petaluma, CA 94954 USA phone: 1-707-765-5608 fax: 1-707-773-3015 www.tegal.com
Tegal is an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronics. We combine proven expertise with practical system strategies to deliver application-specific solutions that are robust and reliable, for applications such as: Silicon DRIE MEMS Etch; PVD and Plasma Etch for AlN, PZT, and other Piezoelectric Films; Precision Descum; Stress-Controlled PVD for Metal Films on Thin Wafers
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Exhibitors continued Tousimis...... 43 2211 Lewis Avenue Rockville, MD 20851 USA phone: 1-301-881-2450 fax: 1-301-881-5374 www.tousimis.com
Tousimis manufactures leading edge Supercritical CO2 Dryers enabling delicate micro 3-D structural preservation for both Bio and Material applications. Tousimis is a USA based company located in the Washington D.C. Technology Corridor. Our reproducible CPD process technology eliminates surface tension forces. Current Supercritical CPD applications include MEMS, Bio-MEMS, Gel, Polymer-Matrix drying, Aero-Gels, Carbon Nanotubes, Graphene and other emerging technologies. Tousimis also manufactures X-Ray Reference Standards. Tousimis supports all products with our global sales and service support network.
TRANSDUCERS'11 - The 16th International Conference on Solid-State Sensors, Actuators and Microsystems...... 56 Beijing, CHINA phone: +86-10-5888-7190 fax: +86-10-6217-4126 www.transducers11-beijing.org
The Conference will be held on June 5-9, 2011 in Beijing, China, at the China National Convention Center which is located in the center of Olympics Park with wonderful facilities and sightseeing. It will share the latest progress in physical, chemical and biological microsensors, the latest development in optical, RF, fluidic, biomedical and power MEMS, and the most advanced technologies in micro/nano fabrication, packaging and design; with short courses, oral presentations, posters, exhibitions, technical tour and social events. For more information, please visit the website: WWW.TRANSDUCERS11-BEIJING.ORG
Xactix, Inc...... 14 2403 Sidney Street, Suite 300 Pittsburgh, PA 15203 USA phone: 1-412-331-3195 fax: 1-412-381-1134 www.xactix.com
XACTIX is the manufacturer of the Xetch® xenon difluoride (XeF2) etching systems with many different models to support small labs through high volume production. These dry isotropic etching tools are used to etch silicon, molybdenum and germanium and are popular in the MEMS community due to high selectivity versus many standard films including photoresist, silicon dioxide, silicon nitride, and aluminum. The Xetch® systems are particularly well suited for release, but are certainly not limited to MEMS applications and are useful for many applications where highly selective isotropic silicon, molybdenum and germanium etching is required. XACTIX also provides XeF2 etching services.
Zurich Instruments AG ...... 20 Technoparkstrasse 1 Zurich, 8005 SWITZERLAND phone: +41-44-633-7849 fax: +41-44-633-1615 www.zhinst.com
Zurich Instruments (ZI) is a technology start-up developing and marketing test & measurement devices for high-tech research laboratories. As a spin-off from Swiss-based ETH Zurich, ZI was established in 2008 and celebrated first sales in the fall of the same year. At the Transducers 2009, Zurich Instruments is introducing its new line of 50 MHz / 200 MSample/s HF2 products, comprising an impedance spectroscope, a digital lock-in amplifier, and an oscillation controller. These products are used in a wide-range of applications such as MEMS, biology, semiconductor test, or nano physics. Visitors at the Transducers will be able to see an attractive demonstration of the capability of the lock-in amplifier performing oscillation control.
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Hotel Floor Plan
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Exhibitor Booths Floor Plan
Conference Exhibit Raffle
The Conference is raffling 4 - iPod Touch's (8GB). In your Conference material, you will find a raffle card. Visit 15 different exhibiting companies and receive a stamp from each one of them. Drop off your completed card in the box located near the Conference Registration Desk by 15:00 on Wednesday to qualify. Winners will be announced on Thursday morning in all Parallel Oral Session rooms. Please note that winners must be present to win.
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Meeting Space Floor Plan
CONCOURSEConcourse LEVEL,Level, PlazaPLAZA Building BUILDING
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Meeting Space Floor Plan
CONCOURSEConcourse LEVEL,Level, PlazaPLAZA Building BUILDING
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Poster Floor Plan Section 1
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Poster Floor Plan Section 2
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Poster Floor Plan Section 3
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Technical Program Information
The technical program consists of three plenary sessions, forty oral sessions of contributed papers and three poster sessions.
Plenary Sessions The plenary sessions will be held Monday morning starting at 08:45.
Plenary I - Kensall D. Wise, University of Michigan, USA Plenary II - Masayoshi Esashi, Tohoku University, JAPAN Plenary III - Nico F. de Rooij, Ecole Polytechnique Fédérale de Lausanne, SWITZERLAND
Parallel Oral Sessions Each day papers will be presented in four parallel sessions. There will be a total of forty oral sessions throughout the four days of the Conference.
Poster Sessions Three poster sessions will be held in three areas of the Concourse Level, Plaza Building. Posters will be on display from Monday at 12:45 through Thursday 14:45. All poster papers are listed with their assigned number and day that they are on display. Authors will be available for questions during their appointed time. Posters are color coded by day and category to coordinate with the floorplans starting on page 29.
Guide to Understanding Paper Numbering Each paper in the technical program is assigned a unique number which clearly indicates when and where the paper is presented. The number of each paper is shown before the paper title.
Typical Paper Number: T3B.4
• The first letter (i.e., T) indicates the day of the Conference:
M = Monday T = Tuesday W = Wednesday Th = Thursday
• The second number (i.e., 3) indicates what time during the day the session is being presented:
1 = Early Morning 2 = Mid Morning 3 = Early Afternoon 4 = Late Afternoon
• The third letter (i.e., B) shows the room location of the paper:
B = Ballroom B, Plaza Building C = Ballroom C, Plaza Building E = Ballroom E, Plaza Building F = Ballroom F, Plaza Building G = Grand Ballroom, Tower Building P = Poster, Concourse Level, Plaza Building
• The number after the point (.) shows the number of the paper in the session in sequence starting at 1.
Page Numbering To assist you with finding the paper in the Technical Digest, we have provided the page number following each paper title.
32 TRANS09 FinalProgram PRINT:TRANS09 6/3/09 11:28 AM Page 33
Technical Program
SUNDAY, June 21, 2009
16:00 - 20:00 REGISTRATION 17:00 - 19:00 BELLY-UP TO THE BAR WELCOME RECEPTION MONDAY, June 22, 2009
08:00 - 08:15 OPENING OF TRANSDUCERS 2009 - K. Najafi, University of Michigan, USA 08:15 - 08:25 WELCOME TO DENVER - L. “Chip” Spangler, Aspen Technologies, USA 08:25 - 08:30 TRANSDUCERS 2011 ANNOUNCEMENT - S. Xia, Chinese Academy of Sciences, CHINA 08:30 - 08:45 TECHNICAL PROGRAM INTRODUCTION - M. Schmidt, MIT, USA PLENARY I - CHAIR M. Schmidt, Massachusetts Institute of Technology, USA
08:45 - 09:25 M1G.001 WIRELESS INTEGRATED MICROSYSTEMS: WEARABLE AND DEVICES FOR IMPROVED HEALTH CARE K.D. Wise University of Michigan, USA ...... 1
PLENARY II - CHAIR L.-S. Fan, National Tsing Hua University, TAIWAN
09:25 - 10:05 M1G.002 WAFER LEVEL PACKAGING OF MEMS M. Esashi Tohoku University, JAPAN ...... 9
10:05 - 10:35 BREAK & EXHIBIT INSPECTION PLENARY III - CHAIR G. Stemme, KTH - Royal Institute of Technology, SWEDEN
10:35 - 11:15 M2G.003 MEMS FOR SPACE N.F. de Rooij1,2, S. Gautsch1, D. Briand1, C. Marxer3, G. Mileti4, W. Noell1, H. Shea1, U. Staufer5, and B. van der Schoot6 1Ecole Polytechnique Fédérale de Lausanne (EPFL), SWITZERLAND, 2Centre Suisse d'Electronique et de Microtechnique SA (CSEM SA), SWITZERLAND, 3Sercalo Microtechnolgoy Ltd., SWITZERLAND, 4Université de Neuchâtel, SWITZERLAND, 5Technical University of Delft, THE NETHERLANDS, and 6Seyonic SA, SWITZERLAND ...... 17
11:15 - 11:35 OUTSTANDING PAPER AWARDS CEREMONY 11:35 - 13:00 LUNCH ON OWN & EXHIBIT INSPECTION
13:00 - 16:00 M3P POSTER SESSION I - see floor plans starting on page 29 Actuators
M3P.001 AN OPTIMIZED CU-NI NANOCOMPOSITE COIL FOR LOW- POWER ELECTROMAGNETIC MICROSPEAKER FABRICATION Y.C. Chen, W.-T. Liu, T.-Y. Chao, and Y.T. Cheng National Chiao Tung University, TAIWAN ...... 25
M3P.002 A LATCHABLE PARAFFIN ACTUATED HIGH-PRESSURE MICROFLUIDIC VALVE S. Ogden, R. Bodén, and K. Hjort Uppsala University, SWEDEN ...... 29
M3P.003 BISTABLE SWITCHING WITH A THERMOELECTRICALLY DRIVEN THERMOPNEUMATIC ACTUATOR J. Ruhhammer, T. Huesgen, and P. Woias University of Freiburg, GERMANY ...... 33
M3P.004 MASS-PRODUCTION-ORIENTED IONIC POLYMER ACTUATOR BASED ON ENGINEERED MATERIAL STRUCTURE N. Nagai, T. Kawashima, and J. Ohsako Sony Corporation, JAPAN ...... 37
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M3P POSTER SESSION I (continued)
M3P.005 A BISTABLE SMA MICROACTUATOR WITH LARGE WORK OUTPUT J. Barth, B. Krevet, and M. Kohl Forschungszentrum Karlsruhe GmbH, GERMANY ...... 41
M3P.006 TANGENTIAL AND PERPENDICULAR DRIVING MICRO TRANSMISSION SYSTEMS BASED ON RATCHET MECHANISM AND ELECTROSTATIC ACTUATOR D.V. Dao1, P.H. Pham2, S. Senkawa1, and S. Sugiyama1 1Ritsumeikan University, JAPAN and 2Hanoi University of Technology, VIETNAM ...... 45
M3P.007 METAL CORE PIEZOELECTRIC TOUGHNESS FIBER H. Sato National Institute of Advanced Industrial Science and Technology (AIST), JAPAN ...... 49
M3P.008 OUTER SHELL ACTUATOR DRIVING CENTRAL BENDING SHAFT BY BALLOON ARRAYS CIRCUMFERENTIALLY-ARRANGED INSIDE OF SHELL S. Konishi1, S. Sawano1, N. Fujiwara1, Y. Kurumi2, and T. Tani2 1Ritsumeikan University, JAPAN and 2Shiga University of Medical Science, JAPAN ...... 53
BioSensors & BioMicrosystems
M3P.009 RAPID DETECTION OF BACTERIAL CELL FROM WHOLE BLOOD: INTEGRATION OF DNA SAMPLE PREPARATION INTO SINGLE MICRO-PCR CHIP K.Y. Hwang1, S.Y. Jung1, J.I. Han1, Y.R. Kim2, and J.H. Kim1 1Samsung Electronics Co., Ltd, KOREA and 2KyungHee University, KOREA ...... 57
M3P.010 A POLYMER CELL CHIP WITH IN SITU MONITORING CAPABILITY OF CELL VIABILITY FOR CADMIUM CYTOTOXICITY TEST OF HUMAN RHABDOMYOSARCOMA CELLS Z. Zou, A. Browne, S. Ho, and C.H. Ahn University of Cincinnati, USA ...... 61
M3P.011 PREVENTING CARDIOMYOCYTES FROM TNF-α INDUCED CELL DEATH BASED ON THE IMPEDANCE-SENSING TECHNIQUE FOR REAL-TIME MONITORING CELL ADHESION Y. Qiu1, R. Liao2, and X. Zhang1 1Boston University, USA and 2Harvard Medical School, USA ...... 65
M3P.012 OPEN-ACCESS CELL ARRAY USING ELECTROOSMOTIC FLOW K. Terao1,2, Y. Kitazawa1,2, A. Okonogi1,2, and H. Kotera1,2 1Kyoto Univeristy, JAPAN and 2Japan Science and Technology Agency (JST), JAPAN ...... 69
M3P.013 A DIELECTROPHORETIC CELL/PARTICLE SEPARATOR FABRICATED BY SPIRAL CHANNELS AND CONCENTRIC GOLD ELECTRODES G. Yilmaz, A.T. Ciftlik, and H. Külah Middle East Technical University, TURKEY ...... 73
M3P.014 QUANTITATIVE IMMUNOPHENOTYPING OF CIRCULATING TUMOR CELLS IN BLOOD USING MICROFLUIDIC SCREENING CHIPINTEGRATED WITH HYPERSPECTRAL MICROSCOPE A.P. Horton1, K. Kumar1, H. Liu2, L. Cheng2, N. Lane2, E. Taylor1, H.R. Garner2, J.W. Uhr2, and X.J. Zhang1 1University of Texas, Austin, USA and 2University of Texas Southwestern Medical Center, USA ...... 77
M3P.015 A PATCH-CLAMP DEVICE WITH CELL SORTING AND POSITIONING FUNCTIONS S. Penmetsa, K. Nagrajan, Z. Gong, D. Mills, and L. Que Louisiana Tech University, USA ...... 81
M3P.016 SURFACE ACOUSTIC WAVE (SAW) BIOSENSOR SYSTEM WITH AN INDIRECT MICROFLUIDIC FLOW INJECTION ANALYSIS SYSTEM B.E. Rapp, K. Länge, and M. Rapp Forschungszentrum Karlsruhe, GERMANY ...... 85
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M3P POSTER SESSION I (continued)
M3P.017 DEVELOPMENT OF A GLUTAMATE BIOSENSOR BASED ON GLUTAMATE OXIDASE USING SMART-BIOCHIPS M.M. Rahman, T. Yamazaki, T. Ikeda, M. Ishida, and K. Sawada Toyohashi University of Technology, JAPAN ...... 88
M3P.018 EWOD BASED MICROFLUIDIC SYSTEM WITH COPLANAR ELECTRODES FOR PARALLEL DNA LIGATION OF ULTRAMICRO VOLUME H.C. Lin, Y.J. Liu, D.J. Yao, and H.Y. Chang National Tsing Hua University, TAIWAN ...... 92
M3P.019 SELF-ALIGNED MICRO CONTACT PRINTING USING MEMS K. Choonee1, R.R.A. Syms1, and H. Zou2 1Imperial College London, UK and 2Dalian University of Technology, CHINA ...... 96
M3P.020 A HIGH SENSITIVITY CARBON NANOTUBES ENHANCED PZT DIAPHRAM-BASED IMMUNOSENSOR ARRAY T. Xu, J.M. Miao, Z.H. Wang, Y.S. Liu, and C.M. Li Nanyang Technological University, SINGAPORE ...... 100
M3P.021 TWO-PHASE MINI-SEPARATOR TO SEPARATE ALPHA-FETOPROTEIN FROM FIBRINOGEN AND IMMUNOGLOBULIN Y. Yang and J. Chae Arizona State University, USA ...... 104
M3P.022 A MICROCHIP FOR AUTOMATED EXTRACTION OF RNA FROM GRAM-POSITIVE BACTERIA P. Vulto, C. Hermann, P. Zahn, U. Maier, G. Dame, and G. Urban University of Freiburg, GERMANY ...... 108
M3P.023 THERMAL ANALYSIS OF PEPTIDES WITH A CALORIMETERCHIP E. Iervolino1, I.M.O. Finoulst2, A.W. van Herwaarden1, W. Wein2, P.D.E.M. Verhaert2, and P.M. Sarro2 1Xensor Integration, THE NETHERLANDS and 2Delft University of Technology, THE NETHERLANDS ...... 112
M3P.024 AUTONOMOUS MICROFLUIDIC SENSING DEVICE EMPLOYING LIQUID CRYSTAL FOR DETECTION OF BIOLOGICAL INTERACTIONS D. Cheng, I.H. Lin, N.L. Abbott, and H. Jiang University of Wisconsin, Madison, USA ...... 116
M3P.025 A MULTI-FUNCTION, MICROFLUIDIC MODULE FOR MUTATION DETECTION T.Y. Lee, K. Han, D.S. Park, S.S. Soper, M.A. Batzer, D.E. Nikitopoulos, and M.C. Murphy Louisiana State University, USA ...... 120
M3P.026 FABRICATION OF A CONTROLLABLE BIO-MICROPUMP DRIVEN BY SKELETAL MUSCLE CELLS T. Kogure, Y. Akiyama, T. Hoshino, and K. Morishima Tokyo University of Agriculture and Technology, JAPAN ...... 124 Chemical Microsensors & Microsystems
M3P.027 PROTOTYPE MICRO GAS CHROMATOGRAPH FOR BREATH BIOMARKERS OF RESPIRATORY DISEASE S.K. Kim, H. Chang, and E.T. Zellers University of Michigan, USA ...... 128
M3P.028 SINGLE-SIDE MICROMACHINED LOW-COST QUAD-CANTILEVER SENSORS WITH A HIGH-SENSITIVE MONOLAYER SELF-ASSEMBLED FOR TRACE TNT DETECTION P. Xu, , Y. Chen, Y. Yang, Y. Liu, J. Li, G. Zuo, and X. Li Chinese Academy of Sciences, CHINA ...... 132
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M3P POSTER SESSION I (continued)
M3P.029 RAPID THERMAL ANALYSIS OF ENERGETIC MATERIALS WITH MICROFABRICATED DIFFERENTIAL SCANNING CALORIMETERS C.M. Spadaccini1, E.V. Mukerjee1, J. Lee2, and W.P. King2 1Lawrence Livermore National Laboratory, USA and 2University of Illinois, Urbana-Champaign, USA ...... 136
M3P.030 POLYMER COMPOSITE COATED MULTIFIBER ARRAY MICROELECTRODES AS MULTI- FUNCTIONAL VOLTAMMETRIC MICROSENSOR FOR THE DETECTION OF DOPAMINE E. Laubender1, F. Garay1, J. Heinze1,2, and G. Urban1,2 1Freiburg Materials Research Center, GERMANY and 2University of Freiburg, GERMANY ...... 140
M3P.031 CHEMORESISTIVE NANOFIBROUS SENSOR ARRAY AND READ-OUT ELECTRONICS ON FLEXIBLE SUBSTRATE A. Pecora, L. Maiolo, E. Zampetti, S. Pantalei, A. Valletta, A. Minotti, F. Maita, D. Simeone, M. Cuscunà, A. Bearzotti, A. Macagnano, L. Mariucci, and G. Fortunato Consiglio Nazionale delle Ricerche (CNR), ITALY ...... 144
M3P.032 NANOSCALE CHEMIRESISTOR ARRAYS WITH PATTERNED NANOPARTICLE INTERFACE LAYERS FOR MICRO GAS CHROMATOGRAPHY F.I. Bohrer, E. Covington, C. Kurdak, and E.T. Zellers University of Michigan, USA ...... 148
M3P.033 DISPOSABLE CHEMICAL AND BIBOLOGICAL SENSORS USING MICRO-IMPRINTED STIMULI-RESPONSIVE HYDROGEL DIFFRACTION GRATING D. Mao and L. Dong Iowa State University, USA ...... 152
M3P.034 VACUUM-GAPPED FILM BULK ACOUSTIC RESONATOR FOR LOW-LOSS MASS SENSING IN LIQUID S.S. Pottigari and J.W. Kwon University of Missouri, Columbia, USA ...... 156
M3P.035 SELF-PATTERNED SEEDLESS GOLD ELECTROPLATING IN HIGH-ASPECT-RATIO CHANNELS FOR MICRO GC APPLICATIONS M.A. Zareian-Jahromi and M. Agah Virginia Polytechnic Institute and State University, USA ...... 160
Materials, Fabrication & Packaging Technologies
M3P.036 CHIP SCALE PACKAGING OF PIEZORESISTIVE PRESSURE SENSORS USING THE DRY-FILM SHIELDING L.T. Chen1, C.Y. Hsu1, J. Pan1, C.H. Chu1, T. Huang2, P. Chu2, Y.S. Chen2, and C.W. Ho2 1Industrial Technology Research Institute (ITRI), TAIWAN and 2IST, TAIWAN ...... 164
M3P.037 A NEW METHOD FOR HERMETICITY MEASUREMENTS USING POROUS ULTRA LOW K DIELECTRICS FOR SUB-PPM MOISTURE DETECTION H. Grange1, J.S. Danel1, H. Feldis1, B. Desloges1, V. Jousseaume1, C. Licitra1, P. Brunet Manquat1, P. Grosgeorges1, B. Fassi1, Z. Sbiaa2, and P. Robert1 1CEA - LETI - Minatec, FRANCE and 2Freescale Semiconductor, USA ...... 168
M3P.038 STRENGTH EVALUATION OF LEAD-FREE-SOLDER JOINT FABRICATED BY REACTIVE FILM LOCAL HEATING K. Ootani, Y. Yamano, T. Namazu, and S. Inoue University of Hyogo, JAPAN ...... 172
M3P.039 PARYLENE BACKGROUND FLUORESCENCE STUDY FOR BIOMEMS APPLICATIONS B. Lu1, S. Zheng1,2, and Y.C. Tai1 1California Institute of Technology, USA and 2Pennsylvania State University, USA ...... 176
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M3P POSTER SESSION I (continued)
M3P.040 YOUNG'S MODULUS AND FATIGUE LIFETIME IMPROVEMENTS BY DIAMOND SIZE EFFECT ON ELECTROPLATED NI-DIAMOND NANOCOMPOSITE C.S. Huang1, Y.T. Cheng1, C.J. Yeh1, H.K. Liu2, W. Hsu1 1National Chiao Tung University, TAIWAN, and 2Feng China University, TAIWAN ...... 180
M3P.041 FABRICATION OF MONOLITHIC FLOW SENSOR ON TUBE STRUCTURE T. Yokota, S. Ukai, M. Shikida, and K. Sato Nagoya University, JAPAN ...... 184
M3P.042 A NOVEL METHOD FOR AMORPHOUS METAL MICROMOLDING USING CARBON MEMS R. Martinez-Duarte1, M.J. Madou1, G. Kumar2, and J. Schroers2 1University of California, Irvine, USA, and 2Yale University, USA ...... 188
M3P.043 CMOS-COMPATIBLE THREE DIMENSIONAL BURIED CHANNEL TECHNOLOGY (3DBCT) P. Zellner, L. Renaghan, and M. Agah Virginia Polytechnic Institute and State University, USA ...... 192
M3P.044 A NOVEL PARYLENE/AL/PARYLENE SANDWICH PROTECTION MASK FOR HF VAPOR RELEASE FOR MICRO ELECTRO MECHANICAL SYSTEMS A. Higo, K. Takahashi, H. Fujita, Y. Nakano, and H. Toshiyoshi University of Tokyo, JAPAN ...... 196
M3P.045 FABRICATION OF NANOPERFORATED SILICON MEMBRANES WITH TUNABLE SIZED HIGH ASPECT RATIO HOLES L. Sainiemi1, J. Viheriälä2, J. Laukkanen3, T. Niemi2, and S. Franssila1 1Helsinki University of Technology, FINLAND, 2Tampere University of Technology, FINLAND, and 3University of Joensuu, FINLAND ...... 200
M3P.046 IN-PLANE MICRONEEDLE CHIP FABRICATED BY CRYSTALLINE WET ETCHING OF (110) SILICON WAFER S.-S. Yun, J.-Y. An, S.-H. Moon, and J.-H. Lee Gwangju Institute of Science and Technology (GIST), KOREA ...... 204
M3P.047 HERMETIC THIN FILM ENCAPSULATION OF MECHANICAL TRANSDUCERS FOR SMART LABEL APPLICATIONS D. Reuter1,2, M. Nowack1, M. Rennau1, A. Bertz1, M. Wiemer2, F. Kriebel3, and T. Gessner1,2 1Chemnitz University of Technology, GERMANY, 2Fraunhofer Research Institution for Electronic Nanosystems, GERMANY, and 3KSW Microtec AG, GERMANY ...... 208
M3P.048 DRY SELF-ALIGNMENT FOR BATCH-ASSEMBLY OF CHIPS I. Kurniawan, M. Tichem, and U. Staufer Delft University of Technology, THE NETHERLANDS ...... 212
M3P.049 ASPECT RATIO DEPENDENT ETCH MODULATION FOR CMOS-MEMS APPLICATIONS P.J. Gilgunn1, J.F. Alfaro2, and G.K. Fedder1 1Carnegie Mellon University, USA and 2Institute for Complex Engineered Systems, USA ...... 216
