High-Voltage, High-Frequency Semiconductor Devices, Smart Grid Power Conditioning Systems, Metrology for HV-HF Device and u-Grid PCS
Allen Hefner
National Institute of Standards and Technology Power Electronics Technologies, and Smart Grid
Grid Transformation via PCS Functionality • Today’s Grid: • Electricity is generated by rotating machines with large inertia • Not much storage: generation instantaneously matches load using • load shedding at large facilities • low efficiency fossil generators for frequency regulation • Future Smart Grid: • High penetration of renewables with power electronic grid interface: • dispatchable voltage, frequency, and reactive power • response to abnormal conditions without cascading events • dispatchable “synthetic” inertia and spinning reserve (w/ storage) • Storage for frequency regulation and renewable variability / intermittency • High-speed and high-energy storage options • Load-based “virtual storage” through scheduling and deferral • Plug-in Vehicles increase efficiency, provide additional grid storage • HVDC, DC circuits, SST, SSCB provide stability, functionality and low cost • Microgrids & automation provide secure, resilient operation HV-HF Switch Mode Power Conversion
• Switch-mode power conversion (Today):
• advantages: efficiency, control, functionality, size, weight, cost • semiconductors from: 100 V, ~MHz to 6 kV, ~100 Hz • New semiconductor devices extend application range:
• 1990’s: Silicon IGBTs • higher power levels for motor control, traction, grid PCS • Emerging: SiC Schottky diodes and MOSFETs, & GaN • higher speed for power supplies and motor control • Future: HV-HF SiC: MOSFET, PiN diode, Schottky, and IGBT • enable 15-kV, 20-kHz switch-mode power conversion
Power Semiconductor Applications
• Switching speed decreases with voltage • SiC enables higher speed and voltage
HVDC and FACTS
Power distribution, transmission and generation
A. Hefner, et.al.; "SiC power diodes provide breakthrough performance for a wide range of applications" IEEE Transactions on Power Electronics, March 2001, Page(s):273 – 280. DARPA/ONR/NAVSEA HPE Program 10 kV HV-HF MOSFET/JBS
High Speed at High Voltage SiC MOSFET: 10 kV, 30 ns Silicon IGBT: 4.5 kV, 2us 20 6000 Vd 15 4500 3000 V 10 3000 Area=Area = 0.1250.15 cm 22 5 1500 T = 25o C
Drain Current (A)Drain 0 0 0 V
Id Voltage Drain-Source (V) -5 -1500 5.0 6.5 8.0 9.5151.1 ns1.3 1.4/div1.6 1.7 1.9 2.0 1us /div E- E- E- E- E- E- E- E- E- E- E- A.08 Hefner,08 08 et.al.08 “Recent07 07 Advances07 07 07 in 07High07-Voltage, High-Frequency Silicon-Carbide Power Devices,” IEEE IASTime Annual (s) Meeting, October 2006, pp. 330-337. ARPA-e ADEPT NRL/ONR 12 kV SiC IGBT 4.5 kV SIC-JBS/Si-IGBT Future option Low cost now SiC IGBT: HV, high Temp, 1 us SiC JBS: improves Si IGBT turn-on
Sei-Hyung Ryu, Craig Capell, Allen Hefner, and Subhashish Bhattacharya, “High Performance, Ultra High Voltage 4H-SiC IGBTs” Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE) Conference 2012, Raleigh, NC, September 15 – 20, 2012. K.D. Hobart, E.A. Imhoff, T. H. Duong, A.R. Hefner “Optimization of 4.5 kV Si IGBT/SiC Diode Hybrid Module” PRiME 2012 Meeting, Honolulu, HI, October 7 - 12, 2012. 10 kV SiC MOSFET/JBS Half-Bridge Module Model and Circuit Simulation
• Half-bridge module model:
2 2 • 10 kV SiC power MOSFETs S h c B D2 J S _ _ i
i • 10 kV SiC JBS for anti-parallel diodes S S 2
SiC_MOS2 S B • low-voltage Si Schottky diodes J _ C i Tj S • voltage isolation and cooling stack G2 Tj
Th S2_D1 Th
1 • Validated models scaled to 1 h S
Tc c c
B T S J _ _ i i 100 A, 10 kV half bridge module S S 1
Ta SiC_MOS1 S Ta B J _ C i Tj S • Model used to perform G1 Tj Th Th simulations necessary to: S1 • optimize module parameters Tc Tc • determine gate drive requirements Ta Ta Half-Bridge • SSPS system integration • high-megawatt converter cost analysis
