Xiaomi Mi 8 Explorer Teardown and Identification of Key Components

STRUCTURAL REPORT

Xiaomi MI 8 Explorer Teardown and Key Components Identification Teardown report by Benjamin PUSSAT November 2018

Overview / Introduction

Teardown o Views & Dimensions o Interfaces o Teardown

Components Identification

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PCB Analysis

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Overview / Introduction • The Excel worksheet linked to the report lists all identified ICs and offers the possibility to make filters and to Teardown sort the data according to several features like the manufacturer name, function, package type, pin count, o Views & Dimensions o Interfaces footprint, pitch… o Teardown

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Overview / Introduction • The PCB of the Main board is a 10 layers HDI PCB with a thickness of 0.6mm and micro-vias of 50µm min diameter. Teardown

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PCB Analysis o Cross section o Line/Space width

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10 layers HDI PCB Total thickness: 603µm Copper layers thickness: 18.7µm

Main Board PCB Cross-Section

Teardown

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Xiaomi Mi 8 Explorer Teardown and Identification of Key Components

Discover Xiaomi’s latest flagship Key devices, technical choices on 3D Sensing and main suppliers to compete against Apple’s iPhone X/Xs/Xr.

With the introduction of the iPhone X in September COMPLETE TEARDOWN WITH 2017, Apple set the technology standard in consumer • Smartphone teardown products. One year later, Xiaomi, a rapid-growing • IC identification, with markings, Chinese player, is putting its answer to Apple’s iPhone manufacturers, references, functions, X on the market. package types, sizes and pin counts • PCB characteristics, including cross- section and minimum line width The progress made by Xiaomi over the last five years is • Assignment graphs impressive. Its latest flagship state-of-the-art technology can compete strongly in China, where TABLE OF CONTENT Apple is still struggling to increase its market share. Its • Overview/Introduction main innovation is the integration of a structured–light  Executive summary based 3D imaging module, as well as under-display • Physical Analysis fingerprint sensing technology.  Views and dimensions of the Mi 8 Explorer The report includes teardown photos, detailed package  Mi 8 Explorer teardown identification and descriptions. It is supplied with an  Electronic boards high Excel file summarizing the Mi 8 Explorer chipset and definition photos the assignments by supplier, package or footprint. It  Main components markings, will help you to identify the manufacturer, the package type, dimensions, pitch and pin count and packaging size, type and pitch as well as the function of identification Title: Xiaomi Mi the 85 ICs in the Mi 8 Explorer.  PCB surface, cross section and 8 Explorer minimum line width Teardown  IC package assignments  IC manufacturer design wins Pages: 85 AUTHORS  IC package footprint Date: November Benjamin Pussat joined System Plus 2018 Consulting as a cost technician in RELATED REPORTS Format: PDF & 2017. He is in charge of reverse costing • Xiaomi Mi 8 Explorer 3D Facial Recognition Excel file with a focus on boards and systems. • Huawei P20 Pro Teardown and He previously worked for Sercel, Price: EUR 1,990 Identification of Key Components Sagem S&D and SEIA, where he was in • Oppo Find X Teardown and Identification charge of board testing and then of Key Components hardware and software development.

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY XIAOMI MI 8 EXPLORER TEARDOWN AND IDENTIFICATION OF KEY COMPONENTS STRUCTURE REPORT ORDER FORM Please process my order for “Xiaomi Mi 8 Explorer Teardown and Identification of Key Components” Structure Report Ref: SP18437 Return order by:  Full Structure Report : EUR 1,990* FAX: +33 (0)472 83 01 83  Annual Subscription offers possible from 3 reports, including this MAIL: YOLE DEVELOPPEMENT report as the first of the year. Contact us for more information. 75 Cours Emile Zola 69100 Villeurbanne – France

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