M3P.050 MICROMOLDING METHODS FOR HOLLOW MICRONEEDLE ARRAYS USING MEGASONICALLY ENHANCED CASTING S. Khumpuang, P. Ruther, and O. Paul University of Freiburg - IMTEK, GERMANY ...... 220
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M3P POSTER SESSION I (continued)
M3P.051 A BIO-INSPIRED, CHEMO-RESPONSIVE POLYMER NANOCOMPOSITE FOR MECHANICALLY DYNAMIC MICROSYSTEMS A. Hess1, J. Dunning2, J. Harris1, J.R. Capadona1,2, K. Shanmuganathan1, S.J. Rowan1, C. Weder1, D.J. Tyler1,2, and C.A. Zorman1 1Case Western Reserve University, USA and 2Louis Stokes Cleveland VA Medical Center, USA ...... 224
M3P.052 DEVELOPMENT OF HIGHLY ROUGHENED POROUS AU ELECTRODE WITH PT NANO-PARTICLE FOR ELECTROCHEMICAL SENSOR APPLICATIONS J.D. Kim, Y.J. Lee, J.Y. Park, H. Kim, and Y. Kim Kwangwoon University, KOREA ...... 228
M3P.053 VAN-DER WAALS THIN-FILM C60 MEMS S. Tin and A. Lal Cornell University, USA ...... 232
M3P.054 FABRICATION OF FLEXIBLE 3D MICROELECTRODE ARRAY WITH PARYLENE-BASED PATTERN TRANSFER TECHNIQUE X. Huang, R. Wang, W. Wang, and Z. Li Peking University, CHINA ...... 236
M3P.055 OPTOFLUIDIC PACKAGING OF SILICON MICROCHIPS FOR APPLICATIONS IN LIGHT EMITTING DEVICES S.E. Chung, S.A. Lee, J. Kim, and S. Kwon Seoul National University, KOREA ...... 240
M3P.056 DEVELOPMENT AND EVALUATION OF AUSI EUTECTIC WAFER BONDING Y.-C. Lin1, M. Baum2, M. Haubold3, J. Frömel2, M. Wiemer2, T. Gessner1,3, and M. Esashi1 1Tohoku University, JAPAN, 2Fraunhofer ENAS, GERMANY, and 3Chemnitz University of Technology, GERMANY ...... 244 Mechanical/Physical Sensors & Systems
M3P.057 CMOS-COMPATIBLE BACK-END PROCESS FOR IN-PLANE ACTUATING FERROMAGNETIC MEMS M. Glickman1, P. Tseng1, J. Harrison1, I.B. Goldberg1, P. Johnson2, P. Smeys2, T. Niblock2, and J.W. Judy1 1University of California, Los Angeles, USA and 2National Semiconductor, USA ...... 248
M3P.058 FUNCTIONALITY OF A NOVEL OVERLOAD RESISTANT SILICON HIGH PRESSURE SENSING ELEMENT P. Heinickel, and R. Werthschützky Technische Universität Darmstadt, GERMANY ...... 252
M3P.059 AN INTELLIGENT WIND SENSOR SYSTEM WITH AUTO-ZERO FUNCTION G.P. Shen, M. Qin, Z.Q. Dong, and Q.A. Huang Southeast University, CHINA ...... 256
M3P.060 A MONOLITHIC INTEGRATED MICROMACHINED PIEZORESISTIVE FLOW SENSOR D. Li, T. Zhao, L. Qian, Z.C. Yang, and D. Zhang Peking University, CHINA ...... 260
M3P.061 HIGH-GF PLANAR ALUMINIUM-SILICON HYBRID STRAIN TRANSDUCERS A.C.H. Rowe1, Ch. Renner2, S. Arscott3 1Ecole Polytéchnique, FRANCE, 2University of Geneva, SWITZERLAND, and 3University of Lille, FRANCE ...... 264
M3P.062 TEMPERATURE-INSENSITIVE SILICON CARBIDE RESONANT MICRO-EXTENSOMETERS R.G. Azevedo, D.R. Myers, and A.P. Pisano University of California, Berkeley, USA ...... 268
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M3P POSTER SESSION I (continued)
M3P.063 A MEMS SENSOR FOR MEAN SHEAR STRESS MEASUREMENTS IN HIGH-SPEED TURBULENT FLOWS WITH BACKSIDE INTERCONNECTS A. O'Grady1, R. Larger2, N. Tiliakos3, G. Papadopoulos3, V. Modi1, and L.G. Frechette2 1Columbia University, USA, 2Universite de Sherbrooke, CANADA, and 3ATK GASL, USA ...... 272
M3P.064 A LOW-COST INTEGRATED MICRO SYSTEM FOR FLOW VELOCITY AND DIRECTION MEASUREMENT P. Liu, R. Zhu, X.D. Liu, F.X. Zhang, and Z.Y. Zhou Tsinghua University, CHINA ...... 276
M3P.065 A SIMPLE MICRO PIRANI VACUUM GAUGE FABRICATED BY BULK MICROMACHINING TECHNOLOGY J. Zhang, W. Jiang, J. Zhou, and X. Wang Peking University, CHINA ...... 280
M3P.066 TACTILE ARRAY SENSOR WITH INCLINED CHROMIUM/SILICON PIEZORESISTIVE CANTILEVERS EMBEDDED IN ELASTOMER M. Sohgawa1, T. Mima1, H. Onishi1, T. Kanashima1, M. Okuyama1, K. Yamashita1,2, M. Noda1,2, M. Higuchi3, and H. Noma4 1Osaka University, JAPAN, 2Kyoto Institute of Technology, JAPAN, 3Omron Corporation, JAPAN, and 4Advanced Telecommunications Research Institute International, JAPAN ...... 284
M3P.067 A LATERAL-AXIS MICROMACHINED TUNING FORK GYROSCOPE WITH NOVEL DRIVING AND SENSING COMBS Z.Y. Guo, Z.C. Yang, L.T. Lin, Q.C. Zhao, J. Cui, X.Z. Chi, and G.Z. Yan Peking University, CHINA ...... 288
M3P.068 AN INVESTIGATION OF DECOUPLING PERFORMACE FOR A NOVEL LATERAL AXIS GYROSCOPE WITH VARYING ENVIRONMENTAL PARAMETERS J. Cui, X.S. Liu, Q.C. Zhao, L.T. Lin, X.Z. Chi, Z.C. Yang, and G. Yan Peking University, CHINA ...... 292
M3P.069 A DOUBLY DECOUPLED MICROMACHINED VIBRATING WHEEL GYROSCOPE Q.C. Zhao1,2, X.S. Liu1, L.T. Lin1, Z.Y. Guo1, J. Cui1, X.Z. Chi1, Z.C. Yang1, and G.Z. Yan1 1Peking University, CHINA and 2Chinese Academy of Sciences, CHINA ...... 296
M3P.070 A MEMS-BASED DUAL-AXIS TILT SENSOR USING AIR MEDIUM J.C. Choi, C.M. Park, J.K. Lee, and S.H. Kong Kyungpook National University, KOREA ...... 300
M3P.071 PREDICTIVE THERMAL MODEL FOR INDIRECT TEMPERATURE MEASUREMENT INSIDE ATOMIC CELL OF NUCLEAR MAGNETIC RESONANCE GYROSCOPE M. Salleras, E.J. Eklund, I.P. Prikhodko, and A.M. Shkel University of California, Irvine, USA ...... 304
M3P.072 CHARACTERIZATION OF A QUARTZ MEMS TILT SENSOR WITH 0.001 DEGREE PRECISION J. Liang1, F. Kohsaka1, X. Li1, K. Kunitomo2, and T. Ueda1 1Waseda University, JAPAN and 2Sakamoto Electric MFG. Co. Ltd., JAPAN ...... 308
M3P.073 LONGITUDINAL BULK ACOUSTIC MASS SENSOR J.H. Hales, J. Teva, A. Boisen, and Z.J. Davis Technical University of Denmark, DENMARK ...... 311
M3P.074 DESIGN AND PROTOTYPING OF A MEMS-BASED CRACKMETER FOR STRUCTURAL MONITORING M. Ferri1, F. Mancarella1, J. Yan2, J.E.-Y. Lee2, A. Seshia2, J. Zalesky3, K. Soga2, and A. Roncaglia1 1Consiglio Nazionale delle Ricerche (CNR), ITALY, 2University of Cambridge, UK, and 3Czech Technical University in Prague, CZECH REPUBLIC ...... 315
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M3P POSTER SESSION I (continued)
M3P.075 DIAPHRAGM STRESS CONTROL FOR SENSITIVITY IMPROVEMENT OF PIEZOELECTRIC ULTRASONIC MICROSENSORS ON SILICON DIOXIDE DIAPHRAGMS K. Yamashita1,2, T. Watanabe2, T. Yoshizaki2, M. Noda1,2, and M. Okuyama2 1Kyoto Institute of Technology, JAPAN and 2Osaka University, JAPAN ...... 319
M3P.076 LONGITUDINAL AND TRANSVERSE COILED GIANT MAGNETOIMPEDANCE TRANSDUCERS: PRINCIPLE, MODELING AND PERFORMANCES J. Moutoussamy1, C. Coillot1, G. Chanteur1, and F. Alvès2 1École Polytechnique, FRANCE and 2Universités Paris XI, FRANCE ...... 323
M3P.077 FABRICATION AND TESTING OF A MEMS BASED EARTH SENSOR K. Ghose and H.R. Shea Ecole Polytechnique Fédérale de Lausanne (EPFL), SWITZERLAND ...... 327
M3P.078 POLARIZATION-ANALYZING IMAGE SENSOR BASED ON STANDARD CMOS TECHNOLOGY T. Tokuda, H. Yamada, K. Sasagawa, and J. Ohta Nara Institute of Science and Technology, JAPAN ...... 331
Medical Microsystems
M3P.079 INTEGRATED SIO2 MICROTUBE-BASED ELECTRICAL NEUROPROBE ARRAY K. Takei1, A. Fujishiro1, T. Kawashima1, K. Sawada1, H. Kaneko2, T. Kawano1, and M. Ishida1 1Toyohashi University of Technology, JAPAN and 2National Institute of Advanced Industrial Science and Technology, JAPAN ...... 334
M3P.080 MICROFABRICATED NEURAL THERMOCOUPLE ARRAYS PROBE FOR BRAIN RESEARCH B.C. Lee1, Y.-G. Lim1, K.-H. Kim2, S. Lee1, and S. Moon1 1Korea Institute of Science and Technology, KOREA and 2Samsung Electronics Co. Ltd., KOREA ...... 338
M3P.081 ARROWHEAD-SHAPED MICRO-ELECTRODE ARRAY ON POLYIMIDE SUBSTRATE FOR RETINAL PROSTHESES ENABLING CLOSE APPROACH TO TARGET CELLS K. Koo, S. Lee, J. Ban, H. Jeong, H. Park, S. Ha, J.-M. Seo, H. Chung, and D. Cho Seoul National University, KOREA ...... 342
M3P.082 CATHETER TYPE OF FLOW SENSOR FOR TRANS-BRONCHIAL MEASUREMENT FOR LUNG FUNCTIONS T. Yokota, J. Naito, M. Shikida, T. Kawabe, Y. Hayashi, and K. Sato Nagoya University, JAPAN ...... 346
M3P.083 A NOVEL ENDOSCOPIC OIDRS SYSTEM FOR NON-INVASIVE EARLY DIAGNOSIS OF ESOPHAGEAL CANCERS K.C. Balareddy1, A. Garcia-Uribe1, J. Zou1, L. Wang2, and K. Wang3 1Texas A&M University, USA, 2Washington University, USA, and 3Mayo Clinic, USA ...... 350
M3P.084 CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT) FOR MR-GUIDED NONINVASIVE THERAPEUTIC ULTRASOUND APPLICATIONS S.H. Wong, M. Kupnik, K.B. Pauly, and B.T. Khuri-Yakub Stanford University, USA ...... 354
M3P.085 WIRELESS IN VIVO EMG SENSOR FOR INTELLIGENT PROSTHETIC CONTROL B.D. Farnsworth, D.M. Taylor, R.J. Triolo, and D.J. Young Case Western Reserve University, USA ...... 358
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Microfluidics
M3P.086 CURVATURE AFFECTS SUPERHYDROPHOBICITY ON FLEXIBLE SILICONE MICROSTRUCTURED SURFACES A.H. Cannon and W.P. King University of Illinois, Urbana-Champaign, USA ...... 362
M3P.087 A MICRO-FABRICATED CAPILLARY ELECTROPHORESIS CHIP FOR DNA PRE-CONCENTRATION AND SEPARATION C.-H. Kuo1, J.-H. Wang1, and G.-B. Lee1,2 1National Cheng Kung University, TAIWAN and 2Industry Technology Research Institute, TAIWAN ...... 366
M3P.088 MICRO BLENDER AND SEPARATOR USING INNER-VORTEX OF DROPLET INDUCED BY SURFACE ACOUSTIC WAVE T. Sano, T. Onuki, Y. Hamate, M. Hojo, S. Nagasawa, and H. Kuwano Tohoku University, JAPAN ...... 370
M3P.089 SYNTHESIS OF TWIN ALGINATE MICROPARTICLES VIA MICROFLUIDIC EMULSIFICATION AND SORTING Y.-S. Lin1, J.-S. Kao1, C.-H. Yang2, K.-S. Huang2, Y.-S. Dong2, and W.-Y. Hsu2 1National Applied Research Laboratories, TAIWAN and 2I-Shou University, TAIWAN ...... 374
M3P.090 CHITOSAN MICROFIBER FABRICATION USING MICROFLUIDIC CHIPS OF DIFFERENT SHEATH CHANNEL ANGLES AND ITS APPLICATION ON CELL CULTURE C.H. Yeh, P.W. Lin, and Y.C. Lin National Cheng Kung University, TAIWAN ...... 378
M3P.091 TEMPERATURE CONTROLLED MINITURIZED CELL IN MAGNETIC BEADS HANDING SYSTEM FOR BIO-CHEMIICAL REACTION N. Inagaki, R. Imai, M. Shikida, M. Okochi, H. Honda, and K. Sato Nagoya University, JAPAN ...... 382
M3P.092 MICROMACHINED TUBE-TYPE OF Si DROPLET GENERATOR H. Hida, N. Inagaki, M. Koyama, M. Shikida, and K. Sato Nagoya University, JAPAN ...... 386
M3P.093 ON-CHIP PHASE SHIFT REFRACTOMETER VIA MICROFLUIDIC LIQUID GRATING Z.G. Li1, B. Liu1, J.B. Zhang2, Z.H. LI3, and A.Q. Liu1 1Nanyang Technological University, SINGAPORE, 2Data Storage Institute, SINGAPORE, and 3Chinese Academy of Sciences, CHINA ...... 390
M3P.094 A NEW METOD OF PARTICULATE SEPARATION BY DIFFERENT DIELECTROPHORETIC HOLDING FORCE Y.H. Liu, Z. Zhao, J. Xu, C. Pang, Z. Fang, and L. Du Chinese Academy of Sciences, CHINA ...... 393
M3P.095 WETTING PROPERTIES OF SILICON MESH MICROCHANNELS COATED WITH SiO2/SnO2 NANOPARTICLES USING LAYER-BY- LAYER NANO SELF ASSEMBLY T. Zhang, B. McDonald, and T. Cui University of Minnesota, USA ...... 397
M3P.096 SUPER WETTING OF MICRO&NANO STRUCTURED TITANIA SURFACES C. Ding, P. Bogorzi, N. Srivastava, M. Sigurdson, C. Meinhart, and N.C. MacDonald University of California, Santa Barbara, USA ...... 401
M3P.097 AN ANTI-ADHESION TECHNIQUE REDUCING PARTICLE-LOSS USING ELECTRODYNAMIC DISTURBANCE FOR AERODYNAMIC CHIP M. Kim, Y.-H. Kim, C.W. Park, J. Hwang, and Y.-J. Kim Yonsei University, KOREA ...... 405
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M3P POSTER SESSION I (continued)
M3P.098 PHASEGUIDE PATTERNS FOR ADVANCED LIQUID HANDLING IN LAB-ON-A-CHIP SYSTEMS P. Vulto, S. Podszun, P. Meyer, and G. Urban University of Freiburg, GERMANY ...... 409
M3P.099 DROPLET TRANSPORTATION USING EWOD-INDUCED WETTABILITY GRADIENT T. Yasuda, K. Imamura, and K. Hirase Kyushu Institute of Technology, JAPAN ...... 413
M3P.100 A NOVEL PASSIVE MICROFLUIDIC DEVICE FOR PREPROCESSING WHOLE BLOOD FOR POINT OF CARE DIAGNOSTICS P.J. Shah, M. Dimaki, and W.E. Svendsen Technical University of Denmark, DENMARK ...... 417
M3P.101 NEAR-FIELD ION FLOW FOR MOLECULAR SCALE MANIPULATION T.-H. Chen, F. Wei, and C.M. Ho University of California, Los Angeles, USA ...... 421
M3P.102 HIGH-THROUGHPUT ON-CHIP FLOW CYTOMETRY SYSTEM USING “MICROFLUIDIC DRIFTING” BASED THREE-DIMENSIONAL (3D) HYDRODYNAMIC FOCUSING X. Mao, S.-C.S. Lin, and T.J. Huang Pennsylvania State University, USA ...... 425
M3P.103 SORTING MICROPARTICES BY ORIENTATION USING WEDGED-FIN AND RAILED MICROFLUIDICS W. Park, H.S. Lee, H. Park, and S. Kwon Seoul National University, KOREA ...... 429
M3P.104 A QUATERNARY MICROFLUIDIC MULTIPLEXER USING DYNAMIC CONTROL OF PRESSURE VALVES HAVING DIFFERENT THRESHOLDS D.W. Lee and Y.-H. Cho Korea Advanced Institute of Science and Technology (KAIST), KOREA ...... 433
M3P.105 A MICROFLUIDIC DEVICE TO CONTROL BIO ACTUATORS OF MICROORGANISMS, AN APPLICATION TO VORTICELLA CONVALLARIA M. Nagai1, S. Ryu2,3, T. Thorsen2, P. Matsudaira2,3, and H. Fujita1 1University of Tokyo, JAPAN, 2Massachusetts Institute of Technology, USA, and 3Whitehead Institute for Biomedical Research, USA ...... 437 Nanoscale Materials & Fabrication Technology, Devices & Systems
M3P.106 DUAL-SCALED STABLE SUPERHYDROPHOBIC NANO-FLOWER SURFACES L. Chen, Z. Xiao, P.C.H. Chan, and Y.-K. Lee Hong Kong University of Science and Technology, HONG KONG ...... 441
M3P.107 USING AN ULTRASONIC VIBRATION MICROFLUIDIC CHIP TO GENERATE UV-CROSSLINKING MICROPARTICLES S.C. Lai1, C.H. Yeh1, Q.L. Zhao2, and Y.C. Lin1 1National Cheng Kung University, TAIWAN and 2Southeast University, CHINA ...... 445
M3P.108 FABRICATION OF MOLECULAR-SCALE PATTERNS WITH CHEMICALLY TUNABLE FUNCTIONALITIES Z. Liu, D.G. Bucknall, and M.G. Allen Georgia Institute of Technology, USA ...... 449
M3P.109 MESOPOROUS THIN FILMS AS VERSATILE SENSITIVE MATRICES ON LOVE WAVE SENSORS FOR FAST SUB-PPM VAPOR DETECTION G. Tortissier1, L. Blanc1, A. Tetelin1, J. Pistre1, J.-L. Lachaud1, C. Boissiere2, C. Sanchez2, C. Dejous1, and D. Rebiere1 1IMS, FRANCE and 2LCMC, FRANCE ...... 453
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M3P POSTER SESSION I (continued)
M3P.110 MICRO TACTILE SENSORS WITH A SUSPENDED AND ORIENTED SINGLE WALLED CARBON NANOTUBE BEAM EMBEDED IN PDMS ELASTOMER M. Lu, D. Lee, T. Yeom, and T. Cui University of Minnesota, USA ...... 457
M3P.111 PORE FORMATION IN INORGANIC-ORGANIC HYBRID MATERIAL BY OXYGEN PLASMA TREATMENT S. Aura1, V. Jokinen2, M. Baumann2, and S. Franssila1 1Helsinki University of Technology, FINLAND and 2University of Helsinki, FINLAND ...... 461
M3P.112 ANALYSIS AND APPLICATIONS OF NANOSTRUCTURES CREATED BY STENCIL LITHOGRAPHY O. Vazquez-Mena1, T. Sannomiya2, M. Tosun1, G. Villanueva1, J. Vörös2, and J. Brugger1 1Ecole Polytéchnique Fédérale de Lausanne (EPFL), SWITZERLAND and 2ETH Zürich, SWITZERLAND ...... 465
M3P.113 ULTRA THIN ALN PIEZOELECTRIC NANO-ACTUATORS N. Sinha1, G.E. Wabiszewski1, R. Mahameed1, V. Felmetsger2, S.M. Tanner2, R.W. Carpick1, and G. Piazza1 1University of Pennsylvania, USA and 2Tegal Corporation, USA ...... 469
M3P.114 MULTIFUNCTIONAL NANOWIRE ARRAY FOR CHEMICAL SENSING AND MANIPULATION I. Park1, S.-H. Ko1,2, Z. Li3, A.P. Pisano2, and C.P. Grigoropoulos2 1Korea Advanced Institute of Science and Technology (KAIST), KOREA, 2University of California, Berkeley, USA, and 3Hewlett Packard Laboratory, USA ...... 473
M3P.115 JUNCTION BASED ENHANCEMENT IN NANOWIRE THERMOELECTRICS N. Duarte1 and S. Tadigadapa2 1Penn State University, USA and 2Solar Power Industries, USA ...... 477
Optical MEMS
M3P.116 INTEGRATED PHOTONIC MEMS CHEMICAL SENSORS M.W. Pruessner1, T.H. Stievater1, W.S. Rabinovich1, J.L. Stepnowski2, and R.A. McGill1 1Naval Research Lab (NRL), USA and 2Nova Research Inc., USA ...... 481
M3P.117 AN UNCOOLED MICROCANTILEVER IR DETECTOR BASED ON BULK SILICON TECHNIQUE Y. Yi1, X. Yu1, W. Xu1, M. Liu2, L. Dong2, X. Liu2, A. Zhao2, and Y. Zhao2 1Peking University, CHINA and 2Beijing Institute of Technology, CHINA ...... 485
M3P.118 COUPLING OF QUANTUM STATES WITH MECHANICAL HETEROSTRUCTURES J.D. Makowski1, B.D. Anderson1, W.S. Chan1, M.J. Saarinen2, C.J. Palmstrøm3, and J.J. Talghader1 1University of Minnesota, USA, 2Tampere University of Technology, FINLAND, and 3University of California, Santa Barbara, USA ...... 489
M3P.119 A TUNABLE HYDROGEL MICROLENS ARRAY WITH LIGHT-SWITCHING CAPABILITY Z. Ding and B. Ziaie Purdue University, USA ...... 493
M3P.120 LASER INDUCED SELF-ALIGNED MICROLENS AND WAVEGUIDE ARRAYS USING A SELF-WRITING PROCESS IN A PHOTOSENSITIVE POLYMER RESIN H. Jung, D. Keum, and K.-H. Jeong Korea Advanced Institute of Science and Technology (KAIST), KOREA ...... 497
M3P.121 RAPID SCANNING DELAY LINE FOR OPTICAL COHERENCE TOMOGRAPHY BASED ON THE THERMO-OPTIC EFFECT IN SILICON E. Margallo-Balbás, G. Pandraud, and P.J. French Delft University of Technology, THE NETHERLANDS ...... 501
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M3P POSTER SESSION I (continued)
M3P.122 CONNECTION CHARACTERISTICS OF SILICON NANOWIRE WAVEGUIDES AND FABRICATION OF PHYSICAL CONTACT SWITCHES E. Bulgan1, Y. Kanamori2, and K. Hane2 1Ozyegin University, TURKEY and 2Tohoku University, JAPAN ...... 505
M3P.123 MEMS-BASED MECHANICALLY TUNABLE FLEXIBLE PHOTONIC CRYSTAL Y.H. Cui1, Q. Wu2, W. Park2, J. Jeon1, M.J. Kim1, and J.-B. Lee1 1University of Texas, USA and 2University of Colorado, USA ...... 509 Power MEMS
M3P.124 ENERGY HARVESTING BY MEMS VIBRATIONAL DEVICES WITH ELECTRETS N. Sato1,2, K. Ono1,2, T. Shimamura1,2, K. Kuwabara1,2, M. Ugajin1,2, S. Mutoh1,2, H. Morimura1, H. Ishii1,2, J. Kodate1,2, and Y. Sato1 1NTT Corporation, JAPAN and 2Japan Science and Technology Agency (JST), JAPAN ...... 513
M3P.125 HIGH PERFORMANCE PIEZOELECTRIC MEMS ENERGY HARVESTER BASED ON D33 MODE OF PZT THIN FILM ON BUFFER-LAYER WITH PBTIO3 INTER-LAYER J.C. Park1, D.H. Lee1, J.Y. Park1, Y.S. Chang2, and Y.P. Lee2 1Kwangwoon University, KOREA and 2Korea Institute of Science and Technology, KOREA ...... 517
M3P.126 A HYBRID GENERATOR FOR VIBRATION ENERGY HARVESTING APPLICATIONS M. Wischke, M. Masur, and P. Woias University of Freiburg - IMTEK, GERMANY ...... 521
M3P.127 DEVELOPMENT OF A SIMPLIFIED HYBRID AMBIENT LOW FREQUENCY, LOW INTENSITY VIBRATION ENERGY SCAVENGER SYSTEM M. Khbeis, J. McGee, and R. Ghodssi University of Maryland, USA ...... 525
M3P.128 CM-SCALE AIR TURBINE AND GENERATOR FOR ENERGY HARVESTING FROM LOW-SPEED FLOWS A. Bansal, D.A. Howey, and A.S. Holmes Imperial College London, UK ...... 529
M3P.129 RAPID PROTOTYPING OF MICRO-DIRECT METHANOL FUEL CELL IN PDMS WITH MICROCHANNEL-INTEGRATED NAFION STRIP M. Shen, S. Walter, and M.A.M. Gijs Ecole Polytéchnique Fédérale de Lausanne (EPFL), SWITZERLAND ...... 533
M3P.130 ELECTRODEPOSITED THIN-LAYER ELECTRODES FOR THE USE IN POTENTIALLY IMPLANTABLE GLUCOSE FUEL CELLS A. Kloke, S. Kerzenmacher, R. Zengerle, and F. von Stetten University of Freiburg - IMTEK, GERMANY ...... 537 RF MEMS, Resonators & Oscillators
M3P.131 DEVELOPMENT OF SPDT-STRUCTURED RF MEMS SWITCH Y. Uno, K. Narise, T. Masuda, K. Inoue, Y. Adachi, K. Hosoya, T. Seki, and F. Sato OMRON, JAPAN ...... 541
M3P.132 INTEGRATION OF TUNABLE CAPACITORS AND BONDED-WIRES FOR CONTACTLESS RF SWITCH AND TUNABLE FILTER S.-J. Chen, C.-Y. Lee, and E.S. Kim University of Southern California, USA ...... 545
M3P.133 MEASURING THE MECHANICAL RESONANCE FREQUENCY AND QUALITY FACTOR OF MEM RESONATORS WITH WELL-DEFINED UNCERTAINTIES USING OPTICAL INTERFEROMETRIC TECHNIQUES S. Stoffels1,2, S. Boedecker3, R. Puers2, I. De Wolf1,2, H.A.C. Tilmans1, and C. Rembe3 1IMEC, BELGIUM, 2Katholieke Universiteit Leuven, BELGIUM, and 3Polytec, GERMANY ...... 549
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M3P POSTER SESSION I (continued)
M3P.134 DEVELOPMENT OF A NEW MINIATURIZED 300-MHZ FREQUENCY BAND ANTENNA FOR WIRELESS MICROSENSOR NODES K. Takeda1,2, T. Masuda1,2, T. Suga1,2, and T. Itoh2,3 1University of Tokyo, JAPAN, 2Japan Science and Technology Agency (JST), JAPAN, and 3National Institute of Advanced Industrial Science and Technology (AIST), JAPAN ...... 553
M3P.135 HIGH Q CMOS-MEMS RESONATOR AND ITS APPLICATIONS AS RF TUNABLE BAND-PASS FILTERS J.L. Lopez1, J. Verd2, J. Giner1, A. Uranga1, G. Murillo1, E. Marigo1, F. Torres1, G. Abadal1, and N. Barniol1 1Universitat Autónoma de Barcelona, SPAIN and 2Universitat de les Illes Balears, SPAIN ...... 557