SECA: 300 MW PCS
~700 V DC Semiconductors Packaging and Interconnects Approx. HF transformers 18 kV 345 kV 500 Filter Inductors and Capacitors Fuel AC AC Cells Cooling System 60 Hz Transformer up to 18 kV ~700 V Breakers and Switchgear DC $40-$100 / kW
IEEE – 519 Ripple < 2% IEEE – 1547 Stack Voltage Range Harmonic Distortion ~700 to 1000 V Future: HVDC transmission ? Estimated $/kW: MV & HV Inverter
Transformer & $200 Switchgear $180 Other PE $160 $140 $120 Semiconductor $100 $80 Cooling $60 loss $40 Magnetics $20 loss $0
Inverter Voltage Medium Medium High High High HV-SiC Diode Schottky Schottky Schottky PiN HV-SiC Switch MOSFET MOSFET IGBT HF Transformer Nano Nano Nano Nano Nano 60 Hz Transformer yes yes
Risk Level: Low Moderate Considerable High DOE Sunshot - SEGIS-AC, ARPA-E “$1/W Systems: A Grand Challenge for Electricity from Solar” Workshop, August 10-11, 2010
Goal : 1$/W by 2017 for 5 MW PV Plant $0.5/W – PV module $0.4/W – BOS $0.1/W – Power electronics Smart Grid Functionality High Penetration Enhanced Grid Value
$1/W achieves cost parity in most states! High Penetration of Distributed Energy Resources
Power Smart Grid PCS PCS PCS Communication
Renewable/Clean Energy Plug-in Vehicle to Grid Energy Storage
• Power Conditioning Systems (PCS) convert to/from 60 Hz AC for interconnection of renewable energy, electric storage, and PEVs
• “Smart Grid Interconnection Standards” required for devices to be utility-controlled operational asset and enable high penetration: • Dispatchable real and reactive power • Acceptable ramp-rates to mitigate renewable intermittency • Accommodate faults faster, without cascading area-wide events • Voltage/frequency regulation and utility-controlled islanding
http://www.nist.gov/pml/high_megawatt/2008_workshop.cfm PCS Architectures for PEV Fleet as Grid Storage
Power Smart Grid PCS PCS Communication
Renewable/Clean Energy Energy Storage
PCS PCS PCS
Plugin Vehicle Fleet
http://www.nist.gov/pml/high_megawatt/jun2011_workshop.cfm Large Inverter with DC Circuits to Fleet PEVs
Power Smart Grid PCS DC-AC PCS Communication
Renewable/Clean Energy Charging Station Energy Storage (Multiple Vehicles)
DC Circuits or DC Bus Storage Asset Management
DC-DC DC-DC DC-DC
Plugin Vehicle Fleet DC Microgrid: DC-AC with DC Circuits
Islandable Microgrid Smart Grid 24 V DC Loads DC-AC
380 V DC Loads DC Circuits / DC Bus
Renewable/Clean Energy Energy Storage
Device Asset Management
DC-DC DC-DC DC-DC
Plugin Vehicle Fleet Flow Control Microgrid: AC-AC with AC Circuits
Islandable Microgrid Smart Grid DC Options AC-AC
Microrid Managed Controller AC Loads
Renewable/Clean Energy AC Circuits Energy Storage
PCS PCS
Device Asset Management PCS PCS PCS
Plugin Vehicle Fleet Microgrid using Disconnect and Local EMS
Disconnect Managed Switch Smart Grid AC Loads Microgrid Controller Islandable Microgrid
Renewable/Clean Energy AC Circuits Energy Storage
PCS PCS
Device Asset Management PCS PCS PCS
Plugin Vehicle Fleet ECONOMIC BENEFITS OF INCREASING ELECTRIC GRID RESILIENCE TO WEATHER OUTAGES Executive Office of the President August 2013 ”Priority 3: Increase System Flexibility and Robustness” “Additional transmission lines increase power flow capacity and provide greater control over energy flows. This can increase system flexibility by providing greater ability to bypass damaged lines and reduce the risk of cascading failures. Power electronic-based controllers can provide the flexibility and speed in controlling the flow of power over transmission and distribution lines. Energy storage can also help level loads and improve system stability. Electricity storage devices can reduce the amount of generating capacity required to supply customers at times of high