Interpack Workshop Flexible Hybrid Electronics Packaging Needs and Manufacturing Methods

InterPACK Workshop Flexible Hybrid Electronics Packaging Needs and Manufacturing Methods

June 20, 2016 Jason Marsh Director of Technology

America’s Flexible Hybrid Electronics Manufacturing Institute Process for Formulating NNMI

Rep Tom Reed Sen Sherrod Brown R NY-23 D Ohio

Rep Joe Kennedy Sen Roy Blunt D MA-4 R Missouri

December 16, 2014 RAMI Bill & NNMI Signed by President

Passed House Passed Senate w/ 2015 Appropriations Sept 15, 2014 Dec 11, 2014 100 CoSponsors (51D, 49R) 18 CoSponsors (10D, 7R, 1I) Building a National Network of Institutes Network Status ESTABLISHED INSTITUTES • Nearly $500M Federal funding catalyzed over $1.2B cost share from consortia Light/Modern Albany & • Institutes have attracted Metals Rochester, hundreds of companies and Detroit, MI NY universities as active partners Digital Mfg & from across the country Flex. Hybrid Elec. Design. Additive Mfg. Revolutionary San Jose, CA Chicago, IL Youngstown, Fibers & Textiles OH Boston, MA Adv. Electronics Composites Raleigh, NC Knoxville, TN INSTITUTES IN DEVELOPMENT Other Institutes in Open topic competition – Planning: addressing “white space” between mission agency topics Smart Mfg. Topic Selected topic competitions for Energy Efficiency TBA Proj. Award TBD supporting Agency mission – using agency authorities and budgets Establishment of NextFlex AUGUST 28, 2015

Established 28 August 2015

Lead FlexTech Alliance

Hub Location San Jose, California

Proposal Contributors 145+ in 27 states

Federal Funding $75 million over 5 years

Committed Matching $96 million

Government Agencies Engaged 17 DOD & OGAs NextFlex FHE Vision Members

Corporate Academic/Non-Profit Federal Government

Tier 1 Tier 1

Tier 2

Tier 3

Associations

State/Local Government

Observer Economic Development Technology Readiness Levels (TRLs) Manufacturing Readiness Levels (MRLs) Full Spectra Au-M1-S1 with ssweat09262014 DUAL USE 120

100 DI Water 0.1 uM Orexin-A 1 uM Orexin-A 80 10 uM Orexin-A 100 uM Orexin-A 500 uM Orexin-A 1000 uM Orexin-A 60

Impedance(ohm)

0 4 106 6 106 8 106 1 107 1.2 107 1.4 107 1.6 107 1.8 107 2 107 Frequency (Hz)

8 Flexible Hybrid Electronics NextFlex is supporting a wide IMPACT Range of DoD missions DOD EXAMPLES

Flexible • Novel Form ubiquitous Factors Sensors • Light-weight, rugged • Low-cost approaches through new manufacturing Bio- • Enabling novel- marker sensors sensing (AFRL) capabilities FHE IOT Building Blocks • Sensor • Size • Power • Weight • Transceiver • Cost • Processor/Memory • Life Time vs Trigger Domain

• Device Cost to Information Value Ratio • Monitor Reliably for the Intended Use Window • Disposal is Considered in Design • Improve Performance or Health of User • Unobtrusive Form Factor Why FHE? • Flexible • Stretchable • Conformable • Transparent • Biocompatible • Lightweight Photo Source: Phillips Photo Source: Phillips • Cost Effective

Photo Source: University of Mass., Lowell Photo Source: DuPont Power Datalink Sensor • Form Factor • Duty Cycle • Temperature • (wakeup time) • Energy Density Standby Protocol • EM Radiation • Charge Capacity • Baud Rate • Voltage • Connectivity Distance • Contact Impedance • Operating Temperature • Optical Response • Bend Radius (fluorescent assays) • Cost • Time Stability (Leakage) • Accelerometer/Strain

• Disposable (REACH, • 6LoWPAN • OCARI • Analytes • 802.15.4 • ONE-NET RoHS, etc) • ANT • OSIAN • Bluetooth • Thread • Gas • Bluetooth low energy (Wibree) • TIBUMAC • DASH7 • TSMP • ISA100.11a • WirelessHART • MiWi • ZigBee • NFC • Z-Wave The Problem with Pure PE • Unimpressive Mobility @ Operating Temp • VT Shift • It works in Display? -9 • 2x10 Duty Cycle • Amorphous Silicon/Metal Oxides • Polymer • Carbon Nanotubes/Graphene (promising mobility)