M3P.136 ENHANCED TRANSDUCTION METHODS FOR ELECTROSTATICALLY DRIVEN MEMS RESONATORS A.T.-H. Lin, J.E.-Y. Lee, J. Yan, and A.A. Seshia University of Cambridge, UK ...... 561
M3P.137 MODELING AND FABRICATION OF PIEZOELECTRIC ALUMINUM NITRIDE RESONATOR AND ITS APPLICATION IN OSCILLATORS O. Mareschal1,2,3, S. Loiseau1,3, F. Verjus2, L. Valbin1, G. Lissorgues1, R. Bouregba3, G. Poullain3, S. Saez3, and C. Dolabdjian3 1Université Paris-Est, FRANCE, 2NXP Semiconductors, FRANCE, and 3Université de Caen, FRANCE ...... 565
M3P.138 SILICON CARBIDE MEMS OSCILLATOR E. Pehlivano lu, C.A. Zorman, and D.J. Young Case Western Reserve University, USA ...... 569
M3P.139 LINEARLY VARIABLE INDUCTOR WITH RF MEMS SWITCHES TO ENLARGE A CONTINUOUS TUNING RANGE D.H. Choi, H.S. Lee, and J.-B. Yoon Korea Advanced Institute of Science and Technology (KAIST), KOREA ...... 573
M3P.140 ULTRA-THIN SUPER HIGH FREQUENCY TWO-PORT ALN CONTOUR-MODE RESONATORS AND FILTERS M. Rinaldi, C. Zuniga, C. Zuo, and G. Piazza University of Pennsylvania, USA ...... 577
15:30 - 16:00 BREAK & EXHIBIT INSPECTION
45 TRANS09 FinalProgram PRINT:TRANS09 6/3/09 11:28 AM Page 46
PARALLEL ORAL SESSIONS
Chemical Microsensors Cell Manipulation & Microsystems I & Analysis I Power MEMS Inertial Sensors
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F
Session Chairs:
M. Shannon, Y.K. Lee, Hong Kong L. Frechette, T. Akin, University of Illinois, University of Science & Université de Middle East Technical Urbana-Champaign, USA Technology, HONG KONG Sherbrooke, CANADA University, TURKEY
J. Voldman, W. Fang, S. Xia, Massachusetts Institute E. Yeatman, National Tsing Hua Institute of Electronics, CHINA of Technology, USA Imperial College London, UK University, TAIWAN
16:00 - 16:15 M4B.001 M4C.001 M4E.001 M4F.001 INDIVIDUAL NANOWIRE UNIDIRECTIONAL NON-RESONANT GYROSCOPE CHEMICAL SENSOR CELLULAR DUROTAXIS BI-STABLE FREQUENCY- ARCHITECTURE WITH SYSTEM SELF- VIA MICROFABRICATED INCREASED POWER STRUCTURALLY POWERED WITH POSTS OF VARYING SCAVENGER FROM FORCED ANTI-PHASE ENERGY SCAVENGING ANISOTROPY LOW-FREQUENCY DRIVE-MODE AND TECHNOLOGIES R.D. Sochol, A.T. Higa, AMBIENT VIBRATION LINEARLY COUPLED J.D. Prades1, R.R.R. Janairo, A. Chou, T. Galchev, H. Kim, ANTI-PHASE R. Jimenez-Diaz1, S. Li, and L. Lin and K. Najafi SENSE-MODE F. Hernandez-Ramirez2, University of California, University of Michigan, A.A. Trusov, A. Cirera1, Berkeley, USA USA A.R. Schofield, A. Romano-Rodriguez1, ...... 604 ...... 632 and A.M. Shkel and J.R. Morante3 University of California, 1Universitat de Irvine, USA Barcelona, SPAIN, ...... 660 2Electronic Nanosystems SL, SPAIN, and 3Institut de Recerca en Energia de Catalunya, SPAIN ...... 581
16:15 - 16:30 M4B.002 M4C.002 M4E.002 M4F.002 ULTRA-LOW POWER LOCALIZED CELL EFFECT OF NONLINEAR LATERALLY-DRIVEN METAL-OXIDE GAS LYSIS USING SELF EXTERNAL CIRCUIT ON DEFORMATION-ROBUST SENSOR ON PLASTIC FOCUSED ACOUSTIC ELECTROSTATIC MEMS GYROSCOPES FOIL TRANSDUCERS DAMPING FORCE OF WITH THREE SETS OF J. Courbat1, D. Briand1, J. Zhu1, X. Qiu1, J. Oiler1, MICRO ELECTRET SYMMETRICALLY L. Yue2, S. Raible2, C. Yu1, Z. Wang1, C. Lee2, GENERATOR ARRANGED FOLDED- and N.F. de Rooij1 T.K. Hsiai3, E.S. Kim3, D. Miki, Y. Suzuki, BEAM SUSPENSIONS 1Ecole Polytéchnique and H. Yu1 and N. Kasagi M. Degawa, H.W. Jeong, Fédérale de Lausanne 1Arizona State University, University of Tokyo, H. Sonobe, C. Takubo, (EPFL), SWITZERLAND USA, 2Touchdown JAPAN K. Yamanaka, and Y. Goto and 2AppliedSensor Technologies, USA, and ...... 636 Hitachi, Ltd., JAPAN GmbH, GERMANY 3University of Southern ...... 664 ...... 584 California, USA ...... 608 16:30 - 16:45 M4B.003 M4C.003 M4E.003 M4F.003 MICROREACTORS HYDRODYNAMIC MAGNETOELECTRIC DESIGN, FABRICATION FOR SYNTHETIC SINGLE-CELL TRAPPING NANOSCALE AND TESTING OF A DIESEL PRODUCTION FOR CELLULAR ASSAYS MAGNETIC-FIELD MICROMACHINED TO OPTIMIZE C.M. Lin, C.C. Tseng, GENERATOR SEISMOMETER WITH NANOSTRUCTURED C.L. Chen, and A.M. Wo T.-K. Chung and NANO-G RESOLUTION COBALT CATALYST National Taiwan G.P. Carman W.T. Pike1, I.M. Standley2, J. Brown, J. McDonald, University, TAIWAN University of California, W.J. Karl1, S. Kumar1, and C. Wilson ...... 612 Los Angeles, USA T. Semple1, Louisiana Tech ...... 640 S.J. Vijendran1, University, USA and T. Hopf1 ...... 588 1Imperial College London, UK and 2Kinemetrics Inc., USA ...... 668
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PARALLEL ORAL SESSIONS (continued)
Chemical Microsensors Cell Manipulation & Microsystems I & Analysis I Power MEMS Inertial Sensors
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 16:45 - 17:00 M4B.004 M4C.004 M4E.004 M4F.004 NOVEL DUAL LEUKOCYTE COUNT A MEMS TURBOPUMP DESIGN AND TRANSIENT AND TWO-PART FOR FUEL DELIVERY IN IMPLEMENTATION OF TEMPERATURE DIFFERENTIAL IN SMALL-SCALE POWER HIGH PERFORMANCE MODULATION WHOLE BLOOD BASED SYSTEMS CMOS-MEMS TECHNIQUE FOR ON A PORTABLE C.M. Waits1,2, CAPACITIVE SENSORS MULTI-VAPOUR MICROFLOW M. McCarthy2, M.-H. Tsai1, C.-M. Sun1, DETECTION CYTOMETER and R. Ghodssi2 Y.-C. Liu1, C. Wang2, T. Iwaki1, J.A. Covington2, W. Shi1, S. Zheng1,2, 1US Army Research and W. Fang1 J.W. Gardner2, H.L. Kasdan3, A. Fridge3, Laboratory, USA and 1National Tsing Hua and F. Udrea3 and Y.C. Tai1 2University of Maryland, University, TAIWAN and 1Denso Corporation, 1California Institute of USA 2Pixart Imaging Inc., JAPAN, 2Warwick Technology, USA, ...... 644 TAIWAN University, UK, and 2Pennsylvania State ...... 672 3Cambridge University, University, USA, and UK 3IRIS International Inc., ...... 592 USA ...... 616 17:00 - 17:15 M4B.005 M4C.005 M4E.005 M4F.005 NANOSTRUCTURED LATERAL-DRIVEN AN AIR-BREATHING A DIGITAL POLYMER CONTINUOUS SILICON-BASED MICRO ACCELEROMETER TRANSISTORS FOR MAGNETOPHORETIC DIRECT METHANOL USING A MICROSCALE VOLATILE ORGANIC MICROSEPARATOR FOR FUEL CELL WITH A LIQUID-METAL COMPOUND DETECTION SEPARATING BLOOD CAPILLARY-BASED DROPLET IN B. Li and D.N. Lambeth CELLS BASED ON THEIR WATER DRAWN OUT PHOTOSENSITIVE Carnegie Mellon NATIVE MAGNETIC STRUCTURE GLASS CHANNEL University, USA PROPERTIES Y.A. Zhou, X.H. Wang, K. Yoo, C. Lee, and J. Kim ...... 596 J. Jung and K.-H. Han X. Lin, Q. Zhan, Pohang University of Inje University, KOREA and L.T. Liu Science and Technology ...... 620 Tsinghua University, (POSTECH), KOREA CHINA ...... 676 ...... 648 17:15 - 17:30 M4B.006 M4C.006 M4E.006 M4F.006 A NOVEL METHOD OF MICROFLUIDIC-DRIVING AN INTEGRATED DESIGN AND SELF-ASSEMBLING MULTI-FUNCTION MICROFLUIDIC IMPLEMENTATION OF SILOXANE BI-LAYER MANIPULATION ARRAY SELF-REGULATING AND LIQUID DROPLET DIRECTLY ON SiO2 OF MICRO-SCALE SELF-CIRCULATING BASED MOTION SURFACE OF BIOLOGICAL SAMPLE HYDROGEN GENERATOR SENSING MICRO-CANTILEVER VIA AC FOR FUEL CELLS H. Zeng and Y. Zhao FOR LONG-TERM ELECTOOSMOSIS L. Zhu1, D.D. Meng2, Ohio State University, REPEATABLE SENSING T.-Y. Chao and C.-H. Liu N. Kroodsma2, J. Yeom1, USA TO TRACE EXPLOSIVES National Tsing Hua and M.A. Shannon1 ...... 680 Y. Chen, P.C. Xu, Y. Liu, University, TAIWAN 1University of Illinois, T.T. Yang, Y.L. Yang, ...... 624 USA and 2Michigan and X.X. Li Technological University, Chinese Academy of USA Sciences, CHINA ...... 652 ...... 600
47 TRANS09 FinalProgram PRINT:TRANS09 6/3/09 11:28 AM Page 48
PARALLEL ORAL SESSIONS (continued)
Chemical Microsensors Cell Manipulation & Microsystems I & Analysis I Power MEMS Inertial Sensors
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 17:30 - 17:45 M4C.007 M4E.007 M4F.007 LARGE SCALE LIQUID- ONE-DIMENSIONAL- MICROFLUIDIC SEMICONDUCTOR- MOTION AND SYSTEMS FOR BASED MICRO POWER PRESSURE HYBRID SEQUENTIAL TRAPPING, SOURCE USING SENSOR FABRICATED LABELING AND RADIOISOTOPE ENERGY AND PROCESS-LEVEL- CONTENT EXTRACTION CONVERSION PACKAGED WITH CMOS OF SINGLE CELLS T. Wacharasindhu, BACK-END-OF-LINE M. Noguchi1, T. Arakawa2, J.W. Kwon, D.E. Meier, PROCESSES K. Sumitomo1, and J.D. Robertson Y. Hanaoka, T. Fujimori, Y. Yamaguchi1, University of Missouri, K. Yamanaka, and S. Shoji1 Columbia, USA S. Machida, H. Takano, 1Waseda University, ...... 656 Y. Goto, and H. Fukuda JAPAN and 2Tokyo Hitachi, Ltd., JAPAN Medical and Dental ...... 684 University, JAPAN ...... 628
17:45 ADJOURN FOR THE DAY
18:30 - 22:00 Evening Reception at the Museum of Nature & Science
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TUESDAY, June 23, 2009 PARALLEL ORAL SESSIONS
Optical Detection MEMS Resonators I Techniques Materials & Processes Biomimetic Systems
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F
Session Chairs:
X. Li, Shanghai Institute of G.B. Lee, M. Huff, W. Olthuis, Microsystem and Information National Cheng Kung MEMS Exchange, USA University of Twente, Technology, CHINA University, TAIWAN THE NETHERLANDS
C.T.-C. Nguyen, S. Pennathur, P. Sarro, University of California, University of California, Delft University of Y. Suzuki, Berkeley, USA Santa Barbara, USA Technology, NETHERLANDS University of Tokyo, JAPAN
08:00 - 08:30 INVITED SPEAKER INVITED SPEAKER INVITED SPEAKER INVITED SPEAKER T1B.001 T1C.001 T1E.001 T1F.001 ENERGY LOSS IN MEMS OPTICAL DETECTION IN CMOS-INTEGRATED SILICON NANOPORE RESONATORS AND THE MICROFLUIDICS: FROM SIGE MEMS: MEMBRANE IMPACT ON INERTIAL, THE SMALL TO THE APPLICATION TO TECHNOLOGY FOR AN AND RF DEVICES LARGE MICRO-MIRRORS IMPLANTABLE M. Weinberg1, A.J. de Mello1, A. Witvrouw1, E. Beyne1, ARTIFICIAL KIDNEY R. Candler3, P.M.W. French1, L. Haspeslagh1, S. Roy1, A. Dubnisheva2, S. Chanderkar2, M.A.A. Neil1, J.B. Edel1, and I. De Wolf1,2 A. Eldridge2, J. Varsanik4, T. Kenny2, R.K.P. Benninger1, 1IMEC, BELGIUM and A.J. Fleischman2, and A. Duwel1 D.D.C. Bradley1, 2Katholieke Universiteit K.G. Goldman3, 1Charles Stark Draper T. Robinson1, Leuven, BELGIUM H.D. Humes4, Laboratory, USA, M. Srisa-art1, ...... 734 A.L. Zydney5, 2Stanford University, O. Hofmann2, and W.H. Fissell2 USA, 3University of and J.C. de Mello1 1University of California, California, Los Angeles, 1Imperial College San Francisco, USA, USA, and London, UK and 2Cleveland Clinic, USA, 4Massachusetts Institute 2Molecular Vision Ltd., 3H-Cubed, USA, of Technology, USA UK 4University of Michigan, ...... 688 ...... 712 USA, and 5Pennsylvania State University, USA ...... 755 08:30 - 08:45 T1B.002 T1C.002 T1E.002 T1F.002 OSCILLATING A NOVEL OPTOFLUIDIC A NEW HIGHLY ON-CHIP BEHAVIOR OF QUALITY EVANESCENT SELECTIVE SACRIFICIAL LOBULE-MIMETIC FACTOR OF A FILM WAVEGUIDE SENSOR LAYER TECHNOLOGY CONSTRUCTION OF BULK ACOUSTIC SYSTEM FOR FOR SIC MEMS HETEROGENEOUS RESONATOR IN LIQUIDS FLUORESCENCE N. Behnel1, T. Fuchs1, CELLS AND CO-CUTURE W. Xu, SPECTROSCOPY and H. Seidel2 VIA A A. Abbaspour-Tamijani, FABRICATED BY 1Robert Bosch GmbH, LOGARITHMICAL- and J. Chae MICRO- GERMANY and 2Saarland CONCENTRATION Arizona State University, STEREOLITHOGRAPHY University, GERMANY VARYING BIOREACTOR USA M. Rosenauer, J. Stampfl, ...... 740 S.-E. Gong, R.-J. Chen, ...... 696 and M.J. Vellekoop C.-K. Chin, W.-C. Chu, Vienna University of C.-T. Ho, H.-Y. Chang, Technology, AUSTRIA and C.-H. Liu ...... 718 National Tsing Hua University, TAIWAN ...... 761 08:45 - 09:00 T1B.003 T1C.003 T1E.003 T1F.003 Q-ENHANCEMENT A MICROCANTILEVER SELECTIVE A NEURON-BENIGN THROUGH SENSOR WITH ELECTROCHEMICAL MICROFLUIDIC MINIMIZATION OF INTEGRATED OPTICAL RELEASE ETCHING OF GRADIENT GENERATOR ACOUSTIC ENERGY READOUT FOR EUTECTICALLY BONDED FOR STUDYING THE RADIATION IN ANTIMICROBIAL DRUG MICROSTRUCTURES GROWTH OF MICROMACHINED DISCOVERY H. Gradin, S. Braun, MAMMALIAN NEURONS LATERAL-MODE S.T. Koev, R. Fernandes, M. Sterner, G. Stemme, TOWARDS AXON RESONATORS W.E. Bentley, and and W. van der Wijngaart GUIDANCE FACTORS B.P. Harrington R. Ghodssi Royal Institute of N. Bhattacharjee, N. Li, and R. Abdolvand University of Maryland, Technology (KTH), and A. Folch Oklahoma State USA SWEDEN University of Washington, University, USA ...... 722 ...... 743 USA ...... 700 ...... 765
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PARALLEL ORAL SESSIONS (continued)
Optical Detection MEMS Resonators I Techniques Materials & Processes Biomimetic Systems
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 09:00 - 09:15 T1B.004 T1C.004 T1E.004 T1F.004 TUNING THE QUALITY A COMBINED EN- CONTINUOUS CELLULAR AUTONOMOUS BEATING FACTOR OF HANCED-FLUORES- AUTOMATON FOR THE AND FLUID PUMPING MICROCANTILEVER CENCE AND SIMULATION OF THE GEL BY USING HYDRODYNAMIC LABEL-FREE IMAGING SURFACE CARDIOMYCYTES DRUG COUPLING OF MICRO INSTRUMENT MORPHOLOGY ON ANY STIMULATION STRUCTURES I.D. Block, P.C. Mathias, SILICON ORIENTATION K. Imagawa1, J.-H. Lee1,2, Y.-D. Lau2, N. Ganesh, Si{HKL} IN H. Horiguchi1, K. Ikeda2, C.-M. Yao1, and W. Fang2 and B.T. Cunningham ANISOTROPIC ETCHING Y. Akiyama1, T. Hoshino1, 1National Applied University of Illinois, Y. Xing1, M.A. Gosálvez2, S. Maruo2, and Research Laboratories, Urbana-Champaign, USA and K. Sato2 K. Morishima1 TAIWAN and 2National ...... 726 1Southeast University, 1Tokyo University of Tsing Hua University, CHINA and 2Nagoya Agriculture and TAIWAN University, JAPAN Technology, JAPAN and ...... 704 ...... 747 2Yokohama National University, JAPAN ...... 769 09:15 - 09:30 T1B.005 T1C.005 T1E.005 T1F.005 FREQUENCY SCALING ENHANCING DNA SURFACTANT IN TMAH ELECTRICAL AND TRANSDUCER MICROARRAY FOR NEW SHAPES OF RECORDING OF LIPID EFFICIENCY IN DETECTION LIMITS SILICON MEMS MEMBRANE IN INTERNAL USING OPTICAL COMPONENTS; ITS ORI- A MICROFLUIDIC DIELECTRICALLY RESONANCES FROM ENTATION DEPENDENT DEVICE TRANSDUCED SILICON PHOTONIC CRYSTAL ADSORPTION DE- Y. Watanabe1,2, T. Osaki3, BAR RESONATORS SURFACES TECTED BY INFRARED and S. Takeuchi1,3,4 D. Weinstein1, P.C. Mathias, S.I. Jones, SPECTROSCOPY 1Ministry of Economy, S.A. Bhave1, S. Morita2, D.O. Gonzalez, P. Pal1, K. Sato1, H. Hida1, Trade and Industry S. Mitarai2, and K. Ikeda2 L.O. Vodkin, M.A. Gosálvez1, (METI), JAPAN, 1Cornell University, USA and B.T. Cunningham Y. Kimura2, K. Ishibashi2, 2Olympus Company, and 2Sony Corporation, University of Illinois, and M. Niwano2 JAPAN, 3University of JAPAN Urbana-Champaign, USA 1Nagoya University, Tokyo, JAPAN and ...... 708 ...... 730 JAPAN and 2Tohoku 4Japan Science and University, JAPAN Technology Agency ...... 751 (JST), JAPAN ...... 773 09:30 - 10:00 BREAK & EXHIBIT INSPECTION PARALLEL ORAL SESSIONS
Droplet and Bubble Packaging and RF MEMS Devices Assembly Magnetic Devices
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F
Session Chairs:
R.N. Candler, J. Ducree, A. Fitzgerald, D. Arnold, University of California, Dublin City University, A.M. Fitzgerald & University of Florida, USA Los Angeles, USA IRELAND Associates, LLC, USA
C.-J. Kim, H. Seidel, P. French, H. Tilmans, University of California, Saarland University, Delft University of Technology, IMEC, BELGIUM Los Angeles, USA GERMANY THE NETHERLANDS
10:00 - 10:15 T2B.001 T2C.001 T2E.001 T2F.001 AN RFMEMS BASED 100 PICOLITER PROGRAMMABLE UNOBSTRUCTING REFLECTION TYPE C-KU DROPLET HANDLING BATCH ASSEMBLY OF MAGNETIC BAND TUNABLE BAND USING 256 (28) MICROPARTS WITH MICROACTUATORS PASS FILTER MICROVALVE ARRAY 100% YIELD FOR IMPLANTABLE S.-S. Lee, T. Nishino, WITH 18 MULTIPLEXED J. Hoo1, R. Baskaran1,2, CATHETERS Y. Kitsukawa, N. Konno, CONTROL LINES and K.F. Böhringer1 H. Lee, S.A. Lee, and M. Miyazaki K. Kawai, Y. Shibata, 1University of M. Bergsneider, Mitsubishi Electric and S. Shoji Washington, USA and and J.W. Judy Corporation, JAPAN Waseda University, 2Intel Corporation, USA University of California, ...... 777 JAPAN ...... 829 Los Angeles, USA ...... 802 ...... 857
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PARALLEL ORAL SESSIONS (continued)
Droplet and Bubble Packaging and RF MEMS Devices Assembly Magnetic Devices
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 10:15 - 10:30 T2B.002 T2C.002 T2E.002 T2F.002 DIGITALLY-SPECIFIED HIGH THROUGHPUT ROOM-TEMPERATURE A NEW MAGNETICALLY MICROMECHANICAL DNA METHYLATION WAFER-LEVEL ACTUATED SWITCH FOR DISPLACEMENT ANALYSIS ON A HERMETIC SEALING PRECISE POSITION AMPLIFIERS DROPLET-IN-OIL FOR LIQUID DETECTION Y. Lin1, W.-C. Li1, I. Gurin1, POLYMERASE CHAIN RESERVOIRS BY GOLD C. Coutier1, L. Chiesi1, S.-S. Li2, Y.-W. Lin3, REACTION ARRAY RING EMBOSSING A. Garnier1, J.C. Fourrier1, Z. Ren1, B. Kim1, Y. Zhang, V. Bailey, M.A. Lapisa, F. Niklaus, C. Lapière1, M. Trouillon1, and C.T.-C. Nguyen1 C.M. Puleo, H. Easwaran, and G. Stemme B. Grappe1, M. Vincent1, 1University of California, E. Griffiths, J.G. Herman, Royal Institute of A. Samperio1, S. Borel2, Berkeley, USA, S.B. Baylin, Technology (KTH), C. Dieppedale2, 2National Tsing Hua and T.-H. Wang SWEDEN E. Lorent2, and H. Sibuet2 University, TAIWAN, and Johns Hopkins ...... 833 1Schneider Electric 3Broadcom Corporation, University, USA Industries, FRANCE and USA ...... 806 2CEA - LETI - Minatec, ...... 781 FRANCE ...... 861 10:30 - 10:45 T2B.003 T2C.003 T2E.003 T2F.003 ON-CHIP ON-DEMAND DOUBLE HIGHLY RELIABLE AND LASER-PRINTED SOFT-FERRITE- EMULSIFICATION MANUFACTURABLE MAGNETIC-POLYMER INTEGRATED UTILIZING IN-LINE WAFER-LEVEL MICROSTRUCTURES INDUCTORS FOR RF IC PNEUMATICALLY HERMETIC PACKAGES N. Klejwa1, R. Misra1, C. Yang1, T.-L. Ren1, ACTUATED MULTILAYER FOR RF MEMS J. Provine1, S.J. Klejwa2, L.-T. Liu1, J. Zhan1, PDMS VARIABLE CAPACITOR M. Zhang1, S.X. Wang1, X. Wang2, A. Wang2, MICROSTRUCTURES A. Kojima, Y. Shimooka, and R.T. Howe1 Z. Wu3, and X. Li3 H.-H. Lin, S.-C. Chang, Y. Sugizaki, M. Endo, 1Stanford University, USA 1Tsinghua University, Y.-M. Tseng, T.-H. Hsu, H. Yamazaki, E. Ogawa, and 2Magnetic Abrasive CHINA, 2University of and Y.-C. Su T. Ikehashi, T. Ohguro, Technologies Inc., USA California, Riverside, National Tsing Hua S. Obata, T. Miyagi, ...... 865 USA, and 3Chinese University, TAIWAN I. Mori, Y. Toyoshima, Academy of Science, ...... 809 and H. Shibata CHINA Toshiba Corporation, ...... 785 JAPAN ...... 837 10:45 - 11:00 T2B.004 T2C.004 T2E.004 T2F.004 A COMPREHENSIVE DROPLET FORMATION A DETAILED STUDY OF SUPERPARAMAGNETIC STUDY FOR DIELECTRIC AND FUSION FOR YIELD AND RELIABILITY PHOTOSENSITIVE CHARGING PROCESS IN ENZYME ACTIVITY FOR VACUUM POLYMER SILICON NITRIDE FILMS MEASUREMENT BY PACKAGES FABRICATED NANOCOMPOSITE FOR FOR RF MEMS LIQUID IN A WAFER-LEVEL MICROACTUATORS SWITCHES USING DIELECTROPHORESIS AU-SI EUTECTIC M. Suter, S. Graf, KELVIN PROBE M. Kumemura, BONDING PROCESS O. Ergeneman, MICROSCOPY S. Yoshizawa, D. Collard, J.S. Mitchell and K. Najafi S. Schmid, A. Camenzind, U. Zaghloul1, A. Belarni1, and H. Fujita University of Michigan, B.J. Nelson, F. Coccetti1, University of Tokyo, USA and C. Hierold G.J. Papaioannou2, JAPAN ...... 841 ETH Zürich, L. Bouscayrol1, P. Pons1, ...... 813 SWITZERLAND and R. Plana1 ...... 869 1Université de Toulouse, FRANCE and 2University of Athens, GREECE ...... 789
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PARALLEL ORAL SESSIONS (continued)
Droplet and Bubble Packaging and RF MEMS Devices Assembly Magnetic Devices
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 11:00 - 11:15 T2B.005 T2C.005 T2E.005 T2F.005 INVESTIGATION OF MICRO-PILLAR FULL WAFER THE DOUBLE-SIDE ANTI-STICTION BARRIERS FOR INTEGRATION OF SHAPE ELECTROPLATING AND COATING USING GUIDING, MIXING MEMORY ALLOY SLENDER π-CONJUGATED AND SORTING MICROACTUATORS FERROMAGNETIC HYDROPHOBIC DROPLETS USING ADHESIVE PATTERNS TORQUE- SELF-ASSEMBLED H.-H. Cui and K.-M. Lim BONDING ENHANCEMENT DESIGN MONOLAYER FOR National University of N. Sandström, S. Braun, FOR MAGNETOSTATIC OHMIC CONTACT Singapore, SINGAPORE G. Stemme, ACTUATOR MEMS SWITCH ...... 817 and W. van der Wijngaart T.-L. Tang, C.-P. Hsu, T. Yamashita1,3, T. Itoh2,3, Royal Institute of W.-C. Chen, and W. Fang and T. Suga1,3 Technology (KTH), National Tsing Hua 1University of Tokyo, SWEDEN University, TAIWAN JAPAN, 2National ...... 845 ...... 873 Institute of Advanced Industrial Science and Technology (AIST), JAPAN, and 3Japan Science and Technology Agency (JST), JAPAN ...... 794