energy demand – known as peak load periods. Another application of energy storage is the ability to balance microgrids to achieve a good match between generation and load. Storage devices can provide frequency regulation to maintain the balance between the network's load and power generated. Power electronics and energy storage technologies also support the utilization of renewable energy, whose power output cannot be controlled by grid operators. A key feature of a microgrid is its ability during a utility grid disturbance to separate and isolate itself from the utility seamlessly with little or no disruption to the loads within the microgrid. Then, when the utility grid returns to normal, the microgrid automatically resynchronizes and reconnects itself to the grid in an equally seamless fashion. Technologies include advanced communication and controls, building controls, and distributed generation, including combined heat and power which demonstrated its potential by keeping on light and heat at several institutions following Superstorm Sandy.” Smart Grid – U.S. National Priority
“We’ll fund a better, smarter electricity grid and train workers to build it…” President Barack Obama
“To meet the energy challenge and create a 21st century energy economy, we need a 21st century electric grid…” Secretary of Energy Steven Chu
“A smart electricity grid will revolutionize the way we use energy, but we need standards …” Secretary of Commerce Gary Locke Congressional Priority: EISA 2007, ARRA, oversight, new bills … Administration Priority – www.whitehouse.gov/ostp/ • A Policy Framework for the 21st Century Grid (June 2011) • Green Button Initiative – available to 35 Million by 2013 – www.nist.gov/smartgrid/greenbutton.cfm
Today’s Electric Grid
Generation Transmission Markets and Operations Distribution Customer Use
One-way flow of electricity
Centralized, bulk generation Heavy reliance on coal, natural gas Limited automation Limited situational awareness Consumers lack data to manage energy usage
Smart Grid = Electrical Grid + Intelligence
2-way flow of electricity and information
NIST Role in Smart Grid
Energy Independence and Security Act (2007) In cooperation with the DoE, NEMA, IEEE, GWAC, and other stakeholders, NIST has “primary responsibility to coordinate development of a framework that includes protocols and model standards for information management to achieve interoperability of smart grid devices and systems…”
http://sgip.org http://www.nist.gov/smartgrid/ White House Kickoff Meeting
• Commitment of industry CEOs for their people (staff) to participate in NIST process to accelerate development of a smart grid roadmap
• May 18, 2009: Meeting chaired by Secretaries of Energy and Commerce • 66 CEOs and senior executives, federal and state regulators NIST Smart Grid Interoperability Plan
PHASE 1 Stakeholder Initial PHASE 2 NEXT CHAPTER Outreach Framework Public-Private Private-Public and Smart Grid “New” Smart Grid Domain Standards Interoperability NIST Interoperability Expert based on Staff and Panel (SGIP) Panel (2.0) Working Research Summer Groups & Stds 2009 PHASE 3 NIST Smart Grid (w/ workshops, Research & GWAC) Testing & finalized Certification Standards Program NIST / Jan2010
Grass Roots Support Federal Advisory Committee Input
2008 2009 2010 & 2012 2013 and on 2011 NIST SG Framework and Roadmap 3.0 Draft
Applications and Requirements - Nine Priority Areas: – Demand response and consumer energy efficiency – Wide-area situational awareness – Distributed Energy Resources (DER) – Energy storage – Electric transportation – Network communications – Advanced metering infrastructure (AMI) – Distribution grid management – Cybersecurity
NIST SG Architecture Reference Model
Markets Operations Service Providers
