CompTIA A+ Exam CPU Notes

Sky D. Semone September 2018

1 Questions

All questions taken from 2016 reference guides and various helpful online sources. [2],[1]

1. Which of the following units is used for measuring the speed of modern CPUs? • GHz 2. A type of CPU architecture where a single physical CPU contains more than one execution core on a single die or chip is known as: • Multicore 3. The (LGA) is a type of packaging that is notable for having pins arranged in a regular array on the underside of the package. • False 4. Hardware enhancements adding support for virtualization developed by AMD for its CPUs are known as: • AMD-V 5. What are the characteristic features of Socket T? • 775 contacts • CPU socket • LGA packaging 6. Which of the following provides a CPU with the fastest access to frequently used data? • Multi-level 7. The NX bit technology implemented in CPUs manufactured by Intel is called:

1 • XD bit 8. Which of the answers listed below refer to the features of Socket H2? • LGA packaging • 1155 contacts • Intel CPU socket 9. A CPU design based on instruction set that tries to improve speed by utilizing relatively few and simple instructions is known as: • RISC

10. The (PGA) is a type of surface-mount packaging for inte- grated circuits (ICs) that is notable for having pins on the socket rather than the integrated circuit. • False

11. Which of the following answers describe the characteristic features of Socket H/H1? • 1156 contacts • LGA packaging • Intel CPU socket

12. The between the CPU and the internal memory cache (L2 cache) inside the CPU housing is called: • Back-side bus (BSB) 13. A set of Intel CPU hardware enhancements improving support for virtu- alization is known as: • VT-x 14. What are the characteristic features of Socket B? • 1366 contacts • Intel CPU socket • LGA packaging 15. The bus between the CPU and northbridge is called: • Front-side bus (FSB)

16. An additional ATX12V power connector designed to supply dedicated power for the CPU is known as: • P4 connector

2 17. Which of the answers listed below describe the features of Socket H3? • LGA packaging • 1150 contacts • Intel CPU socket 18. Which of the following acronyms refers to a specific feature of certain types of sockets that facilitates the insertion and removal of a CPU chip? • ZIF 19. What is the name of a microprocessor component that performs all com- parisons and calculations? • ALU 20. Which of the following answers refer(s) to example(s) of Intel CPU(s) designed for desktop/workstation computers? • • • Core i3, i5, i7. 21. What is the name of a server-dedicated CPU series designed by AMD? • 22. Which of the following answers refer to the characteristics of Socket R? • Intel CPU socket • 2011 contacts • LGA packaging 23. Intel CPU server brands include • • 24. The NX bit technology implemented by AMD in its CPUs is known as: • EVP 25. The AMD CPU brands designed for desktop/workstation computers in- clude: • Athlon • • Phenom

3 • FX 26. As opposed to active cooling components, such as cooling fans, heat sinks fall into the category of passive cooling components because they do not need to draw any electrical power in order to operate. • True 27. Which of the following answers describe the features of Socket FM2? • AMD CPU socket • PGA-ZIF packaging • 904 contacts 28. A 64-bit CPU can be used either with a 32-bit or 64-bit version of the Microsoft Windows . • True 29. What are the characteristic features of Socket FM2+? • 906 contacts • AMD CPU socket • PGA-ZIF packaging 30. Which of the terms listed below refers to a situation where a single CPU appears as two virtual CPUs to the operating system? • Hyperthreading 31. What are the characteristic features of Socket AM3? • PGA-ZIF packaging • AMD CPU socket • 941 contacts 32. The most notable difference between Pin Grid Array (PGA) and Land Grid Array (LGA) packaging relates to the placement of contact pins, which in case of PGA can be found on the socket, and in case of LGA on the CPU. • False 33. Which of the answers listed below refer(s) to solution(s) aimed at improv- ing CPU heat dissipation? • Heat sink • CPU fan • thermal paste

4 • liquid cooling 34. Which of the following built-in functionalities allows a CPU to take over tasks normally executed by a dedicated graphics card? • Integrated GPU

35. What are the characteristic features of Socket FM1? • AMD CPU socket • PGA-ZIF packaging • 905 contacts

36. In CPU cooling, thermal compound is applied to fill in the narrow space between: • CPU and heat sink 37. Which of the answers listed below refers to the area of implementation of No-eXecute bit (NX bit)? • Malware protection 38. What are the characteristic features of Socket AM3+? • AMD CPU socket • PGA-ZIF packaging • 942 contacts 39. A security feature used by CPUs for isolating areas of memory in order to prevent the execution of code from non-executable memory locations is known as:

• No-eXecute bit (NX bit) 40. Which of the CPU models listed below are compatible with the LGA 775 socket? • , , Celeron, Celeron D, Pentium XE, Core 2 Duo, Core 2 Extreme, Core 2 Quad, Xeon

5 References

[1] Dulaney Emmett. Skandier Toby. Docter, Quentin. CompTIA A+ Complete Certification Kit: Exams 220-901 and 220-902. Sybex, 2016. [2] Mike Meyers. CompTIA A+ Certification All-in-One Exam Guide, Ninth Edition (Exams 220-901 220-902). McGraw-Hill Education, 2016.

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