11:15 - 11:30 T2B.006 T2C.006 T2E.006 T2F.006 OSCILLATOR CAPTURING, CARRYING, WAFER LEVEL 2D CMOS INTEGRATED FAR-FROM-CARRIER AND RELEASING OF FABRICATION OF HIGH MAGNETOMETER PHASE NOISE MICRO-OBJECTS BY PERFORMANCE MEMS BASED ON THE REDUCTION VIA AC-ELECTROWETING- USING BONDED AND MINIATURIZED NANO-SCALE GAP ACTUATED THINNED BULK CIRCULAR VERTICAL TUNING OF OSCILLATING BUBBLES PIEZOELECTRIC HALL DEVICE MICROMECHANICAL S.K. Chung and S.K. Cho SUBSTRATES M. Banjevic, B. Furrer, RESONATORS University of Pittsburgh, E.E. Aktakka, H. Kim, and R.S. Popovic M. Akgul, B. Kim, USA and K. Najafi Ecole Polytéchnique L.-W. Hung, Y. Lin, ...... 821 University of Michigan, Fédérale de Lausanne W.-C. Li, W.-L. Huang, USA (EPFL), SWITZERLAND I. Gurin, A. Borna, ...... 849 ...... 877 and C.T.-C. Nguyen University of California, Berkeley, USA ...... 798 11:30 - 11:45 T2C.007 T2E.007 T2F.007 A LOW VOLTAGE FABRICATION OF THE MAGNETIC CAPILLARY EINZEL LENS ARRAY CALIBRATION OF MICROGRIPPER USING WITH ONE-MASK RIE ARBITRARILY SHAPED ELECTROWETTING PROCESS FOR HALL SENSORS IN THE A. Vasudev and J. Zhe ELECTRON ABSENCE OF MAGNETIC University of Akron, USA MICRO-OPTICS FIELDS ...... 825 E. Tomono, H. Miyashita, M. Cornils and O. Paul T. Ono, and M. Esashi University of Freiburg - Tohoku University, JAPAN IMTEK, GERMANY ...... 853 ...... 881
11:45 - 13:00 LUNCH ON OWN & EXHIBIT INSPECTION
52 TRANS09 FinalProgram PRINT:TRANS09 6/3/09 11:28 AM Page 53
13:00 - 16:00 T3P POSTER SESSION II - see floor plans starting on page 29 Actuators
T3P.001 AN ELECTROMAGNETICALLY ACTUATED MICROSPEAKER WITH FULLY-INTEGRATED WAX-BONDED ND-FE-B MICROMAGNETS FOR HEARING AID APPLICATIONS S.-S. Je1, N. Wang2, H.C. Brown1, D.P. Arnold2, and J. Chae1 1Arizona State University, USA and 2University of Florida, USA ...... 885
T3P.002 LARGE STROKE HIGH FORCE PNEUMATIC ACTUATORS FABRICATED BY SU-8 MICROMACHINING F. Ceyssens, M. De Volder, D. Reynaerts, and R. Puers Katholieke Universiteit Leuven, BELGIUM ...... 889
T3P.003 ROBUSTNESS OF ELECTROSTATIC MEMS ACTUATORS AGAINST ELECTRICAL OVERSTRESS J. De Coster, X. Rottenberg, S. Sangameswaran, P. Ekkels, H.A.C. Tilmans, and I. De Wolf IMEC, BELGIUM ...... 893
T3P.004 CONCEPTUAL DESIGN OF MINIATURE TUNABLE STIFFNESS DISPLAY USING MR FLUIDS T.-H. Yang1, H.-J. Kwon1, S.S. Lee1, J. An2, J.-H. Koo3, S.-Y. Kim4, and D.-S. Kwon1 1Korea Advanced Institute of Science and Technology (KAIST), KOREA, 2Daegu Gyeongbuk Institute of Science and Technology, KOREA, 3Miami University, Oxford, USA, and 4Korea University of Technology and Education, KOREA ...... 897
T3P.005 POLYCRYSTALLINE SILICON CARBIDE NEMS FOR HIGH-TEMPERATURE LOGIC T.-H. Lee1, K.M. Speer1, X.A. Fu2, S. Bhunia1, and M. Mehregany1 1Case Western Reserve University, USA and 2University of Louisville, USA ...... 900
T3P.006 MAGNETIC TORQUE DRIVING 2D MICRO SCANNER WITH A NON-RESONANT LARGE SCAN ANGLE W. Makishi, Y. Kawai, and M. Esashi Tohoku University, JAPAN ...... 904
T3P.007 SELF-ALIGNED ELECTROSTATIC ANGULAR VERTICAL COMB ACTUATORS ASSEMBLED ON-CHIP USING IN-PLANE ELECTROTHERMAL ACTUATORS Y. Eun, H. Na, J. Choi, and J. Kim Yonsei University, KOREA ...... 908
T3P.008 FUNCTIONAL 1.6 GHZ MEMS SWITCH USING ALIGNED COMPOSITE CNT MEMBRANE BY DIELECTROPHORETIC SELF-ASSEMBLY M.W. Jang, M. Lu, T. Cui, and S.A. Campbell University of Minnesota, USA ...... 912
BioSensors & BioMicrosystems
T3P.009 2-DIMENSIONAL POTASSIUM ION IMAGE SENSOR AIMING FOR LABEL-FREE DYNAMIC IMAGING OF LIVING-CELL ACTIVITY K. Atsumi1, Y. Masaki1, T. Noda1, T. Hattori1, H. Takao1,2, M. Ishida1,2, and K. Sawada1,2 1Toyohashi University of Technology, JAPAN and 2Japan Science and Technology Agency (JST), JAPAN ...... 916
T3P.010 A POWER-FREE BLOOD PLASMA EXTRACTION DEVICE BASED ON PLANAR CROSSFLOW FILTER MICROSTRUCTURE Y.C. Kim1, S.-H. Kim2,3, P.W. Heo1, and J.-K. Park2 1Korea Institute of Machinery and Materials, KOREA, 2Korea Advanced Institute of Science and Technology, KOREA, and 3Toshiba-Samsung Storage Technology, KOREA ...... 920
T3P.011 APPLICATIONS OF A NOVEL CELL MICROPATTERNING PROCESS FOR LONG-TERM NEURON AND CELL CULTURE W.C. Chang and D.W. Sretavan University of California, San Francisco, USA ...... 924
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T3P POSTER SESSION II (continued)
T3P.012 MICROSYSTEMS FOR DETERMINING THE HETEROGENIETY OF HEAD AND NECK CANCER CELL POPULATIONS BY PARA-MAGNETOPHORESIS Y. Jung1, D. Wang2, G. Chen2, D. Shin2, K.H. Han3, and A.B. Frazier1 1Georgia Institute of Technology, USA, 2Emory University, USA, and 3Inje University, KOREA ...... 928
T3P.013 TISSUE-MIMICKING IN VITRO ANALYSIS SYSTEM TO EXCLUSIVELY STIMULATE SINGLE CELL AND DETECT ITS PHYSIOLOGICAL REACTION A. Okonogi1, K. Terao1, T. Okitsu1,3, T. Suzuki1,4, and H. Kotera1,2 1Japan Science and Technology Agency (JST), JAPAN, 2Kyoto University, JAPAN, 3Kyoto University Hospital, JAPAN, and 4Kagawa University, JAPAN ...... 932
T3P.014 A WIRELESS-COMPATIBLE CMOS-BASED CELLULAR SENSOR M. Anwar1,2,3 and P. Matsudaira1,2 1Massachusetts Institute of Technology, USA, 2Whitehead Institute, USA, and 3University of California, San Francisco, USA ...... 936
T3P.015 MICROFLUIDIC PROTEIN SYNTHESIS ARRAY FOR TOXIN DETECTION Z.H. Fan, Q. Mei, R. Khnouf, and S. Jin University of Florida, USA ...... 939
T3P.016 A REGENERATIVE BIOSENSING SURFACE USING ELECTROCHEMICAL DESORPTION OF SELF-ASSEMBLED MONOLAYER IN MICROFLUIDICS S. Choi and J. Chae Arizona State University, USA ...... 943
T3P.017 EARLY DIAGNOSIS OF CANCER BY ELECTRICAL DETECTION OF NUCLEIC ACID BIOMARKERS M. Javanmard, A.H. Talasaz, M. Nemat-Gorgani, M. Ronaghi, F. Pease, and R.W. Davis Stanford University, USA ...... 947
T3P.018 AUTOMATIC ON-CHIP SEQUENTIAL PROCESSING FOR BIO-MICROSYSTEMS N. Ohnishi, W. Satoh, K. Morimoto, J. Fukuda, and H. Suzuki University of Tsukuba, JAPAN ...... 951
T3P.019 COULOMETRIC DETECTION OF AN ANALYTE IN A LIQUID PLUG FORMED IN A MICROFLOW CHANNEL F. Sassa1, H. Laghzali2, J. Fukuda1, and H. Suzuki1 1University of Tsukuba, JAPAN and 2Joseph Fourier University, FRANCE ...... 955
T3P.020 MICROCANTILEVER SENSOR USING PHOTONIC CRYSTAL NANOCAVITY RESONATOR W. Xiang1, F.L. Hsiao1, and C. Lee1,2 1National University of Singapore, SINGAPORE and 2Agency for Science, Technology and Research (A+ STAR), SINGAPORE ...... 959
T3P.021 MWCNTS ARRAY INCORPORATED NANOCHANNEL WITH CHARGE-SELECTIVITY FOR HIGH EFFICIENT BIOMOLECULE PRECONCENTRATION R.G. Wu1, Y.S. Wu1, C.S. Yang1,2, and F.G. Tseng1,3 1National Tsing Hua University, TAIWAN, 2National Health Research Institutes, TAIWAN, and 3Research Center for Applied Sciences, TAIWAN ...... 963
T3P.022 HYDROPHILIC MODIFICATION OF MULTI-WALLED CARBON NANOTUBES BASED NEURAL MICROELECTRODE ARRAY C.H. Chen, H.C. Su, S.C. Chuang, S.J. Yen, Y.C. Chen, Y.T. Lee, T.R. Yew, H. Chen, S.R. Yeh, Y.C. Chang, and D.J. Yao National Tsing Hua University, TAIWAN ...... 967
T3P.023 CARBON NANOTUBE LABELED IMMUNOSENSOR FOR LATERAL FLOW DIAGNOSTICS A. Abera and J.-W. Choi Louisiana State University, USA ...... 971
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T3P POSTER SESSION II (continued)
T3P.024 TWO-DIMENSIONAL LABEL-FREE ACETYLCHOLINE IMAGE SENSOR FOR IMAGING NEURONAL COMMUNICATION S. Takenaga1, S.R. Lee1, M.M. Rahman1, H. Takao1,2, M. Ishida1,2, and K. Sawada1,2 1Toyohashi University of Technology, JAPAN and 2Japan Science and Technology Agency (JST), JAPAN ...... 975
T3P.025 CONTINUOUS MONITORING OF INSULIN ATTACHMENT KINETICS ON PHOTOTHERMALLY ACTUATED MICROCANTILEVER BIOSENSOR J.W. Park1, O. Ducloux2, S. Nishida1, and H. Fujita1 1University of Tokyo, JAPAN and 2Centre National de la Reserche Scientifique (CNRS), FRANCE ...... 979
Chemical Microsensors & Microsystems
T3P.026 A MICRO GAS PRECONCENTRATOR WITH IMPROVED PERFORMANCES FOR ENVIRONMENTAL MONITORING E.H.M. Camara1,2, P. Breuil1, D. Briand2, L. Guillot2, C. Pijolat1, and N.F. de Rooij2 1École Nationale Supérieure des Mines, FRANCE and 2École Polytechnique Fédérale de Lausanne, SWITZERLAND ...... 983
T3P.027 HYPER-BRANCHED SENSING POLYMERS SELF-ASSEMBLED ON RESONANT MICRO-CANTILEVER SENSORS FOR ULTRA-LOW CONCENTRATION DMMP VAPOR DETECTION Y. Liu1,2, H. Yu1, S. Gao2, X. Gan1, M. Liu1, G. Zuo1,2, Z. Cheng2, and X. Li1 1Chinese Academy of Sciences, CHINA and 2ICD, CHINA ...... 987
T3P.028 AN ACCELERATOR BASED NEUTRON GUN MICRO-FABRICATED WITH CERAMIC/METAL PACKAGING C. Whitney and C.G. Wilson Louisiana Tech University, USA ...... 991
T3P.029 SIMULTANEOUS AND WIRELESS MEASUREMENT OF CO2 AND NO2 USING A SAW REFLECTIVE DELAY LINE C. Lim, S. Yang, and K. Lee Ajou University, KOREA ...... 995
T3P.030 A SLAB WAVEGUIDE SENSOR FOR A FULLY INTEGRATED IR-ABSORPTION SENSOR SYSTEM - THEORETICAL AND EXPERIMENTAL VERIFICATION J. Kasberger1, P. Rauter2, T. Fromherz2, and B. Jakoby2 1Integrated Microsystems, AUSTRIA and 2Johannes Kepler University Linz, AUSTRIA ...... 999
T3P.031 OPTIMISING A NITRIC OXIDE SENSING TECHNIQUE FOR HYPOXIC TUMOR CELL CULTURES K. Aravindalochanan1, J. Kieninger1, J.A. Sandvick2, E.O. Petterson2, and G.A. Urban1 1University Freiburg, GERMANY and 2Biophysics Institute, NORWAY ...... 1003
T3P.032 A CHEMICAL SENSING MICROSYSTEM UTILIZING AN ADAPTIVE FEEDBACK CIRCUIT X.Z. Fan1, N. Siwak1, S. Kanakaraju2, C. Richardson2, and R. Ghodssi1 1University of Maryland, USA and 2Laboratory for Physical Sciences, USA ...... 1007
T3P.033 HIGH-PERFORMANCE HUMIDITY SENSOR WITH POLYIMIDE NANO-GRASS H. Lee, S. Jung, H. Kim, and J. Lee Seoul National University, KOREA ...... 1011
T3P.034 ARRAY TYPE DISSOVLED OXYGEN SENSOR AND MEASUREMENT SYSTEM FOR SIMULTANEOUS MEASUREMENT OF CELLULAR RESPIRATION LEVEL J. Park1, J.-H. Chang1, S. Ahn2, Y.K. Pak2, S. Han3, and J.J. Pak1 1Korea University, KOREA, 2Kyunghee University, KOREA, and 3Hoseo University, KOREA ...... 1015
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T3P.035 MEMS RESONATORS ACTUATED BY TbCo/FeCo NANOSTRUCTED MAGNETOSTRICTIVE MULTILAYERS IN LIQUID ENVIRONMENT O. Ducloux1, J.W. Park2, N. Tiercelin2, P. Pernod2, V. Preobrazhensky2, M. Hamon1, Y. Sakai1, and H. Fujita2 1University of Tokyo, JAPAN and 2Centre National de la Reserche Scientifique (CNRS), FRANCE ...... 1019
T3P.036 MULTIPARAMETRIC LIGHT-ASSISTED SILICON DEVICE TRANSDUCTION OF MOLECULAR RECOGNITION EVENTS C. Di Natalie1, A. D'Amico1, R. Paolesse1, F. Dini1, E. Martinelli1, D. Filippini2, A. Lloyd-Spetz2, and I. Lundström2 1University of Rome, ITALY and 2University of Linköping, SWEDEN ...... 1023
Materials, Fabrication & Packaging Technologies
T3P.037 PARYLENE TO SILICON ADHESION ENHANCEMENT R. Huang and Y.C. Tai California Institute of Technology, USA ...... 1027
T3P.038 SIMULTANEOUS WAFER-SCALE VACUUM ENCAPSULATION AND MICROSTRUCTURE CLADDING WITH LPCVD POLYCRYSTALLINE 3C-SIC C.S. Roper1, R. Candler1, S. Yoneoka2, T. Kenny2, R.T. Howe2, and R. Maboudian1 1University of California, Berkeley, USA and 2Stanford University, USA ...... 1031
T3P.039 BI2TE3 AS AN ACTIVE MATERIAL FOR MEMS BASED DEVICES FABRICATED AT ROOM TEMPERATURE S. Sedky1, A. Kamal1, M. Yomn1, H. Bakr1, R. Ghannam1, V. Leonov2, and P. Fiorini2 1American University, Cairo, EGYPT and 2IMEC, BELGIUM ...... 1035
T3P.040 STUDIES ON LOW-TEMPERATURE BONDING MECHANISM OF VUV AND PLASMA PRETREATED CYCLO-OLEFIN POLYMER H. Shinohara, T. Suzuki, J. Mizuno, and S. Shoji Waseda University, JAPAN ...... 1039
T3P.041 ENCAPSULATION OF MICROPARTICLES AND BIOMOLECULES BASED ON LAYER-BY-LAYER NANOASSEMBLY TECHNIQUES WITH MICROFLUIDIC DROPLET DEVICES Z. Gong, S. Penmetsa, Z. Zheng, Y. Lvov, and L. Que Louisiana Tech University, USA ...... 1043
T3P.042 EXPLORATORY CORRUGATED INFRARED HOT-ELECTRON TRANSISTOR ARRAYS R.X. Fu, K.K. Choi, K. Olver, and J. Sun U.S. Army Research Laboratory, USA ...... 1047
T3P.043 THIN FILM DIFFUSION BARRIER FORMATION IN PDMS MICROCAVITIES A. Riaz1,2, R.P. Gandhiraman1, I.K. Dimov1, L. Basabe-Desmonts1, A.J. Ricco1, J. Ducrée1, S. Daniels1, and L.P. Lee1,2 1Dublin City University, IRELAND and 2University of California, Berkeley, USA ...... 1051
T3P.044 PLANAR SACRIFICIAL SURFACE MICROMACHINING BY NICKEL SILICIDE K. Khosraviani and A.M. Leung Simon Fraser University, CANADA ...... 1055
T3P.045 THREE-DIMENSIONAL MICROSTRUCTURES FABRICATED BY MULTI-STEP ELECTROCHEMICAL ETCHING OF ALUMINUM SHEET Y. Kim1, S. Youn1, W. Han1, Y.-H. Cho1, H. Park2, B. Chang2, and Y. Oh2 1Digital Nanolocomotion Center, KOREA and 2Samsung Electromechanics, KOREA ...... 1059
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T3P.046 NOVEL SCANNING IMMERSION LITHOGRAPHY (SIL) FOR 3D MICROFABRICATION H.C. Sheu1,2, B.Y. Shew1, C.W. Liu1,3, C.T. Peng1, and S.C. Tseng2 1National Synchrotron Radiation Research Center, TAIWAN, 2National Yunlin University of Science and Technology, TAIWAN, and 3National Tsing Hua University, TAIWAN ...... 1063
T3P.047 PREDICTION OF STRENGTH AND FATIGUE LIFETIME OF MEMS STRUCTURES WITH ARBITRARY SHAPES T. Kawai1, J. Gaspar2, O. Paul2, and S. Kamiya1 1Nagoya Institute of Technology, JAPAN and 2University of Freiburg, GERMANY ...... 1067
T3P.048 ALIGNMENT INSENSITIVE ANISOTROPIC ETCHING OF SILICON CAVITIES WITH SMOOTH 49° SIDEWALLS C. Shen, H.T.M. Pham, and P.M. Sarro Delft University of Technology, THE NETHERLANDS ...... 1071
T3P.049 FABRICATION OF DENSE FLOW SENSOR ARRAYS ON FLEXIBLE MEMBRANES N. Izadi1, M.J. de Boer1, J.W. Berenschot1, R.J. Wiegerink1, T.S.J. Lammerink1, H.V. Jansen1, J. Mogdans2, and G.J.M. Krijnen1 1University of Twente, THE NETHERLANDS and 2University of Bonn, GERMANY ...... 1075
T3P.050 SELECTIVE VAPOR-LIQUID-SOLID GROWTH OF NEEDLE ARRAYS BY HOTWIRE CHEMICAL VAPOR DEPOSITION WITH LOW SUBSTRATE TEMPERATURE A.V. Govindarajan1, S. Paluri2, A. Sharma2, V. Ramgopal Rao2, and K.F. Böhringer1 1University of Washington, USA and 2Indian Institute of Technology (IIT Bombay), INDIA ...... 1079
T3P.051 OHMIC CONTACTS ON N-TYPE POLYCRYSTAL SILICON CARBIDE WITH Ti/TaSi2/Pt S. Jin1, X.A. Fu2, and M. Mehregany1 1Case Western Reserve University, USA and 2University of Louisville, USA ...... 1083
T3P.052 STRESS AND STRAIN GRADIENT CONTROL OF POLYCRYSTALLINE SiC FILMS X.A. Fu1, J. Dunning2, C.A. Zorman2, and M. Mehregany2 1University of Louisville, USA and 2Case Western Reserve University, USA ...... 1087
T3P.053 SUSPENDED MICROSTRUCTURES MADE USING SILICON MIGRATION R. Kant, M. Ziaei-Moayyed, and R. Howe Stanford University, USA ...... 1091
T3P.054 WAFER RECONSTITUTION WITH PRECISION DRY FRONT-TO-FRONT REGISTRATION J.-W.P. Chen and R.T. Howe Stanford University, USA ...... 1095
T3P.055 CREATING MICROSTRUCTURES IN ELECTROSPUN NANOFIBERS USING A MICROPATTERNED COLLECTOR CHIP H. Zeng and Y. Zhao Ohio State University, USA ...... 1099
T3P.056 CHARACTERIZATIONS AND OPTIMIZATION OF ELECTRICAL CONTACT BETWEEN NANOCOMPOSITE ELASTOMER AND METAL H. Hu and C. Liu Northwestern University, USA ...... 1103
T3P.057 3D HIGH ASPECT RATIO, MEMS INTEGRATED MICRO-SOLENOIDS AND HELMHOLTZ MICRO-COILS V. Badilita, K. Kratt, T. Burger, J.G. Korvink, and U. Wallrabe University of Freiburg, GERMANY ...... 1106
T3P.058 STEPPED-ETCHING FOR PRESERVING CRITICAL DIMENSIONS IN THROUGH-WAFER DEEP REACTIVE ION ETCHING OF THICK SILICON S.E. Alper, A. Aydemir, and T. Akin Middle East Technical University, TURKEY ...... 1110
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T3P.059 DESIGN, FABRICATION, AND ASSEMBLY OF A HOLLOW-CORE FIBER-BASED MICRO CRYOGENIC COOLER M.-H. Lin1, P.E. Bradley2, H.-J. Wu1, J.C. Booth2, R. Radebaugh2, and Y.C. Lee1 1University of Colorado, Boulder, USA and 2National Institute of Standards and Technology, USA ...... 1114
T3P.060 A NOVEL MONOLITHICALLY INTEGRATED PRESSURE, ACCELEROMETER AND TEMPERATURE COMPOSITE SENSOR Q. Wang1, X. Li1, T. Li1, M. Bao2, K. Zhang1, X. Ge1, W. Zhou1, and H. Bao1 1Chinese Academy of Sciences, CHINA and 2Fudan University, CHINA ...... 1118
T3P.061 A MULTI-TERMINAL PRESSURE SENSOR WITH ENHANCED SENSITIVITY G.O. Coraucci, M.R. Finardi, and F. Fruett University of Campinas (Unicomp), BRAZIL ...... 1122
T3P.062 SIMULATION AND FABRICATION OF A 2D-FLOW SENSOR FOR THERMAL CHARACTERIZATION OF FLUIDS AND FOR FLOW SPEED MEASUREMENTS A.S. Cubukcu and G.A. Urban University of Freiburg, GERMANY ...... 1126
T3P.063 PRESSURE STABLE THERMOELECTRIC FLOW SENSORS BY MEANS OF MEMBRANE PERFORATION M. Kropp1, C. Kutzner2, N. Hartgenbusch1, S. Gu1, C. Sosna1, R. Buchner1, P. Hauptmann2, and W. Lang1 1University Bremen, GERMANY and 2IMOS University Magdeburg, GERMANY ...... 1130
T3P.064 SINGLE ELEMENT 3-TERMINAL PRESSURE SENSORS: A NEW APPROACH TO PRESSURE SENSING AND ITS COMPARISON TO THE HALF-BRIDGE SENSORS U. Gowrishetty, K. Walsh, S. McNamara, T. Roussel, and J. Aebersold University of Louisville, USA ...... 1134
T3P.065 USING ENCAPSULATED MEMS RESONATORS TO MEASURE EVOLUTION IN THIN FILM STRESS Y.Q. Qu1, R. Melamud2, and T.W. Kenny1 1Stanford University, USA and 2SiTime Corporation, USA ...... 1138
T3P.066 FIBER-OPTICAL ACOUSTIC SENSOR BASED ON A PHOTONIC-CRYSTAL DIAPHRAGM O. Kilic, M.J.F. Digonnet, G.S. Kino, and O. Solgaard Stanford University, USA ...... 1142
T3P.067 TRANSPARENT AND FLEXIBLE TACTILE SENSOR FOR MULTI TOUCH SCREEN APPLICATION WITH FORCE SENSING H.-K. Kim1, S.-G. Lee1, J.-E. Han1, T.-R. Kim1, S.-U. Hwang1, S.D. Ahn2, I.-K. You2, K.-I. Cho2, T.-K. Song1, and K.-S. Yun1 1Sogang University, KOREA and 2Electronics & Telecommunications Research Institute, KOREA ...... 1146
T3P.068 HIGH SENSITIVITY ULTRASONIC TRANSDUCER ARRAY FOR 2-D HYDROPHONE APPLICATION, USING AN EPITAXIAL PZT THIN FILM GROWN ON ɣ-Al2O3/Si I. Kanja1, M. Otonari1, T. Yogi1, D. Akai1, K. Sawada1, M. Ishida1, N. Okada2, and K. Higuchi2 1Toyohashi University of Technology, JAPAN and 2Honda Electronics Co., Ltd., JAPAN ...... 1150
T3P.069 A NOVEL SOI Z-AXIS ACCELEROMETER WITH GAP CLOSING DIFFERENTIAL SENSING ELECTRODES C.-P. Hsu, M.-C. Yip, and W. Fang National Tsing Hua University, TAIWAN ...... 1154
T3P.070 A NEW Z-AXIS CAPACITIVE ACCELEROMETER WITH HIGH IMPACT DURABILITY Y. Hirata, N. Konno, T. Tokunaga, M. Tsugai, and H. Fukumoto Mitsubishi Electric Corporation, JAPAN ...... 1158
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T3P.071 THE DEVELOPMENT OF NOVEL SURFACE ACOUSTIC WAVE MEMS-IDT GYROSCOPE BASED ON STANDING WAVE MODE H. Oh, K. Lee, and S. Yang Ajou University, KOREA ...... 1162
T3P.072 A DIGITAL OUTPUT PIEZOELECTRIC ACCELEROMETER USING CMOS-COMPATIBLE ALN THIN FILM T. Kobayashi, H. Okada, M. Akiyama, R. Maeda, and T. Itoh National Institute of Advanced Industrial Science and Technology (AIST), JAPAN ...... 1166
T3P.073 DESIGN AND FABRICATION OF CONVECTIVE INERTIAL SENSOR CONSISTING OF 3DOF GYROSCOPE AND 2DOF ACCELEROMETER V.T. Dau, T. Otake, T.X. Dinh, and S. Sugiyama Ritsumeikan University, JAPAN ...... 1170
T3P.074 MICRO ACCELEROMETER USING SCREEN PRINTED BATIO3 FILM ON A CERAMIC SUBSTRATE M. Suzuki1, Y. Kobayashi1, S. Aoyagi1, H. Tajiri2, and T. Nagahata2 1Kansai University, JAPAN and 2ROHM Co., Ltd., JAPAN ...... 1174
T3P.075 A MICROMACHINED SUSPENDED PLATE VISCOSITY SENSOR FEATURING IN-PLANE VIBRATIONS AND INTEGRATED PIEZORESISTIVE READOUT C. Riesch1, E.K. Reichel2, A. Jachimowicz1, J. Schalko1, B. Jakoby2, and F. Keplinger1 1Vienna University of Technology, AUSTRIA and 2Johannes Kepler University Linz, AUSTRIA ...... 1178
T3P.076 SINGLE PULSE PROXIMAL DISTANCE SENSOR WITH THERMOACOUSTIC TRANSMITTER Y. Hashimoto, A. Nakai, K. Matsumoto, and I. Shimoyama University of Tokyo, JAPAN ...... 1182
T3P.077 NEW POLYSILICON SENSOR AND ACTUATOR TECHNOLOGY FOR THE DEVELOPMENT OF A THERMAL PLATFORM B. Marty, T. Camps, J. Tasselli, A. Marty, and D. Lagrange Université de Toulouse, FRANCE ...... 1186
T3P.078 MICRO- AND NANOSTRUCTURED MAGNETIC FIELD SENSOR FOR SPACE APPLICATIONS A. Persson, H. Nguyen, F. Riddar, and G. Thornell Uppsala University, SWEDEN ...... 1190