Retailer / RTO/ISO Transmission Distribution Ops Utility Third-Party Wholesaler Ops Ops Provider Provider DMS Asset Mgmt EMS CIS CIS Aggregator EMS Demand Retail Energy WAMS Response MDMS Provider Billing Billing
Energy Enterprise Enterprise Enterprise Home / Building Market Bus Bus Bus Manager Clearinghouse
Aggregator RTO Transmission Metering Distribution ISO/RTO SCADA SCADA System SCADA Participant Internet / Others Internet / e-Business e-Business
Customer Market Wide Area EMS Services Field Area Networks Energy Interface Networks Services Interface Data Collector Customer Plant Control Equipment System Substation Substation Field Meter LANs Controller Device Premises Generators Networks Distributed Electric Appliances Generation Substation Generation Storage Device Domain Electric Storage Electric Electric Network Storage Vehicle Thermostat Roles and Actors Transmission Distributed Gateway Role Generation Comms Path Distribution Customer Comms Path Changes Owner / Domain Distributed Energy Resources SGIP 2.0 Inc, Organization (Draft) SGIP 2.0 Inc, Organization (Draft)
PAPs
PAP 7: Smart Grid ES-DER Standards
Task 0: Task 2: IEEE 1547.4 for island applications and IEEE 1547.6 for secondary networks Scoping Document Prioritized timeline for Task 3: Unified interconnection method with ES-DER standards multifunctional operational interface for range of a) storage and generation/storage. b) IEEE 1547.8 (a) Operational interface (b) Storage without gen Task 1: Use Cases, c) *EPRI PV-ES Inverter (c) PV with storage d Define requirements (d) Wind with storage for different scenarios e) (e) PEV as storage
Info exchanges MIC
Task 4: Develop and Harmonize Object Models Task 5: Test, Safe and PAPs IEC 61850-7-420: Expanded to include Reliable Implementation • Multifunctional ES-DER operational interface UL Implementation1741, NEC-NFPA70 , • Harmonized with CIM & MultiSpeak SAE, CSA and IEC • Map to MMS, DNP3, web services, & SEP 2 EPRI/Sandia NL Smart Inverter Initiative
Map to Modbus- Protocols Sunspec
DNP3 Represent in Select a Identify Standard Specific Way to Smart Needed Information Implement Energy Functions Model each Function Profile IEC 61850-7-420 MMS, Interest Group, Smart Inverter Published Web Demonstrations, Focus Group IEC 61850-90-7 Services, PAP7, IEEE 1547 Informative document Other Standards Groups, Funded Efforts
courtesy: Brian Seal (EPRI) EPRI/SNL Volt-Var Control Function
Utility-Defined Curve Shapes
Q1 Volt/Var Capacitive Mode 1 – System Q2 Q3 Normal Voltage Regulation V4 V1 V2 V3
Simple Generated VARs Inductive Q4 Broadcast
Q1 Capacitive Volt/Var System Mode 2 – Q2 Voltage Transmission VAR Support V1 V2
VARs Generated VARs Inductive
courtesy: Brian Seal (EPRI) SGIP 2.0 Inc, Organization (Draft)
DEWGs Distributed Renewables, Generators and Storage
• DRGS Domain Expert Working Group initiated September 2011 • Identify Smart Grid standards and interoperability issues/gaps for – Integration of renewable/clean and distributed generators and storage – Operation in high penetration scenarios, weak grids, microgrids, DC grids – Including interaction of high-bandwidth and high-inertia type devices • Focus on Smart Grid functions that – mitigate impact of variability and intermittency of renewable generators – enable generators and storage to provide valuable grid supportive services – prevent unintentional islanding and cascading events for clustered devices • Activities of DRGS DEWG – Consistent approaches for generators/storage types and domains – Use cases and information exchange requirements – Define new PAPs to address standards gaps and issues • Subgroups: A, B, C, D, E, and F DRGS DEWG Activities