Photo: imec HPE Challenges

• Temperature • Resolution • Substrate Flex or Stretch • Bio Compatible Materials Printing (& Curing) • Aerosol Jet • Photonic • Inkjet • Thermal • Extrusion • Catalytic • Screen • Gravure Thinning • Carrier Bond 800

700 • Edge Trim to Eliminate Bevel 600 500

400 • Mechanical Grind 300 200

100

0 • CMP 775 µm Wafer 50 µm Wafer 15 µm Wafer • Plasma • Bumping Singulation • Dicing & Edge Cleanup • Plasma Singulation • Femtosecond Laser Die Handling • Tape Frame/Reel • 15-50 µm thick die • 3,000-20,000 CPH Integration • Conductive Adhesive • Solder • ACF/ACP • Thermo-Compression • TLPS Materials • Direct Print • Wirebond? Integration @ 50µm Differentiating from Subtractive Conformal Antennas

Photos: Si2, OptimecP , Dupont Can’t Live with Low Temp? • Flexible Glass (500˚C) • Flexible Ceramics (1000˚C) Integrated Lines Print, Die Placement, Ablation, Etch, Bonding, Encapsulation Display Production Capability • AMAT Cluster Machines

• Over 900 of these installed worldwide • Entry price $5M • High operating cost • Vacuum deposition & CVD 3D Printing & FHE

Photos: Holst Center Challenges For Smarter Devices • Pin count, bond pitch • Power consumption, thermal management • Device value and reliability requirements • Signal integrity for additive materials Strategic Road-mapping Framework Demos 1 Demos 1 Key Features Key Features TPD1 Human Monitoring 1. 1. “What” we do 2. 2. • Led by Tech council TPD2 Asset Monitoring • Strong end-user participation TPD3 Integrate array antenna systems • Demos describe “What” the institute is doing in manufacturing TPD4 Soft robotics • Revised annually TIME

MT1. Device Integration and Packaging “How” we do it • Industry Led at WG level MT2. Materials • Clear boundaries, detailed roadmaps and deliverables feeding MT3. Printed Flexible Components& Microfluidics into TPDs • Develop “How” – gap analysis MT4. Modeling & Design • Drive Project Calls • Revised semi-annually MT5. Standards, Test & Reliability

In March we had 660 attendees at FLEX2016 from Industry, academia, government (FTA run) Technical Working Groups: 140 participants focused on the Roadmapping Human Monitoring Systems

2016 2017 2018 2019 2020 2021 2022 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

Wearable vital sign monitors for clinical decision making; Smart bandages for wound monitoring and healing Wearable non-invasive sensors for body temperature, fluid-based biomarkers, and ultra sound sensors for infectious and chronic Medical disease monitoring Wearable sensors for - protein bio-marker for stress, fatigue, infection; drug metabolite sensing for optimal delivery; rehab assisting device Wearable smart monitoring system for rehabilitation assistance

Wearables sensors for performance monitoring -hydration, electrolyte, gait, impact (sensors for helmet, knee/elbow pads), injury event; tactile display for sensory substitution; Also relevant for occupational exertion area Wireless injury event warning system for first responders Extreme Performance Smart patches for soft tissue monitoring to assess micro stress strain and fatigue of musculo- skeletal and vascular systems Smart adaptable athletic wear for temperature and pressure control

Wearable sensors for- monitoring cognitive load attention, and sleep deprivation; indicating proper use of personal protection equipment -all industrial and military application Occupational Wearable devices with integrated environment (Temp, humidity, smoke, toxicity, moving objects etc.) risk sensing capabilities. Wearable sensors for human-robot/machine interaction & collaboration tracking

Wear and Forget (such as instrumented wardrobe) health and wellness status-check system akin to the "check Wellnes engine light" NextFlex Program Construct