T3P.079 PARAMETRICALLY AMPLIFIED MEMS MAGNETOMETER M.J. Thompson and D.A. Horsley University of California, Davis, USA ...... 1194
T3P.080 FLASH TYPE MEMS-BASED ANALOG-TO-DIGITAL CONVERTER OF FIELD EMISSION P. Lee1, S.H. Lee1, S.W. Kwon2, Y.T. Hong2, and S.S. Lee1 1Korea Advanced Institute of Science and Technology (KAIST), KOREA and 2Samsung Advanced Institute of Technology, KOREA ...... 1198
Medical Microsystems
T3P.081 IMPLANTABLE POLYCRYSTALLINE DIAMOND NEURAL PROBE FOR IN VIVO AND IN VITRO PHYSIOLOGICAL RECORDING H.-Y. Chan, M. Varney, S. Hatch, and D.M. Aslam Michigan State University, USA ...... 1202
T3P.082 FABRICATION OF 3-DIMENSIONAL SILICON MICROELECTRODE ARRAYS USING MICRO ELECTRO DISCHARGE MACHINING FOR NEURAL APPLICATIONS P. Tathireddy, D. Rakwal, E. Bamberg, and F. Solzbacher University of Utah, USA ...... 1206
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T3P.082 FABRICATION OF 3-DIMENSIONAL SILICON MICROELECTRODE ARRAYS USING MICRO ELECTRO DISCHARGE MACHINING FOR NEURAL APPLICATIONS P. Tathireddy, D. Rakwal, E. Bamberg, and F. Solzbacher University of Utah, USA ...... 1206
T3P.083 WAFER-SCALE PROCESSED, LOW-IMPEDANCE, NEURAL ARRAYS WITH VARYING LENGTH MICROELECTRODES R. Bhandari1,2, S. Negi1,2, L. Reith1, and F. Solzbacher1,2 1University of Utah, USA and 2Blackrock Microsystems, USA ...... 1210
T3P.084 AN ENDOSCOPE UTILIZING TUNABLE-FOCUS MICROLENSES ACTUATED THROUGH INFRARED-LIGHT X. Zeng and H. Jiang University of Wisconsin, Madison, USA ...... 1214
T3P.085 BIOSENSOR FOR CALCIUM BASED ON A HYDROGEL OPTICAL WAVEGUIDE WITH INTEGRATED SENSOR PROTEINS T. Förster1, C. Strohhöfer1, K. Bock1,2, P. Kasak3, M. Danko3, Z. Kronekova3, T. Nedelcev3, I. Krupa3, and I. Lacik3 1Fraunhofer IZM, GERMANY, 2Technical University of Berlin, GERMANY, and 3PISAS, SLOVAKIA ...... 1218
T3P.086 CMUT-IN-CMOS ULTRASONIC TRANSDUCER ARRAYS WITH ON-CHIP ELECTRONICS X. Cheng1, D.F. Lemmerhirt1, O.D. Kripfgans2, M. Zhang2, C. Yang1, C.A. Rich1, and J.B. Fowlkes2 1Sonetics Ultrasound, USA and 2University of Michigan Medical School, USA ...... 1222
Microfluidics
T3P.087 A QUADRUPOLAR MAGNETIC ACTUATION SYSTEM FOR SUPERPARAMAGNETIC PARTICLES Y. Moser, T. Lehnert, and M.A.M. Gijs Ecole Polytéchnique Fédérale de Lausanne (EPFL), SWITZERLAND ...... 1226
T3P.088 VACUUM SUPPORTED LIQUID WASTE HANDLING FOR DNA EXTRACTION ON CENTRIFUGALLY OPERATED LAB-ON-A-CHIP SYSTEMS D. Mark1, S. Haeberle1, S. Lutz1, R. Zengerle1,2, and F. von Stetten1,2 1Institute for Micromachining and Information Technology (HSG-IMIT), GERMANY and 2University of Freiburg - IMTEK, GERMANY ...... 1230
T3P.089 HIGH-PERFORMANCE MAGNETIC ACTIVE-VALVE MICROPUMP M. Shen and M.A.M. Gijs Ecole Polytéchnique Fédérale de Lausanne (EPFL), SWITZERLAND ...... 1234
T3P.090 MAGNETIC PARTICLE DOSING, RELEASE AND SEPARATION IN A MICROFLUIDIC CHIP WITH MAGNETIC ACTUATION R. Afshar, T. Lehnert, Y. Moser, and M.A.M. Gijs Ecole Polytéchnique Fédérale de Lausanne (EPFL), SWITZERLAND ...... 1238
T3P.091 MICROFABRICATED OUT-OF-PLANE ARRAYS OF INTEGRATED CAPILLARY NANO-ELECTROSPRAY EMITTERS R. Krpoun and H.R. Shea Ecole Polytéchnique Fédérale de Lausanne (EPFL), SWITZERLAND ...... 1242
T3P.092 A NEW PLATFORM FOR MANIPULATION AND SEPARATION OF OIL-IN-WATER EMULSION DROPLETS USING OPTICALLY INDUCED DIELECTROPHORESIS S.-H. Hung1, Y.-H. Lin1, and G.-B. Lee1,2 1National Cheng Kung University, TAIWAN and 2Industrial Technology Research Institute, TAIWAN ...... 1246
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T3P.093 ON-CHIP DROPLET ENHANCED FLUORESCENCE EMISSION FOR LOW CONCENTRATION PROTEIN MEASUREMENT Y.F. Yu1,2, T. Bourouina2, and A.Q. Liu1 1Nanyang Technological University, SINGAPORE and 2University of Paris Est, FRANCE ...... 1250
T3P.094 IMPROVEMENT OF DETECTION SENSITIVITY USING ELECTRODES WITH MICROPILLAR STRUCTURES T. Ginoza, K. Okamura, J. Fukuda, and H. Suzuki University of Tsukuba, JAPAN ...... 1253
T3P.095 LOCAL STIMULATION TO SINGLE CELL ON TISSUE-MIMICKING MICROFLUIDIC DEVICE K. Terao1,2, A. Okonogi1.2, T. Okitsu2,3, T. Suzuki2,4, M. Washizu2,5, and H. Kotera1,2 1Kyoto Univeristy, JAPAN, 2Japan Science and Technology Agency (JST), JAPAN, 3Kyoto University Hospital, JAPAN, 4Kagawa University, JAPAN, and 5University of Tokyo, JAPAN ...... 1257
T3P.096 PRECISE DOSAGE SYSTEM FOR CONTROLLED LIQUID DELIVERY BASED ON FAST MEMS BASED FLOW SENSOR M. Goetz1, S. Messner1, M. Ashauer1, and R. Zengerle1,2 1Institute for Micromachining and Information Technology (HSG-IMIT), GERMANY and 2University of Freiburg - IMTEK, GERMANY ...... 1261
T3P.097 LIQUID RECIRCULATION IN MICROFLUIDIC CHANNELS BY THE INTERPLAY OF CAPILLARY AND CENTRIFUGAL FORCES J.L. Garcia-Cordero1, L. Basabe-Desmonts1, J. Ducrée1, L.P. Lee1,2, and A.J. Ricco1 1Dublin City University, IRELAND and 2University of California, Berkeley, USA ...... 1265
T3P.098 A DIGITAL DILUTION CHIP USING SELECTIVE CONTROL OF INTER-WELL VALVES D.W. Lee and Y.-H. Cho Korea Advanced Institute of Science and Technology (KAIST), KOREA ...... 1269
T3P.099 A BONDING-FREE PROCESS FOR FABRICATING INTEGRATED MICROFLUIDIC DEVICES WITH EMBEDDED ELECTRODES UTILIZING LOW-COST UV CURABLE RESINS S.-M. Kuo, C.-C. Yang, J.-T. Hsieh, and C.-H. Lin National Sun Yat-sen University, TAIWAN ...... 1273
T3P.100 AN AIR-BUBBLE-ACTUATED MICROPUMP FOR ON-CHIP BLOOD TRANSPORTATION S.-H. Chiu and C.-H. Liu National Tsing Hua University, TAIWAN ...... 1277
T3P.101 HYBRID INTEGRATED PLATFORM OF PDMS MICROFLUIDICS AND SILICA CAPILLARY FOR EFFECTIVE CE AND ESI-MS COUPLING I.K. Dimov1, A. Riaz1, J. Ducrée1, and L.P. Lee2 1Dublin City University, IRELAND and 2University of California, Berkeley, USA ...... 1281
T3P.102 SIMULATION AND OPTIMIZATION OF TRANSPORT IN A LINEAR BROWNIAN MOTOR B.C. Trzynadlowski1, S. Volz2, S.T. Dunham1, E. Altintas2, H. Fujita2, and K.F. Böhringer1 1University of Washington, USA and 2University of Tokyo, JAPAN ...... 1285
T3P.103 A THERMALLY ACTUATED MICROFLUIDIC RELAY VALVE V. Bazargan and B. Stoeber University of British Columbia, CANADA ...... 1289
T3P.104 PROPULSION AND STEERING OF A FLOATING MINI-ROBOT BASED ON MARANGONI FLOW ACTUATION K. Visvanathan, F. Shariff, S.Y. Yee, and A. Basu University of Michigan, USA ...... 1293
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T3P.105 DIFFERENTIAL IMPEDANCE SPECTROMETER AND VISION SYSTEM FOR ANALYSIS OF SINGLE CELLS T. Lanz, S. Hafizovic, J. Rothe, R. Streichan, N. Goedecke, F. Heer, and A. Hierlemann ETH Zürich, SWITZERLAND ...... 1297
T3P.106 A FULLY ADDRESSABLE MICRO-ARRAY CHIP INTEGRATED WITH CASCADE MULTIPLEXORS FOR SELECTIVE CELL LOADING AND RETRIEVAL X. Lou1, J. Chung1,2, Y.J. Kim1,2, I.-J. Cho1, and E. Yoon1,2 1University of Michigan, USA and 2University of Minnesota, USA ...... 1301
Nanoscale Materials & Fabrication Technology, Devices & Systems
T3P.107 FABRICATION AND PROCESS CHARACTERIZATION OF ATOM TRANSISTOR CHIPS H.C. Chuang1,2, E.A. Salim2, V. Vuletic3, D.Z. Anderson2, and V.M. Bright2 1National Taipei University of Technology, TAIWAN, 2University fo Colorado, USA, and 3Massachusetts Institute of Technology, USA ...... 1305
T3P.108 DEVELOPMENT OF 100-NM-THICK SELF-SENSING NANOCANTILEVERS AND CHARACTERIZATION OF THE TEMPERATURE DEPENDENCE OF THE PIEZORESISTIVITY AND CONDUCTIVITY Y. Jiang, T. Ono, and M. Esashi Tohoku University, JAPAN ...... 1309
T3P.109 A H2 MICROSENSOR BASED ON NANOCOLUMNAR TUNGSTEN OXIDE GROWN BY TEMPLATE-ASSISTED ANODIZATION R. Calavia1, A. Mozalev2, V. Kahtko1, G. Gorokh2, X. Vilanova1, X. Correig1, I. Grácia3, C. Cané3, and E. Llobet1 1University Rovira i Virgili, SPAIN, 2Belarusian State University, BELARUS, and 3Centre Nacional de Microelectrónica, SPAIN ...... 1313
T3P.110 STRESS-ASSISTANT SELECTIVE ETCHING MECHANISM FOR LITHOGRAPHY-INDEPENDENT NANOFABRICATION F. Ding, C. Ni, W.X. Yu, C. Li, W.G. Wu, and J. Xu Peking University, CHINA ...... 1317
T3P.111 YOUNG'S MODULUS MEASUREMENT METHOD FOR NANO-SCALE FILM MATERIALS BY USING MEMS RESONATOR ARRAY D. Goto1, T. Namazu1, S. Inoue1, T. Takeuchi2, K. Murakami2, E. Komatsu2, Y. Kawashimo2, and T. Takano3 1University of Hyogo, JAPAN, 2Shinko Seiki Co., Ltd., JAPAN, and 3New Industry Research Organization (NIRO), JAPAN ...... 1321
T3P.112 ORGANIC EMITTING LAYER FORMATION WITH MICROFLUIDIC CHANNEL FOR MULTI-COLORED OLED ARRAY S. Takaya1, N. Misawa2, and S. Takeuchi1,2 1University of Tokyo, JAPAN and 2Japan Science and Technology Agency (JST), JAPAN ...... 1325
T3P.113 PATTERNING HIGH DENSITY SWNT NETWORKS ON FLEXIBLE PARYLENE-C SUBSTRATE C.-L. Chen, C.-F. Yang, X. Xiong, A. Busnaina, and M.R. Dokmeci Northeastern University, USA ...... 1329
T3P.114 SENSITIVITY ENHANCEMENT OF PIEZORESISTIVE MICRO ACCELERATION SENSORS WITH NANOMETER STRESS CONCENTRATION REGIONS ON SENSING ELEMENTS R. Amarasinghe, D.V. Dao, V.T. Dau, B.T. Tung, and S. Sugiyama Ritsumeikan University, JAPAN ...... 1333
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T3P POSTER SESSION II (continued)
T3P.115 FABRICATION AND CHARACTERIZATION OF MULTIPLE NANOWIRES USING MICROTUBULE STRUCTURES K. Wada1, M.C. Tarhan2, C. Bottier2, D. Collard2, H. Fujita2, and R. Yokokawa1 1Ritsumeikan University, JAPAN and 2University of Tokyo, JAPAN ...... 1337
T3P.116 DESIGN OF A NOVEL MICROREACTOR FOR MICROFLUIDIC SYNTHESIS OF SILICA NANOPARTICLES C.K. Chung, T.R. Shih, and B.H. Wu National Cheng Kung University, TAIWAN ...... 1341
Optical MEMS
T3P.117 PITCH-VARIABLE MEMS GRATING WITH 4-LEVEL BLAZED SURFACE Y. Wang, Y. Kanamori, and K. Hane Tohoku University, JAPAN ...... 1345
T3P.118 GAN-LED GROWTH ON SI SUBSTRATE BY MBE/MOCVD AND MONOLITHIC FABICATION OF A LIGHT DISTRIBUTION VARIABLE DEVICE M. Wakui, R. Ito, H. Sameshima, F.-R. Hu, and K. Hane Tohoku University, JAPAN ...... 1349
T3P.119 CHARACTERISTICS OF MICROMACHINED INJECTION LOCKING LASERS H. Cai1,2, B. Liu1, J. Tamil1, W.M. Zhu1, J.F. Tao1, W. Zhang1, Q.X. Zhang2, and A.Q. Liu1 1Nanyang Technological University, SINGAPORE and 2Institute of Microelectronics, SINGAPORE ...... 1353
T3P.120 MEMS TUNABLE FABRY-PEROT FILTERS WITH THICK, TWO SIDED OPTICAL COATINGS P.A. Stupar, R.L. Borwick III, J.F. DeNatale, P.H. Kobrin, and W.J. Gunning Teledyne Scientific and Imaging, USA ...... 1357
T3P.121 THERMO-OPTIC INFRARED FOCAL PLANE ARRAY X. Yan, F. Feng, and Y.L. Wang Chinese Academy of Sciences, CHINA ...... 1361
T3P.122 ELLIPSOIDAL MICRO LENS FABRICATED BY DEPOSITING PARYLENE DIRECTLY ON LIQUID R. Miyamoto, N. Binh-Khiem, E. Iwase, K. Matsumoto, and I. Shimoyama University of Tokyo, JAPAN ...... 1365
T3P.123 CMOS-MEMS KNIFE-EDGE OPTICAL SPOT PROFILING SYSTEM Y. Chiu, T.L. Chang, and C.H. Pan National Chiao Tung University, TAIWAN ...... 1369
T3P.124 SELF-POWERED OPTICAL SENSOR SYSTEMS H. Wu1, A. Emadi1, G. de Graaf1, J. Leijtens2, and R.F. Wolffenbuttel1 1Delft University of Technology, THE NETHERLANDS and 2TNO Science and Industry, THE NETHERLANDS ...... 1373
T3P.125 HYPERSPECTRAL IMAGING USING A MICROMACHINED IN-PLANE VIBRATORY GRATING SCANNER G. Zhou, K.K.L. Cheo, Y. Du, and F.S. Chau National University of Singapore, SINGAPORE ...... 1377 Power MEMS
T3P.126 AN ELECTROSTATIC ENERGY HARVESTER WITH ELECTRET BIAS E. Halvorsen1, E.R. Westby1, S. Husa1, A. Vogl2, N.P. Østbø2, V. Leonov3, T. Sterken3, and T. Kvisterøy4 1Vestfold University College, NORWAY, 2SINTEF, NORWAY, 3IMEC, BELGIUM, and 4SensoNor Technologies AS, NORWAY ...... 1381
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T3P.127 TEMPERATURE THRESHOLD TUNING OF A THERMAL HARVESTING SWITCH L. Carlioz1,2, J. Delamare1, and S. Basrour2 1Techniques of Informatics and Microelectronics for Integrated Systems Architecture (TIMA), FRANCE, and 2G2Elab, FRANCE ...... 1385
T3P.128 HARVESTING ENERGY FROM VEHICLE WHEELS G. Manla, N.M. White, and J. Tudor Southampton University, UK ...... 1389
T3P.129 MICROSTRUCTURED POLYMER FOR SHOE POWER GENERATION D. Han and V. Kaajakari Louisiana Tech University, USA ...... 1393
T3P.130 ELECTROMAGNETIC MICRO GENERATOR ARRAY CONSISTING OF 3D MICRO COILS OPPOSING A MAGNETIC PDMS MEMBRANE B. Mack, K. Kratt, M. Stürmer, and U. Wallrabe University of Freiburg - IMTEK, GERMANY ...... 1397
T3P.131 SYMMETRIC SILICON MICRO FUEL CELL WITH POROUS ELECTRODES G. Scotti, P. Kanninen, T. Kallio, and S. Franssila Helsinki University of Technology, FINLAND ...... 1401
RF MEMS, Resonators & Oscillators
T3P.132 MEMS FREQUENCY DETECTOR AT X-BAND BASED ON MMIC TECHNOLOGY D. Hua, X.P. Liao, J. Zhang, and Y. Jiao Southeast University, CHINA ...... 1405
T3P.133 HIGH TEMPERATURE STABLE RF MEMS SWITCH BASED ON TUNGSTEN-TITANIUM S. Klein1, S. Thilmont1, V. Ziegler2, U. Prechtel2, U. Schmid3, and H. Seidel1 1Saarland University, GERMANY, 2EADS Innovation Works, GERMANY, and 3Vienna University of Technology, AUSTRIA ...... 1409
T3P.134 PIEZORESISTIVE RING-SHAPED MEMS RESONATOR K.L. Phan1, J.T.M. van Beek1, and G.E.J. Koops2 1NXP Semiconductors, THE NETHERLANDS and 2NXP Semiconductors, BELGIUM ...... 1413
T3P.135 MODEL FOR PREDICTING SPURIOUS MODES CAUSED BY FRINGING FIELDS IN LATERAL ELECTROSTATIC ACTUATORS FOR MEM RESONATORS S. Stoffels1,3, X. Rottenberg1, S. Boedecker2, R. Puers3, C. Rembe2, and H.A.C. Tilmans1 1IMEC, BELGIUM, 2Polytec Gmbh, GERMANY, and 3Katholieke Universiteit Leuven, BELGIUM ...... 1417
T3P.136 ENCAPSULATED OUT-OF-PLANE DIFFERENTIAL SQUARE-PLATE RESONATOR WITH INTEGRATED ACTUATION ELECTRODES K.-L. Chen, S. Wang, J. Salvia, R.T. Howe, and T.W. Kenny Stanford University, USA ...... 1421
T3P.137 SQUEEZED FILM DAMPING MEASUREMENTS ON A PARALLEL-PLATE MEMS IN THE FREE MOLECULE REGIME L. Mol1, L.A. Rocha2, E. Cretu3, and R.F. Wolffenbuttel1 1Delft University of Technology, THE NETHERLANDS, 2University of Minho, PORTUGAL, and 3University of British Columbia, CANADA ...... 1425
T3P.138 CONTACTLESS ELECTROMAGNETIC INTERROGATION OF A MEMS-BASED MICRORESONATOR USED AS PASSIVE SENSING ELEMENT B. Andò1, S. Baglio1, M. Baù2, V. Ferrari2, E. Sardini2, N. Savalli1, M. Serpelloni2, and C. Trigona1 1University of Catania, ITALY and 2University of Brescia, ITALY ...... 1429
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T3P POSTER SESSION II (continued)
T3P.139 56 MHZ PIEZORESISTIVE MICROMECHANICAL OSCILLATOR J.J.M. Bontemps1,2, A. Murroni2, J.T.M. van Beek2, J.A.T.M. van den Homberg2, J.J. Koning2, G.E.J. Koops3, G.J.A.M. Verheijden3, J. van Wingerden2, K.L. Phan2, P. Vermeeren2, C. van der Avoort2, H.C.W. Beijerinck1, and P.G.M. Baltus1 1Technische Universiteit Eindhoven, THE NETHERLANDS, 2NXP Semiconductors, THE NETHERLANDS, and 3NXP Semiconductors, BELGIUM ...... 1433
T3P.140 HIGH-Q, GALLIUM NITRIDE NANOWIRE-ALD COMPOSITE MECHANICAL RESONATORS J.R. Montague1, D. Seghete1, K.A. Bertness2, N.A. Sanford2, S.A. George1, V.M. Bright1, and C.T. Rogers1 1University of Colorado, USA and 2National Institute of Standards and Technology (NIST), USA ...... 1437
T3P.141 7MHZ LENGTH-EXTENSIONAL SOI RESONATORS WITH T-SHAPED ANCHORS L. Khine and M. Palaniapan National University of Singapore, SINGAPORE ...... 1441
T3P.142 QUALITY FACTOR ENHANCEMENT OF MICROMECHANICAL RESONATORS AT CRYOGENIC TEMPERATURES W.-C. Li, Y. Lin, B. Kim, Z. Ren, and C.-T. Nguyen University of California, Berkeley, USA ...... 1445
15:30 - 16:00 BREAK & EXHIBIT INSPECTION
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PARALLEL ORAL SESSIONS
Medical Flow & Acoustic Microsystems I NEMS Actuators I Devices
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F
Session Chairs:
J. Judy, K. Turner, D. Horsley, S. Bouwstra, University of California, University of California, University ofCalifornia, MEMS TC, Los Angeles, USA Santa Barbara, USA Davis, USA THE NETHERLANDS
S. Konishi, M. Wong, Hong Kong Ritsumeikan University, University of Science & T. Ono, M. Judy, JAPAN Technology, HONG KONG Tohoku University, JAPAN Analog Devices, USA
16:00 - 16:15 T4B.001 T4C.001 T4E.001 T4F.001 A NOVEL SS-DNA-DECORATED SINGLE MASK 3-PHASE A PIEZO-ACTUATED LAB-ON-A-TUBE SINGLE-WALLED ELECTROSTATIC CLOSED LOOP MEMS FOR MULTIMODAL CORBON NANOTUBES ROTARY STEPPER SYSTEM FOR ACTIVE MONITORING OF INTEGRATED ON CMOS MICROMOTOR DELAY OF TRANSITION PATIENTS WITH CIRCUITRY FOR HIGH E. Sarajlic1, D. Haller1, J. Hempel1, TRAUMATIC BRAIN SENSITIVITY GAS C. Yamahata2, A. Paetzold2, N. Losse2, INJURY SENSING M. Cordero3, L. Jalabert3, I. Peltzer2, W. Nitsche2, C. Li, P.-M. Wu, W. Jung, C.-L. Chen1, C.-F. Yang1, T. Iizuka3, and H. Fujita3 R. King2, and P. Woias1 C.H. Ahn, L.A. Shutter, V. Agarwal2, 1SmartTip B.V., 1University of Freiburg - and R.K. Narayan S. Sonkusale2, Enschede, IMTEK, GERMANY and University of Cincinnati, A. Busnaina1, M. Chen3, THE NETHERLANDS, 2Berlin Institute of USA and M.R. Dokmeci1 2Ecole Polytéchnique Technology, GERMANY ...... 1449 1Northeastern University, Fédérale de Lausanne ...... 1533 USA, 2Tufts University, (EPFL), SWITZERLAND, USA, and 3Simmons and 3University of Tokyo, College, USA JAPAN ...... 1477 ...... 1505 16:15 - 16:30 T4B.002 T4C.002 T4E.002 T4F.002 IMPLANTABLE NANO-PILLAR A CMOS-MEMS ROTARY A METAL-ON-SILICON FLUORESCENT STRUCTURE FOR MICROACTUATOR DIFFERENTIAL HYDROGEL FOR SENSITIVITY SUITABLE FOR HARD CAPACITIVE SHEAR CONTINOUS BLOOD ENHANCEMENT DISK DRIVE STRESS SENSOR GLUCOSE MONITORING OF SPR SENSOR APPLICATIONS V. Chandrasekharan, H. Shibata1,3, Y. Tsuda1,2, T. Kan, K. Matsumoto, W. Messner1, J.A. Bain1, J. Sells, J. Meloy, T. Kawanishi1,3, and I. Shimoyama M. Koenders2, D.P. Arnold, N. Yamamoto1,2, University of Tokyo, J. Groenesteijn2, and M. Sheplak T. Okitsu1,4, and JAPAN G.H. Marsman2, University of Florida, USA S. Takeuchi1,2 1481 P.J. Gilgunn1, ...... 1537 1BEANS Project, JAPAN, and G.K. Fedder1 2University of Tokyo, 1Carnegie Mellon JAPAN, 3TERUMO Co. University, USA and R&D Center, JAPAN, and 2University of Twente, 4Kyoto University Hospi- THE NETHERLANDS tal, JAPAN ...... 1509 ...... 1453 16:30 - 16:45 T4B.003 T4C.003 T4E.003 T4F.003 A CAPACITIVELY BASED A DIRECT-WRITE A PHOTOVOLTAIC HIGHLY-SENSITIVE, MEMS AFFINITY PIEZOELECTRIC PVDF PN-JUNCTION BIOMIMETIC HAIR GLUCOSE SENSOR NANOGENERATOR VERTICAL COMB-DRIVE SENSOR ARRAYS X. Huang1, S. Li2, C. Chang, Y.-K. Fuh, MICRO-ACTUATOR FOR SENSING J. Schultz3, Q. Wang2, and L. Lin H.-Y. Huang1, H.-T. Hsu1, LOW-FREQUENCY and Q. Lin1 University of California, H.-Y. Lin2, Y. Chiu3, AIR FLOWS 1Columbia University, Berkeley, USA J.-C. Chiou3, R. K. Jaganatharaja, USA, 2University of South ...... 1485 and W. Fang1 C.M. Bruinink, Carolina, USA, and 1National Tsing Hua B.M. Hagedoorn, 3University of California, University, TAIWAN, M.L. Kolster, Riverside, USA 2Touch Micro-System T.S.J. Lammerink, ...... 1457 Technology Corporation, R.J. Wiegerink, TAIWAN, and and G.J.M. Krijnen 3National Chiao Tung University of Twente, University, TAIWAN THE NETHERLANDS ...... 1513 ...... 1541
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PARALLEL ORAL SESSIONS (continued)
Medical Flow & Acoustic Microsystems I NEMS Actuators I Devices
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F