• DRGS Subgroups: A. Standards Roadmap – Al Hefner B. UCs, Information Exchange, and Object Models – Frances Cleveland C. Microgrids and Hierarchical Distributed Control – Jim Reilly D. Conformity and Interoperability Test and Certification – Robert Broderick – Ward Bower E. Regulatory and Market Issues – Amanda Stallings F. DER Interconnection Standards – Tom Basso Weather Information PAP – Al Hefner
• Special Topics – Hierarchical Classification of DER Use Cases – Information Support for Integration of Microgrids into Grid Operation – California Rule 21 Updates for Smart Inverters – Regulatory Issues for Microgrid Development
Cyber-Physical Architecture Reference for Resilient/Transactive Power Systems
Markets Providers
Bulk Distributed Premises, Loads Generation Generation and “Prosumer” and Storage Storage “DER”
Transmission Distribution Microgrids T-Operations D-Operations uG-Operator Electricity delivery system
Mobile: Electrical connections (Physical) ______EV, rail, ship, air, Al Hefner 091713 microgrids Secure Communications (Cyber) ______
Smart u-Grid PCS Testing Virtual Instrument Microgrid PCS SGIP Smart Grid Testbed Interoperability
Oscilloscope and NIST Virtual Instrument Computer with Network Analyzer Measurement Network and IEEE 488 Bus Cards Science and Instrumentation Cards IEEE 488 DOE/DOD Labs, Test & Certification Electronic Grid Emulator Electronic Electronic Load 36 kW Power Source Load Emulator … Emulator ESI, EMS, Microgrid (phase, harmonics, (nonlinear, (nonlinear, motor, & Storage functions transient faults, …) motor, reactive, reactive, rectifier, …) rectifier, …)
Sensors, IT Networks ((( & meter stds. Probes Utility Network HAN NIST Power Emulator
Electronics Energy Operating HAN Technologies System: ESI, EMS Optional Power Electronics, Relays, Smart Meter: Data Acquisition, Control Grid-Interactive Power and DER functions & Communication Microgrid PCS Under Test Energy appliances Smart Microgrid PCS Lab 208 V, 400 A Panel DC/AC DC/AC Load Load 12kW 12kW 12kW Safety ReGen ReGen Grid Grid Grid Interlock Cabinet Cabinet controls 28” wide 20” long, 19” wide, <4’ tall
3’ long each 6’ high each
A027 μ-Grid PCS
Under Test
Safety DC
Loads Scope Window AC/DC Supply
Instrument
Console
Energy Operating System:
A025 ESI, EMS 25 kV Curve Tracer Schematic
IEEE 488 Bus
Arbitrary High Voltage Oscilloscope Waveform Amplifier Generator
Rlimit
DUT 1000 X Probe
Source Meter ± 200 V, ± 1 A Clamped Probe
Rsense
HV safety interlocks Model Validation for 100 A, 10 kV SiC Power MOSFET active area = 3 cm2 25 oC 125 oC 100 100 Measured Measured Vgs=10 V 90 Simulated 90 Simulated o I = 0.5K (V -V )2 o 80 T = 25 C PEAK P GS T 80 T = 125 C 250 W/cm2 ] ]
A Vgs=8 V A [ 70 70 [
t Vgs=10 V Vgs=20 V t Vgs=20 V n 60 n 60 e e r r r 50 r u 50 u C C
40 40 n n i i a a r 30 30 Vgs=8 V r Vgs=6 V D 20 D 20
10 Vgs=6 V 10 VT Vgs=4 V 0 0 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Drain Voltage [V] Drain Voltage [V]
* Dashed curves based on area scaling of 10 A die to 100 A multi-chip module. HV-HF Switching Test Circuit
0 – 450V Inductor Supply
Load Inductor 0 – 15kV Clamp Supply Gate Driver High Voltage Probe 1Ω,15ns SW (-5 to 20V) Drain Current Load 2.5 µF Probe Resistor
Rg DUT Pulse In
Gate Current Gate Voltage Probe Probe Model Validation for 100 A, 10 kV SiC Power MOSFET active area = 3 cm2 240 6
200 5
160 4 ] ] V A [ k
[
t 120 3
n e e
Measured g r a r
Simulated t l u 80 2 o C
V
n i n i a 40 1 r a r D D 0 0
-40 -1
-80 -2 50 50.05 50.1 50.15 50.2 Time [µs]
* Dashed curves based on area scaling of 10 A die to 100 A multi-chip module. High Speed Transient Thermal Impedance
IGBT1 IGBT Scope Module Ch.2 D1
Scope 470 Ch.1 IGBT2 + 1.2mF + 470 Anode Gate D2 Voltage -
Cathode-Gate Voltage + 62V Pulsed Current 7.5k - Source Multi-Chip Module Heat Conduction Model
Direct Bonded Cooper Voltage Isolation Stack (15 kV)
Chip and DBC Layout
Dynamic Thermal Component Model