Project Call Process Flow Institute’s Pilot Line

Working Groups Industry, Govt, Academia Mfg processes cross- TPDs used to demo cutting with TPDs mfg processes Capabilities • Mfg consistent Technical Council Industry, Govt, Academia • Low volume Cross-reference • Complimentary to industry Identify specific common mfg necessary gaps requirements and members • Significant for long-term Propose % Institute Allocations & Projects sustainability • Provide service to projects Governing Council Industry, Govt, Academic Balance long-term Decide on allocation strategy a Growing a Lean and Flexible Workforce Program – Nationally and Locally

NextFlex coordinated meeting NextFlex coordinated between San Jose Workforce HS tour of the Jabil Blue Apprenticeships Hacking 4 Investment Board and Bestronics Sky Center Internships K-12 Full Spectrum Defense TRL Tours Innovating in FHE Operating in FHE environments FabLab environments

Outreach Education / Employment

Project Calls Year 1 Pilots

Taxonomy

Reliability 5 Focus FHE Materials Thinned Device Device / Sensor System Design Integrated Printing / Testing & Areas Scale Up Processing Tools Packaging Monitoring

Initiated Taxonomy Study Hacking 4 Defense pilot programs

Kicked off coordination for Internship and Apprenticeship Commenced Outreach Tours within the Hub Pilots in OH and CA Region FHE Roadmap & PC 2.0 Topics • Roadmap Identified Several Areas of Capability Gaps for FHE SOA • Placement of Flexible Die • Interconnect of Flexible Die • Design & Modelling Software • Ability to print circuits on 3D surfaces • Stretchable circuits • Additionally we took AMS and IAA TPD • Result: 13 topics launched and down-selected to 7 technical topics

MTA-2 Ultra-Thin Die Assembly for FHE Systems •PC Topic 2.1: Ultra-Thin Die Assembly for FHE Systems MTA-4 Registration Methods for FHE •PC Topic 2.2: Multi-Process Integration Tool with Real MTA-8 FHE Process Design Kit 1.0 Time Metrology MTA-11 Mechanical Test Methods •PC Topic 2.3: Printing On Complex Surfaces •PC Topic 2.4: FHE Process Design Kit (Phase 1) MTA-9 Materials Database •PC Topic 2.5: Mechanical Test Methods MTA-5 Printing On Topography •PC Topic 2.6: Flex-Hybrid Array Antenna MTA-10 Stretchable Conductors •PC Topic 2.7: Asset Monitoring for Time Critical Inventory MTA-6 Real Time Metrology •PC Topic 2.8: Failure Modes in Wearable Performance MTA-3 Multi -Technology Printing Tool Monitors •PC Topic 2.WFD: Stand Alone Work Force Development MTA-1 Ultra-thin Die Preparation for FHE Assembly [Topic 2.9] MTA-7 Roll to Roll Expanded Capability Project Call Milestones

• Institute Fast Start – delivers fastest path to first Project Call • 67 days from award to PC1.0 release • 11/5/15 – PC 1.0 Launched PC 1.0 - Responses • 3 Topic Areas (Human and Asset Monitoring) • $5M in Federal Funding • 12/15/15 – PC 1.0 – 70 Pre-Proposals Received • Broad geographic diversity in lead institutions • 21 Industrial leads • 70 Industrial partners • 2/26/16 – PC 1.0 - 17 Full Proposals Received • 4/15/16 – PC 1.0 - 8 Proposal Advanced to Development Agreements • 5/5/16 – PC 2.0 Launched • 9 Topics for PC 2.0 with WFD • $10M in Federal Funding • 5/11/16 – PC 2.0 Kickoff Webinar – 80+ registrants • 6/6/16 – PC 2.0 Pre-Proposals Received – 60 Proposals • 6/17/17 – PC 2.0 Pre-Proposals Down-selected for Full Proposal Invitation NextFlex HQ Layout

Lunch Board

Room

Conf Conf Room Conf

Screen Conf Exp Seminar, Training and Mechanical Workforce Development Lab

Lobby Printing and Additive Design Processing Area Lab (class 10,000 Clean Room)

Cubicles Wearables Lab Product Display Assembly Area

Lab (class 10,000 Clean Room) Materials

Registry Test and

Measurement (class 10,000 Clean Room) Library Ship Receive

Conf Break Room More Information

www.NextFlex.us

Contact: Paul Semenza, Director of Commercialization Phone: 408-797-2231 Email: [email protected]