16:45 - 17:00 T4B.004 T4C.004 T4E.004 T4F.004 A PARYLENE BELLOWS LOW CONTACT SPHINCTER-LIKE EXPLOITATION OF ELECTROCHEMICAL RESISTANCE MICRO MICRO ACTUATORS AEROELASTIC EFFECTS ACTUATOR FOR THERMAL SWITCH BASED FOR DRIFT REDUCTION INTRAOCULAR DRUG WITH CARBON- ON ELECTROACTIVE IN AN ALL-POLYMER DELIVERY NANOTUBE-ENHANCED POLYMER AIR FLOW SENSOR P.-Y. Li, R. Sheybani, CONTACTOR S. Herrlich1, C. Song, A. Aiyar, J.T.W. Kuo, and E. Meng T. Tsukamoto, M. Esashi, R. Zengerle1,2, S.-H. Kim, and M.G. Allen University of Southern and S. Tanaka and S. Haeberle1 Georgia Institute of California, USA Tohoku University, JAPAN 1Institute for Technology, USA ...... 1461 ...... 1489 Micromachining and ...... 1545 Information Technology (HSG-IMIT), GERMANY and 2University of Freiburg - IMTEK, GERMANY ...... 1517 17:00 - 17:15 T4B.005 T4C.005 T4E.005 T4F.005 PH-RESPONSIVE A HIGH SENSITIVITY 2-AXIS MEMS MATERIAL DRUG-DELIVERY SINGLE-WALLED DEFLECTING DISCRIMINATION BY DEVICES FOR CARBON-NANOTUBE- CANTILEVER HEAT FLOW SENSING IMPLANTABLE ARRAY-BASED STRAIN MICROINSTRUMENT K. Katoh, Y. Ichikawa, APPLICATIONS SENSOR FOR WEIGHING FOR IN-SITU E. Iwase, K. Matsumoto, J. Chen, M. Chu, X. Yang1, Z.Y. Zhou1, RELIABLILITY STUDIES and I. Shimoyama K. Koulajian, X.Y. Wu, F.Z. Zheng1, M. Zhang1, F. Liu1,2, I. Laboriante1, University of Tokyo, A. Giacca, and Y. Sun J. Zhang2, and Y.G. Yao2 B. Bush1, C.S. Roper1,2, JAPAN University of Toronto, 1Tsinghua University, C. Carraro1, ...... 1549 CANADA CHINA and 2Peking and R. Maboudian1 ...... 1465 University, CHINA 1University of California, ...... 1493 Berkeley, USA and 2University of Science and Technology of China, CHINA ...... 1521 17:15 - 17:30 T4B.006 T4C.006 T4E.006 T4F.006 IMPLANTABLE MULTI A GOLD FREQUENCY- MICROMACHINED SENSOR SYSTEM FOR NANOPARTICLES SELECTABLE WIRELESS PIEZOELECTRIC MICRO- IN VIVO MONITORING DISPERSION ACTUATION OF PHONE OF CARDIOVASCULAR WAVEGUIDE FOR HYDROGEL USING WITH HIGH SIGNAL TO PARAMETERS LABEL-FREE MICROMACHINED NOISE RATIO P. Bingger1, J. Fiala1, DETECTION RESONANT HEATERS Z.H. Wang1, J.M. Miao1, A. Seifert1, N. Weber1, S. Xiong1, Y. Yang1, H.J. TOWARD IMPLANTABLE T. Xu1, G. Barbastathis2, A. Moser1, Huang2, D.P. Tsai2, DRUG DELIVERY and M. Triantafyllou2 F. Goldschmidtboeing1, and A.Q. Liu1 APPLICATIONS 1Nanyang Technological K. Foerster2, 1Nanyang Technological E.H. Sarraf, G.K. Wong, University, SINGAPORE C. Heilmann2, University, SINGAPORE and K. Takahata and 2Massachusetts F. Beyersdorf2, P. Woias1, and 2National TAIWAN University of British Institute of Technology, and H. Zappe1 University, TAIWAN Columbia, CANADA USA 1University of Freiburg - ...... 1497 ...... 1525 ...... 1553 IMTEK, GERMANY and 2University Hospital Freiburg, GERMANY ...... 1469
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PARALLEL ORAL SESSIONS (continued)
Medical Flow & Acoustic Microsystems I NEMS Actuators I Devices
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 17:30 - 17:45 T4B.007 T4C.007 T4E.007 T4F.007 A WIRELESS DIRECT FORMATION OF “ARTIFICIAL SENSITIVITY BATTERYLESS IN VIVO PARALLELSINGLE- FLAGELLATES” ENHANCEMENT BY EKG AND BODY WALLED CARBON SELECTIVE MICRO HELMHOLTZ TEMPERATURE NANOTUBE BRIDGES ON ATTACHMENT OF RESONATOR FOR SENSING MICROMACHINED WIDE FLAGELLA AS A ULTRASONIC DISTANCE MICROSYSTEM WITH TRENCHES FOR BIOACTUATOR OF A SENSOR ADAPTIVE RF HIGH-PERFORMANCE MICRO-OBJECT A. Suzuki, H. Takahashi, POWERING FOR INFRARED SENSORS N. Mori, K. Kuribayashi, E. Iwase, K. Matsumoto, GENETICALLY F.B. Rao, T. Li, Y.X. Zhou, and S. Takeuchi and I. Shimoyama ENGINEERED MICE X. Liu, P. Zhou, University of Tokyo, University of Tokyo, MONITORING and Y.L. Wang JAPAN JAPAN N. Chaimanonart Chinese Academy of ...... 1529 ...... 1557 and D.J. Young Sciences, CHINA Case Western Reserve ...... 1501 University, USA ...... 1473
17:45 ADJOURN FOR THE DAY
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WEDNESDAY, June 24, 2009 PARALLEL ORAL SESSIONS
Optical Actuation Mass & Tip-Based Micro and Nanofluidics Techniques 3D Technologies Sensors
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F
Session Chairs:
J. Kutter, H. Toshiyoshi, B. Pruitt, S. Franssila, Technical University of University of Tokyo, Stanford University, USA Helsinki University of Denmark, DENMARK JAPAN Technology, FINLAND
Z. Zhou, J. Oberhammer, Tsinghua University, Royal Institute of Technology O. Tabata, S. Hoen, CHINA (KTH), SWEDEN Kyoto University, JAPAN Agilent, USA
08:00 - 08:30 INVITED SPEAKER INVITED SPEAKER INVITED SPEAKER INVITED SPEAKER W1B.001 W1C.001 W1E.001 W1F.001 NANOFLUIDICS: OPTOELECTRONIC MATERIALS AND CANTILEVER SENSORS FUNDAMENTALS AND TWEEZERS - A NEW MECHANICS FOR EQUIPPED WITH NANO APPLICATIONS PARALLEL OPTICAL STRETCHABLE SENSING EFFECTS FOR J.C.T. Eijkel, MANIPULATION TOOL ELECTRONICS - FROM ULTRA-SENSITVIE W. Sparreboom, L. Shui, M.C. Wu, A. Jamshidi, ELECTRONIC EYE DETECTION OF G.B. Salieb-Beugelaar, S.L. Neale, M.-C. Tien, CAMERAS TO BIO/CHEMICAL and A. van den Berg A.T. Ohta, and K. Yu CONFORMAL BRAIN MOLECULES Twente University, University of California, MONITORS X. Li THE NETHERLANDS Berkeley, USA J. Rogers Chinese Academy of ...... 1561 ...... 1582 University of Illinois, Sciences, CHINA Urbana-Champaign, USA ...... 1620 ...... 1602 08:30 - 08:45 W1B.002 W1C.002 W1E.002 W1F.002 A NEW TECHNIQUE TO SURFACE PLASMON HIGH ASPECT RATIO AN ARRAY OF CONSTRUCT THE TWEEZERS-INDUCED MICROELECTRO- MONOLITHIC MICRO AND NANO NANOPARTICLES MECHANICAL FBAR-CMOS FLUIDIC SYSTEM USING PATTERNING IN SYSTEMS: A VERSATILE OSCILLATORS FOR A SINGLE WALL MICROFLUIDICS APPROACH USING MASS-SENSING CARBON NANOTUBE J. Shi, Y.B. Zheng, X. Xi, CARBON NANOTUBES APPLICATIONS J. Oh1, G. Kim2, S.S. Lin, J. Du, AS A FRAMEWORK M.L. Johnston, and H. Noh1 B.R. Tittmann, D.N. Hutchison, Q. Aten, I. Kymissis, 1Drexel University, USA and T.J. Huang B. Turner, N. Morrill, and K.L. Shepard and 2Kyungpook National Pennsylvania State L.L. Howell, B.D. Jensen, Columbia University, USA University, KOREA University, USA R.C. Davis, ...... 1626 ...... 1566 ...... 1586 and R.R. Vanfleet Brigham Young University, USA ...... 1604 08:45 - 09:00 W1B.003 W1C.003 W1E.003 W1F.003 MICROFABRICATED A NEW PLATFORM A THREE-DIMENSIONAL HIGH Q FACTOR PLATE MULTI-TURN GRADIENT FOR MANIPULATING SILICON SHADOW RESONATORS FOR COILS FOR A SINGLE DNA MASK FOR PATTERNING ULTRASENSITIVE MICROSCALE FLOW MOLECULE BY USING ON TRENCHES WITH MASS SENSING IMAGING OPTICALLAY-INDUCED VERTICAL WALLS APPLICATIONS R. Sahebjavaher, DIELECTROPHORESIS S. Morishita1, J.H. Kim1, B. Stoeber, and K. Walus Y.-H. Lin1, C.-M. Chang1, F. Marty2, Y. Li3, V. Agaché, M. Cochet, University of British and G.-B. Lee1,2 A.J. Walton3, and Y. Mita1 R. Blanc, F. Baleras, Columbia, CANADA 1National Cheng Kung 1University of Tokyo, and P. Caillat ...... 1570 University, TAIWAN and JAPAN, 2Université Paris CEA - LETI - Minatec, 2Industrial Technology Est, FRANCE, and FRANCE Research Institute, 3University of Edinburgh, ...... 1630 TAIWAN UK ...... 1590 ...... 1608
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PARALLEL ORAL SESSIONS (continued)
Optical Actuation Mass & Tip-Based Micro and Nanofluidics Techniques 3D Technologies Sensors
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 09:00 - 09:15 W1B.004 W1C.004 W1E.004 W1F.004 MULTIPLEXED ANALYSIS MICROFLUIDIC MINIMIZED BLURRING INTERFEROMETRIC OF INFLAMMATION INTEGRATED IN STENCIL FORCE SENSING BIOMARKERS USING OPTOELECTRONIC LITHOGRAPHY USING AFM PROBES FOR SPECTRALLY-ENCODED TWEEZERS A COMPLIANT NANOMECHANICAL ON-CHIP K.W. Huang1, T.-H. Wu1, MEMBRANE MAPPING OF MATERIAL ELECTROPHORESIS J.F. Zhong2, and P.Y. K. Sidler, G. Villanueva, PROPERTIES C. Hou and A.E. Herr Chiou1 O. Vazquez-Mena, A.F. Sarioglu1, M. Liu2, University of California, 1University of California, and J. Brugger and O. Solgaard1 Berkeley, USA Los Angeles, USA and Ecole Polytéchnique 1Stanford University, USA ...... 1574 2University of Southern Fédérale de Lausanne and 2Agilent California, USA (EPFL), SWITZERLAND Laboratories, USA ...... 1594 ...... 1612 ...... 1634 09:15 - 09:30 W1B.005 W1C.005 W1E.005 W1F.005 MICROFLUIDIC SORTING OF PARAMETER TIP-MATTER TWO-DIMENSIONAL DIFFERENTIATED OPTIMIZATION METHOD INTERACTION IEF-CZE FOR NEURONS USING FOR FABRICATING 3D MEASUREMENTS PROTEOMICS PHOTOTRANSISTOR- MICROSTRUCTURES USING MEMS RING S. Yang1 and D.L. DeVoe2 BASED EMBEDDED IN RESONATORS 1Io Biosystems, Inc., USA OPTOELECTRONIC SINGLE-LAYER E. Algré, B. Legrand, and 2University of TWEEZERS FOR CELL NEGATIVE-TONE M. Faucher, B. Walter, Maryland, USA REPLACEMENT PHOTORESIST and L. Buchaillot ...... 1578 THERAPY OF Y. Hirai, K. Sugano, Centre National de la NEURODEGENERATIVE T. Tsuchiya, Reserche Scientifique DISEASES and O. Tabata (CNRS), FRANCE H.Y. Hsu, H. Lee, Kyoto University, JAPAN ...... 1638 S. Pautot, K. Yu, S. Neale, ...... 1616 A.T. Ohta, A. Jamshidi, J. Valley, E. Isocaff, and M.C. Wu University of California, Berkeley, USA ...... 1598 09:30 - 10:00 BREAK & EXHIBIT INSPECTION PARALLEL ORAL SESSIONS
Chemical Microsensors Biochemical and & Microsystems II Humidity Sensors Metal MEMS Physical Sensors
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F
Session Chairs:
J.R. Morante, M. Maharbiz, M. Esashi, A. Shkel, Catalonia Institute for Energy University of California, Tohoku University, JAPAN University of California, Research (IREC), SPAIN Berkeley, USA Irvine, USA
J.-K. Park, Korea Advanced K. Sawada, G. Hawkins, Institute of Science and Toyohashi University of Eastman Kodak Company, R. Syms, Technology, KOREA Technology, JAPAN USA Imperial College London, UK
10:00 - 10:15 W2B.001 W2C.001 W2E.001 W2F.001 MICROFLUIDIC CMOS BASED SENSORS SILVER NANOPARTICLE TORQUE HIGH-RESOLUTION FOR BIOCHEMICAL STRUCTURES REALIZED MEASUREMENTS OF NMR CHIP FOR ANALYSIS BY DIGITAL SURFACE AN AUTOMOTIVE BIOLOGICAL FLUIDS A. Frey1, M. Schienle1, MICROMACHINING HALFSHAFT UTILIZING J.G.E. Gardeniers1, and H. Seidel2 E.W. Lam, H. Li, A MEMS RESONANT J. Bart1, A.J. Kolkman2, 1Siemens AG, GERMANY and M.A. Schmidt STRAIN GAUGE A.J. de Vries2, and 2Saarland University, Massachusetts Institute D.R. Myers J.W.G. Janssen2, GERMANY of Technology, USA and A.P. Pisano P.J.M. van Bentum2, ...... 1670 ...... 1698 University of California, K.A.M. Ampt2, Berkeley, USA S.S. Wijmenga2, ...... 1726 and A. Kentgens2 1University of Twente, THE NETHERLANDS and 2Radboud University, THE NETHERLANDS ...... 1642
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PARALLEL ORAL SESSIONS (continued)
Chemical Microsensors Biochemical and & Microsystems II Humidity Sensors Metal MEMS Physical Sensors
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 10:15 - 10:30 W2B.002 W2C.002 W2E.002 W2F.002 CNT-BASED GAS SUBCELLULAR- NEW ELECTRICAL IMPLEMENTATION OF IONIZERS WITH RESOLUTION CONNECTION A MONOLITHIC TPMS INTEGRATED MEMS RECORDING OF TECHNOLOGY FOR USING CMOS-MEMS GATE FOR PORTABLE ELECTRICAL ACTIVITY MICROSYSTEMS USING TECHNIQUE MASS SPECTROMETRY USING A CMOS- INKTELLIGENT C.-M. Sun1, M.-H. Tsai1, APPLICATIONS MICROELECTRODE PRINTING® AND C. Wang2, Y.-C. Liu1, L. Velásquez-Garcia1, SYSTEM FUNCTIONAL and W. Fang1 B. Gassend2, U. Frey1, U. Egert2, NANOSCALED INKS 1National Tsing Hua and A. Akinwande1 F. Heer1, S. Hafizovic1, H. Sturm1, C. Sosna1, University, TAIWA and 1Massachusetts Institute and A. Hierlemann1 R. Buchner1, C. Werner2, 2PixArt. Inc, TAIWAN of Technology, USA and 1ETH Zürich, D. Godlinski2, V. Zöllmer2, ...... 1730 2Exponent, Inc., USA SWITZERLAND and M. Busse2, and W. Lang1 ...... 1646 2University of Freiburg, 1University Bremen, GERMANY GERMANY and ...... 1674 2Fraunhofer IFAM, GERMANY ...... 1702 10:30 - 10:45 W2B.003 W2C.003 W2E.003 W2F.003 SELECTIVE DETECTION THE ROLE OF SURFACE MECHANICAL NOVEL EXTENSION OF CHEMICAL SPECIES CHARGE AND BINDING CHARACTERIZATION OF METHODS OF THE IN LIQUIDS AND PROPERTIES IN CMOS METAL LAYERS SENSING PRESSURE GASES USING SILICON-BASED FIELD J. Gaspar1, T. Smorodin2, RANGE OF THE PIRANI RADIO-FREQUENCY EFFECT NANOWIRE M.E. Schmidt1, C. Bohm2, VACUUM SENSOR IDENTIFICATION BIOSENSORS M. Stecher2, and O. Paul1 N. Takashima, (RFID) SENSORS Y. Liu and R.W. Dutton 1University of Freiburg, and M. Kimura R.A. Potyrailo, C. Surman, Stanford University, USA GERMANY and Tohoku Gakuin W.G. Morris, and S. Go ...... 1678 2Infineon Technologies University, JAPAN General Electric AG, GERMANY ...... 1734 Company, USA ...... 1706 ...... 1650 10:45 - 11:00 W2B.004 W2C.004 W2E.004 W2F.004 A MICRO GAS MULTISITE FIELD IMPLEMENTATION OUT-OF-PLANE CHROMATOGRAPH FOR POTENTIAL RECORDING OF A NOVEL ZERO- MICROWIRE FORCE HIGH-SPEED FROM RETINA VIA INSERTION-FORCE (ZIF) SENSOR ARRAYS WITH DETERMINATIONS OF VAPOR-LIQUID-SOLID MEMS-CONNECTOR EMBEDDED P-N DIODES EXPLOSIVE VAPORS GROWN SILICON PROBE B.-H. Jang1,2, BY SELECTIVE G. Serrano, H. Chang, ARRAY H.-Y. Huang1, VAPOR-LIQUID-SOLID and E.T. Zellers T. Harimoto1,2, and W. Fang1 GROWTH University of Michigan, A. Ishihara2, T. Kawano1, 1National Tsing Hua A. Ikedo, T. Kawano, USA K. Takei1, H. Kaneko3, University, TAIWAN and and M. Ishida ...... 1654 M. Ishida1, and S. Usui1,2,4 2Industrial Technology Toyohashi University of 1Toyohashi University of Research Institute (ITRI), Technology, JAPAN Technology, JAPAN, TAIWAN ...... 1738 2Chukyo University, ...... 1710 JAPAN, 3National Institute of Advanced Industrial Science and Technology (AIST), JAPAN and 4RIKEN Brain Science Institute, JAPAN ...... 1682
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PARALLEL ORAL SESSIONS (continued)
Chemical Microsensors Biochemical and & Microsystems II Humidity Sensors Metal MEMS Physical Sensors
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 11:00 - 11:15 W2B.005 W2C.005 W2E.005 W2F.005 LOW LEAK RATE MEMS MINIATURIZED MECHANICAL NEW VALVES FOR MICRO- REFERENCE DEGRADATION ELECTROMAGNETIC GAS-ANALYZER FLOW ELECTRODE WITH A MECHANISM OF TRANSDUCTION CONTROL NEGATIVE FEEDBACK ALUMINUM-ALLOY MICRO-SENSOR P. Galambos, J.W. Lantz, FUNCTION FOR STRUCTURAL FILMS CONCEPT FOR PASSIVE C.D. James, J.L. McClain, POTENTIAL EVALUATED BY WIRELESS PRESSURE M. Baker, R. Anderson, STABILIZATION ENVIRONMENT- MONITORING and R.J. Simonson T. Adachi, J. Fukuda, CONTROLLED TENSILE APPLICATION Sandia National and H. Suzuki TESTING M.M. Jatlaoui, F. Chebila, Laboratories, USA University of Tsukuba, Y. Kaibara1, H. Fujii1, T. I. Gmati, P. Pons, ...... 1658 JAPAN Namazu1, Y. Tomizawa2, and H. Aubert ...... 1686 K. Masunishi2, Université de Toulouse, and S. Inoue1 FRANCE 1University of Hyogo, ...... 1742 JAPAN and 2Toshiba Corporation, JAPAN ...... 1714 11:15 - 11:30 W2B.006 W2C.006 W2E.006 W2F.006 SELECTIVE A MAGNETIC-BEAD MICROFABRICATED, DEVELOPMENT OF PRECONCENTRATION BASED MICROFLUDIC ULTRA-DENSE, FABRIC FORCE SENSOR BY TEMPERATURE SYSTEM FOR RAPID THREE-DIMENSIONAL FOR DETECTING MANIPULATION OF DETECTION OF METAL COILS NORMAL AND LATERAL CASCADED MICRO IMMUNOGLOBULINS F. Herrault1, S. Yorish2, FORCE BY APPLYING PRECONCENTRATORS Y.-F. Lee1, K.-Y. Lien2, T. Crittenden2, UMBONAL FIBER B. Alfeeli1,2 and M. Agah1 H.-Y. Lei1, and M.G. Allen1 G. Kita, Y. Suzuki, 1Virginia Polytechnic and G.-B. Lee1,2 1Georgia Institute of M. Shikida, and K. Sato Institute, USA and 1National Cheng Kung Technology, USA and Nagoya University, 2State University, USA University, TAIWAN and 2Virtual AeroSurface JAPAN ...... 1662 2Industrial Technology Technologies, USA ...... 1746 Research Institute, ...... 1718 TAIWAN ...... 1690 11:30 - 11:45 W2B.007 W2C.007 W2E.007 W2F.007 HIGH-SPEED TWO- IN-SITU FORMATION WAFER QUANTITATIVE VOLUME DIMENSIONAL GAS OF AN ION-DOPED COUNTER-BONDING DETERMINATION OF CHROMATOGRAPHY POROUS STRUCTURE FOR INTEGRATING DISPENSED NANOLITER USING FOR HIGH SENSITIVE CTE-MISMATCHED DROPLETS ON THE FLY MICROFABRICATED HUMIDITY SENSING SUBSTRATES AND A. Ernst1, W. Streule2, GC COLUMNS UTILIZING LOW-COST ITS APPLICATION TO R. Zengerle1, COMBINED WITH UV SENSITIVE GLUE MEMS TUNEABLE and P. Koltay1,2 NANOELECTRO- C.-H. Chen, C.-W. Hung, METAMATERIALS 1University of Freiburg, MECHANICAL and C.-H. Lin M. Sterner, G. Stemme, GERMANY and MASS SENSORS National Sun Yat-sen and J. Oberhammer 2BioFluidix GmbH, J.J. Whiting1, C.S. Fix1, University, TAIWAN Royal Institute of GERMANY J.M. Anderson1, ...... 1694 Technology (KTH), ...... 1750 A.W. Staton1, SWEDEN R.P. Manginell1, ...... 1722 R.D. Wheeler1, E.B. Myers2, M.L. Roukes2, and R.J. Simonson1 1Sandia National Laboratories, USA and 2California Institute of Technology, USA ...... 1666
11:45 - 13:00 LUNCH ON OWN & EXHIBIT INSPECTION
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13:00 - 15:00 W3P POSTER SESSION III - see floor plans starting on page 29 Actuators
W3P.001 SCALABLE CASCADED SNAP-IN ACTUATORS FOR LARGE-STROKE DISPLACEMENTS N. Golay1, A. Masse2, Y. Pétremand1, W. Noell1, J.-F. Manceau2, and N.F. Rooij1 1Ecole Polytéchnique Fédérale de Lausanne (EPFL), SWITZERLAND and 2Universiy of Franche-Comté, FRANCE ...... 1754
W3P.0023 DOF EQUIVALENT CIRCUIT MODEL OF A COMB-DRIVE ACTUATOR Y. Nishimori1, N. Fujiwara2, H. Ooiso1, T. Tuchiya3,4, S. Mochizuoki4, and G. Hashiguchi1 1Shizuoka University, JAPAN, 2Mizuho Information & Research Institute, JAPAN, 3Kyoto University, JAPAN and 4Mathematical Systems Inc., JAPAN ...... 1758
W3P.003 IMPROVED PERFORMANCE OF LARGE STROKE COMB-DRIVE ACTUATORS BY USING A STEPPED FINGER SHAPE J.B.C. Engelen1, M.A. Lantz2, H.E. Rothuizen2, L. Abelmann1, and M.C. Elwenspoek1,3 1University of Twente, THE NETHERLANDS, 2IBM Zürich, SWITZERLAND and 3Albert-Ludwigs Universität, GERMANY ...... 1762
W3P.004 OFF-CHIP ACTUATION FOR ANGULAR POSITION CONTROL OF MEMS MIRRORS S.M. Ardanuc and A. Lal Cornell University, USA ...... 1766
W3P.005 HEATING AND ACTUATION CHARACTERISTICS OF SHAPE MEMORY THIN FILM ACTUATOR FOR BLOOD VESSEL HOLDING M. Ozaki1, N. Kida1, T. Mineta1, E. Makino1, S. Toh2, T. Kawashima2, and T. Shibata2 1Hirosaki University, JAPAN and 2Toyohashi University of Technology, JAPAN ...... 1770
W3P.006 AN ESD PROTECTION DEVICE USING NORMALLY-ON MEMS SWITCH T. Ikehashi and T. Saito Toshiba Corporation, JAPAN ...... 1774
BioSensors & BioMicrosystems
W3P.007 ELECTROACTIVE SURFACES BASED ON CONDUCTING POLYMERS FOR CONTROLLING CELL ADHESION, SIGNALING, AND PROLIFERATION E.W.H. Jager1,3, M.H. Bolin1,3, K. Svennersten2,3, X. Wang1,3, A. Richter-Dahlfors2,3, and M. Berggren1,3 1Linköping University, SWEDEN, 2Karolinska Institutet, SWEDEN, and 3Strategic Research Center for Organic Bioelectronics, SWEDEN ...... 1778
W3P.008 IMPROVEMENT OF CELL CAPTURE EFFICIENCY USING A REVERSIBLE DEP FIELD S.C. Chu1,2, B.Y. Shew2, C.K. Chen2, Y.C. Su1, S.J. Liu3, and C.H. Leng3 1National Tsing Hua University, TAIWAN, 2National Synchrotron Radiation Research Center, TAIWAN, and 3National Health Research Institute, TAIWAN ...... 1782
W3P.009 A MONOLITHICALLY INTEGRATED PLATFORM FOR HIGH THROUGHPUT CELL CHARACTERIZATION AND DRUG SCREENING X. Ji, L. Yang, Z. Wei, L. Wang, J. Xi, and Z. Li Peking University, CHINA ...... 1786
W3P.010 AN ORGANIC ELECTRONIC ION PUMP TO REGULATE INTRACELLULAR SIGNALING AT HIGH SPATIOTEMPORAL RESOLUTION D.T. Simon1,3, E.W.H. Jager1,3, K. Tybrandt1,3, K.C. Larsson2,3, S. Kurup2,3, A. Richter-Dahlfors2,3, and M. Berggren1,3 1Linköping University, SWEDEN, 2Karolinska Institutet, SWEDEN, and 3Strategic Research Center for Organic Bioelectronics, SWEDEN ...... 1790
W3P.011 REPEATEDLY USABLE BIO-MOLECULE CANTILEVER SENSORS WITH A COORDINATION-BOND BREAKING AND RE-LINKING TECHNIQUE H. Yu, J. Li, X. Gan, M. Liu, P. Xu, and X. Li Chinese Academy of Sciences, CHINA ...... 1794
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W3P POSTER SESSION III (continued)
W3P.012 NANOPARTICLE SIZE EFFECT ON THE AMPLIFICATION EFFICIENCY OF NANO-PCR Y.C. Lin, C.C. Su, and H.L. Wu National Cheng Kung University, TAIWAN ...... 1798
W3P.013 A BEAD-BASED ELECTROCHEMICAL BIOSENSOR WITH INTEGRATED MAGNETIC MANIPULATION FOR SAMPLE PRECONCENTRATION Z.-C. Peng1, T. Sulchek1, W. Heineman2, and P. Hesketh1 1Georgia Institute of Technology, USA and 2University of Cincinnati, USA ...... 1802
W3P.014 FLEXIBLE ENZYME FREE GLUCOSE MICRO-SENSOR FOR CONTINUOUS MONITORING APPLICATIONS Y.J. Lee, J.D. Kim, and J.Y. Park Kwangwoon University, KOREA ...... 1806
W3P.015 A CURVATURE CONTROLLED FLEXIBLE SILICON MICRO ELECTRODE ARRAY TO WRAP NEURONS FOR SIGNAL ANALYSIS J.-H. Kim, M. Kubota, A. Higo, H. Abe, Y. Oka, and Y. Mita University of Tokyo, JAPAN ...... 1810
W3P.016 LABEL-FREE ELECTRONIC DETECTION OF GROWTH FACTOR INDUCED CELLULAR CHATTER ON CHEMORECEPTIVE NEURON MOS (CνMOS) TRANSISTORS K. Jayant, T. Porri, J.W. Erickson, and E.C. Kan Cornell University, USA ...... 1814
W3P.017 AN INDUCED CHARGE-SELECTIVE NANOCHANNEL OF MULTIWALL CARBON NANOTUBES (MWCNTS) ARRAY FOR BIOMOLECULAR PRECONCENTRATION IN MICROCHIP R.-G. Wu, Y.-S. Wu, C.-S. Yang, and F.G. Tseng National Tsing Hua University, TAIWAN ...... 1818
