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Apple Iphone X Components Analyzed Special Offer- System Plus

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Apple Iphone X Components Analyzed Special Offer- System Plus Apple iPhone X Special Offer Get an overview of a Reverse Costing report with a sample of the ams ALS & Color Sensor report in the following slides. To have access to all the following iPhone X components analyzed by System Plus Consulting, a special offer is available for you. • ams ALS & Color Sensor • Bosch 6-Axis MEMS IMU The most advanced multispectral 6-channel ambient light sensor, 6-Axis IMU from Bosch featured in iPhone X, iPhone 8 and Apple supplied and produced by ams for its biggest customer, Apple. Watch Series 3. Custom product with only 0.6mm thickness. Released in December 2017 To be released in January 2018 • Infrared Dot Projector • Apple A11 Application Processor The IR Dot Projector is the structured light transmitter of the New Apple application processor: Packaged with TSMC inFO, new TrueDepth camera. An incredible illumination module for 3D sensing integration of silicon capacitors. with 4 innovative parts: package, dedicated VCSEL, folded optic and To be released in January 2018 DOE active which form the most advanced DOT Projector. To be released in December 2017 Select as many reports as you wish and benefit from a bundle price! • STMicroelectronics NIR Camera Near infrared camera module from STMicroelectronics using SOI • One full Reverse Costing report: EUR 3,490 substrate with deep trench isolation. To be released in December 2017 • Annual Subscription Offer: o 2 reports EUR 6 000 • Broadcom AFEM-8072 Mid / High Band Front-End Module o 3 reports EUR 8 400 Mid/high band front-end module in one package with less o 4 reports EUR 11 000 interconnection. Broadcom managed to combine mid and high band even with electromagnetic interferences. o 5 reports EUR 12 500 To be released in January 2018 o 6 reports EUR 14 400 o 7 reports EUR 16 000 • Flood Illuminator & Proximity Sensor Module Module integrating STMicroelectronics ToF proximity sensor with Contact us for more information : [email protected] VCSEL based flood illuminator. To be released in January 2018 ©2017 by System Plus Consulting | Apple iPhone X Special Offer 1 ams Multi-Spectral Sensor True Color ambient light sensor from Apple iPhone X IMAGING report by Stéphane ELISABETH December 2017 – version 1 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2017 by System Plus Consulting | Apple iPhone X Special Offer 2 Table of Contents Overview / Introduction 4 Sensor Manufacturing Process 62 o Executive Summary o Global Overview o Reverse Costing Methodology o Sensor Die Front-End Process & Fabrication Unit Company Profile 8 o Packaging Process & Fabrication unit o ams Cost Analysis 75 o ams portfolio o Summary of the cost analysis 76 o Apple iPhone X Teardown o Yields Explanation & Hypotheses 78 o Module View & Dimensions o Sensor die 80 Physical Analysis 20 Sensor Die Front-End Cost o Summary of the Physical Analysis 21 Sensor Filter Front-End Cost o Package 23 Sensor Die Probe Test, Thinning & Dicing Package View & Dimensions Sensor Die Wafer & Die Cost Package Opening o Packaged Component 84 Package Cross-Section: Packaging Cost Materials, Flex PCB, Wire Bonding, Glass Window, Diffuser Package Cost per steps o Sensor Die 39 Back End: Final Test Sensor Die View & Dimensions Component Cost Sensor Die Overview: Estimated Price Analysis 89 Optical Isolation, Sensing Cells Sensor Delayering & main Blocs Customer Feedbacks 93 Sensor Die Process Company services 95 Sensor Die Cross-Section: Substrate, Metal layers, Optical Isolation, Filters, Photodiode Area Sensor Die Process Characteristic ©2017 by System Plus Consulting | Apple iPhone X Special Offer 3 Executive Summary Overview / Introduction o Executive Summary • This full reverse costing study has been conducted to provide insight on technology data, manufacturing o Reverse Costing Methodology cost and selling price of the Multi-spectral Sensor in the Apple iPhone X supplied by ams. o Glossary Company Profile & Supply Chain • Located in the phone’s front, above the main speaker, the ALS shares the flex PCB with the proximity sensor and the front microphone. The custom version provided by ams is a multi-spectral ALS in very long, Physical Analysis narrow packaging (6 x 0.9mm). Manufacturing Process Flow Cost Analysis • The ALS’ architecture allows for large spectral sensing. Combined with a diffuser, the die sensor features six Selling Price Analysis different cells, probably dedicated to UV, red, green, blue, NIR1, and NIR2, thus providing a broad light spectrum. This allows the sensor to adapt the display color and brightness towards warm or cool-white Feedbacks based on the correlated color temperature (CCT) level of the phone’s environment. About System Plus • This report analyzes the complete multi-spectral ALS, from the sensor die to the custom packaging developed for the device. This report also includes a complete analysis of the package and sensor die, along with a cost analysis and a price estimate for the device. ©2017 by System Plus Consulting | Apple iPhone X Special Offer 4 Apple iPhone X Teardown Overview / Introduction Company Profile & Supply Chain o ams o ams Portfolio o Apple iPhone X teardown Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Apple iPhone X Overview About System Plus ©2017 by System Plus Consulting Apple iPhone X Front, Side and Back View ©2017 by System Plus Consulting ©2017 by System Plus Consulting | Apple iPhone X Special Offer 5 Spectral Sensor Module Overview / Introduction Company Profile & Supply Chain o ams o ams Portfolio o Apple iPhone X teardown Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 6 Summary of the Physical Analysis Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package View o Package Cross-Section o Sensor Die View o Sensor Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 7 Package Views & Dimensions Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package View o Package Cross-Section o Sensor Die View o Sensor Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 8 Package Cross-Section Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package View o Package Cross-Section o Sensor Die View o Sensor Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 9 Package Cross-Section – Bottom Glass Window Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package View o Package Cross-Section o Sensor Die View o Sensor Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 10 Sensor Die – Die View & Dimensions Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package View o Package Cross-Section o Sensor Die View o Sensor Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 11 Sensor Die – Die Overview – Sensing Cells Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package View o Package Cross-Section o Sensor Die View o Sensor Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 12 Sensor Die – Die Cross-Section – Optical Isolation Layer Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package View o Package Cross-Section o Sensor Die View o Sensor Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 13 Sensor Die – Die Cross-Section – Filters Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package View o Package Cross-Section o Sensor Die View o Sensor Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 14 Sensor Die – Die Cross-Section – Filters Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package View o Package Cross-Section o Sensor Die View o Sensor Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 15 Sensor Die – Die Cross-Section – Photodiodes Area Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package View o Package Cross-Section o Sensor Die View o Sensor Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple iPhone X Special Offer 16 Packaging Process Flow 1/5 Overview / Introduction Company Profile & Supply Chain Physical Analysis • PCB Substrate Manufacturing Process Flow o Global Overview o Sensor Die Process PCB Panel o Packaging Process Cost Analysis Selling Price Analysis
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