W3P.018 A MICROFLUDIC APTASENSOR WITH INTEGRATED SAMPLE PRECONCENTRATION, ISOCRATIC ELUTION AND MASS SPECTROMETRIC DETECTION T.H. Nguyen, R. Pei, M. Stojanovic, D. Landry, and Q. Lin Columbia University, USA ...... 1822
Chemical Microsensors & Microsystems
W3P.019 MONOLITHIC MEMS VACUUM VALVES FOR MINIATURE CHEMICAL PRE-CONCENTRATORS C. Baker1, M.-A. Scwab1, R. Moseley1, R.R.A. Syms1,2, and E.M. Yeatman1,2 1Microsaic Systems Ltd, UK and 2Imperial College London, UK ...... 1826
W3P.020 PLANAR MICRO FLAME IONIZATION DETECTOR WITH MINIMIZED LEAK CURRENT W.J. Kuipers and J. Müller Hamburg University of Technology, GERMANY ...... 1830
W3P.021 SENSITIVE CHLORINE GAS DETECTION AT THE SUB-PPM LEVEL USING NANOPHASE-SEPARATED AMPHIPHILIC CO-NETWORKS AS HIGHLY CONVENIENT MATRICES S. Meskath, J. Heinze, and G. Urban University of Freiburg, GERMANY ...... 1834
W3P.022 EXPLORING THE RESOLUTION OF DIFFERENT DISK-TYPE CHEMICAL SENSORS S. Truax1, K.S. Demirci1, A. Hierlemann2, and O. Brand1 1Georgia Institute of Technology, USA and 2ETH Zürich, SWITZERLAND ...... 1838
W3P.023 PHASE-MODE LAPS AND ITS APPLICATION TO CHEMICAL IMAGING K. Miyamoto1, T. Wagner1, T. Yoshinobu1, S. Kanoh1, and M. Schöning2,3 1Tohoku University, JAPAN, 2Aachen University of Applied Sciences, GERMANY, and 3Research Centre Jülich, GERMANY ...... 1842
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W3P POSTER SESSION III (continued)
W3P.024 LAB-ON-A-CHIP SENSOR FOR POINT-OF-CARE MEASUREMENT OF MANGANESE EXPOSURE P. Jothimuthu, E.N. Haynes, and I. Papautsky University of Cincinnati, USA ...... 1846
W3P.025 NEEDLE-TYPE IN-SITU PLANT WATER CONTENT SENSORS WITH POLYETHERSULFONE MEMBRANE T. Iwashita and N. Miki Keio University, JAPAN ...... 1849
Materials, Fabrication & Packaging Technologies
W3P.026 LOCALLY PASSIVE HYBRID SENSING TAGS BASED ON FLEXIBLE SUBSTRATES AND SURFACE ACOUSTIC WAVE DEVICES H. Ho, E. Chu, M.A. Forman, and J.L. Skinner Sandia National Laboratories, USA ...... 1853
W3P.027 INTELLIGENT MACHINE PARTS WITH SURFACE EMBEDDED SENSORS UNDER WEAR RESISTANT COATINGS T. Schönberg1, K.P. Almtoft2, M.K. Hansen2, B.H. Christensen2, M. Svensson1, N.P. Østbø3, H. Ronkainen4, and L.P. Nielsen2 1Acreo AB, SWEDEN, 2Danish Technological Institute, DENMARK, 3Sintef ICT, NORWAY, and 4VTT, FINLAND ...... 1857
W3P.028 THERMOELECTRIC CHARACTERISTICS OF N-TYPE POLYCRYSTALLINE SILICON CARBIDE AND COMPARISON WITH CONVENTIONAL THERMOPILES J. Lee, M.I. Lei, S. Rajgopal, and M. Mehregany Case Western Reserve University, USA ...... 1861
W3P.029 SELECTIVE REMOVAL OF MICRO-CORRUGATION BY ANISOTROPIC WET ETCHING N. Inagaki, H. Sasaki, M. Shikida, and K. Sato Nagoya University, JAPAN ...... 1865
W3P.030 A TEMPLATE-BASED FABRICATION TECHNIQUE FOR SPACIALLY-DESIGNED POLYMER MICRO/NANOFIBER COMPOSITES N. Naik1, J. Caves1,2, V. Kumar2, E. Chaikof2, and M.G. Allen1 1Georgia Institute of Technology, USA and 2Emory University, USA ...... 1869
W3P.031 LOW-TEMPERATURE BONDING OF PHOTODIODES ON GLASS SUBSTRATE USING AU STUD BUMPS AND ITS APPLICATION TO MICROSENSORS WITH THREE DIMENSIONAL STRUCTURE E. Higurashi1, D. Chino1, T. Suga1, and R. Sawada2 1University of Tokyo, JAPAN and 2Kyushu University, JAPAN ...... 1873
W3P.032 TSV (THROUGH SILICON VIA) INTERCONNECTION ON WAFER-ON-A-WAFER (WOW) WITH MEMS TECHNOLOGY K. Fujimoto1, N. Maeda2, H. Kitada2, K. Suzuki1, T. Nakamura3, and T. Ohba2 1DNP, JAPAN, 2University of Tokyo, JAPAN, and 3Fujitsu Laboratories Ltd., JAPAN ...... 1877
W3P.033 DESIGN AND FABRICATION OF POSFET DEVICES FOR TACTILE SENSING R.S. Dahiya1, M. Valle2, G. Metta2, L. Lorenzelli3, and A. Adami3 1Italian Institute of Technology, ITALY, 2University of Genova, ITALY, and 3Fondazione Bruno Kessler, Trento, ITALY ...... 1881
W3P.034 THE INFLUENCE OF PACKAGING TECHNOLOGIES ON THE PERFORMANCE OF INERTIAL MEMS SENSORS J. Mehner1, V. Kolchuzhin1, I. Schmadlak2, T. Hauck2, G. Li3, D. Lin3, and T.F. Miller3 1Chemnitz University of Technology, GERMANY, 2Freescale Halbleiter GmbH, GERMANY, and 3Freescale Semiconductor Inc., USA ...... 1885
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W3P POSTER SESSION III (continued)
W3P.035 LOW-COST MASKLESS GRAYSCALE LITHOGRAPHY USING A NEW PHOTO-DEFINABLE POLYIMIDE FOR POLYMER MEMS APPLICATIONS J. Lake, K. Walsh, and S. McNamara University of Louisville, USA ...... 1889
W3P.036 CHARACTERIZATION OF WATER VAPOR PERMEATION THROUGH THIN FILM PARYLENE C P.R. Menon, W. Li, A. Tooker, and Y.C. Tai California Institute of Technology, USA ...... 1892
W3P.037 A HIGH D33 CMOS COMPATIBLE PROCESS FOR ALUMINUM NITRIDE ON TITANIUM J.C. Doll1, B.C. Petzold1, B. Ninan2, R. Mullapudi2, and B.L. Pruitt1 1Stanford University, USA and 2Tango Systems, Inc., USA ...... 1896
W3P.038 ASSEMBLY-FREE 3-D MICROFABRICATION PROCESS USING SINGLE-MASK MULTIDIRECTIONAL PHOTOLITHOGRAPHY T. Suzuki1, H. Yamamoto2, I. Kanno2, M. Washizu3,4, and H. Kotera2,4 1Kagawa University, JAPAN, 2Kyoto University, JAPAN, 3University of Tokyo, JAPAN, and 4Japan Science and Technology Agency (JST), JAPAN ...... 1900
W3P.039 PYROLYZED POLYMER AND ITS COMPOSITE FOR 18F- CONCENTRATION ELECTRODE TOWARD PET APPLICATION K. Okamoto1, A. Syunori1, R. Iwata2, H. Saiki3, H. Nakanishi3, and S. Konishi1 1Ritsumeikan University, JAPAN, 2Tohoku University, JAPAN, and 3Shimadzu Corporation, JAPAN ...... 1904
W3P.040 MICRO PROJECTION LITHOGRAPHY INSIDE DEEP TRENCHES USING MICROLENS ON A MASK C.-H. Ji, F. Herrault, and M.G. Allen Georgia Institute of Technology, USA ...... 1908 Mechanical/Physical Sensors & Systems
W3P.041 ROBUST COMB DESIGN FOR INDUCTIVE DISPLACEMENT SENSOR WITH LARGE TRAVEL AND HIGH SENSITIVITY S. Schonhardt, J.G. Korvink, and U. Wallrabe University of Freiburg - IMTEK, GERMANY ...... 1912
W3P.042 AERO-ACOUSTIC MICROPHONE WITH LAYER-TRANSFERRED SINGLE-CRYSTAL SILICON PIEZORESISTORS Z.J. Zhou1, L. Rufer2, and M. Wong1 1Hong Kong University of Science and Technology, HONG KONG and 2Techniques of Informatics and Microelectronics for Integrated Systems Architecture (TIMA), FRANCE ...... 1916
W3P.043 NOVEL 3D FORCE SENSOR USING ULTRA-THIN SILICON STRAIN GAUGE BONDED ON METAL MEMBRANE Y.D. Kim1, Y.D. Kim2, C.S. Lee2, and S.J. Kwon1 1Korea Advanced Institute of Science and Technology (KAIST), KOREA and 2Tyco Electronics, KOREA ...... 1920
W3P.044 TINY (0.72 MM2) PRESSURE SENSOR INTEGRATING MEMS AND CMOS LSI WITH BACK-END-OF-LINE MEMS PLATFORM T. Fujimori, H. Takano, S. Machida, and Y. Goto Hitachi, Ltd., JAPAN ...... 1924
W3P.045 HIGH FREQUENCY FORCE SENSING WITH PIEZORESISTIVE CANTILEVERS J.C. Doll, B.C. Petzold, P. Ghale, M.B. Goodman, and B.L. Pruitt Stanford University, USA ...... 1928
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W3P POSTER SESSION III (continued)
W3P.046 NOVEL THEORETICAL DESIGN AND FABRICATION TEST OF BIOMIMICRY DIRECTIONAL MICROPHONE S. Ando1, T. Kurihara1, K. Watanabe1, Y. Yamanishi2, and T. Ooasa2 1University of Tokyo, JAPAN and 2Tokyo Electron AT Limited, JAPAN ...... 1932
W3P.047 FABRICATION OF A PIEZORESISTIVE PRESSURE SENSOR FOR ENHANCING SENSITIVITY USING SILICON NANOWIRE J.H. Kim1, K.T. Park1, H.C. Kim2, and K. Chun1 1Seoul National University, KOREA and 2University of Ulsan, KOREA ...... 1936
W3P.048 DEVELOPMENT OF A SHOCK ACCELERATION MICROSWITCH WITH ENHANCED-CONTACT AND LOW OFF-AXIS SENSITIVITY Z.Q. Yang, G.F. Ding, H.G. Cai, H. Wang, W.Q. Chen, and X.L. Zhao Shanghai Jiao Tong University, CHINA ...... 1940
W3P.049 A NOVEL DIFFERENTIAL CAPACITIVE-SENSING DUAL-AXIS ACCELEROMETER DESIGN USING PENDULUM-PROOFMASS, GIMBAL-SPRINGS, AND HARM VERTICAL-COMBS C.-K. Chan1, C.-P. Hsu1, M. Wu2, H. Hocheng1, R. Chen1, and W. Fang1 1National Tsing Hua University, TAIWAN and 2Domintech Co., LTD., TAIWAN ...... 1944
W3P.050 MEMS ACCELEROMETER WITH MECHANICAL AMPLIFICATION MECHANISM FOR ENHANCED SENSITIVITY A. Ya'akobovitz and S. Krylov Tel Aviv Univeristy, ISRAEL ...... 1948
W3P.051 DESIGN TRADE-OFFS OF MICROMACHINED GYROSCOPE CONCEPT ALLOWING INTERCHANGEABLE OPERATION IN BOTH ROBUST AND PRECISION MODES A.R. Schofield, A.A. Trusov, and A.M. Shkel University of California, Irvine, USA ...... 1952
W3P.052 MEMS-BASED RESONANT SENSOR WITH UNIFORM MASS SENSITIVITY K. Park1 and R. Bashir2 1Purdue University, USA and 2University of Illinois, Urbana-Champaign, USA ...... 1956
W3P.053 BULK ACOUSTIC WAVE RESONATORS FOR INFRARED DETECTION APPLICATIONS M.B. Pisani, P. Kao, and S. Tadigadapa Pennsylvania State University, USA ...... 1959
W3P.054 FEEDBACK-ENHANCED THERMO-ELECTRIC TOPOGRAPHY SENSING A. Sebastian, D. Wiesmann, P. Baechtold, H. Rothuizen, M. Despont, and U. Drechsler IBM Zürich Research Laboratory, SWITZERLAND ...... 1963
W3P.055 FLEXIBLE X-RAY DETECTOR BASED ON THE SEEBECK EFFECT J.G. Rocha, L.M. Goncalves, and S. Lanceros-Mendez University of Minho, PORTUGAL ...... 1967
W3P.056 PYROELECTRIC IR SENSOR ARRAY USING LEAD-FREE PYROELECTRIC NBT THIN FILM ON EPITAXIAL ɣ-Al2O3/Si (100) SUBSTRATES T. Sugai, K. Kikuchi, R. Yoshita, D. Akai, K. Sawada, and M. Ishida Toyohashi University of Technology, JAPAN ...... 1971
Medical Microsystems
W3P.057 RECENT ADVANCES IN INTERCONNECT TECHNOLOGY FOR SLIM-BASE BIOMEDICAL PROBE ARRAYS A.A.A. Aarts1,2, H.P. Neves1, R. Puers2, and C. Van Hoof1,2 1IMEC, BELGIUM and 2Katholieke Universiteit Leuven, BELGIUM ...... 1975
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W3P POSTER SESSION III (continued)
W3P.058 PHOTONIC PATTERNS AND MICRO KNIFE ARRAY ON INDIVIDUAL FACES OF TRANSPARENT BIFACIAL CHIP FOR IN SITU NIR OBSERVATION AND BIOPSY T. Kobayashi, H. Koga, and S. Konishi Ritsumeikan University, JAPAN ...... 1979
W3P.059 MAGNETIC SHAPING OF FERRITE-PDMS COMPOSITE AND ITS APPLICATION IN MAGNETIC CARRIER TARGETING Y.-M. Yang, H.-H. Tsai, T.-H. Hsu, and Y.-C. Su National Tsing Hua University, TAIWAN ...... 1983
W3P.060 CONTROL OF LOCOMOTION IN AMBULATORY AND AIRBORNE INSECTS USING IMPLANTED THERMAL MICROSTIMULATORS K. Visvanathan1, N.K. Gupta1, M.M. Maharbiz2, and Y.B. Gianchandani1 1University of Michigan, USA and 2University of California, Berkeley, USA ...... 1987 Microfluidics
W3P.061 LIQUID REAGENT STORAGE AND RELEASE FOR CENTRIFUGALLY OPERATED LAB-ON-A-CHIP SYSTEMS BASED ON A BURSTABLE SEAL J. Hoffmann2, D. Mark1, R. Zengerle1,2, and F. von Stetten1,2 1Institute for Micromachining and Information Technology (HSG-IMIT), GERMANY and 2University of Freiburg - IMTEK, GERMANY ...... 1991
W3P.062 WATER DROPLET ENCAPSULATION BY A QUANTITATIVE AND REMOVABLE OIL SHELL Y.-W. Hsu, C.-H. Chen, and S.-K. Fan National Chiao Tung University, TAIWAN ...... 1995
W3P.063 FABRICATION AND TESTING OF A FLAT POLYMER MICRO HEAT PIPE C.J. Oshman, B. Shi, C. Li, R.G. Yang, Y.C. Lee, and V.M. Bright University of Colorado, USA ...... 1999
W3P.064 SCALING RULES FOR FLOW FOCUSING DEVICES: FROM STANDARD TO LARGE FFDS FOR CELL ENCAPSULATION IN ALGINATES S. Le Vot1, J. Berthier1, N. David1, G. Costa1, M. Alessio1, V. Mourier1, P.Y. Benhamou2, and F. Rivera1 1CEA - LETI - Minatec, FRANCE and 2INSERM UMR S 578, FRANCE ...... 2003
W3P.065 PERISTALTIC MICROPUMP FABRICATED BY DEPOSITING PARYLENE DIRECTLY ON LIQUID S. Komatsu, N. Binh-Khiem, E. Iwase, K. Matsumoto, and I. Shimoyama University of Tokyo, JAPAN ...... 2007
W3P.066 A MICRO-FLUIDIC-OPTICAL SWITCH USING MULTI-DROPLET RESONATORS ARRAY Y.F. Yu1,2, T. Bourouina2, and A.Q. Liu1 1Nanyang Technological University, SINGAPORE and 2University of Paris Est, FRANCE ...... 2011
W3P.067 RESISTANCE OF DROPLETS SLIDING BY EWOD ACTUATION W. Nelson, P. Sen, and C.-J. Kim University of California, Los Angeles, USA ...... 2014
W3P.068 A ELECTROLYSIS-BUBBLE-ACTUATED MICROPUMP USING ELECTROWETTING ON DIELECTRIC(EWOD) FOR 1XN MICRO-SAMPLE SWITCHES S.-C. Yang and C.-H. Liu National Tsing Hua University, TAIWAN ...... 2018
W3P.069 NOVEL MICROFLUIDIC CHIP GENERATING MONO-DISPERSE CORE-SHELL MICROCAPSULES C. Kim1,2, E. Kang1, Y.E. Kim1, K.J. Lee2, T.S. Kim1, and J.Y. Kang1 1Korea Institute of Science and Technology (KIST), KOREA and 2Korea University, KOREA ...... 2022
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W3P POSTER SESSION III (continued)
W3P.070 TEFLON-CARBON BLACK AS NEW MATERIAL FOR THE HYDROPHOBIC PATTERNING OF POLYMER LABS-ON-A-CHIP L. Riegger1, M.M. Mielnik2, D. Mark3, W. Streule1, M. Clad1, R. Zengerle1, and P. Koltay1 1University of Freiburg - IMTEK, GERMANY, 2SINTEF ICT, NORWAY, and 3HSG-IMIT, GERMANY ...... 2026
W3P.071 A CROSS-JUNCTION CHANNEL VALVELESS-MICROPUMP WITH INTEGRATED HOTWIRES FOR FLUIDIC APPLICATION V.T. Dau, T. Otake, T.X. Dinh, K. Tanaka, R. Amarasinghe, and S. Sugiyama Ritsumeikan University, JAPAN ...... 2030
W3P.072 MICRO-PARTICLE FILTER MADE IN SU-8 FOR BIOMEDICAL APPLICATIONS N. Noeth, S. Keller, S. Fetz, O. Geschke, and A. Boisen Technical University of Denmark, DENMARK ...... 2034
W3P.073 CONTINUOUS MICROFLUIDIC AIRBORNE BACTERIA SEPARATION USING DIELECTROPHORESIS H.S. Moon1, Y.W. Nam2, J.C. Park2, and H.I. Jung1 1Yonsei University, KOREA and 2Samsung Advanced Institute of Technology, KOREA ...... 2038 Nanoscale Materials & Fabrication Technology, Devices & Systems
W3P.074 MONOLITHICALLY INTEGRATED CARBON NANOTUBE BUNDLE FIELD EMITTERS USING A DOUBLE-SOI PROCESS R. Toda, E.M. Luong, R. Lin, A. Liao, and H.M. Manohara California Institute of Technology, USA ...... 2042
W3P.075 CONTROLLED GROWTH ORIENTATION OF CARBON NANOTUBES PILLARS BY CATALYST PATTERNING IN MICROTRENCHES M. De Volder1,2, S. Tawfick2, and A.J. Hart1 1Katholieke Universiteit Leuven, BELGIUM and 2University of Michigan, USA ...... 2046
W3P.076 OBSERVATION OF LIQUID/LIQUID INTERFACE BY ATOMIC FORCE MICROSCOPY C.Y. Yang1, F.H. Ho2, and J.A. Yeh1 1National Tsing Hua University, TAIWAN and 2National Applied Research Laboratories, TAIWAN ...... 2050
W3P.077 ATOMIC LAYER DEPOSITION ENABLED INTERCONNECT TECHNOLOGY FOR VERTICAL NANOWIRE ARRAY DEVICES M.J. Lee1, J.-H. Cheng1, K. Bertness2, N. Sanford2, D. Seghete1, S. George1, and Y.C. Lee1 1University of Colorado, Boulder, USA and 2National Institute of Standards and Technology, USA ...... 2054
W3P.078 SUPERSONIC CLUSTER BEAM DEPOSITION AS NOVEL TOOL ADDRESSING NANO-ON-MICRO ISSUE E. Barborini1, S. Vinati1, M. Leccardi1, P. Repetto1, M. Decarli2, L. Lorenzelli2, and P. Milani3 1Tethis srl, ITALY, 2Bruno Kessler Foundation, ITALY, and 3CIMAINA, ITALY ...... 2058
W3P.079 TENSILE TESTING OF FULLERENE NANO WIRE USING ELECTROSTATIC MEMS DEVICE Y. Ura, K. Sugano, T. Tsuchiya, and O. Tabata Kyoto University, JAPAN ...... 2062
W3P.080 ADHESION FORCE MEASUREMENT BETWEEN SILICON AND CARBON NANOTUBES SYNTHESIZED BY CHEMICAL VAPOR DEPOSITION A. Hashimoto, Y. Takei, E. Iwase, K. Matsumoto, and I. Shimoyama University of Tokyo, JAPAN ...... 2066
Optical MEMS
W3P.081 CMOS BASED OPTICAL FOCUSING STAGE WITH PHASE GRATING FRESNEL LENS S.-Y. Lee, C.-H. Wang, C.-H. Yang, C.-M. Sun, and W. Fang National Tsing Hua University, TAIWAN ...... 2070
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W3P POSTER SESSION III (continued)
W3P.082 NOVEL VOLTAGE CONTROLLED SPATIAL MODULATION METHOD FOR DIGITAL MICROSHUTTER DISPLAY WITH HIGH PERFORMANCE K.-H. Lee1, D.-H. Kim1, J.-H. Chang2, and J.-B. Yoon1 1Korea Advanced Institute of Science and Technology (KAIST), KOREA and 2Samsung Electronics, KOREA ...... 2074
W3P.083 CONCAVE MICROPATTERNED COMPLEX OPTICAL SURFACES FOR WIDE ANGULAR ILLUMINATION S. Chae and J.-J. Kim, K.H. Jeong Korea Advanced Institute of Science and Technology (KAIST), KOREA ...... 2078
W3P.084 AN EYEBALL-LIKE BICONVEX/MENISCUS LENS OPTICAL SYSTEM WITH FLUIDIC-CONTROLLED FOCUS FOR TUNABLE LENS APPLICATIONS G.-H. Feng and Y.-C. Chou National Chung Cheng University, TAIWAN ...... 2082
W3P.085 MICROLENS FORMATION TECHNOLOGY UTILIZING MULTI-PHASE LIQUID AMBIENT C.-C. Lee, S.-Y. Hsiao, and W. Fang National Tsing Hua University, TAIWAN ...... 2086
W3P.086 A MIRROR-TILT-INSENSITIVE FOURIER TRANSFORM SPECTROMETER BASED ON A LARGE VERTICAL DISPLACEMENT MICROMIRROR WITH DUAL REFLECTIVE SURFACE L. Wu, A. Pais, S.R. Samuelson, S. Guo, and H. Xie University of Florida, USA ...... 2090
Power MEMS
W3P.087 AN IMPACT BASED PIEZOELECTRIC HARVESTER ADAPTED TO LOW FREQUENCY ENVIRONMENTAL VIBRATIONS M. Renaud1, P. Fiorini1, R. van Schaijk1,2, and C. van Hoof2 1IMEC, BELGIUM and 2Holst Centre, THE NETHERLANDS ...... 2094
W3P.088 MEMS DC/DC CONVERTERS FOR 1D AND 2D VIBRATION-TO-ELECTRICITY POWER CONVERSION A. Mahmood Paracha1, P. Basset1, D. Galayko2, A. Dudka2, F. Marty1, and T. Bourouina1 1Université Paris-Est, FRANCE and 2Université Paris XI, FRANCE ...... 2098
W3P.089 MICROFLUIDIC BIOFUEL CELLS: SERIES-CONNECTION WITH SUPERHYDROPHOBIC AIR VALVES M. Togo1, K. Morimoto1, T. Abe1, H. Kaji1,2, and M. Nishizawa1,2 1Tohoku University, JAPAN and 2Japan Science and Technology Agency (JST), JAPAN ...... 2102
W3P.090 SPUTTERED PLATINUM-IRIDIUM AS CATALYST FOR HYDROGEN FUEL CELLS G. Ganske1, G. Topalov2, E. Slavcheva2, W. Mokwa1, and U. Schnakenberg1 1RWTH Aachen University, GERMANY and 2Bulgarian Academy of Sciences, BULGARIA ...... 2106 RF MEMS, Resonators & Oscillators
W3P.091 MECHANICAL RESPONSE OF ELECTROSTATIC ACTUATORS UNDER ESD STRESS S. Sangameswaran1,2, J. De Coster1, D. Linten1, M. Scholz1,3, S. Thijs1,2, C. Van Hoof1,2, I. De Wolf1,2, and G. Groeseneken1,2 1IMEC vzw, BELGIUM, 2Katholieke Universiteit Leuven, BELGIUM, and 3Vrije Universiteit Brussel, BELGIUM ...... 2110
W3P.092 HIGH-Q AND LOW-RM 24-MHz RADIAL-CONTOUR MODE DISK RESONATORS FABRICATED WITH SILICON PASSIVE INTEGRATION TECHNOLOGY M. Sworowski1, F. Neuilly2, B. Legrand1, A. Summanwar2, F. Lallemand2, P. Philippe2, and L. Buchaillot1 1Centre National de la Reserche Scientifique (CNRS), FRANCE and 2NXP Semiconductors, FRANCE ...... 2114
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W3P POSTER SESSION III (continued)
W3P.093 CMOS-COMPATIBLE ELECTROCHEMICAL PROCESS FOR RF CMOS INDUCTORS L.Y. Ding1, T. Wang1, Y.C. Hu2, W.P. Shih1, S.S. Lu1, and P.Z. Chang1 1National Taiwan University, TAIWAN and 2National Ilon University, TAIWAN ...... 2118
W3P.094 MICROMACHINED W-BAND PLASTIC SLOT ARRAY ANTENNA WITH SELF-ALIGNED AND INTEGRATED FLANGE Y.-K. Fuh1, A. Margomenos2, Y. Jiang1, and L. Lin1 1University of California, Berkeley, USA and 2Toyota Research Institute, USA ...... 2122
W3P.095 SINGLE-CHIP PRECISION OSCILLATORS BASED ON MULTI-FREQUENCY, HIGH-Q ALUMINUM NITRIDE MEMS RESONATORS K.E. Wojciechowski, R.H. Olsson III, M.R. Tuck, E. Roherty-Osmun, and T.A. Hill Sandia National Laboratories, USA ...... 2126
W3P.096 EFFECT OF PHONON INTERACTIONS ON LIMITING THE f.Q PRODUCT OF MICROMECHANICAL RESONATORS R. Tabrizian1, M. Rais-Zadeh2, and F. Ayazi1 1Georgia Institute of Technology, USA and 2University of Michigan, USA ...... 2131
15:00 ADJOURN FOR THE DAY
15:30 - 23:00 CHUCKWAGON BBQ AND RODEO BANQUET
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THURSDAY, June 25, 2009 PARALLEL ORAL SESSIONS
Dielectrophoresis & Separation Techniques Nanosystems Robotic Sensors Optical MEMS I
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F
Session Chairs:
C. Ahn, M. Mehregany, K. Bohringer, C.-Y. Kwok, University of Cincinnati, USA Case Western Reserve University of Washington, USA University of New University, USA South Wales, AUSTRALIA
J.-B. Yoon, Korea Advanced H. Gardeniers, University of Institute of Science and K. Sato, O. Solgaard, Twente, THE NETHERLANDS Technology, KOREA Nagoya University, JAPAN Stanford University, USA
08:00 - 08:30 INVITED SPEAKER INVITED SPEAKER INVITED SPEAKER INVITED SPEAKER Th1B.001 Th1C.001 Th1E.001 Th1F.001 OPTICALLY-INDUCED TOWARDS MEMS ON ROBOT OPTICAL MEMS FOR DIELECTROPHORESIS NANOROBOTS APPLICATIONS INFORMATION USING POLYMER B.J. Nelson K. Noda, Y. Hashimoto, TECHNOLOGY MATERIALS FOR ETH Zürich, Y. Tanaka, and H. Toshiyoshi BIOMEDICAL SWITZERLAND I. Shimoyama University of Tokyo, APPLICATIONS ...... 2155 University of Tokyo, JAPAN G.-B. Lee1, Y.-H. Lin1, JAPAN ...... 2198 W.-Y. Lin1, W. Wang1, ...... 2176 and T.-F. Guo2 1National Cheng Kung University, TAIWAN and 2Industrial Technology Research Institute, TAIWAN ...... 2135 08:30 - 08:45 Th1B.002 Th1C.002 Th1E.002A FLEXIBLE Th1F.002 CONTINUOUS A NANOPLASMONIC TACTILE SENSING ELECTROTHERMALLY MULTI-PARTICLE SWITCH BASED ON ARRAY BASED ON ACTUATED FREE SPACE SEPARATION USING MOLECULAR MACHINES NOVEL CAPACITANCE BOARD-TO-BOARD DETERMINISTIC Y.B. Zheng1, Y.-W. Yang2, MECHANISM OPTICAL FOCUSING IN SPIRAL 1 2 M.-Y. Cheng, B.-T. Liao, INTERCONNECT WITH MICROCHANNELS L. Jensen , L. Fang , X.-H. Huang, ZERO POWER HOLD 1 1 S.S. Kuntaegowdanahalli, B.K. Juluri , P.S. Weiss , and Y.-J. Yang J.B. Chou1, K. Yu1, A.A.S. Bhagat, J.F. Stoddart2, National Taiwan D. Horsley2, S. Mathai3, and I. Papautsky and T.J. Huang1 University, TAIWAN B. Yoxall2, M. Tan3, University of Cincinnati, 1Pennsylvania State ...... 2182 S.Y. Wang3, and M.C. Wu1 USA University, USA and 1University of California, ...... 2139 2Northwestern University, Berkeley, USA, 2 USA University of California, ...... 2160 Davis, USA, and 3HP Labs, USA ...... 2202 08:45 - 09:00 Th1B.003 Th1C.003 Th1E.003 Th1F.003 DYNAMIC CONTROL NANO MONORAIL FOR THREE DIMENSIONAL LIQUID-CORE OF LOCAL MOLECULAR MOLECULAR MOTORS: SURFACE-SHAPE LIQUID-CLADDING CONCENTRATION USING INDIVIDUALLY TACTILE IMAGER WITH OPTICAL WAVEGUIDE OPTOELECTROFLUIDIC MANIPULATED FINGERTIP-SIZE BY LIQUID FLUORESCENCE MICROTUBULES FOR SILICON INTEGRATED DIELECTROPHORESIS MICROSCOPY KINESIN MOTION SENSOR-MEMBRANE C.-C. Chien, H. Hwang, and J.-K. Park M.C. Tarhan1, H. Takao, M. Yawata, and S.-K. Fan Korea Advanced Institute L. Jalabert1, K. Sawada, M. Ishida, National Chiao Tung of Science and R. Yokokawa2,3, and H. Okada University, TAIWAN Technology (KAIST), C. Bottier1, D. Collard1, Toyohashi University of ...... 2210 KOREA and H. Fujita1 Technology, JAPAN ...... 2143 1University of Tokyo, ...... 2186 JAPAN, 2Ritsumeikan University, JAPAN, and 3Japan Science and Technology Agency (JST), JAPAN ...... 2164
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PARALLEL ORAL SESSIONS (continued)
Dielectrophoresis & Separation Techniques Nanosystems Robotic Sensors Optical MEMS I
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 09:00 - 09:15 Th1B.004 Th1C.004 Th1E.004 Th1F.004 THE INTEGRATION DIRECT PICK, BREAK, A TUNABLE HIGH-PERFORMANCE OF 3D CARBON AND PLACEMENT OF RANGE/SENSITIVITY QUANTUM-WELL DIELECTROPHORESIS NANOSTRUCTURES AND CMOS-MEMS SILICON-GERMANIUM ON A ROTATING THEIR INTEGRATION CAPACITIVE TACTILE BOLOMETERS USING PLATFORM WITH MEMS SENSOR WITH IC-COMPATIBLE R. Martinez-Duarte, B.D. Sosnowchik, POLYMER FILL-IN INTEGRATION FOR R. Gorkin, K. Abi-Samra, J. Chang, and L. Lin TECHNIQUE LOW-COST INFRARED and M.J. Madou University of California, Y.-C. Liu, C.-M. Sun, IMAGERS University of California, Berkeley, USA L.-Y. Lin, M.-H. Tsai, F. Forsberg1, N. Roxhed1, Irvine, USA ...... 2168 and W. Fang P. Ericsson2, S. Wissmar2, ...... 2147 National Tsing Hua F. Niklaus1, University, TAIWAN and G. Stemme1 ...... 2190 1Royal Institute of Technology (KTH), SWEDEN and 2Acreo AB, SWEDEN ...... 2214
09:15 - 09:30 Th1B.005 Th1C.005 Th1E.005 Th1F.005 A NOVEL DEVICE FOR NANOPOROUS SILICON A DUAL FUNCTION A MEMS DIGITAL PARTICLE BATCH AS A BULK ENERGETIC PARYLENE-BASED MIRROR FOR TUNABLE SEPARATION BASED ON MATERIAL BIOMIMETIC TACTILE LASER WAVELENGTH DIELECTROPHORESIS L. Currano1, SENSOR AND SELECTION L. Zhang, and A. Bossche W. Churaman1, ACTUATOR FOR NEXT W.M. Zhu1, W. Zhang1, Delft University of and C. Becker2 GENERATION H. Cai1, J. Tamil1, B. Liu1, Technology, THE 1U.S. Army Research MECHANICALLY T. Bourouina2, NETHERLANDS Lab, USA and 2University RESPONSIVE and A.Q. Liu1 ...... 2151 of Colorado, USA MICROELECTRODE 1Nanyang Technological ...... 2172 ARRAYS University, SINGAPORE C.A. Gutierrez and 2University of Paris and E. Meng Est, FRANCE University of Southern ...... 2206 California, USA ...... 2194
09:30 - 10:00 BREAK & EXHIBIT INSPECTION
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PARALLEL ORAL SESSIONS (continued)
Medical Microsystems II Nanoscale Devices Micropumps Optical MEMS II
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F
Session Chairs:
E. Meng, L. Buchaillot, S. Shoji, J.-U. Bu, University of Southern IEMN, FRANCE Waseda University, JAPAN SenPlus, KOREA California, USA
U. Schnakenberg, R.J. Simonson, RWTH Aachen University, R. Zengerle, Sandia National Laboratories, J. Talghader, GERMANY HSG-IMIT, GERMANY USA University of Minnesota, USA
10:00 - 10:15 Th2B.001 Th2C.001 Th2E.001 Th2F.001 CAPACITIVE SILICON CARBIDE (SiC) MAGNETIC HYDROGEL-ACTUATED MICROMACHINED TOP-DOWN NANOWIRE NANOPARTICLE-DRIVEN TUNABLE-FOCUS ULTRASONIC ELECTROMECHANICAL PUMPING IN MICROLENS ARRAYS TRANSDUCER WITH RESONATORS MICROCHANNELS MIMICKING COMPOUND DRIVING VOLTAGE OVER X.L. Feng1, K.L. Tsai1, D. Pickard2, EYES 100 V AND VIBRATION M.H. Matheny1, J. Kao1, X. Yin1, B. Leen1, D. Zhu, C. Li, X. Zeng, DURABILITY OVER R.B. Karabalin1, K. Knutson1, R. Kant1, and H. Jiang 1011 CYCLES C.A. Zorman2, and R.T. Howe1 University of Wisconsin, S. Machida1, M. Mehregany2, 1Stanford University, USA Madison, USA T. Kobayashi1, and M.L. Roukes1 and 2National University ...... 2302 M. Degawa1, T. Takezaki1, 1California Institute of of Singapore, H. Tanaka1, S. Migitaka1, Technology, USA and SINGAPORE K. Hashiba1, H. Enomoto1, 2Case Western Reserve ...... 2274 T. Nagata1, Y. Yoshimura1, University, USA K. Asafusa2, K. Ishida2, ...... 2246 S. Sano2, and M. Izumi2 1Hitachi, Ltd., JAPAN and 2Hitachi Medical Corporation, JAPAN ...... 2218
10:15 - 10:30 Th2B.002 Th2C.002 Th2E.002 Th2F.002 A SCANNING RAPID PASSIVE FLOW-RATE 4-BIT DIGITAL LIQUID MICROMIRROR WITH DIELECTROPHORESIS REGULATORS USING LENS FOR VARIABLE STATIONARY ROTATION ASSEMBLY OF SINGLE THE PARALLEL FOCAL LENGTH AXIS AND DUAL CARBON NANOCOIL ON MEMBRANE VALVES D.W. Lee and Y.-H. Cho REFLECTIVE SURFACES AN AFM PROBE TIP RECTIFYING DYNAMIC Korea Advanced Institute FOR 360º M.-D. Wu1, Y.-L. Hsieh1, INLET PRESSURE of Science and FORWARD-VIEW Y.-C. Tsai1, Y.-J. Chen1, I. Doh and Y.-H. Cho Technology (KAIST), ENDOSCOPIC IMAGING W.-P. Shih1, S.-H.Chang1, Korea Advanced Institute KOREA L. Wu and H. Xie P.-Z. Chang1, of Science and ...... 2306 University of Florida, USA J.-T. Huang2, Technology (KAIST), ...... 2222 and L.-J. Yang3 KOREA 1National Taiwan ...... 2278 University, TAIWAN, 2National Taipei University of Technology, TAIWAN, and 3Tamkang University, TAIWAN ...... 2250
10:30 - 10:45 Th2B.003 Th2C.003 Th2E.003 Th2F.003 LARGE SCALE DECORATED NANOTUBE CHEMICALLY ACTUATED SIGNAL SENSITIVITY GENERATION OF BUCKYPAPER AS MICROINJECTORS AND AND INTENSITY GENETICALLY MODIFIED ELECTROCATALYST FOR PROGRAMMING WITH A ENHANCEMENT FOR T-CELLS USING MICRO- GLUCOSE FUEL CELLS MICROFLUIDIC A POLYMER-BASED ELECTROPORATORS L. Hussein1, Y. Feng2, NETWORK FABRY-PEROT FOR CANCER A. Habrioux2, K. Servat2, A. Takashima, J. Fukuda, INTERFEROMETER TREATMENTS B. Kokoh2, and H. Suzuki WITH EMBEDDED Y. Choi1, S. Maiti1, N. Alonso-Vante2, University of Tsukuba, NANOSTRUCTURES C. Yuen1, H. Huls1, G.A. Urban1, JAPAN IN ITS CAVITY R. Raphael2, T. Killian2, and M. Krüger1 ...... 2282 T. Zhang, Z. Gong, D. Stark2, S. Lupascu2, 1University of Freiburg, R. Giorno, and L. Que D. Lee1, E. Shpall1, GERMANY and Louisiana Tech P. Kebriaei1, 2University of Poitiers, University, USA R. Champlin1, S. Biswal2, FRANCE ...... 2310 and L.J.N. Cooper1 ...... 2254 1University of Texas M. D. Anderson Cancer Center, USA and 2Rice University, USA ...... 2226
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PARALLEL ORAL SESSIONS (continued)
Medical Microsystems II Nanoscale Devices Micropumps Optical MEMS II
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 10:45 - 11:00 Th2B.004 Th2C.004 Th2E.004 Th2F.004 THREE-DIMENSIONAL MEMS IN TEM: A NOVEL A MEMS DIGITAL CELL-HYDROGEL THERMAL THERMO-PNEUMATIC MIRROR ARRAY PRINTER USING CHARACTERIZATION PERISTALTIC INTEGRATED WITH ELECTROMECHANICAL OF SUB-20NM MICROPUMP WITH HIGH-VOLTAGE MICROVALVE FOR NANOJUNCTION LOW TEMPERATURE LEVEL-SHIFTER TISSUE ENGINEERING L. Jalabert1,3, T. Ishida1, ELEVATION S. Maruyama, W. Lee1, V.K. Lee2, S. Volz1, B. Rousset2, E. B.T. Chia, H.-H. Liao, K. Takahashi, H. Fujita, S. Polio2,3, K. Fischer2, Scheid2, and H. Fujita1 and Y.-J. Yang and H. Toshiyoshi J.-H. Lee2, J.-K. Park1, 1University of Tokyo, National Taiwan University of Tokyo, and S.-S. Yoo2 JAPAN, 2University of University, TAIWAN JAPAN 1Korea Advanced Toulouse, FRANCE, and ...... 2286 ...... 2314 Institute of Science and 3INP Toulouse, FRANCE Technology (KAIST), ...... 2258 KOREA, 2Brigham and Women's Hospital, Harvard Medical School, USA, and 3Boston University, USA ...... 2230
11:00 - 11:15 Th2B.005 Th2C.005 Th2E.005 Th2F.005 A HIGH EFFICIENCY A 3D GLASS SIMULTANEOUS TUNABLE OPTICAL MICROMACHINED MICROPROBE ARRAY PUMPING AND BANDPASS FILTER ARTIFICIAL LUNG WITH EMBEDDED DENSITY-SELECTIVE WITH HIGH-QUALITY J.A. Potkay SILICON FOR PARTICLE FOCUSING VERTICAL MIRRORS Department of Veterans ALIGNMENT AND USING AC-DRIVEN MICROASSEMBLED Affairs Medical Center, ELECTRICAL ELECTRO-OSMOTIC ON MOVABLE MEMS USA CONNECTION MICROPUMPS PLATFORMS ...... 2234 Y.-T. Lee, C.-W. Lin, W. Hilber, B. Weiss, J.W. Jeong1, I.W. Jung1, C.-M. Lin, S.-R. Yeh, A. Saeed, T. Lederer, D.M. Baney2, Y.-C. Chang, C.-C. Fu, and B. Jakoby and O. Solgaard1 and W. Fang Johannes Kepler 1Stanford University, USA National Tsing Hua University Linz, AUSTRIA and 2Agilent University, TAIWAN ...... 2290 Laboratories, USA ...... 2262 ...... 2318 11:15 - 11:30 Th2B.006 Th2C.006 Th2E.006 Th2F.006 OCCLUSIVE BITE FORCE FLEXIBLE CARBON ADAPTIVE GAS SELF-ALIGNED MEASUREMENT NANOTUBES PUMPING BY OPPOSITE MIRRORS UTILIZING FLEXIBLE ELECTRODE CONTROLLED TIMING FOR TILTING FIELD FORCE SENSOR ARRAY ARRAY FOR NEURAL OF ACTIVE OF VIEW DRIVEN BY FABRICATED WITH RECORDING MICROVALVES ELECTROWETTING LOW-COST MULTILAYER C.-M. Lin, Y.-T. Lee, IN PERISTALTIC K. Suzuki, A. Takei, CERAMIC CAPACITORS S.-R. Yeh, and W. Fang MICROPUMPS E. Iwase, K. Matsumoto, (MLCC) National Tsing Hua S. Lee, S.Y. Yee, and I. Shimoyama K.R. Lin1, T.H. Liu1, University, TAIWAN A. Besharatian, H. Kim, University of Tokyo, S.W. Lin1, C.H. Chang1, ...... 2266 L.P. Bernal, and K. Najafi JAPAN and C.H. Lin2 University of Michigan, ...... 2322 1National Cheng Kung USA University, TAIWAN and ...... 2294 2National Sun Yat-Sen University, TAIWAN ...... 2238
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PARALLEL ORAL SESSIONS (continued)
Medical Microsystems II Nanoscale Devices Micropumps Optical MEMS II
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 11:30 - 11:45 Th2B.007 Th2C.007 Th2E.007 Th2F.007 FABRICATION OF REALISTIC IMITATION A PLANAR CASCADING A MICRO OPTICAL PATTERNED CARBON OF MOSQUITO'S ARCHITECTURE FOR BLOOD FLOW SENSOR NANOTUBE (CNT) / PROBOSCIS-SHARP A CERAMIC KNUDSEN AND ITS APPLICATION ELASTOMER BILAYER AND JAGGED MICROPUMPS TO DETECTION OF MATERIAL AND ITS NEEDLE AND THEIR N.K. Gupta AVIAN INFLUENZA UTILIZATION AS FORCE COOPERATIVE and Y.B. Gianchandani R. Seto1,2, F. Matsuoka1,2, SENSORS INSERTING MOTION University of Michigan, T. Soh1,2, T. Itoh2,3, W. Xu and M.G. Allen H. Izumi1, M. Suzuki1, USA H. Okada2,3, T. Masuda2,4, Georgia Institute of T. Kanzaki2, ...... 2298 T. Umeda2,4, I. Maeda2,5, Technology, USA and S. Aoyagi1 K. Tsukamoto2,6, ...... 2242 1Kansai University, K. Suzuki2,6, Y. Kimura1,7, JAPAN and 2Dainihon A. Onoe7, E. Higurashi4, Jochugiku Co., Ltd, R. Maeda3, W. Iwasaki1,2, JAPAN and R. Sawada1 ...... 2270 1Kyushu University, JAPAN, 2Japan Science and Technology Agency (JST), JAPAN, 3National Institute of Advanced Industrial Science and Technology, JAPAN, 4University of Tokyo, JAPAN, 5Ibaraki Prefectural Livestock Research Center, JAPAN, 6National Institute of Animal Health, JAPAN, and 7Pioneer Corporation, JAPAN ...... 2326
11:45 - 13:00 LUNCH ON OWN & EXHIBIT INSPECTION PARALLEL ORAL SESSIONS
Cell Manipulation MEMS Resonators II & Analysis II Actuators II Thermal Devices
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F
Session Chairs:
G. Fedder, R. Bashir, R. Puers, Q.-A. Huang, Carnegie Mellon University, University of Illinois, Katholieke Universiteit Southeast University, CHINA USA Urbana-Champaign, USA Leuven, BELGIUM
J. Miao, E. Verpoorte, Nanyang Technological University of Groningen, L. “Chip” Spangler, I. Shimoyama, University, SINGAPORE THE NETHERLANDS Aspen Technologies, USA University of Tokyo, JAPAN
13:00 - 13:15 Th3B.001 Th3C.001 Th3E.001 Th3F.001 ACOUSTIC BAND BIOMEDICAL A CONTACT POSITION HIGH-PERFORMANCE GAP-ENABLED HIGH-Q MICRODEVICE FOR DETECTION AND MICRO SCALE THERMO- MICRO-MECHANICAL ANALYZING THE INTERACTION FORCE ELECTRIC COOLER: AN RESONATORS EFFECT OF ELEC- MONITORING SENSOR OPTIMIZED 6-STAGE S. Mohammadi, TROCHEMOTHERAPY FOR MICRO-ASSEMBLY COOLER A.A. Eftekhar, W.D. Hunt, ON CANCER CELLS APPLICATIONS A. Gross, G. Hwang, and A. Adibi Y.-S. Choi1,2, H.-B. Kim3, J. Wei, M. Porta, B. Huang, H. Yang, Georgia Institute of S.-H. Kim1, J. Choi1, M. Tichem, N. Ghafouri, H. Kim, Technology, USA and J.-K. Park1 and P.M. Sarro C. Uher, M. Kaviany, ...... 2330 1Korea Advanced Delft University of and K. Najafi Institute of Science Technology, THE University of Michigan, and Technology (KAIST), NETHERLANDS USA KOREA, 2Kyungwon Tech, ...... 2385 ...... 2413 KOREA, and 3Solco Biomedical Co., KOREA ...... 2358
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PARALLEL ORAL SESSIONS (continued)
Cell Manipulation MEMS Resonators II & Analysis II Actuators II Thermal Devices
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 13:15 - 13:30 Th3B.002 Th3C.002 Th3E.002 Th3F.002 DEMONSTRATION OF A SELECTIVE RELEASE NOVEL MEMS A JOULE-THOMSON INVERSE ACOUSTIC METHOD USING GRIPPERS CAPABLE OF COOLING SYSTEM WITH BAND GAP STRUCTURE ELECTRONICALLY BOTH GRASPING AND A SI/GLASS HEAT IN AlN AND GENERATED BUBBLES ACTIVE RELEASE OF EXCHANGER FOR INTEGRATION WITH FOR CELL ARRAY MICRO OBJECTS 0.1-1 W HEAT LOADS PIEZOELECTRIC APPLICATIONS B.K. Chen, Y. Zhang, W. Zhu1, M.J. White2, CONTOUR MODE T. Kurakazu1, and Y. Sun G.F. Nellis2, S.A. Klein2, TRANSDUCERS K. Kuribayashi1, University of Toronto, and Y.B. Gianchandani1 N. Kuo, C. Zuo, Y. Tsuda1,2, H. Kimura1, CANADA 1University of Michigan, and G. Piazza T. Fujii1, Y. Sakai1, ...... 2389 USA and 2University of University of and S. Takeuchi1,2 Wisconsin, USA Pennsylvania, USA 1University of Tokyo, ...... 2417 ...... 2334 JAPAN and 2Ministry of Economy, Trade and Industry (METI), JAPAN ...... 2362 13:30 - 13:45 Th3B.003 Th3C.003 Th3E.003 Th3F.003 HIGHER ORDER STUDY OF SINGLE-CELL DEVELOPMENT OF 3D ULTRASONIC MODE INTERNAL ELECTROENDOCYTOSIS 4-ELECTRODE IPMC MICROHEATERS USING ELECTROSTATIC USING BIO-MEMS ACTUATOR WITH PIEZO-CERAMICS FOR TRANSDUCTION OF TECHNOLOGY ACCURATE CAUTERIZATION AND A BULK-MODE RING R. Lin, D.C. Chang, OMNIDIRECTIONAL OTHER APPLICATIONS RESONATOR ON A and Y.-K. Lee CONTROL ABILITY FOR K. Visvanathan QUARTZ SUBSTRATE Hong Kong University of MICROENDOSCOPIC and Y.B. Gianchandani M. Ziaei-Moayyed1, Science and Technology, SURGICAL APPLICATION University of Michigan, J. Hsieh2, J.-W.P. Chen1, HONG KONG G.-H. Feng and J.-W. Tsai USA E.P. Quévy3, D. Elata4, ...... 2366 National Chung Cheng ...... 2421 and R.T. Howe1 University, TAIWAN 1Stanford University, ...... 2393 USA, 2Asia Pacific Microsystems, TAIWAN, 3Silicon Clocks Inc., USA, and 4Technion-Israel Institute of Technology, USA ...... 2338
13:45 - 14:00 Th3B.004 Th3C.004 Th3E.004 Th3F.004 SIMULTANEOUS A HIGH-THROUGHPUT ELECTROLYSIS-BASED POLYSILICON SENSORS MASS-DETECTION OF ARRAY FOR PARYLENE-BALLOON FOR CMOS-MEMS TWO SORTS OF MECHANICAL ACTUATORS ELECTROTHERMAL ANALYTE WITH A STIMULATION OF L. Giacchino and Y.C. Tai PROBES SINGLE RESONANT ADHERENT BIOLOGICAL California Institute of J. Liu, M. Noman, MICRO-CANTILEVER CELLS Technology, USA J.A. Bain, Y.L. Yang, H. Yu, C. Moraes, ...... 2397 T.E. Schlesinger, G.M. Zuo, and X.X. Li C.A. Simmons, and Y. Sun and G.K. Fedder Chinese Academy of University of Toronto, Carnegie Mellon Sciences, CHINA CANADA University, USA ...... 2342 ...... 2370 ...... 2425
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PARALLEL ORAL SESSIONS (continued)
Cell Manipulation MEMS Resonators II & Analysis II Actuators II Thermal Devices
PLAZA BALLROOM B PLAZA BALLROOM C PLAZA BALLROOM E PLAZA BALLROOM F 14:00 - 14:15 Th3B.005 Th3C.005 Th3E.005 Th3F.005 PIEZOELECTRIC MODAL FORMING LARGE STROKE MONOLITHIC SENSORS/ACTUATORS SELF-ASSEMBLED MINIATURIZED CMOS-MEMS BASED ON CELL ARRAYS AND DIELECTRIC ELASTOME OSCILLATORS WITH MICROPLATES MEASURING THE ACTUATORS MICRO-DEGREE APPLYING SURFACE OXYGEN CONSUMPTION S. Rosset, P. Dubois, TEMPERATURE ELECTRODE RATE OF A SINGLE M. Niklaus, and H. Shea RESOLUTION IN AIR PATTERNING LIVE CELL Ecole Polytéchnique CONDITIONS J.L. Sanchez-Rojas1, J.R. Etzkorn1, Fédérale de Lausanne J. Verd1, M. Sansa2, J. Hernando1, A. Donoso1, S.C. McQuaide1, (EPFL), SWITZERLAND A. Uranga3, C. Pey3, J.C. Bellido1, J.B. Anderson1, ...... 2401 G. Abadal3, L.M. Gutiérrez1, D.R. Meldrum2, F. Perez-Murano2, A. Ababneh2, H. Seidel2, and B.A. Parviz1 and N. Barniol3 and U. Schmid3 1University of 1Universitat de les Illes 1University Castilla-La Washington, USA and Balears, SPAIN, Mancha, SPAIN, 2Arizona State University, 2Centro Nacional de 2Saarland University, USA Microelectronica, SPAIN, GERMANY and 3Vienna ...... 2374 and 3Universitat University of Technology, Autónoma de Barcelona, AUSTRIA SPAIN ...... 2346 ...... 2429
14:15 - 14:30 Th3B.006 Th3C.006 Th3E.006 Th3F.006 ENHANCING LABEL-FREE A LARGE TEMPERATURE- PARAMETRIC BIOSENSING DISPLACEMENT TO-FREQUENCY SENSITIVITY USING USING PASSIVE PIEZODRIVEN SILICON CONVERTER MODE LOCALIZATION RADIO-FREQUENCY XY-MICROSTAGE CONSISTING OF IN ELECTRICALLY IDENTIFICATION M.F.M. Sabri1,2, T. Ono1, SUBTHRESHOLD COUPLED MEMS (RFID) SENSORS and M. Esashi2 MOSFET CIRCUITS RESONATORS R.A. Potyrailo1, 1Tohoku University, FOR SMART P. Thiruvenkatanathan, C. Surman1, R. Chen1, JAPAN and 2University of TEMPERATURE-SENSOR J. Yan, J.E.-Y. Lee, S. Go1, K. Dovidenko1, Malaya, MALAYSIA LSIS and A.A. Seshia W.G. Morris1, E. Holwitt2, ...... 2405 K. Ueno, T. Asai, University of Cambridge, V. Sorola2, and J.L. Kiel2 and Y. Amemiya UK 1General Electric Hokkaido University, ...... 2350 Company, USA and JAPAN 2Air Force Research Lab, ...... 2433 USA ...... 2378 14:30 - 14:45 Th3B.007 Th3C.007 Th3E.007 Th3F.007 FILM BULK CULTURE AND CMOS-INTEGRATED EFFICIENT EXTRACTION ACOUSTIC-WAVE DIFFERENTIATION OF POLY-SIGE OF THIN FILM THERMAL RESONATOR (FBAR) AMNIOTIC STEM CELLS CANTILEVERS WITH PROPERTIES VIA BASED ULTRAVIOLET IN A MICROFLUIDIC READ/WRITE SYSTEM PARAMETRIC MODEL SENSOR SYSTEM FOR PROBE STORAGE ORDER REDUCTION X. Qiu, J. Zhu, J. Oiler, H.-W. Wu1, X.-Z. Lin1, DEVICE AND OPTIMIZATION C. Yu, Z. Wang, and H. Yu S.-M. Hwang2, S. Severi1, J. Heck2, T. Bechtold1, D. Hohlfeld2, Arizona State University, and G.-B. Lee1,3 T.-K.A. Chou2, N. Belov3, and E.B. Rudnyi3 USA 1National Cheng Kung J.-S. Park3, D. Harrar3, 1University of Wuppertal, ...... 2354 University, TAIWAN, A. Jain2, R. Van Hoof1, GERMANY, 2IMEC, 2Food Industry Research B. DuBois1, J. De Coster1, THE NETHERLANDS, and and Development O.V. Pedreira1, 3CADFEM GmBH, Institute, TAIWAN, and M. Willegems1, J. Vaes1, GERMANY 3Industrial Technology G. Jamieson1, ...... 2437 Research Institute, L. Haspeslagh1, TAIWAN D. Adams3, V. Rao2, ...... 2381 S. Decoutere1, and A. Witvrouw1 1IMEC, BELGIUM, 2Intel Corporation, USA, and 3Nanochip, Inc., USA ...... 2409
14:45 CONFERENCE ADJOURNS
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